Claims
- 1. An apparatus for cooling an electrical component of a computing device, the apparatus comprising:
- at least one sorber containing a sorbent;
- a condenser in fluid communication with the sorber;
- an evaporator in fluid communication with both the sorber and the condenser and coupled in heat-exchange relation to the electrical component;
- wherein a sorbate which has been condensed in the condenser is evaporated in the evaporator, thereby absorbing heat from the electrical component, and then adsorbed onto the sorbent;
- an electromagnetic wave generator coupled to the sorber;
- wherein the sorber and the evaporator are integrated into a single structure which is adapted to be connected to a circuit board forming a part of the computing device; and
- wherein the sorbate is desorbed from the sorbent by the electromagnetic waves and the then condensed in the condenser.
- 2. The apparatus of claim 1, wherein the electromagnetic wave generator comprises a solid state electromagnetic wave generating device which is integrated into the single structure.
- 3. The apparatus of claim 1, wherein the sorber comprises a housing forming an enclosure for the sorbent, the housing being constructed of a dielectric material, and wherein the sorber is configured to allow propagation of the electromagnetic waves onto the sorbent.
- 4. The apparatus of claim 3, further comprising a first stripline transmission line formed in or positioned adjacent the housing and configured to propagate the electromagnetic waves onto the sorbent.
- 5. The apparatus of claim 4, wherein the first stripline transmission line comprises a ground plane conductor located on a first side of the enclosure and a stripline conductor located on a side of the enclosure opposite the first side.
- 6. The apparatus of claim 3, further comprising a waveguide configured to propagate the electromagnetic waves onto the sorbent.
- 7. The apparatus of claim of 1, wherein the evaporator comprises:
- an evaporator housing having a depending shroud adapted to be positioned over the electrical component;
- a manifold located in the evaporator housing above the shroud;
- a plurality of holes connecting the manifold with a space encompassed by the shroud;
- an inlet for providing fluid communication between the manifold and the condenser; and
- an outlet for providing fluid communication between the space and the sorber.
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 08/821,258 filed on Mar. 20, 1997, now U.S. Pat. No. 5,855,119, which is a continuation-in-part of U.S. patent application Ser. No. 08/811,759 filed Mar. 6, 1997 now U.S. Pat. No. 5,855,121, which is a continuation of Ser. No. 08/533,153 filed Sep. 20, 1995, now abandoned.
US Referenced Citations (40)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0 037 643 A1 |
Oct 1981 |
EPX |
0 091 382 A1 |
Oct 1983 |
EPX |
2 651 621 A1 |
Mar 1991 |
FRX |
2666141 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
821258 |
Mar 1997 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
533153 |
Sep 1995 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
811759 |
Mar 1997 |
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