Number | Name | Date | Kind |
---|---|---|---|
4193445 | Chu et al. | Mar 1980 | A |
4498530 | Lipschutz | Feb 1985 | A |
4882654 | Nelson et al. | Nov 1989 | A |
5016090 | Galyon et al. | May 1991 | A |
5023695 | Umezawa et al. | Jun 1991 | A |
5052481 | Horvath et al. | Oct 1991 | A |
5166863 | Shmunis | Nov 1992 | A |
5170319 | Chao-Fan Chu et al. | Dec 1992 | A |
5239443 | Fahey et al. | Aug 1993 | A |
5294830 | Young et al. | Mar 1994 | A |
5309319 | Messina | May 1994 | A |
5420753 | Akamatsu et al. | May 1995 | A |
5463528 | Umezawa | Oct 1995 | A |
5537291 | Onodera et al. | Jul 1996 | A |
5774334 | Kawamura et al. | Jun 1998 | A |
6111749 | Lamb et al. | Aug 2000 | A |
Entry |
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IBM Technical Disclosure Bulletin, vol. 29, No. 7. Dec. 1986, p. 2887. entitled “Liquid-Cooled Circuit Package with Jet Impinging On Heat Sink Held Against Semiconductor Chip That Is Sealed From The Jet”, by V. M. Antonetti et al. |