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H01L23/4338

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4338Pistons

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Distributing heatsink load across a processor module with separable...
- Patent number 11,776,876
- Issue date Oct 3, 2023
- International Business Machines Corporation
- Jason R. Eagle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conduction device and associated heat dissipation system
- Patent number 11,002,496
- Issue date May 11, 2021
- ALSTOM TRANSPORT TECHNOLOGIES
- Adrien Zanetti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible heat transfer mechanism configurations
- Patent number 10,980,151
- Issue date Apr 13, 2021
- Hewlett Packard Enterprise Development LP
- Sunil Rao Ganta Papa Rao Bala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding thermal device and system for effecting heat transfer wit...
- Patent number 10,887,978
- Issue date Jan 5, 2021
- Raytheon Company
- Brian W. Johansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for removing heat
- Patent number 10,665,527
- Issue date May 26, 2020
- Sagemcom Broadband SAS
- Gilles Bourgoin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for coupling a semiconductor device of an autom...
- Patent number 10,418,308
- Issue date Sep 17, 2019
- Rockwell Automation Technologies, Inc.
- Paul Jerome Grosskreuz
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Expanding thermal device and system for effecting heat transfer wit...
- Patent number 10,292,255
- Issue date May 14, 2019
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside initiated uniform heat sink loading
- Patent number 10,170,391
- Issue date Jan 1, 2019
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Scott W. Dickover
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dynamic mounting thermal management for devices on board
- Patent number 10,147,664
- Issue date Dec 4, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip self adjusting cooling solution
- Patent number 10,141,241
- Issue date Nov 27, 2018
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement for the thermal protection of a power semicondu...
- Patent number 10,008,847
- Issue date Jun 26, 2018
- HKR SEUFFER AUTOMOTIVE GMBH & CO. KG
- Jochen Fuchs
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat transferring device
- Patent number 9,863,717
- Issue date Jan 9, 2018
- Pentair Technical Solutions GmbH
- Michael Joist
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible metallic heat connector
- Patent number 9,658,000
- Issue date May 23, 2017
- Abaco Systems, Inc.
- Graham Charles Kirk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for thermomechanically decoupling heatsink
- Patent number 9,550,258
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Sri M Sri-Jayantha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable heat pipe thermal unit
- Patent number 9,366,482
- Issue date Jun 14, 2016
- Intel Corporation
- Jin Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Signal transmission device
- Patent number 9,230,882
- Issue date Jan 5, 2016
- Hitachi Metals, Ltd.
- Yoshinori Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and on-board power conversion device
- Patent number 9,147,634
- Issue date Sep 29, 2015
- Mitsubishi Electric Corporation
- Katsuhisa Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 9,087,834
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component assembly for thermal transfer
- Patent number 8,957,316
- Issue date Feb 17, 2015
- Honeywell International Inc.
- Chris R. Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,906,809
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,900,927
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable heat sink assembly
- Patent number 8,861,203
- Issue date Oct 14, 2014
- ADLINK TECHNOLOGY INC.
- Chih-Liang Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip cooling device having wedge element
- Patent number 8,662,155
- Issue date Mar 4, 2014
- GE Intelligent Platforms Embedded Systems, Inc.
- Klaus Weinmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,587,114
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate having blades that interleave with memory modules
- Patent number 8,570,744
- Issue date Oct 29, 2013
- Hewlett-Packard Development Company, L.P.
- Timothy Rau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,445,331
- Issue date May 21, 2013
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lower profile heat dissipating system embedded with springs
- Patent number 8,437,138
- Issue date May 7, 2013
- Hon Hai Precision Industry Co., Ltd.
- Darrell Lynn Wertz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cooling apparatus
- Patent number 8,368,208
- Issue date Feb 5, 2013
- Raytheon Company
- Scott T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,999,394
- Issue date Aug 16, 2011
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for cooling memory modules
- Patent number 7,969,736
- Issue date Jun 28, 2011
- International Business Machines Corporation
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTING HEATSINK LOAD ACROSS A PROCESSOR MODULE WITH SEPARABLE...
- Publication number 20220238416
- Publication date Jul 28, 2022
- International Business Machines Corporation
- JASON R. EAGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR REMOVING HEAT
- Publication number 20190341333
- Publication date Nov 7, 2019
- SAGEMCOM BROADBAND SAS
- Gilles BOURGOIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Expanding Thermal Device and System for Effecting Heat Transfer wit...
- Publication number 20190261502
- Publication date Aug 22, 2019
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
- Publication number 20190067158
- Publication date Feb 28, 2019
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD
- Publication number 20180308783
- Publication date Oct 25, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE METALLIC HEAT CONNECTOR
- Publication number 20170219303
- Publication date Aug 3, 2017
- Abaco Systems, Inc.
- Graham Charles Kirk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOM...
- Publication number 20170141013
- Publication date May 18, 2017
- Rockwell Automation Technologies, Inc.
- Paul Jerome Grosskreuz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
- Publication number 20160276243
- Publication date Sep 22, 2016
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140291833
- Publication date Oct 2, 2014
- Toyota Jidosha Kabushiki Kaisha
- Takato SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING AND POWER MODULE HAVING THE SAME
- Publication number 20140285972
- Publication date Sep 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Chang Seob Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE
- Publication number 20140252587
- Publication date Sep 11, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Katsuhisa Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal Transmission Device
- Publication number 20140140011
- Publication date May 22, 2014
- Hitachi Metals, Ltd.
- Yoshinori SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT PIPE THERMAL UNIT
- Publication number 20140090816
- Publication date Apr 3, 2014
- Jin YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ADJUSTABLE HEAT SINK ASSEMBLY
- Publication number 20140063731
- Publication date Mar 6, 2014
- ADLINK TECHNOLOGY INC.
- Chih-Liang Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20140051211
- Publication date Feb 20, 2014
- International Business Machines Corporation
- Suresh D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT CONDUCTING DEVICE AND ELECTRONIC DEVICE APPLYING THE SAME
- Publication number 20130235529
- Publication date Sep 12, 2013
- Huawei Technologies Co., Ltd
- Youquan YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLEXIBLE METALLIC HEAT CONNECTOR
- Publication number 20130206363
- Publication date Aug 15, 2013
- GENERAL ELECTRIC COMPANY
- Graham Charles Kirk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-CONDUCTING ELEMENT, ASSEMBLY AND USE OF THE SAME
- Publication number 20130153194
- Publication date Jun 20, 2013
- Schneeberger Holding AG
- Hans-Martin Schneeberger
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE
- Publication number 20130088836
- Publication date Apr 11, 2013
- Tatsuro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTION WITH SPRING-LOADED INTERFACE
- Publication number 20130032324
- Publication date Feb 7, 2013
- Russell W. Aldridge
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120241944
- Publication date Sep 27, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOWER PROFILE HEAT DISSIPATING SYSTEM EMBEDDED WITH SPRINGS
- Publication number 20120218718
- Publication date Aug 30, 2012
- HON HAI PRECISION INDUSTRY CO., LTD.
- DARRELL LYNN WERTZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120196408
- Publication date Aug 2, 2012
- International Business Machines Corporation
- SURESH D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERHEAD-MOUNTED HEATSINK
- Publication number 20120168123
- Publication date Jul 5, 2012
- Stephen Belgin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE HAVING BLADES THAT INTERLEAVE WITH MEMORY MODULES
- Publication number 20120113586
- Publication date May 10, 2012
- Timothy Rau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR COOLING APPARATUS
- Publication number 20120080785
- Publication date Apr 5, 2012
- Raytheon Company
- Scott T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120080784
- Publication date Apr 5, 2012
- International Business Machines Corporation
- SURESH D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT ASSEMBLY FOR THERMAL TRANSFER
- Publication number 20120061127
- Publication date Mar 15, 2012
- Honeywell International Inc.
- Chris R. Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120039046
- Publication date Feb 16, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Distributing heatsink load across a processor module with separable...

Thermal conduction device and associated heat dissipation system

Flexible heat transfer mechanism configurations

Expanding thermal device and system for effecting heat transfer wit...

Device for removing heat

Systems and methods for coupling a semiconductor device of an autom...

Expanding thermal device and system for effecting heat transfer wit...

Backside initiated uniform heat sink loading

Dynamic mounting thermal management for devices on board

Multi-chip self adjusting cooling solution

Circuit arrangement for the thermal protection of a power semicondu...

Heat transferring device

Flexible metallic heat connector

Method and system for thermomechanically decoupling heatsink

Adjustable heat pipe thermal unit

Signal transmission device

Semiconductor device, and on-board power conversion device

Multichip electronic packages and methods of manufacture

Electrical component assembly for thermal transfer

Multichip electronic packages and methods of manufacture

Multichip electronic packages and methods of manufacture

Adjustable heat sink assembly

Chip cooling device having wedge element

Multichip electronic packages and methods of manufacture

Cold plate having blades that interleave with memory modules

Multichip electronic packages and methods of manufacture

Lower profile heat dissipating system embedded with springs

Semiconductor cooling apparatus

Void reduction in indium thermal interface material

System for cooling memory modules

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

DISTRIBUTING HEATSINK LOAD ACROSS A PROCESSOR MODULE WITH SEPARABLE...

DEVICE FOR REMOVING HEAT

Expanding Thermal Device and System for Effecting Heat Transfer wit...

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD

FLEXIBLE METALLIC HEAT CONNECTOR

SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOM...

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

SEMICONDUCTOR DEVICE

HOUSING AND POWER MODULE HAVING THE SAME

SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE

Signal Transmission Device

ADJUSTABLE HEAT PIPE THERMAL UNIT

ADJUSTABLE HEAT SINK ASSEMBLY

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

HEAT CONDUCTING DEVICE AND ELECTRONIC DEVICE APPLYING THE SAME

FLEXIBLE METALLIC HEAT CONNECTOR

HEAT-CONDUCTING ELEMENT, ASSEMBLY AND USE OF THE SAME

HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE

THERMAL SOLUTION WITH SPRING-LOADED INTERFACE

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

LOWER PROFILE HEAT DISSIPATING SYSTEM EMBEDDED WITH SPRINGS

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

OVERHEAD-MOUNTED HEATSINK

COLD PLATE HAVING BLADES THAT INTERLEAVE WITH MEMORY MODULES

SEMICONDUCTOR COOLING APPARATUS

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

ELECTRICAL COMPONENT ASSEMBLY FOR THERMAL TRANSFER

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE