Patent Application
20160219753
This application claims priority to Chinese Patent Application No. 201510042844.7 filed on Jan. 28, 2015 in the China Intellectual Property Office, the contents of which are incorporated by reference herein.
The subject matter herein generally relates to a cooling module, and more particularly to a cooling module for an electronic component.
A variety of electronic components, such as graphics processing unit (GPU) have become important in computer systems. In order to ensure the GPU operates normally, a cooling module is installed around the GPU for cooling the GPU.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The air guiding duct 30 defines an opening 31. The airflow can pass through the opening 31 to enter into the radiator 50. The cooling portion 40 includes a cooling fan (not shown) and defines a plurality of vents 42. The airflow can exhaust from the vent 42 after passing through the radiator 50. The cooling portion 40 adjacent the receiving portion 20 is equipped with a buffer strip 45. The buffer strip 45 is configured to buffer the radiator 50 for protection.
The radiator 50 includes a base plate 51 and a plurality of fins 55 which are parallel and fixed on the base plate 51. The base plate 51 is equipped with a plurality of fixing pieces 511. The fixing pieces 511 can be mounted on a motherboard (not shown) to fix the cooling module 100 on the motherboard. One side away from the fin 55 of the base plate 51 is equipped with an endothermic piece 512. The endothermic piece 512 can be closely contacted with the electronic component to absorb heat from the electronic component. The bottom of the fins 55 near the both ends are equipped with two protrusion blocks 555, the protrusion blocks 555 are inserted into the latch hole 231 of the latch piece 23 to fix the radiator 50 in the shell 10.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201510042844.7 | Jan 2015 | CN | national |
