Outer radiating structures on heat dissipating housings

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H05K7/20409

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20409Outer radiating structures on heat dissipating housings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device
- Patent number 12,363,869
- Issue date Jul 15, 2025
- NIDEC CHAUN-CHOUNGTECHNOLOGY CORPORATION
- Abbas Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling devices, and systems, to cool multi-chip modules
- Patent number 12,363,857
- Issue date Jul 15, 2025
- Coolit Systems, Inc.
- Bradley Zakaib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal conduction band for improved mobile computing device perfor...
- Patent number 12,349,316
- Issue date Jul 1, 2025
- Intel Corporation
- Smit Kapila
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical panelboard assembly including power distribution heatsin...
- Patent number 12,342,496
- Issue date Jun 24, 2025
- EATON INTELLIGENT POWER LIMITED
- Jayram Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management devices
- Patent number 12,342,504
- Issue date Jun 24, 2025
- Hewlett-Packard Deveopment Company, L.P.
- Hendry Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid system for servers
- Patent number 12,336,152
- Issue date Jun 17, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid omnidirectional camera systems
- Patent number 12,335,635
- Issue date Jun 17, 2025
- Amazon Technologies, Inc.
- Jeffrey David Barr
- G08 - SIGNALLING
Information Patent Grant
Thermal management solution for power stage comprising top-cooled p...
- Patent number 12,336,148
- Issue date Jun 17, 2025
- GaN Systems Inc.
- Ruoyu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and communication device
- Patent number 12,336,149
- Issue date Jun 17, 2025
- Huawei Technologies Co., Ltd.
- Yu Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underwater data center
- Patent number 12,317,453
- Issue date May 27, 2025
- KOREA INSTITUTE OF OCEAN SCIENCE & TECHNOLOGY
- Taek Hee Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Network interface device having heat dissipating members
- Patent number 12,309,976
- Issue date May 20, 2025
- MELLANOX TECHNOLOGIES LTD.
- Ayal Shabtay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,302,488
- Issue date May 13, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,295,116
- Issue date May 6, 2025
- Getac Technology Corporation
- Jui-Lin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphics card and computer host
- Patent number 12,289,866
- Issue date Apr 29, 2025
- Acer Incorporated
- Yu-Ming Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus including thermal management mechanism and methods of man...
- Patent number 12,284,788
- Issue date Apr 22, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electric appliance having a housing part
- Patent number 12,284,787
- Issue date Apr 22, 2025
- Sew-Eurodrive GmbH & Co. KG
- Franz Daminger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus comprising a heat sink for a pluggable module
- Patent number 12,274,033
- Issue date Apr 8, 2025
- Nokia Solutions and Networks Oy
- Reinhold Seitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 12,272,896
- Issue date Apr 8, 2025
- Molex, LLC
- Che-Yuan Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Self-cooling chassis for a communications device
- Patent number 12,267,987
- Issue date Apr 1, 2025
- RAKUTEN SYMPHONY, INC.
- Gerard MacManus
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Heat pipe for improved thermal performance at cold plate interface
- Patent number 12,262,508
- Issue date Mar 25, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for dissipating heat from vehicle-based devices having elec...
- Patent number 12,262,512
- Issue date Mar 25, 2025
- Motional AD LLC
- Christopher P. Bird
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 12,250,787
- Issue date Mar 11, 2025
- Lenovo (Singapore) Pte. Ltd.
- Kosei Kimura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Enhanced thermal management in electrical boxes using passive cooling
- Patent number 12,250,788
- Issue date Mar 11, 2025
- Crestron Electronics, Inc.
- Albert Pedoeem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control-cabinet system having a base module and a functional module...
- Patent number 12,245,398
- Issue date Mar 4, 2025
- BECKHOFF AUTOMATION GMBH
- Hans Beckhoff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for cooling a substrate support
- Patent number 12,232,299
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Robert Irwin Decottignies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server packaging for immersion cooling with local acceleration
- Patent number 12,225,693
- Issue date Feb 11, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for a SSD memory in a video game console
- Patent number 12,225,691
- Issue date Feb 11, 2025
- Nexark, Inc.
- Menachem Eliyahu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transceiver handle heat dissipation airflow channeling system
- Patent number 12,225,681
- Issue date Feb 11, 2025
- Dell Products L.P.
- Shree Rathinasamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device and electronic device including the same
- Patent number 12,219,721
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yusuf Cinar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device and electronic control device with housings havin...
- Patent number 12,218,027
- Issue date Feb 4, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPEAKER-INDUCED AIRFLOW FOR ACTIVE DEVICE COOLING
- Publication number 20250240926
- Publication date Jul 24, 2025
- RealWear, Inc.
- Noah Nicholas BALMER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...
- Publication number 20250234493
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISTRIBUTED IMPINGEMENT AND RECOVERY MANIFOLD (DIRM) COLD PLATE
- Publication number 20250227891
- Publication date Jul 10, 2025
- STRATEGIC THERMAL LABS, LLC
- AUSTIN MICHAEL SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE SPRING SENSOR CLOSURE
- Publication number 20250224483
- Publication date Jul 10, 2025
- GM Cruise Holdings LLC
- Johannes KOEPP
- B60 - VEHICLES IN GENERAL
Information Patent Application
COOLING SYSTEM
- Publication number 20250227872
- Publication date Jul 10, 2025
- Toyota Jidosha Kabushiki Kaisha
- Akihiro SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Transceiver Module and Communication Device
- Publication number 20250220861
- Publication date Jul 3, 2025
- Huawei Technologies Co., Ltd
- Ming Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE AND BASE STATION EQUIPMENT
- Publication number 20250212358
- Publication date Jun 26, 2025
- ZTE CORPORATION
- Jian WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION DEVICE AND QUANTUM COMPUTER SYSTEM FOR QUANTUM BIT
- Publication number 20250209359
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Che-Hao Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVER AND HEAT DISSIPATION MODULE
- Publication number 20250203823
- Publication date Jun 19, 2025
- WISTRON CORP.
- Wen Hua Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND COMPUTING DEVICE
- Publication number 20250194042
- Publication date Jun 12, 2025
- CANAAN CREATIVE CO., LTD.
- Shaohua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD
- Publication number 20250194054
- Publication date Jun 12, 2025
- CANAAN CREATIVE CO., LTD.
- Huan YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE AND PROJECTION DEVICE
- Publication number 20250172861
- Publication date May 29, 2025
- CORETRONIC CORPORATION
- Pei-Rong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION-TYPE HEAT DISSIPATING DEVICE
- Publication number 20250176137
- Publication date May 29, 2025
- COOLER MASTER., LTD.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR A SILENT BLOWER IN AN INFORMATION HANDLING...
- Publication number 20250165048
- Publication date May 22, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heating Element Cooling Device
- Publication number 20250151234
- Publication date May 8, 2025
- KMW Inc.
- Hwang Ju LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting System For Mounting An Element To An Aircraft Surface
- Publication number 20250151233
- Publication date May 8, 2025
- Carlisle Interconnect Technologies, Inc.
- Bradley J. Purpus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET ASSEMBLY AND ELECTRICAL CONNECTOR COMPRISING THE SAME
- Publication number 20250141152
- Publication date May 1, 2025
- Tyco Electronics (Shanghai) Co., Ltd.
- Yongfeng (Richard) Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
- Publication number 20250142778
- Publication date May 1, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE
- Publication number 20250128618
- Publication date Apr 24, 2025
- TE CONNECTIVITY INDIA PRIVATE LIMITED
- Akshay Sanjay PATIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
Cooling System Assembly
- Publication number 20250133697
- Publication date Apr 24, 2025
- Cooler Master Co., Ltd.
- Fuming Zhong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250133705
- Publication date Apr 24, 2025
- HYUNDAI MOBIS CO., LTD.
- Sung Hyun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUDIO AMPLIFIER AND METHOD FOR COOLING AN AUDIO AMPLIFIER
- Publication number 20250126740
- Publication date Apr 17, 2025
- POWERSOFT S.P.A.
- CLAUDIO LASTRUCCI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECESSED HEAT SINK WITH A DISCERNIBLE COMPONENT AS PART OF A DEVICE...
- Publication number 20250126755
- Publication date Apr 17, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Saad Bushnaq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
- Publication number 20250120048
- Publication date Apr 10, 2025
- xFusion Digital Technologies Co., Ltd.
- Minqi Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods Of Cooling A Vertical Line Card
- Publication number 20250107047
- Publication date Mar 27, 2025
- Google LLC
- Tanya Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES
- Publication number 20250098095
- Publication date Mar 20, 2025
- Nubis Communications, Inc.
- Christopher Robert Cole
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATE CENTER LOCAL COOLING SYSTEM WITH PRE-COOLING CHILLER
- Publication number 20250098125
- Publication date Mar 20, 2025
- SAMHWA ACE CO., LTD.
- Byoung Nam CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POTTING BOAT HEAT SINK
- Publication number 20250091190
- Publication date Mar 20, 2025
- Milwaukee Electric Tool Corporation
- Mauricio Builes Zapata
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COOLING MODULE
- Publication number 20250098120
- Publication date Mar 20, 2025
- Fujitsu Limited
- Hiroyuki Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20250089208
- Publication date Mar 13, 2025
- Microsoft Technology Licensing, LLC
- Oscar FARIAS MOGUEL
- G06 - COMPUTING CALCULATING COUNTING

Outer radiating structures on heat dissipating housings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation device

Liquid-cooling devices, and systems, to cool multi-chip modules

Thermal conduction band for improved mobile computing device perfor...

Electrical panelboard assembly including power distribution heatsin...

Thermal management devices

Hybrid system for servers

Hybrid omnidirectional camera systems

Thermal management solution for power stage comprising top-cooled p...

Heat sink and communication device

Underwater data center

Network interface device having heat dissipating members

Electronic control device

Electronic device

Graphics card and computer host

Apparatus including thermal management mechanism and methods of man...

Electric appliance having a housing part

Apparatus comprising a heat sink for a pluggable module

Connector assembly with movable heat sink

Self-cooling chassis for a communications device

Heat pipe for improved thermal performance at cold plate interface

Systems for dissipating heat from vehicle-based devices having elec...

Electronic apparatus

Enhanced thermal management in electrical boxes using passive cooling

Control-cabinet system having a base module and a functional module...

Methods and apparatus for cooling a substrate support

Server packaging for immersion cooling with local acceleration

Cooling apparatus for a SSD memory in a video game console

Transceiver handle heat dissipation airflow channeling system

Memory device and electronic device including the same

Electrical device and electronic control device with housings havin...

Patents Applicationslast 30 patents

SPEAKER-INDUCED AIRFLOW FOR ACTIVE DEVICE COOLING

APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...

DISTRIBUTED IMPINGEMENT AND RECOVERY MANIFOLD (DIRM) COLD PLATE

WIRE SPRING SENSOR CLOSURE

COOLING SYSTEM

Optical Transceiver Module and Communication Device

HEAT DISSIPATION DEVICE AND BASE STATION EQUIPMENT

SIGNAL TRANSMISSION DEVICE AND QUANTUM COMPUTER SYSTEM FOR QUANTUM BIT

SERVER AND HEAT DISSIPATION MODULE

HEAT DISSIPATION APPARATUS AND COMPUTING DEVICE

HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD

HEAT DISSIPATION MODULE AND PROJECTION DEVICE

IMMERSION-TYPE HEAT DISSIPATING DEVICE

METHOD AND APPARATUS FOR A SILENT BLOWER IN AN INFORMATION HANDLING...

Heating Element Cooling Device

Mounting System For Mounting An Element To An Aircraft Surface

SOCKET ASSEMBLY AND ELECTRICAL CONNECTOR COMPRISING THE SAME

HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE

ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE

Cooling System Assembly

ELECTRONIC DEVICE

AUDIO AMPLIFIER AND METHOD FOR COOLING AN AUDIO AMPLIFIER

RECESSED HEAT SINK WITH A DISCERNIBLE COMPONENT AS PART OF A DEVICE...

HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

Methods Of Cooling A Vertical Line Card

COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES

DATE CENTER LOCAL COOLING SYSTEM WITH PRE-COOLING CHILLER

POTTING BOAT HEAT SINK

COOLING MODULE

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES