Cooling Orbital Lapping Device

TECHNICAL FIELD

This disclosure relates in general to an orbital lapping device, and more particularly to a device providing cooling fluid during use of the orbital lapping device.

BACKGROUND

Polishing or sanding a target material generates heat and raises the temperature of the target material. Typically, polishing or sanding the target material when the material is in its glass state or within its glass transition temperature reduces the risk of ripping the target material at a molecular level. Most plastics and metals have a high glass transition state, or temperature, so the heat generated from friction does not affect the quality of the polishing or sanding.

However, some materials such as special paints, soft plastics, and coatings have a glass transition state that is below room temperature. Any added heat above the glass transition state, or temperature, increases the possibility of the material ripping instead of being cut. Friction still generates heat when sanding or polishing at low RPM speeds, so maintaining a low temperature of the target material is very difficult.

Previous cooling methods of the target material include using a cold air blower, a dry ice chamber, or placing the material in a walk-in freezer. The problem with these methods is the heat from friction is directly below the polishing pad, blocking any cold air or gas that is attempting to cool the area. The area surrounding the polishing area is being constantly cooled, but the desired polishing area is not receiving any cold fluid. Cold environments that apply cold air or gas can also be a hazardous working environment for the worker, having potential problems such as reduced sanding skills, frostbite, and hypothermia.

Other problems occur when polishing or sanding materials with a lower glass transition temperature. When sanding or polishing with abrasive grit sizes or at high speeds, a larger amount of heat is generated. For example, when automotive shops are polishing paint, operators must take frequent breaks to ensure the paint does not get too hot. Otherwise, the operators could delaminate the paint, wear out the polishing pad quickly, and dry out the polishing compound.

Previous attempts to solve this problem, for example European Patent No. 0391148 B1, involved injecting liquid nitrogen or liquid carbon dioxide into a rotating polishing pad to polish special automotive paints at extremely low temperatures. The use of liquid nitrogen or liquid carbon dioxide made the device larger and unwieldy. Using liquid nitrogen or carbon dioxide also required expensive tooling that decreased the affordability of the device. Finally, the very cold temperatures of liquid nitrogen increased the risk of injury to the operator of the device.

SUMMARY OF THE DISCLOSURE

According to one embodiment, an apparatus for sanding or polishing a surface may include a sanding housing having an inlet and an outlet, where the inlet and the outlet may be fluidly connected. The apparatus also includes a sander attached to the sanding housing. The apparatus also includes a sanding head removably attached to the outlet of the sanding housing. The sanding head may be used to sand or polish the surface. The sander may actuate the sanding head. The apparatus also includes a fluid supply line connecting the inlet of the sanding housing to a fluid supply source. The apparatus also includes a handle attached to at least one of the sander and the fluid supply source. The fluid supply source may provide a fluid through the fluid supply line and the sanding head to cool the surface.

In a particular embodiment, the fluid supply source may be a vortex tube.

In a particular embodiment, the fluid may be compressed air.

In a particular embodiment, the sander may be an orbital sander.

In a particular embodiment, the apparatus may also include a second handle attached to at least one of the sander, the sanding housing, and the fluid supply source.

In a particular embodiment, the sanding head may include a sanding pad and a sanding pad support structure. The sanding pad may be a porous material suitable for the fluid to pass through the sanding pad to the surface. The sanding pad support structure may include a plurality of apertures configured to allow the fluid to pass through the sanding pad and configured to collect solid particulate. The solid particulate may be ice.

In a particular embodiment, the sanding head may be at least one of: circular in shape, cylindrical in shape, spherical in shape, and convex in shape.

In a particular embodiment, the sanding head may define a first axis passing through a center of the sanding head. The fluid supply line may be arranged parallel to the first axis. The fluid supply source may be arranged parallel to the first axis. The sander may be arranged orthogonal to the first axis.

According to another embodiment, an apparatus for sanding or polishing a surface may include a sander having a motor and a sanding head. The sanding head may define a fluid flow axis passing through the center of the sanding head. The fluid flow axis may be non-parallel with the surface. The apparatus may also include at least one cooling fluid device fluidly connected to the sanding head and may provide a cooling fluid along the fluid flow axis through the sanding head. The apparatus may also include at least one handle. The handle may structurally support the motor and the at least one cooling fluid device. The at least one cooling fluid device may be fluidly connected to a fluid supply source. The sanding head may include a particulate filter to capture solid particulate generated by the cooling fluid.

In a particular embodiment, the cooling fluid may be compressed air.

In a particular embodiment, the at least one cooling fluid device may be at least one vortex tube.

In a particular embodiment, the sanding head may include a material that allows fluid to flow through the material.

In a particular embodiment, the at least one handle may be mounted to a robotic arm.

In a particular embodiment, the apparatus may also include at least one tube fluidly connects the at least one cooling fluid device to the sanding head.

The present disclosure may provide numerous technical advantages. For example, certain embodiments cool a target surface while the apparatus is sanding or polishing instead of cooling the surround area of the target surface. In this manner, the operator of the device is able to continue sanding or polishing without raising the temperature of the target surface allowing longer operational periods. Additionally, operators do not need to be worried about damaging the target surface during sanding and polishing operations. As another example, certain embodiments do not require hazardous working conditions to perform the sanding or polishing operations. This includes the use of dangerous or hazardous fluids that pose a risk to the operator, such as liquid nitrogen. As another example, certain embodiments of the apparatus allow for easier implementation due to cost savings regarding expensive cooling fluids as well interoperability with existing working environments.

Other technical advantages will be readily apparent to one skilled in the art from the following figures, descriptions, and claims. Moreover, while specific advantages have been enumerated above, various embodiments may include all, some, or none of the enumerated advantages.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description, taken in conjunction with the accompanying drawings, in which:

FIG. 1A illustrates an example of previous cooling methods that required a surface to be cooled externally from the sanding or polishing device;

FIG. 1B illustrates a cross-section of a surface implementing the cooling using a sanding or polishing apparatus, according to certain embodiments;

FIG. 2 illustrates an assembled sanding or polishing apparatus, according to certain embodiments.

FIG. 3 illustrates a disassembled view of a sanding or polishing apparatus, according to certain embodiments.

FIG. 4A illustrates a first view of a sanding housing and a sander, according to certain embodiments.

FIG. 4B illustrates a second view of a sanding housing and a sander, according to certain embodiments.

FIG. 5 illustrates a partially assembled sanding or polishing apparatus, according to certain embodiments.

FIG. 6 illustrates a sanding head with and without a sanding pad, according to certain embodiments.

DETAILED DESCRIPTION OF THE DISCLOSURE

To facilitate a better understanding of the present disclosure, the following examples of certain embodiments are given. The following examples are not to be read to limit or define the scope of the disclosure. Embodiments of the present disclosure and its advantages are best understood by referring to FIGS. 1A through 6, where like numbers are used to indicate like and corresponding parts.

As described above, polishing or sanding a target material generates heat and raises the temperature of the target material. Typically, polishing or sanding the target material when the material is in its glass state or below the glass transition temperature of the material reduces the risk of ripping the target material at a molecular level. Most plastics and metals have a high glass transition state, or temperature, so the heat generated from friction does not affect the quality of the polishing or sanding.

FIG. 1A illustrates a previous method of cooling a surface 10 during polishing or sanding, which may also be referred to as a target surface, material, or target material. The previous method of cooling included using a conventional sander or polisher 20, such as an orbital sander, to polish the target surface 10, including target area 11. The conventional sander 20 would generate heat from friction in the target area 11 during operation of sander 20. The heat generated would lead to damaging the material 10, so the previous method would introduce cooling fluid 30 to the target surface 10. However, as can be seen in FIG. 1A, the cooling fluid 30 would be or introduced external to the conventional sander polisher 20 and would cool the material 10 in external areas 12, but would fail to cool the target area 11 where the conventional sander 20 is generating heat in the material 10.

FIG. 1B illustrates a cross-section of the surface 10 during sanding or polishing utilizing an apparatus according to embodiments of the present disclosure. As shown in FIG. 1B, a sander or polisher 40, according to certain embodiments, would sand or polish the target area 11 of the material 10. As shown in FIG. 1B, a sanding head 41 contacts the target 11 of the material 10 during operation of the sander or polisher 40. The sanding head 41, may also be, for example, a polishing head, a buffing head, etc. According to certain embodiments, the cooling fluid 30 may pass through the sanding head 41 to cool the target area 11 of the material 10 during operation of the sander or polisher 40. The cooling fluid 30, according to certain embodiments, is applied directly to a location where the sanding head 41 is generating heat through friction. This direct application allows the operator of the sander or polisher 40 to work continuously without damaging the material 10. Additionally, the external cooling described in FIG. 1A, requires the operator to work in dangerous working conditions, such as working in a walk-in freezer, or using hazardous cooling fluids, such as liquid nitrogen, to achieve the necessary cooling to maintain the target area 11 at temperature below the glass transition temperature of the material 10. Material 10 may include any material that requires sanding or polishing having a glass transition temperature below room temperature, or approximately 70 degrees Fahrenheit, for example certain plastics, paints, and material coatings. Another advantage to the cooling fluid 30 passing through the sanding head 41 is reducing the wear of a sanding or polishing pad (not shown in FIG. 1B) attached to the sanding head 41 due to the heat generated from friction, which can burn the sanding or polishing pad.

FIG. 2 illustrates an exemplary embodiment of an apparatus 100 for sanding or polishing a surface or material. According to the exemplary embodiment, apparatus 100 may include a sanding head 110 for sanding or polishing the target surface or material. The apparatus 100 may include a sanding housing 120 connected to the sanding head 110 and to a sander or polisher 130. The apparatus 100 may also include a handle 140 that may be connected to the sander or polisher 130. The apparatus 100 may also include at least one fluid supply source that may include at least one cooling fluid device 150. According to this exemplary embodiment, the at least one fluid supply includes two cooling fluid devices 150, but any number of cooling fluid devices 150 are contemplated, as well as any number of fluid supply sources. The at least one cooling fluid device 150 may be connected to the handle 140. The at least one cooling fluid device may also be connected to a second handle 160. At least one fluid supply line 151 may fluidly connect the at least one cooling fluid device 150 to the sanding housing 120 so that a cooling fluid may flow from the at least one cooling fluid device to the sanding head 110. According to this exemplary embodiment, the at least one fluid supply includes fluid supply lines.

The sanding head 110 may include a sanding head support structure 111 and a sanding pad (not shown in FIG. 2). The sanding head support structure 111 is discussed further below in reference to FIG. 6. As shown in FIG. 2, the sanding head 110 may be cylindrical in shape. In certain embodiments, the sanding head 110 may have a spherical shape, a conical shape, a rectangular shape, or any other shape suitable for sanding or polishing a surface.

In certain embodiments, the sanding head 110 may be removably attached to a sanding housing 120. The sanding head 110 may be configured to receive a cooling fluid at a first end and exhaust a fluid at a second end. For example, the sanding head 110 may be fluidly connected to the sanding housing 120 and the cooling fluid flows from the sanding housing 120 to the sanding head 110. In an alternative embodiment, the sanding head 110 may be fluidly connected directly to one or more fluid supply lines 151. The sanding head 110 may define a fluid flow axis passing through the center of the sanding head 110. The fluid flow axis may be substantially orthogonal to the target surface or material that the apparatus is sanding or polishing. Substantially orthogonal, according to the exemplary embodiment, may be defined as orthogonal relative to a point of contact between the sanding pad of the sanding head 110 and the target surface. The target surface or material may be concave in shape or may be substantially flat in shape. In the exemplary embodiment when the target surface or material is concave in shape, the fluid flow axis may be substantially parallel to the radius of curvature of the target surface or material. According to the exemplary embodiment shown in FIG. 2, the sanding head 110 may be attached to the sanding housing 120. The sanding housing 120 may be removably attached to a sander or polisher 130. For example, the sanding housing 120 may include a flange 123 configured to removably attach the sander or polisher 130.

In certain embodiments, the sanding housing 120 may include one or more fluid inlets (not shown in FIG. 2) configured to receive a cooling fluid. The one or more fluid supply lines 151 may be removably attached to the one or more fluid inlets.

In certain embodiments, the sanding head 110 may be removably attached to the sander or polisher 130. The sander or polisher 130 may be removably attached to a handle 140. In certain embodiments, the sander or polisher 130 may be structurally integrated into the apparatus 100 such that the sander or polisher 130 is not removably attached. The sander or polisher 130 may be an orbital sander or polisher, or a random orbital sander or polisher. The sander or polisher 130 may be powered by pneumatics or electrical power. The sander may have a motor. The motor may be a pneumatic motor or an electrical motor. The sander or polisher 130 may be an off-the-shelf product, for example, the 3M™ Elite Mini Orbital Sander. The apparatus is not limited to use of the identified off-the shelf-products it as is contemplated that most sanders could be used with the apparatus 100.

In certain embodiments, the sander or polisher 130 may be connected to one or more pneumatic fittings 170, to power the sander or polisher 130. The sander or polisher 130 may be connected to the one or more pneumatic fittings by a pneumatic connection port 171. The one or more pneumatic fittings 170 may be removably attached to the apparatus 100. The one or more pneumatic fittings may be removably attached to the handle 140. The one or more pneumatic fittings may be removably attached to the at least one cooling fluid devices 150. The one or more pneumatic fittings 170 may be removably attached to the second handle 160. The one or more pneumatic fittings 170 may be fluidly connected to one or more cooling fluid devices 150.

In certain embodiments, the second handle 160, may provide support to the one or more cooling fluid devices. The second handle 160, as shown in FIG. 2 for example, may be in the form of a structural guard to prevent hitting the one or more pneumatic fittings 170, as well as configured to provide support for the shoulder of the operator.

In certain embodiments, the at least one fluid supply source may include the at least one cooling fluid devices 150. According to an exemplary embodiment, the cooling fluid device 150 may be a vortex tube that is connected to a compressed air supply line which cools compressed air below the glass transition temperature of the material to be sanded. However, it is contemplated that the cooling fluid device 150 could be the fluid supply source for the apparatus where the cooling fluid device both stores and cools the fluid used for cooling. The cooling fluid may be, for example, compressed air, coolant, or other non-hazardous refrigerants. According to an exemplary embodiment, the cooling fluid is compressed air. In certain embodiments, the apparatus 100 may not include the cooling fluid device 150 but would receive the cooling fluid from the fluid supply source.

In certain embodiments, the at least one cooling fluid device 150 may be removably connected to the handle 140. The handle 140 may have a handle head 141 configured to connect the handle 140 to the at least one cooling fluid device 150. The handle head 141 may also provide structural support for the at least one cooling fluid device. The handle head 141 may also be configured to receive the at least one fluid supply line 151. The at least one fluid supply line 151 may be fluidly connected to the at least one cooling fluid device. For example, the at least one fluid supply line 151 may be tubing connected to the at least one cooling fluid device 150. Any suitable material for transferring fluid flow may be used for the at least one fluid supply line 151. The at least one fluid supply line 151 may be contained within at least either the handle head 141 or the sanding housing 120. In certain embodiments, the at least one fluid supply line may be a fluid flow path within the handle head 141 or the sanding housing 120.

In certain embodiments, the sander 130 may be removably attached to the handle 140. In certain embodiments, the handle 140 may be combined with the sanding housing 120 such that the handle 140 and the sanding housing 120 are a single piece.

FIG. 3 illustrates an alternative exemplary embodiment of the apparatus 100 for sanding or polishing a surface or material, where the apparatus 100 is disassembled. According to the exemplary embodiment, the sanding housing 120 may include at least one housing inlet 121 configured to receive the at least one fluid supply line 151. The at least one housing inlet may also form a fluid flow path to receive cooling fluid from the at least one cooling fluid device 150.

In certain embodiments, the sanding head 110 may include the sanding pad 112. The sanding pad 112, may be a polishing pad, or any other material suitable for sanding, polishing, or buffing. The sanding pad 112 may be porous such that the sanding pad 112 allows fluid flow to pass through the sanding pad 112.

As shown in FIG. 3, the apparatus 100 can be a modular device that can be customized to fit the needs of the operator. In certain embodiments, the apparatus 100 may include an alternative second handle 161 that includes a handle grip for the operator to hold while using the device.

The modular design of the apparatus 100, according to the exemplary embodiment of FIG. 3, is a non-limiting exemplary design. In certain embodiments, the apparatus 100 may be arranged such that the sanding housing 120, the sander 130, the handle 140, the at least one fluid supply line 151, and the second handle 161 are structurally connected such that the apparatus 100 is one structural piece. According to this embodiment, the sanding head 110, the at least one cooling fluid device 150, and the pneumatic fitting 170 may be removable. It is contemplated that all components of the apparatus 100 may be structurally connected and only the sanding pad 112 may be replaceable.

FIGS. 4A and 4B illustrate an exemplary embodiment of the sanding housing 120 and the connection of the sanding housing 120 to the sander 130. In certain embodiments, the sanding housing 120 may include the flange 123. The sanding housing 120 may be removably connected to the sander 130 via the flange 123. The flange 123 may be connected to the sander 130 by bolts, screws, or other suitable fixtures.

In certain embodiments, the sanding housing 120 may include a housing outlet 122. The housing outlet 122 may be configured to allow the cooling fluid to pass through the sanding housing 120 to the sanding head 110. The sanding head may also include at least one housing inlet 121. The sanding housing 120 may be configured to allow fluid flow to pass from the at least one housing inlet 121 to the housing outlet 122. The housing outlet 122 may be configured to removably connect to the sanding head 110. The housing outlet 122 may have a center defining a fluid flow axis. For example, according to the exemplary embodiment, the housing outlet 122 may be circular shape such that the center of the circular shape defines the center of the housing outlet 122. The fluid flow axis may pass through the center of the housing outlet 122 such that the fluid flow axis passes through the center of the sanding head 110 and is relatively orthogonal to the surface or material to be sanded or polished.

FIG. 5 illustrates an exemplary embodiment showing the partial assembly of the sanding housing 120, the sander 130, the handle 140, and the at least one fluid supply line 151. In certain embodiments, the sanding housing 120 may be axially aligned with the handle head 141 and the at least one fluid supply line 151 such that the handle head 141 and the at least one fluid supply line 151 are axially aligned with the fluid flow axis defined by the housing outlet 122.

FIG. 6 illustrates exemplary embodiments of the sanding head 110. In certain embodiments, sanding head 110 may include the sanding pad support structure 111 and the sanding pad 112. The sanding pad support structure 111 may be circular in shape and configured to connect to the housing outlet 122. The sanding pad support structure 111 may be configured to all flow fluid to travel from the housing outlet 122 to the sanding pad 112. The sanding pad support structure 111 may include a particulate filter 113. In certain embodiments, the particulate filter 113 may be aerated, or otherwise configured, to capture solid particulate while allowing the cooling fluid to pass through the particulate filter. For example, the particulate filter 113 may be integrated into the sanding pad support structure 111 such that the sanding pad support structure 111 may be aerated, or may include a plurality of holes, to capture solid particulate. The solid particulate may include ice generated by the cooling fluid, or any other solid particulate that may accumulate. In certain embodiments, the particulate filter 113 may be removably attached to the sanding pad support structure 111.

In certain embodiments, the sanding pad 112 may be abrasive pads that are suitable for sanding a surface. The sanding pad 112 may also pads that are suitable for polishing a surface. The sanding pad 112 may be porous such that the cooling fluid passes through to the target surface or material.

The present disclosure may provide numerous advantages, such as the various technical advantages that have been described with respective to various embodiments and examples disclosed herein. Other technical advantages will be readily apparent to one skilled in the art from the following figures, descriptions, claims. Moreover, while specific advantages have been enumerated in this disclosure, various embodiments may include all, some, or none of the enumerated advantages.

The scope of this disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments described or illustrated herein that a person having ordinary skill in the art would comprehend. The scope of this disclosure is not limited to the example embodiments described or illustrated herein. Moreover, although this disclosure describes and illustrates respective embodiments herein as including particular components, elements, functions, operations, or steps, any of these embodiments may include any combination or permutation of any of the components, elements, functions, operations, or steps described or illustrated anywhere herein that a person having ordinary skill in the art would comprehend. Furthermore, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative.

Although the present disclosure has been described with several embodiments, a myriad of changes, variations, alterations, transformations, and modifications may be suggested to one skilled in the art, and it is intended that the present disclosure encompass such changes, variations, alterations, transformations, and modifications as fall within the scope of the appended claims.

Cooling Orbital Lapping Device

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