Claims
- 1. A cooling plate provided with a cooling medium passage therein, said cooling medium passage being formed by integrally joining a plurality of metal plates each having a cooling medium passage forming groove on a joining surface thereof, characterized in that: an anodic oxide film is formed on at least said cooling medium passage forming groove on said joining surface, and said plurality of metal plates are integrally joined each other by a friction agitation joining method.
- 2. The cooling plate as recited in claim 1, wherein said anodic oxide film is formed on an entire surface of said joining surface of said metal plate.
- 3. The cooling plate as recited in claim 1, wherein at least a vicinity of a peripheral portion of said cooling medium passage in a gap between joined metal plates is fluid-tightly sealed with a sealing agent.
- 4. The cooling plate as recited in claim 3, wherein said sealing agent is metal material.
- 5. The cooling plate as recited in claim 3, wherein said sealing agent is waterproof resin adhesive.
- 6. The cooling plate as recited in claim 5, wherein said waterproof resin adhesive is one or more resins selected from a group consisting of epoxy family resin, phenol family resin and polyolefin family resin.
- 7. The cooling plate as recited in claim 1, wherein said metal plate is an aluminum plate.
- 8. The cooling plate as recited in claim 1, wherein said anodic oxide film is formed on an entire surface of said joining surface of said metal plate, wherein at least a vicinity of a peripheral portion of said cooling medium passage in a gap between joined metal plates is fluid-tightly sealed with a sealing agent, and wherein said metal plate is an aluminum plate.
- 9. The cooling plate as recited in claim 8, wherein said sealing agent is metal material.
- 10. The cooling plate as recited in claim 8, wherein said sealing agent is waterproof resin adhesive.
- 11. The cooling plate as recited in claim 10, wherein said waterproof resin adhesive is one or more resins selected from a group consisting of epoxy family resin, phenol family resin and polyolefin family resin.
- 12. A method for manufacturing a cooling plate, comprising:
a first step for forming a cooling medium passage forming groove on each joining surface of a plurality of metal plates; a second step for forming an anodic oxide film by anodizing joining surfaces of said metal plates; and a third step for integrally joining said plurality of metal plates with said plurality of metal plates stacked by a friction agitation joining method.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-185859 |
Jun 2001 |
JP |
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CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to Japanese Patent Application No. 2001-185859 filed on Jun. 20, 2001 and U.S. Provisional Patent Application No. 60/330,927 filed on Nov. 2, 2001, the disclosure of which is incorporated by reference in its entirety.
[0002] This application is an application filed under 35 U.S.C. §111(a) claiming the benefit pursuant to 35 U.S.C. §119(e)(1) of the filing date of Provisional Application No. 60/330,927 filed on Nov. 2, 2001 pursuant to 35 U.S.C. §111(b).
Provisional Applications (1)
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Number |
Date |
Country |
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60330927 |
Nov 2001 |
US |