Claims
- 1. A cooling plate provided with a cooling medium passage therein, said cooling plate comprising:a plurality of metal plates having flat joining surfaces respectively, a cooling medium passage forming groove being formed on each of said flat joining surfaces, said plurality of metal plates being integrally joined by a friction agitation joining method to thereby form said cooling medium passage; an anodic oxide film formed on said cooling medium passage forming groove; and a sealing agent disposed between said flat joining surfaces to fluid-tightly seal a gap formed between said flat joining surfaces along a periphery of said cooling medium passage.
- 2. The cooling plate as recited in claim 1, wherein said anodic oxide film is formed on an entire surface of each of said joining surfaces.
- 3. The cooling plate as recited in claim 1, wherein said sealing agent is metal material.
- 4. The cooling plate as recited in claim 1, wherein said sealing agent is waterproof resin adhesive.
- 5. The cooling plate as recited in claim 4, wherein said waterproof resin adhesive is one or more resins selected from a group consisting of epoxy family resin, phenol family resin and polyolefin family resin.
- 6. The cooling plate as recited in claim 1, wherein said plurality of metal plates are aluminum plates.
- 7. A cooling plate provided with a cooling medium passage therein, said cooling plate comprising:a plurality of metal plates having flat joining surfaces respectively, a cooling medium passage forming groove being formed on each of said flat joining surfaces, said plurality of metal plates being integrally joined by a friction agitation joining method to thereby form said cooling medium passage; an anodic oxide film formed on said cooling medium passage forming groove and an entire surface of each of said flat joining surfaces; and a sealing agent disposed between said flat joining surfaces to fluid-tightly seal a gap formed between said flat joining surfaces along a periphery of said cooling medium passage, wherein each of said plurality of metal plates is an aluminum plate.
- 8. The cooling plate as recited in claim 7, wherein said sealing agent is metal material.
- 9. The cooling plate as recited in claim 7, wherein said sealing agent is waterproof resin adhesive.
- 10. The cooling plate as recited in claim 9, wherein said waterproof resin adhesive is one or more resins selected from a group consisting of epoxy family resin, phenol family resin and polyolefin family resin.
CROSS REFERENCE TO RELATED APPLICATIONS
This application claims priority to Japanese Patent Application No. 2001-185859 filed on Jun. 20, 2001 and U.S. Provisional Patent Application No. 60/330,927 filed on Nov. 2, 2001, the disclosure of which is incorporated by reference in its entirety.
This application is an application filed under 35 U.S.C. §111(a) claiming the benefit pursuant to 35 U.S.C. §119(e)(1) of the filing date of Provisional Application No. 60/330,927 filed on Nov. 2, 2001 pursuant to 35 U.S.C. §111(b).
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
6344117 |
Enomoto et al. |
Feb 2002 |
B2 |
20020153130 |
Okamoto et al. |
Oct 2002 |
A1 |
Foreign Referenced Citations (4)
Number |
Date |
Country |
1-16225 |
Mar 1989 |
JP |
2000-73164 |
Mar 2000 |
JP |
2000-248399 |
Sep 2000 |
JP |
2000-311932 |
Nov 2000 |
JP |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/330927 |
Nov 2001 |
US |