Claims
- 1. A copolyimide having the recurring structure ##STR9## wherein AR is AR.sub.1 or AR.sub.2, wherein AR.sub.1 is ##STR10## and wherein AR.sub.2 is ##STR11## provided that the molar ratio of AR.sub.1 to AR.sub.2 is 3:1 to 1:3 and wherein AR.sub.3 is selected from the group consisting of ##STR12## provided that no endcapping reagent is used in the preparation of the polymer.
- 2. A copolyimide according to claim 1 in which the molar ratio of AR.sub.1 to AR.sub.2 is 2:1 to 1:2.
- 3. A copolyimide according to claim 1 in which the molar ratio of AR.sub.1 to AR.sub.2 is 1.5:1 to 1:1.5.
- 4. A copolyimide according to claim 1 in which the molar ratio of AR.sub.1 to AR.sub.2 is 1:1.
- 5. An article comprising an electrically conductive material coated with a copolyimide according to claim 1.
- 6. An article comprising an electrically conductive material coated with a copolyimide according to claim 2.
- 7. An article comprising an electrically conductive material coated with a copolyimide according to claim 3.
- 8. An article comprising an electrically conductive material coated with a copolyimide according to claim 4.
- 9. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 1, and optional bonding materials between said layers.
- 10. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 2, and optional bonding materials between said layers.
- 11. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 3, and optional bonding materials between said layers.
- 12. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 4, and optional bonding materials between said layers.
- 13. A copolyimide having the recurring structure ##STR13## wherein AR is either AR.sub.1 or AR.sub.2, wherein AR.sub.1 is ##STR14## and wherein AR.sub.2 is ##STR15## provided that the molar ratio of AR.sub.1 to AR.sub.2 is 3:1 to 1:3, and wherein AR.sub.3 is selected from the group consisting of ##STR16## terminated by an unreactive endcap.
- 14. A copolyimide according to claim 13 in which the molar ratio of AR.sub.1 to AR.sub.2 is 2:1 to 1:2.
- 15. A copolyimide according to claim 13 in which the molar ratio of AR.sub.1 to AR.sub.2 is 1.5:1 to 1:1.5.
- 16. A copolyimide according to claim 13 in which the molar ratio of AR.sub.1 to AR.sub.2 is 1:1.
- 17. An article comprising an electrically conductive material coated with a copolyimide according to claim 13.
- 18. An article comprising an electrically conductive material coated with a copolyimide according to claim 14.
- 19. An article comprising an electrically conductive material coated with a copolyimide according to claim 15.
- 20. An article comprising an electrically conductive material coated with a copolyimide according to claim 16.
- 21. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 13, and optionally bonding materials between said layers.
- 22. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 14, and optional bonding materials between said layers.
- 23. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layer of a copolyimide according to claim 15, and optional bonding materials between said layers.
- 24. An article in the form of a tape comprising an electrically conductive layer which may be fashioned into electrically conductive leads suitable for attachment to a semiconductor device, a layers of the copolyimide according to claim 16, and optional bonding materials between said layers.
Parent Case Info
This invention is a continuation-in-part of U.S. Ser. No. 07/427,286, filed Oct. 26, 1989, copending herewith, now U.S. Pat. No. 5,077,382.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
63-264121 |
Nov 1988 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
427286 |
Oct 1989 |
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