Organic substrates

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H01L23/145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/145Organic substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective use of different advanced interface bus with electronic c...
- Patent number 12,334,449
- Issue date Jun 17, 2025
- Altera Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standardized commodity programmable logic semi...
- Patent number 12,255,195
- Issue date Mar 18, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having conductive p...
- Patent number 12,159,822
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supports for thinned semiconductor substrates and related methods
- Patent number 12,132,005
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive resin composition, photosensitive resin film, printe...
- Patent number 12,103,999
- Issue date Oct 1, 2024
- Resonac Corporation
- Akihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,100,672
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Glass core package substrates
- Patent number 12,080,632
- Issue date Sep 3, 2024
- Advanced Micro Devices, Inc.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 12,074,122
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing electrical connection bo...
- Patent number 12,040,245
- Issue date Jul 16, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maleimide resin composition, prepreg, laminated board, resin film,...
- Patent number 12,024,624
- Issue date Jul 2, 2024
- Resonac Corporation
- Naoyoshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monofunctional phenolic compound, active ester resin and method for...
- Patent number 12,017,980
- Issue date Jun 25, 2024
- DIC Corporation
- Masaki Hazama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, metal-clad laminated plate, insula...
- Patent number 12,021,015
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Tamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having protrusions as fixing structures
- Patent number 12,014,963
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Articles including metallized vias
- Patent number 12,004,295
- Issue date Jun 4, 2024
- Corning Incorporated
- Shrisudersan Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having protrusions as fixing structures
- Patent number 11,978,684
- Issue date May 7, 2024
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS
- Publication number 20250201656
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...
- Publication number 20250188263
- Publication date Jun 12, 2025
- Resonac Corporation
- Naoyoshi SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
- Publication number 20250183240
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Mudit Sunilkumar Khasgiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183163
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250174543
- Publication date May 29, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250174568
- Publication date May 29, 2025
- InnoLux Corporation
- Po-Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250167059
- Publication date May 22, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES
- Publication number 20250167125
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...
- Publication number 20250149393
- Publication date May 8, 2025
- ABSOLICS INC.
- Hyejin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250149529
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A FAN-OUT LEVEL PACKAGE
- Publication number 20250140619
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250118721
- Publication date Apr 10, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250112166
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250112115
- Publication date Apr 3, 2025
- Resonac Corporation
- Masaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096070
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE SAME
- Publication number 20250069968
- Publication date Feb 27, 2025
- LAPIS Semiconductor Co., Ltd.
- Shohei HIEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...
- Publication number 20250062203
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Hi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSI...
- Publication number 20250054821
- Publication date Feb 13, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...
- Publication number 20250038086
- Publication date Jan 30, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin Fiber Sheet, Prepreg and Method for Producing Prepreg
- Publication number 20250034344
- Publication date Jan 30, 2025
- Asahi Kasei Kabushiki Kaisha
- Shinichiro Tachibana
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GLASS CORE PACKAGE SUBSTRATES
- Publication number 20250029900
- Publication date Jan 23, 2025
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20250022808
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Publication number 20240413237
- Publication date Dec 12, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS

Organic substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective use of different advanced interface bus with electronic c...

Robust mold integrated substrate

Semiconductor device having an integrated device positioned within...

Logic drive based on standardized commodity programmable logic semi...

Package structure, RDL structure comprising redistribution layer ha...

Electronic device and method of manufacturing electronic device

Method of manufacturing a semiconductor package having conductive p...

Semiconductor device and method of forming ultra high density embed...

Organic interposer including a dual-layer inductor structure and me...

Supports for thinned semiconductor substrates and related methods

Thermosetting resin composition for semiconductor package, prepreg...

Photosensitive resin composition, photosensitive resin film, printe...

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Semiconductor device and method of manufacture

Thermosetting resin composite and metal clad laminate using the same

Glass core package substrates

Inductor structure, semiconductor package and fabrication method th...

Chip package structure with multiple gap-filling layers and fabrica...

Semiconductor device

Circuit board and method for manufacturing electrical connection bo...

Maleimide resin composition, prepreg, laminated board, resin film,...

Monofunctional phenolic compound, active ester resin and method for...

Thermosetting resin composition, metal-clad laminated plate, insula...

Semiconductor packages having a die, an encapsulant, and a redistri...

Power semiconductor module having protrusions as fixing structures

High density organic bridge device and method

Articles including metallized vias

Substrate and method for manufacturing the same

Power semiconductor module having protrusions as fixing structures

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS

RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE

SEMICONDUCTOR PACKAGE

Multi-Layered Metal Frame Power Package

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

POWER CONVERSION DEVICE

BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES

SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

SEMICONDUCTOR PACKAGE WITH A FAN-OUT LEVEL PACKAGE

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE SAME

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSI...

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...

Resin Fiber Sheet, Prepreg and Method for Producing Prepreg

GLASS CORE PACKAGE SUBSTRATES

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS