Claims
- 1. A copper film coated substrate, comprising:
- an organic substrate having a surface which has been irradiated with inert gas ions; and
- a copper crystal film formed on said surface of (111) orientation predominate and said copper film has an X-ray diffraction intensity of 2.0 cps/nm or more per unit film thickness at a crystal orientation (111) face of said copper film.
- 2. A copper film coated substrate as claimed in claim 1, wherein said substrate is an organic film.
Priority Claims (3)
Number |
Date |
Country |
Kind |
4-70389 |
Feb 1992 |
JPX |
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4-66239 |
Mar 1992 |
JPX |
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4-84299 |
Apr 1992 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 07/892,378, filed Jun. 4, 1992, now U.S. Pat. No. 5,316,802.
US Referenced Citations (8)
Foreign Referenced Citations (3)
Number |
Date |
Country |
1547700 |
Oct 1967 |
EPX |
0206145 |
Dec 1986 |
EPX |
1075663 |
Mar 1989 |
JPX |
Non-Patent Literature Citations (2)
Entry |
EPO Search Report. |
"Formation of Copper Thin Film by a Low Kinetic Energy Particle Process", Tadahiro Ohmi, 1046 Journal of the Electrochemical Society 138 (1991) Apr., No. 4, Manchester, NH, US. |
Divisions (1)
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Number |
Date |
Country |
Parent |
892378 |
Jun 1992 |
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