Metals Technology, Feb. 1975, "Effect of Certain Impurity Elements on the Wetting Properties of 60% Tin-40% Lead Solders", pp. 73-85. |
Webster's Unabridged Dictionary of the English Language, p. 1500, published 1989 by Portland House, New York. |
Mechanics of Patent Claim Drafting by John Landis, 2d. ed., pp. 143-167, published Nov. 1974 by Practising Law Institute, New York. |
Metals Handbook 8th ed., vol. 8, p. 299, 1973. |
Research Disclosure, Apr. 1989, No. 300, Kenneth Mason Publications, Ltd., England, "Copper Enhanced Solder Paste". |
IBM Technical Disclosure Bulletin, Aug., 1976, p. 834, "Component Rework with Low Melt Solder". |
Solders and Soldering, H. H. Manko, 1964, pp. 65-66, McGraw-Hill Book Co., New York, London, Toronto. |
Properties of Solders, Product flyer from Multicore on Savbit Solder, from Multicore, Cantiague Rock Road, Westbury, New York, 11590, undated. |
"Wetting Properties of Tin-Lead Solders", journal article in Metals Technology, Feb., 1975 by Ackroyd et al., pp. 73-85. |
Metals Handbook, Desk Edition, by the American Society for Metals, pp. 28-34, Metals Park, Ohio, copyright 1985. |