Claims
- 1. A method for fabricating an assembly on a substrate comprising the steps of:
- forming a multilayer structure comprising a layer of gold on a surface of the substrate;
- forming a photoresist mask over the substrate including the multilayer structure;
- depositing an aluminum layer through an opening in the mask at a portion of the substrate spaced from the multilayer;
- depositing a protection layer over the aluminum layer, the protection layer being selected from the group consisting of titanium, Zirconium, Hafnium, Vanadium, Niobium, Tantalum, Chromium, Molybdenum and Tungsten;
- stripping the photoresist mask from the surface of the substrate; and
- removing the protection layer from over the aluminum layer.
- 2. The method according to claim 1 wherein the assembly is an optoelectronics assembly.
- 3. The method according to claim 2 wherein the aluminum layer is deposited in a cavity formed in the substrate adjacent to the multilayer.
- 4. The method according to claim 1 wherein the thickness of the protection layer is within the range 250 to 2000 .ANG..
- 5. The method according to claim 1 wherein the protection layer is formed by electron beam evaporation.
- 6. The method according to claim 1 wherein the substrate is silicon.
- 7. The method according to claim 1 wherein the photoresist mask is stripped in by an electrolytic solution.
- 8. The method according to claim 1 wherein the multilayer comprises titanium, platinum and gold.
- 9. A method for fabricating an assembly on a substrate comprising the steps of:
- forming a structure comprising at least one layer on a surface of the substrate, at least one layer of said structure being gold;
- forming a photoresist mask over the substrate including the structure;
- depositing an aluminum layer through an opening in the mask at a portion of the substrate spaced from the structure;
- depositing a titanium protection layer over the aluminum layer;
- stripping the photoresist mask from the surface of the substrate; and
- removing the protection layer from over the aluminum layer.
Parent Case Info
This application is a continuation of, and claims priority from, application Ser. No. 08/919,918, filed on Aug. 28, 1997 now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5178319 |
Coucoulas |
Jan 1993 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
919918 |
Aug 1997 |
|