Embodiments of the invention relate to the enhancement of metal surface electrical conductivity, corrosion resistance and the electrode reaction activity for electrochemical applications. More specifically, the embodiments disclosed herein relate to the use of titanium alloys and an electrically conductive titanium oxide to modify a metal surface for electrochemical applications that typically need the high corrosion resistant and electrically conductive surface of metallic components.
Metallic materials are widely used in various electrochemical devices, including the electrode in a chlor-alkali process and the separator plates in fuel cells. Metal components are also used in batteries, electrolyzers and electrochemical gas separation devices. In most of these applications, the surface of the metal components need to have high electrical conductance (or low electrical resistance) to reduce the internal electrical losses of the electrochemical devices, or high activity for electrode reactions to reduce electrode polarization, for high operation efficiency. The major challenge for this application is that the metal component must also have high corrosion resistance while maintaining its high electrical conductance. In applications using metal as an electrode, the metal surface should have high catalytic activity for a highly efficient electrode reaction.
U.S. Pat. No. 6,649,031 discloses fuel cell metal bipolar plates that are coated with a corrosion resistant and electrically conductive carbon layer that with a sub-layer between the metal substrate and coating layer. In order to further improve the corrosion resistance, the coating layer is treated with an overcoating sealing that seals off the pores in the carbon layer.
U.S. Pat. No. 6,689,213 discloses a fuel cell metal bipolar plate that has a multi-phase surface coating. One phase is metal, and the other phase is a compound phase that consists of metal nitride, oxide, carbide or boride.
US patent application publication no. 2006/0134501 discloses a fuel cell metal separator plate that has an electrically conductive, corrosion resistant surface layer on a metal substrate. The surface layer comprises metal carbides, metal borides, and metal oxides. There is a metal layer between the surface layer and the metal substrate to improve the adhesion of the surface layer and the metal substrate. It has Cr-rich surface passive film.
US Patent application publication no. 2009/0269649 discloses a fuel cell stainless steel separator plate that has an electrically conductive and corrosion resistant surface layer that comprises metal nitride, carbide and metal boride. The surface layer is deposited on the surface modified stainless steel.
US Patent application publication no. 2008/0107928 discloses a fuel cell bipolar plate that has a gold (Au) or platinum (Pt) surface layer and an oxygen containing interface layer.
US Patent application publication no. 2009/0015029 discloses fuel cell bipolar plates that are coated with an electrically conductive layer. The conductive layer could be carbon, molybdenum doped indium oxide, chromium nitride or an MoSi2 layer. The '029 publication does not specifically disclose an underlayer between the conductive coating layer and the substrate layer.
US Patent application publication no. 2007/0003813 discloses using conductive oxide including doped TiO2 as a surface coating layer in fuel cells. The deposition process includes physical vapor deposition.
There remains a need for a method that produces metal components for electrochemical devices that need high electrical conductance, corrosion resistance and electrode reaction activities for long term operation at a low cost.
In the following detailed description, a plurality of specific details, such as types of materials and dimensions, are set forth in order to provide a thorough understanding of the preferred embodiments discussed below. The details discussed in connection with the preferred embodiments should not be understood to limit the present inventions. Furthermore, for ease of understanding, certain method steps are delineated as separate steps; however, these steps should not be construed as necessarily distinct nor order dependent in their performance.
An object of the embodiments disclosed herein is to provide a metal surface that has a titanium alloy layer deposited therein and that can grow an electrically conductive doped titanium oxide on the surface of the alloy. The possible applications of the disclosed embodiments include use in electrochemical devices, including fuel cells, batteries, electrolyzers, and gas separation devices. It should be appreciated that growing the doped titanium oxide is a much better technique as it provides better qualities (e.g., better adhesive qualities) than deposition methods.
An advantage of the disclosed methods are that they can produce metal components for electrochemical devices that need high electrical conductance, corrosion resistance and electrode reaction activities for long term operation at a low cost. As is explained below, these devices include fuel cells, batteries, electrolyzers and gas separation devices.
Regular titanium oxide (titania) is an electrical insulator in the form of TiO2 in which titanium is in the valence status of Ti+4. Through certain processes, some Ti+4 can be converted to lower chemical valences such as Ti+3 and Ti+2. The co-existence of multiple valance Ti in the oxide can make the titanium oxide an excellent electrical conductor (i.e., electrically conductive titania).
One way to convert Ti+4 to lower chemical valences is to reduce TiO2 at high temperature, and quench it to room temperature to “freeze” the Ti+3 and Ti+2. The final formulation of the reduced titanium oxide (i.e., reduced titania) is TiOx, where x is less than 2.
A more reliable way is to dope high valence element oxides (e.g., M2O5 or MO3) into TiO2 to form a solid solution of the dopant oxide and TiO2 (i.e., doped titania, M:TiOx). The high valence of the dopant will stabilize low valence (+2 and +3) titanium in the titanium oxide crystal structure, which will make the doped titania electrically conductive. The common dopants are niobium (Nb) and tantalum (Ta).
It is known that directly depositing oxides on a metal surface has the risks of poor adhesion of the oxides to the metal surface. This problem is overcome in the embodiments disclosed herein by growing titanium oxide on a titanium alloy for better adhesion.
The embodiments disclosed herein use electrically conductive titania grown on a titanium alloy that is coated on a metal substrate surface to improve the surface electrical resistance, corrosion resistance and electrode reaction activity of the metal for electrochemical applications. The embodiments also form the doped titania on the surface of titanium alloys.
According to the disclosed principles, the titanium alloy could be deposited by various deposition techniques, including e.g., vapor deposition (physical or chemical) and thermal spray. Then, the electrically conductive titania could be grown on a titanium alloy surface. The titanium alloy has the proper concentration of the dopant elements as the alloy elements. The concentration is within the range of 1%-30%, preferably between %-10%. The titanium alloy can be deposited on a lower cost metal substrate surface. It can cover the entire substrate surface or a partial surface of the metal substrate.
The metal substrate could be corrosion resistive metal, such as titanium, niobium, zirconium, tantalum, chromium, nickel and their alloys, or low cost carbon steel, stainless steel, copper, aluminum and their alloys with a corrosion resistive surface treatment.
In one embodiment, the titanium alloy contains, among other things, high valence (e.g., greater than +4) elements, such as e.g., niobium (Nb), tantalum (Ta), vanadium (V), arsenic (As), selenium (Se), antimony (Sb), molybdenum (Mo), or tungsten (W). The doped titania layer can grow naturally on the alloy surface during its application. It can also grow through a special treatment step, such as thermal oxidization, anodizing and plasma oxidation.
A schematic drawing of a first embodiment is shown in
In another embodiment, the titanium alloy is deposited to partially cover the metal substrate surface. Referring to
It should be appreciated that the embodiments of
In one application, a niobium doped titania (Nb:TiOx) layer is deposited on a stainless steel substrate surface by e.g., a physical vapor deposition process. The Nb concentration in the doped titania is 2-10%. The thickness of the Nb doped titania is 0.1 p.m. This plate can be used as a separator plate for proton exchange membrane (PEM) fuel cells an example of which is shown in
An example fuel cell stack 10 disposed in a container 19 is shown in
In another application, a thin Ti15Nb alloy (e.g., 85% wt Ti, 15% wt Nb alloy) layer is deposited on a titanium substrate surface by e.g., a physical vapor deposition process. The thickness of the Ti15Nb layer is 0.5 μm. Then, the coated titanium substrate is thermally oxidized at 600° C. to obtain the stable Nb doped titania surface layer. This coated titanium substrate can be used as the components in water electrolyzer cells. Specifically, the coated titanium substrate could be used as a single piece bipolar plate and/or an oxygen gas diffusion layer in an electrolyzer cell, an example of which is shown in
In one further application, particles of Ti20Ta (e.g., 80% wt Ti, 20% wt Ta) alloy is deposited on a titanium substrate by thermal spray process. Then, the coated titanium substrate is thermally oxidized at 450° C. in air to obtain the Ta doped titania surface layer on the Ti20Ta alloy particles. This coated Ti plate can be used as the electrode of soluble lead acid flow batteries, such as the battery 722 shown in
In yet another application, a Ti20Nb alloy is used as a separate plate and/or an electrode for vanadium redox flow batteries. After the substrate is formed to the desired shape, it is anodized at a high voltage to grow a layer of e.g., Nb doped titania. Then, the Ti alloy substrate with the doped titania is heat treated at high temperature to form a better crystalized structure. The high surface area of the conductive titania will have the high electrode reaction activity needed for vanadium ion redox reactions in the vanadium redox flow battery, such as the example battery 800 shown in
The typical flow battery is the all liquid flow battery that all reactants and products of the electrode reaction are liquid, can flow in and out of the cell EC. Another type is the semi-flow battery, the at least one electrode reaction is liquid to solid. This type of flow battery include Zr—Br battery (include zinc ion to zinc metal reaction), and all iron battery (include iron ion to iron metal reaction). The metal plate can be used as the electrode.
As mentioned above, it should be appreciated that embodiments disclosed herein are not limited to the specific features discussed above. For example, although not shown, in the embodiments of
The foregoing examples are provided merely for the purpose of explanation and are in no way to be construed as limiting. While reference to various embodiments is made, the words used herein are words of description and illustration, rather than words of limitation. Further, although reference to particular means, materials, and embodiments are shown, there is no limitation to the particulars disclosed herein. Rather, the embodiments extend to all functionally equivalent structures, methods, and uses, such as are within the scope of the appended claims.
Additionally, the purpose of the Abstract is to enable the patent office and the public generally, and especially the scientists, engineers and practitioners in the art who are not familiar with patent or legal terms or phraseology, to determine quickly from a cursory inspection the nature of the technical disclosure of the application. The Abstract is not intended to be limiting as to the scope of the present inventions in any way.
This application is a continuation of U.S. patent application Ser. No. 13/776,042 filed Feb. 25, 2013, which claims priority from U.S. Provisional Application Ser. No. 61/602,253 filed Feb. 23, 2012 and U.S. Provisional Application Ser. No. 61/760,767 filed on Feb. 5, 2013, the entireties of which are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
4223049 | Murray et al. | Sep 1980 | A |
4255247 | Oda et al. | Mar 1981 | A |
4411762 | Kline | Oct 1983 | A |
4443317 | Kawashima et al. | Apr 1984 | A |
4457822 | Asano et al. | Jul 1984 | A |
4468416 | Asano et al. | Aug 1984 | A |
4581117 | Asano et al. | Apr 1986 | A |
4618404 | Pellegri | Oct 1986 | A |
4686017 | Young | Aug 1987 | A |
5143746 | Inoue et al. | Sep 1992 | A |
5202152 | Giannelis et al. | Apr 1993 | A |
5204140 | Grosvenor et al. | Apr 1993 | A |
5290415 | Shimamune et al. | Mar 1994 | A |
5294319 | Kaczur et al. | Mar 1994 | A |
5298095 | Russo et al. | Mar 1994 | A |
5364513 | Sekhar et al. | Nov 1994 | A |
5419824 | Weres et al. | May 1995 | A |
5521029 | Fiorino et al. | May 1996 | A |
5531875 | Shimamune et al. | Jul 1996 | A |
5962904 | Hu | Oct 1999 | A |
6060229 | Eichorst et al. | May 2000 | A |
6071570 | Hardee et al. | Jun 2000 | A |
6121134 | Burton et al. | Sep 2000 | A |
6231731 | Kondo et al. | May 2001 | B1 |
6270831 | Kumar et al. | Aug 2001 | B2 |
6455107 | Sekhar et al. | Sep 2002 | B1 |
6527924 | Andolfatto et al. | Mar 2003 | B1 |
6761808 | Revill et al. | Jul 2004 | B1 |
7077895 | Akui et al. | Jul 2006 | B2 |
7258778 | Hardee | Aug 2007 | B2 |
7294248 | Gao | Nov 2007 | B2 |
7318974 | Ohara et al. | Jan 2008 | B2 |
7422671 | Bhatia et al. | Sep 2008 | B2 |
7510792 | Nakanishi et al. | Mar 2009 | B2 |
7592037 | Uchiyama et al. | Sep 2009 | B2 |
7722989 | Ohzuku et al. | May 2010 | B2 |
7736772 | Sarkar et al. | Jun 2010 | B2 |
7901742 | Shirono et al. | Mar 2011 | B2 |
8007643 | Faita et al. | Aug 2011 | B2 |
8043692 | Zhuk et al. | Oct 2011 | B2 |
8173320 | Takata et al. | May 2012 | B2 |
8349248 | Trotzschel et al. | Jan 2013 | B2 |
20020018105 | Usui et al. | Feb 2002 | A1 |
20020192527 | Seido et al. | Dec 2002 | A1 |
20030151032 | Ito et al. | Aug 2003 | A1 |
20030170980 | Moriya et al. | Sep 2003 | A1 |
20030232136 | Fukuda et al. | Dec 2003 | A1 |
20040003993 | Weres et al. | Jan 2004 | A1 |
20040038111 | Eddy et al. | Feb 2004 | A1 |
20040053049 | Tsunashima et al. | Mar 2004 | A1 |
20040110058 | Lee et al. | Jun 2004 | A1 |
20040151952 | Brady et al. | Aug 2004 | A1 |
20040168927 | Matsushita | Sep 2004 | A1 |
20040176828 | O'Brien | Sep 2004 | A1 |
20040188247 | Hardee | Sep 2004 | A1 |
20040203221 | Matsuda et al. | Oct 2004 | A1 |
20040226817 | Hosonuma | Nov 2004 | A1 |
20040241490 | Finley | Dec 2004 | A1 |
20040244648 | Akui et al. | Dec 2004 | A1 |
20040247978 | Shimamune | Dec 2004 | A1 |
20050147870 | Nakanishi et al. | Jul 2005 | A1 |
20050191504 | Brady | Sep 2005 | A1 |
20050205165 | Akui et al. | Sep 2005 | A1 |
20050221158 | Yamauchi et al. | Oct 2005 | A1 |
20060134501 | Lee et al. | Jun 2006 | A1 |
20060188775 | Mance et al. | Aug 2006 | A1 |
20060251800 | Weidman et al. | Nov 2006 | A1 |
20060278123 | Wirth | Dec 2006 | A1 |
20060289057 | Gonda et al. | Dec 2006 | A1 |
20070031694 | Hosonuma et al. | Feb 2007 | A1 |
20070034505 | Ikematsu et al. | Feb 2007 | A1 |
20070066053 | Furuya | Mar 2007 | A1 |
20070202361 | Frauchiger et al. | Aug 2007 | A1 |
20070264821 | Kim et al. | Nov 2007 | A1 |
20080076004 | Rodak et al. | Mar 2008 | A1 |
20080115810 | Kato | May 2008 | A1 |
20080245661 | Beckmann et al. | Oct 2008 | A1 |
20090017318 | Ruuttu et al. | Jan 2009 | A1 |
20090061210 | Ruuttu et al. | Mar 2009 | A1 |
20090061272 | Blennow et al. | Mar 2009 | A1 |
20090126787 | Ruuttu et al. | May 2009 | A1 |
20090136739 | Ruuttu et al. | May 2009 | A1 |
20090166812 | Ruuttu et al. | Jul 2009 | A1 |
20090176120 | Wang | Jul 2009 | A1 |
20090200162 | Faita et al. | Aug 2009 | A1 |
20090202736 | Horie et al. | Aug 2009 | A1 |
20090211667 | Suzuki et al. | Aug 2009 | A1 |
20090214926 | Watanabe et al. | Aug 2009 | A1 |
20090214927 | Dadheech et al. | Aug 2009 | A1 |
20090218228 | Inbe et al. | Sep 2009 | A1 |
20090242417 | Cao et al. | Oct 2009 | A1 |
20090253025 | Whitacre | Oct 2009 | A1 |
20090269649 | Jeon et al. | Oct 2009 | A1 |
20090297918 | Sasaoka et al. | Dec 2009 | A1 |
20100025253 | Yoshioka et al. | Feb 2010 | A1 |
20100071810 | Nadaud et al. | Mar 2010 | A1 |
20100084259 | Kato et al. | Apr 2010 | A1 |
20100086793 | Kawashita et al. | Apr 2010 | A1 |
20100132786 | Inoue et al. | Jun 2010 | A1 |
20100136366 | Sasaoka | Jun 2010 | A1 |
20100221489 | Lappalainen et al. | Sep 2010 | A1 |
20100233587 | Sato et al. | Sep 2010 | A1 |
20100260928 | Hasegawa et al. | Oct 2010 | A1 |
20100261034 | Cardarelli | Oct 2010 | A1 |
20100291467 | Ji et al. | Nov 2010 | A1 |
20100310969 | Maeda et al. | Dec 2010 | A1 |
20100311289 | Sullivan et al. | Dec 2010 | A1 |
20110001153 | Tchakarov et al. | Jan 2011 | A1 |
20110048525 | Yoneya et al. | Mar 2011 | A1 |
20110065024 | Jeon et al. | Mar 2011 | A1 |
20110168253 | Yamada et al. | Jul 2011 | A1 |
20110192458 | Doi et al. | Aug 2011 | A1 |
20110232743 | Yamaguchi et al. | Sep 2011 | A1 |
20110262757 | Lu et al. | Oct 2011 | A1 |
20110311732 | Bignon et al. | Dec 2011 | A1 |
20110318600 | Matsunaga et al. | Dec 2011 | A1 |
20120017979 | Igarashi et al. | Jan 2012 | A1 |
20120031483 | Obana et al. | Feb 2012 | A1 |
20120040254 | Amendola et al. | Feb 2012 | A1 |
20120085571 | Niksa et al. | Apr 2012 | A1 |
20120094075 | Peter et al. | Apr 2012 | A1 |
20120094215 | Satou et al. | Apr 2012 | A1 |
20120103828 | Bulan et al. | May 2012 | A1 |
20120125785 | Gulla et al. | May 2012 | A1 |
20120171468 | Tanaka et al. | Jul 2012 | A1 |
20120211048 | Murofushi et al. | Aug 2012 | A1 |
20120222963 | Ishida et al. | Sep 2012 | A1 |
20120295184 | Watanabe et al. | Nov 2012 | A1 |
20130056360 | Lu et al. | Mar 2013 | A1 |
Number | Date | Country |
---|---|---|
1300874 | Jun 2001 | CN |
101667647 | Mar 2010 | CN |
101748427 | Jun 2010 | CN |
101853945 | Oct 2010 | CN |
202094217 | Dec 2011 | CN |
34 32 652 | Mar 1986 | DE |
0 845 281 | Jun 1998 | EP |
1 449 891 | Aug 2004 | EP |
11-273693 | Oct 1999 | JP |
2005-005137 | Jan 2005 | JP |
2005-174572 | Jun 2005 | JP |
2005293862 | Oct 2005 | JP |
2008-121087 | May 2008 | JP |
2009-102676 | May 2009 | JP |
2001-0040354 | May 2001 | KR |
2330124 | Jul 2008 | RU |
2419686 | May 2011 | RU |
WO 9417224 | Aug 1994 | WO |
WO 9637005 | Nov 1996 | WO |
WO 9727344 | Jul 1997 | WO |
WO 9936193 | Jul 1999 | WO |
WO 03067683 | Aug 2003 | WO |
WO 2007096485 | Aug 2007 | WO |
WO 2009118991 | Oct 2009 | WO |
WO2010007918 | Jan 2010 | WO |
Entry |
---|
International Search report issued in International Application No. PCT/US2013/027630, dated May 23, 2013. |
Written Opinion issued in International Application No. PCT/US2013/027630, dated May 23, 2013. |
E.E. Averiyanov, Spravochnik po anodirovaniyu, Moskva, Mashinostroenie, pp. 82-83 (1988). |
English language abstract of RU 2419686, published May 27, 2011. |
English language abstract of RU 2330124, published Jul. 28, 2008. |
English language abstract of CN 101853945, published Oct. 6, 2010. |
English language abstract of CN 202094217, published Aug. 28, 1984. |
English language abstract of JP 11-273693, published Oct. 8, 1999. |
Machine English language translation of JP 11-273693, published Oct. 8, 1999. |
English language abstract of JP 2009-102676, published May 14, 2009. |
Machine English language translation of JP 2009-102676, published May 14, 2009. |
English language abstract of JP 2005-005137, published Jan. 6, 2005. |
Machine English language translation of JP 2005-005137, published Jan. 6, 2005. |
English language abstract of JP 2005-293862, published Oct. 20, 2005. |
Machine English language translation of JP 2005-293862, published Oct. 20, 2005. |
English language abstract of DE 34 32 652, published Mar. 13, 1986. |
English language abstract of JP 2005-174572, published Jun. 30, 2005. |
Machine English language translation of JP 2005-174572, published Jun. 30, 2005. |
English language abstract of CN 101748427, published Jun. 23, 2010. |
English language abstract of CN 101667647, published Mar. 10, 2010. |
English language abstract of JP 2008-121087, published May 29, 2008. |
Machine English language translation of JP 2008-121087, published May 29, 2008. |
Office Action issued in Chinese Application No. 2013/0009244.X dated Nov. 23, 2015. |
Partial English language translation Office Action issued in Chinese Application No. 2013/0009244.X dated Nov. 23, 2015. |
English language abstract of CN 1300874 published Jun. 27, 2001. |
Chines Office Action dated Aug. 4, 2016 for counterpart Chinese Patent Application No. 201380009244.X. |
Partial English Translation of Chines Office Action dated Aug. 4, 2016 for counterpart Chinese Patent Application No. 201380009244.X. |
Number | Date | Country | |
---|---|---|---|
20150247247 A1 | Sep 2015 | US |
Number | Date | Country | |
---|---|---|---|
61602253 | Feb 2012 | US | |
61760767 | Feb 2013 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13776042 | Feb 2013 | US |
Child | 14713348 | US |