Patent Application
20120285720
The subject matter herein relates generally to corrosion resistant electrical conductors.
Electrical conductors are used to transmit data signals and/or power. Typical examples of electrical conductors are contacts used as part of an electrical connector that may be electrically connector to a wire, electrical traces on a printed circuit board, or another contact of another electrical connector. Other examples of electrical conductors are conductive traces on a printed circuit board. The electrical conductors typically include a metal substrate, such as a copper or copper alloy substrate. To enhance the properties or characteristics of the metal substrate, such as to reduce corrosion or provide a harder surface for connection to another electrical component, the metal substrate is typically plated, such as with a nickel plating layer and a gold plating layer. The nickel plating layer is used as a buffer between the gold plating layer and the copper substrate.
However, conventional nickel-gold plated copper conductors are not without disadvantages. For example, the nickel-gold plating may be insufficient to resist corrosion. For example, a problem exists with pitting corrosion that occurs through the nickel-gold plating layer due to pin holes existing in the gold plating layer and/or the nickel plating layer. Counter measures such that a nickel plating layer and/or a gold plating layer are thickened have been considered, but such counter measures increase the cost of the plating.
A need remains for an electrical conductor that is corrosion resistant.
In one embodiment, an electrical conductor is provided having a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal.
Optionally, the seal plating layer may be tin based. The tin based seal plating layer may be bright, semi-bright, or matte tin plated on the metal substrate. The tin based seal plating layer may be flash tin plated on the metal substrate. Optionally, the seal plating layer may have a lower porosity than the nickel plating layer. The seal plating layer may be pin hole free. The seal plating layer may be more noble than the nickel plating layer.
Optionally, the seal plating layer may form intermetallic interface layers from solid state inter-diffusion and reaction with the nickel plating layer and the metal substrate. The intermetallic process creating the intermetallic interface layers may cause a volumetric increase in the seal plating layer thereby sealing pin holes in at least one of the seal plating layer, the nickel plating layer or the metal substrate. Optionally, the seal plating layer may be heat treated and/or reflowed thereby increasing the growth rate of intermetallic interface layers.
Optionally, the seal plating layer may have a thickness selected based on the metal compounds of the metal substrate, the nickel plating layer and the seal plating layer such that either substantially all or all of the metal of the seal plating layer is converted to intermetallic interface layers between the seal plating layer and the metal substrate and between the seal plating layer and the nickel plating layer. The seal plating layer may have a thickness less than 25% of a combined thickness of the nickel plating layer and the gold plating layer. The seal plating layer may have a thickness less than 10% of a combined thickness of the nickel plating layer and the gold plating layer.
Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact. The contact includes the metal substrate, the seal plating layer, the nickel plating layer and the gold plating layer.
In another embodiment, an electrical conductor is provided having a metal substrate. A tin based seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer.
In a further embodiment, an electrical conductor is provided having a metal substrate. A seal plating layer is provided directly on and exterior of the metal substrate. An intermetallic interface layer is defined between the seal plating layer and the metal substrate. A nickel plating layer is provided directly on and exterior of the seal plating layer. An intermetallic interface layer is defined between the seal plating layer and the nickel plating layer. A gold plating layer is provided on and exterior of the nickel plating layer.
The electrical conductor 100 is suitable for use as a contact or terminal, such as those used in an electrical connector. The electrical conductor 100 may be terminated to an end of a wire or alternatively may be configured for mounting to a printed circuit board. In an alternative embodiment, the electrical conductor 100 may be a conductive trace on a printed circuit board. The electrical conductor 100 exhibits high resistance to corrosion.
The electrical conductor 100 includes a metal substrate 102, such as a copper substrate, a copper alloy substrate, a steel substrate and the like. The metal substrate 102 forms the base metal for the metal conductor 100. A seal plating layer 104 is provided on the metal substrate 102. A nickel plating layer 106 is provided on the seal plating layer 104 and the metal substrate 102. The nickel plating layer 106 may include nickel alloys (e.g. Ni—S, Ni—P, Ni—W and the like). A gold plating layer 108 is provided on the nickel plating layer 106, the seal plating layer 104 and on the metal substrate 102. The gold plating layer 108 may be soft gold (e.g. pure gold) or hard gold, such as gold alloys (e.g. Co—Au, Ni—Au and the like). Other layers may be used in alternative embodiments any of between, above or below any of the plating layers 104, 106, 108. The plating layers 104, 106, 108 enhance properties or characteristics of the electrical conductor 100. For example, the plating layers 104, 106, 108 may provide corrosion resistance. The plating layers 104, 106, 108 may provide enhancements to other characteristics in addition to corrosion resistance.
In an exemplary embodiment, the seal plating layer 104 is tin based. The seal plating layer 104 may be a tin alloy, such as a tin nickel material. The seal plating layer 104 may be another metal or metal alloy in alternative embodiments, such as silver or silver alloy or gold. In an exemplary embodiment, the seal plating layer 104 is a non-nickel based metal. The seal plating layer 104 may be a non-group VII based metal. The seal plating layer 104 may be a non-transition metal. The seal plating layer 104 may be a noble metal. The seal plating layer 104 may be made from a metal or metal alloy that readily and easily undergoes intermetallic formation with the metal substrate 102 and/or the nickel plating layer 106.
The metal substrate 102 includes an outer surface 110. In an exemplary embodiment, the seal plating layer 104 is provided directly on the outer surface 110 of the metal substrate 102. Provided “directly on” means that the layer engages the other layer without other layers in between. The seal plating layer 104 is provided exterior of the metal substrate 102. The seal plating layer 104 is formed by a plating process on the metal substrate 102. For example, the seal plating layer 104 may be formed by electroplating, electroless plating, or immersion plating. The seal plating layer 104 may be deposited by other means or processes in alternative embodiments. In an exemplary embodiment, the tin based seal plating layer 104 is bright tin plated on the metal substrate 102. The small grains of bright tin plating may promote inter-diffusion between the seal plating layer 104 and the metal substrate 102 and/or the nickel plating layer 106. Alternatively, the tin based seal plating layer 104 may be semi-bright tin plated or matte tin plated. In other alternative embodiments, the seal plating layer 104 may be flash tin plated on the metal substrate 102.
The tin based seal plating layer 104 may react with the metal substrate 102, which may be copper, to undergo intermetallic formation to copper tin (CuSn) intermetallics (e.g. Cu6Sn5, Cu3Sn and the like) from solid state diffusion and/or in a heat treatment or reflow process. An intermetallic interface layer 112 is defined at the interface between the seal plating layer 104 and the metal substrate 102. The intermetallic interface layer 112 is harder than either the seal plating layer 104 or the metal substrate 102. The intermetallic interface layer 112 may be continuous and nonporous. The intermetallic interface layer 112 has a high relative nobility as compared to the metal substrate 102. The intermetallic interface layer 112 is resistive to corrosion. The intermetallic interface layer 112 seals the interface between the metal substrate 102 and the seal plating layer 104. Optionally, the intermetallic layer formation may be forced or sped up by increasing the temperature of the electrical conductor 100. Because some or all of the seal plating layer 104 undergoes intermetallic layer formation, the intermetallic interface layer 112 may be thicker than the seal plating layer 104 after the intermetallic layer formation.
In an exemplary embodiment, the nickel plating layer 106 is provided directly on the seal plating layer 104. The nickel plating layer 106 is exterior of the seal plating layer 104. The nickel plating layer 106 is formed by a nickel plating process, such as electroplating. The nickel plating layer 106 may be deposited on the seal plating layer 104 by other means or processes in alternative embodiments.
The tin based seal plating layer 104 reacts with the nickel plating layer 106 from solid state diffusion and/or in a heat treatment or reflow process to form a layer of nickel tin (NiSn) intermetallics (e.g. Ni3 Sn, NiSn3 and the like). An intermetallic interface layer 114 is defined at the interface between the seal plating layer 104 and the nickel plating layer 106. The intermetallic interface layer 114 is harder than either the seal plating layer 104 or the nickel plating layer 106. The intermetallic interface layer 114 may be continuous and nonporous. The intermetallic interface layer 114 has a high relative nobility as compared to the nickel plating layer 106. The intermetallic interface layer 114 is resistive to corrosion. The intermetallic interface layer 114 seals the interface between the nickel plating layer 106 and the seal plating layer 104. Optionally, the intermetallic layer formation may be forced or sped up by increasing the temperature of the electrical conductor 100. Because some or all of the seal plating layer 104 undergoes intermetallic layer formation, the intermetallic interface layer 114 may be thicker than the seal plating layer 104 after the intermetallic layer formation. Optionally, after the intermetallic layer formation, the seal plating layer 104 may be substantially or entirely transformed into the intermetallic interface layer 112 and/or 114.
In an exemplary embodiment, the gold plating layer 108 is provided directly on the nickel plating layer 106. The gold plating layer 108 is exterior of the nickel plating layer 106. The gold plating layer 108 includes an outer surface 116 that defines an exterior or outer surface of the electrical conductor 100. The gold plating layer 108 is formed by plating over the nickel plating layer 106. In an exemplary embodiment, the gold plating layer 108 is electroplated. The gold plating layer 108 may be deposited on the nickel plating layer 106 by other means or processes in alternative embodiments.
The gold plating layer 108 includes pin holes 120 that inevitably exist in the gold plating layer 108 due to the relative thinness of the gold plating layer 108. As shown in
In an exemplary embodiment, the seal plating 104 is pin hole free and does not include pin holes like the nickel and gold plating layers 106, 108. The seal plating layer 104 has a lower porosity than the nickel plating layer 106 reducing and/or eliminating pitting corrosion to the metal substrate 102.
In an exemplary embodiment, the seal plating layer 104 is more noble than the nickel plating layer 106. The seal plating layer 104 is less susceptible to corrosion than the nickel plating layer 106. The intermetallic formation at the inner and outer surfaces of the seal plating layer 104 hardens the seal plating layer 104 and/or increases the nobility of the seal plating layer 104 at the intermetallic interface layers 112, 114. The intermetallic interface layers 112, 114 have a high resistance to corrosion, effectively sealing the metal substrate 102 from the environment external of the electrical conductor 100.
The thicknesses of the plating layers 104, 106, 108 may be selected to balance the effectiveness of the corrosion resistance with the added cost of providing a thicker layer. In an exemplary embodiment, the gold plating layer 108 has a thickness of approximately 15 μin. The nickel plating layer 106 has a thickness of approximately 50 μin. The seal plating layer 104 has a thickness of approximately 10 μin. Other thicknesses of the plating layers 104, 106, 108 are possible in alternative embodiments. For example, the gold plating layer 108 may be flash plated, such as approximately 5-10 μin, due to the reduced corrosion effect from using the seal plating layer 104.
In an exemplary embodiment, the nickel plating layer 106 is generally thicker than the gold plating layer 108 and the seal plating layer 104. Optionally, the seal plating layer 104 may be less than 25% of the combined thickness of the nickel-gold plating layers 106, 108. Optionally, the seal plating layer 104 may be less than 10% of the combined thickness of the nickel-gold plating layers 106, 108. In other alternative embodiments, the seal plating layer 104 may be approximately equal to the thickness of the nickel plating layer 106. In other alternative embodiments, the seal plating layer 104 may be thicker than that nickel plating layer 106.
In an exemplary embodiment, the seal plating layer 104 has a thickness selected such that either substantially all or all of the metal of the seal plating layer 104 is converted to the intermetallic interface layers 112, 114. Optionally, more of the metal of the seal plating layer 104 may be undergo conversion or reaction with the nickel plating layer 106 than with the metal substrate 102. Alternatively, more of the metal of the seal plating layer 104 may be undergo conversion or reaction with the metal substrate 102 than with the nickel plating layer 106. The thickness of the seal plating layer 104 may be selected based on the metal compounds of the metal substrate 102, the nickel plating layer 106 and the seal plating layer 104. Depending on the metals used in the metal substrate 102, the nickel plating layer 106 and the seal plating layer 104, the amount of intermetallic conversion at the intermetallic interfaces 112, 114 may vary. The amount of the metal of the seal plating layer 104 that is converted may be different depending on the metal compounds.
In an exemplary embodiment, the intermetallic formation process causes a volumetric increase in the seal plating layer 104, thereby sealing any pin holes in the seal plating layer 104 and/or in the nickel plating layer 106 or the metal substrate 102. Optionally, the electrical conductor 100 may be heat treated, or otherwise subjected to an increase in temperature, thereby increasing the growth rate of intermetallic formation between the seal plating layer 104 and the metal substrate 102 and/or the nickel plating layer 106.
The method includes promoting 136 intermetallic formation between the seal plating layer and the metal substrate. The intermetallic formation stems from solid state inter-diffusion and reaction with the seal plating layer and the metal substrate. The intermetallic formation may be promoted based on the metals of the metal substrate and the seal plating layer. The intermetallic formation may be promoted by increasing a temperature of the electrical conductor during or after the manufacturing process to increase the amount of intermetallic formation and/or the thickness of the intermetallic interface layer between the seal plating layer and the metal substrate.
The method includes promoting 138 intermetallic formation between the seal plating layer and the nickel plating layer. The intermetallic formation stems from solid state inter-diffusion and reaction with the seal plating layer and the nickel plating layer. The intermetallic formation may be promoted based on the metals of the nickel plating layer and the seal plating layer. The intermetallic formation may be promoted by increasing a temperature of the electrical conductor during or after the manufacturing process to increase the amount of intermetallic formation and/or the thickness of the intermetallic interface layer between the seal plating layer and the nickel plating layer.
The method includes depositing 140 a gold plating layer on the nickel plating layer. In an exemplary embodiment, the gold plating layer is deposited after the intermetallic formation to eliminate the possibility of nickel diffusion through the gold plating layer, which may occur if the gold plating layer were deposited prior to promoting intermetallic formation between the seal plating layer and the nickel plating layer. In an alternative embodiment, the gold plating layer may be deposited prior to promoting intermetallic formation. Other steps may be performed before, during or after the steps identified in
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
