Patent Application
20140373637
The present disclosure relates to pressure testing devices, and particularly to a central processing unit (CPU) pressure testing device.
A CPU is mounted to a base of a printed circuit board. A heat sink is mounted on the CPU to dissipate heat generated by the CPU. An engaging member is mounted on the heat sink to secure the heat sink on the CPU. However, the CPU may be damaged due to undue pressure from the engaging member.
Many aspects of the embodiments described herein can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The mounting bracket 30 includes a base portion 31 secured on the base panel 10 and an engaging member 33 pivotally mounted to the base portion 31. The base portion 31 includes a base body 310 and a mounting portion 332 secured to the base body 310. The base body 310 defines a recess 311 and a slot 313 communicating with the recess 311. The engaging member 33 includes a pressing element 331 pivotally mounted to the mounting portion 332 and an engaging element 333 pivotally mounted to the pressing element 331. The pressing element 331 includes two pressing arms 3311. The engaging element 333 includes a handle 334 and two engaging arms 335 extending from opposite sides of the handle 334. The two engaging arms 335 are pivotally mounted to the two pressing arms 3311. Each engaging arm 335 defines an engaging cutout 3351. The base portion 31 further includes two clasping portions 336. Each clasping portion 336 includes a clasping protrusion 3361. The clasping protrusion 3361 is configured to be engaged in the engaging cutout 3351. The heat sink 50 includes a base body 51 and a plurality of fins 53 extending from the base body 51.
The CPU simulating member 70 includes a CPU simulating body 71 and a pressure sensor 73. The CPU simulating body 71 defines an opening 711. The opening 711 defines a circular wide part 713 and a narrow part 715 communicating with the wide part 713. The pressure sensor 73 includes a main body 731 and a cable 733 connected to the main body 731. The cable 733 passes through the narrow part 715 and the slot 313 to be connected to the pressure display 90. The CPU simulating body 71 is mounted in the recess 311.
During disassembly, the engaging element 333 rotates along a second rotation direction to enable the engaging cutout 3351 to disengage from the clasping protrusion 3361. The engaging element 333 continues to rotate to enable the pressing element 331 to separate from the heat sink 50.
It is to be understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, including in the matters of shape, size, and arrangement of parts within the principles of the disclosure. The embodiments described herein are illustrative and are not to be construed as limiting the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013102463963 | Jun 2013 | CN | national |
