Current reference apparatus and systems

Abstract

A current reference, which may be fabricated independently, on a die, as part of an integrated circuit, or a system, or in various other forms, is disclosed. The current reference may include a voltage source having a substantially temperature stable output voltage, a first semiconductor device biased by the substantially temperature stable output voltage to provide a first output current, and a second semiconductor device providing a second output current, wherein a reference current is provided approximately equal to the difference between the first and second output currents.

Description

FIELD OF THE INVENTION

[0002] The embodiments disclosed relate generally to current sources.

BACKGROUND INFORMATION

[0003] Current references may be designed to provide a source of substantially constant current, typically used in turn by other circuits which depend upon a minimal variance in the supply of current. In fact, the ultimate performance of a circuit which makes use of a current reference is often dependent on the stability of the reference.

[0004] One problem with current reference circuits may be that the current provided is sensitive to voltage, temperature, and process variations. Thus, as supply or bias voltage, temperature, or process parameters (such as transistor threshold voltages) vary, the current generated by the reference may also vary. Thus, sensitivity to temperature and power supply voltage variations in current references, and the reduction thereof, has been the subject of much study. See, for example, Sueng-Hoon Lee and Yong Jee, “A Temperature and Supply Voltage Insensitive CMOS Current Reference,” IEICE Trans. Electron., Vol. E82-C, No.8, August 1999; and Cheol-Hee et al., “A Temperature and Supply Insensitive CMOS Current Reference Using a Square Root Circuit,” IEEE ICVC, Oct. 1997, pp 498-500.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is a block diagram of a current reference according to various embodiments;

[0006] FIG. 2 is a schematic diagram of a current reference, die, and an integrated circuit according to various embodiments;

[0007] FIG. 3 is a graph of internal currents over a range of temperatures and processes which may be provided by a current reference according to various embodiments;

[0008] FIG. 4 is a graph of reference current output over a variety of processes which may be provided by a current reference according to various embodiments;

[0009] FIG. 5 is a schematic diagram of a current reference according to an alternative embodiment;

[0010] FIG. 6 is a graph of internal currents over a range of temperatures and processes which may be provided by a current reference according to various embodiments; and

[0011] FIG. 7 is a graph of reference current output over a variety of processes and temperatures which may be provided by a current reference according to various embodiments.

DETAILED DESCRIPTION

[0012] FIG. 1 is a schematic block diagram of an embodiment of a current reference, a die, and an integrated circuit according to various embodiments. The current reference 100 may include a first current source 110 providing an output current 112 (of magnitude I1) which is substantially stable over the expected operating range of temperatures for the reference 100. A second current source 114 may also be included in the reference 100. Like the first current source 110, the second current source may provide an output current 116 (of magnitude I2) which is substantially stable over the expected operating temperature range for the reference 100.

[0013] Finally, the current reference 100 may include a differencing circuit 118, which provides a reference output current 120 (of magnitude Iref) approximately equal to the difference between I2 and I1. The magnitude of I1 may be multiplied by a preselected constant value, k, which may be any real number value selected by the reference designer (except 0, and including 1). That is, the reference output current magnitude Iref may be selected to be approximately equal to the difference I2−k*I1, where k≠0.

[0014] The first current source 110 may be similar to, or identical to the second current source 114, with a single exception: the magnitude I1 of the of the output current 112 should not be identical to the magnitude I2 of the output current 116, so that the magnitude Iref of the reference output current 120 will be a non-zero value. This reference output current 120 may be carried by an output node or pin 122, which may be coupled to the current sources 110, 114 and/or the differencing circuit 118. Thus, the reference designer will typically specify that the nominal magnitude I2 of the output current 116 be shifted away from the nominal magnitude I1 of the of the output current 112 by some predetermined amount, so as to increase the probability that a non-zero reference current output Iref will be present at the output node or pin 122 of the die 123 or integrated circuit 125 containing the reference 100, over the expected voltage, process, and temperature variations.

[0015] FIG. 2 is a schematic diagram of a current reference, die, and an integrated circuit according to various embodiments. The approach taken may be characterized as generating a temperature and process compensated reference current by taking the difference between two temperature stable current sources, the output of one source being shifted away from the other, to ensure a non-zero output current. Further process independence may be obtained by applying a body bias voltage to selected semiconductor devices within the sources, and scaling the reference output.

[0016] The reference 200 in this case may include a first Lee current source as the first current source 210, providing an output current 212 of magnitude ILP. A second Lee current source may be used as the second current source 214, with an output magnitude of ILPx. As used herein, the term “Lee current reference” means any current reference which is identical to, or similar to, the circuit structure shown with respect to element 210 in FIG. 2, or any other structure which operates to provide a substantially temperature stable output current by canceling the mobility dependence of the output current using a first internal current component (which is proportional to mobility), multiplied by a second internal current component (which is inversely proportional to mobility) using a square-root circuit, as is well known to those skilled in the art. Reference may also be made to the article published by Messrs. Sueng-Hoon Lee and Yong Jee, noted above, as well as the article by C. -H. Lee and H. -J Park, “All-CMOS Temperature Independent Current Reference”, Electronics Letters, Vol. 32, No. 14, Jul. 4, 1996. For example, in FIG. 2, the Lee current reference 210 uses transistors M1-M4 (typically operating in the subthreshold region) to implement the square-root multiplication circuit. Transistors M5-M16 are typically operated in the strong inversion saturation region, such that M5-M7 generate the current component proportional to mobility (IM), and M8-M16 to generate the current component which is inversely proportional to mobility (IIM). The term “substantially temperature stable” with respect to an output current, as used herein, means an output current which has a magnitude that varies by less than about ±5% over a temperature range of about 0 to 110° C.

[0017] Subtracting the output currents 212, 216 from each other, as generated by a pair of similarly constructed, substantially temperature stable current sources, such as the Lee references 210, 214, using the differencing circuit 218, may result in an output current 220 which is substantially constant with respect to process variations (especially when the current sources 210, 214 are both made using the same or similar processes). In this case, the differencing circuit 218 may be constructed using a pair of electronically coupled current mirrors 224, 226. One of the current mirrors 226 may be designed to implement the scaling constant, k, which is typically chosen after test data are obtained, such that the lowest value of current variation is obtained. k may be determined by the ratio of the transistor sizes in the current mirror 226.

[0018] The references 210, 214, as well as the differencing circuit 218, may be constructed on a single die 223, or as part of an integrated circuit 225. The output node 222 of the integrated circuit 225 may be in electrical communication with the references 210, 214 and the differencing circuit 218, such that the output current 220 is carried by the output node 222, external to the reference 200.

[0019] The value of resistance R, Rx in the references 210, 214 may be selected to ensure that the output current magnitudes ILP and ILPx are different (i.e., ILPx is shifted away from ILP), such that the magnitude of Iref is non-zero over the expected operating range of the circuitry. It should be noted that the resistance values R, Rx may be implemented using a physical resistor, or some equivalent element, such as a metal-oxide semiconductor (MOS) n-well device, which presents an appropriate resistance value within the circuitry of the references 210, 214. To further decrease the dependence of the output current 222 due to variations in process, a body bias voltage Vb, Vbx may be applied to one or more transistors 228, 229 included in the current sources 210, 214. The equations representing the magnitudes of the first and second output currents, ILP and ILPx, as well as the magnitude of the reference output current Iref, can be shown as follows:

I LP =C 1 *[(Vdd−Vn−Vt)/R];   [1]

I LPx =C 2 *[(Vdd−Vnx−Vtx)/Rx]; and   [2]

I ref =I LPx −k*I LP ,   [3]

[0020] where c1 and c2 are constants, Vn and Vnx are parameters of the Lee references, Vt and Vtx are the threshold voltages arising from the application of body bias Vb and Vbx, respectively, and k is the scaling factor noted previously. It should be noted that the constants c1 and c2 can be scaling constants which depend on the relative sizes of the transistors in the circuit; these constants may determine the relative magnitude of the currents ILP and ILPx. (e.g., whether ILP and ILPx are in the microampere or milliampere range). It should also be noted that Vn and Vnx Vnx can be important to obtaining proper temperature compensation in the Lee references; Vn is used to bias the transistor 228 so that its current mobility dependence cancels the inverse mobility dependence of the current in resistor 230. Vnx may be used in a similar fashion with respect to transistor 229, to cancel the current dependence in resistor 231.

[0021] Since ILP and ILPx may depend on Vdd, the parameters Vn and Vnx can be chosen after Vdd has been determined. If the percentage change in R, Rx and Vt, Vtx with respect to temperature is known, then Vn, Vnx can be calculated such that the temperature dependence of ILP, ILPx can be substantially reduced, or even eliminated. Vt, Vtx, and k can be chosen based on test data for the fabricated devices, and typically are only changed if the circuitry is manufactured using a different process technology. Otherwise, fixing the values of Vt, Vtx, Vn, Vnx, and k may serve to adequately compensate for day-to-day variance in the manufacturing process.

[0022] FIG. 3 is a graph of internal currents over a range of temperatures and processes which may be provided by a current reference constructed according to various embodiments (e.g., similar to that illustrated in FIG. 2). More particularly, the graph 340 illustrates the expected changes in output current 342 versus temperature 344 for ILP and ILPx as the result of devices manufactured using a slow process 346, 348; a typical process 350, 352; and a fast process 354, 356. As used herein, “slow” and “fast” processes refer to manufacturing processes which vary so as to provide semiconductors that operate differently given a fixed bias voltage. Generally, a “fast” device exhibits a higher source current than a “slow” device, given the same value of applied bias voltage. In this case, the expected variation of each Lee reference across the operating temperature range is about ±1%.

[0023] FIG. 4 is a graph of reference current output over a variety of processes which may be provided by a current reference constructed according to various embodiments (e.g., similar to that illustrated in FIG. 2). More particularly, the graph 458 illustrates the expected changes in reference output current 460 versus temperature 462 as a result of a slow process 464, a typical process 468, and a fast process 470. Referring to graphs 340 and 458, shown in FIGS. 3 and 4 respectively, it can be seen that even though the internal currents ILP and ILPx of the first and second references vary by almost eight microamperes over temperature and process, the reference output current varies by less than about 0.2 microamperes over the same temperature and process variations.

[0024] Another approach to solving the problems which arise in the prior art with respect to current references can be seen in FIG. 5, which is a schematic diagram of an alternative embodiment of a current reference. In this case, the general approach to providing a reference current which is compensated for temperature, process, and supply voltage variations may use one or more temperature stable voltage sources operating two semiconductor devices in saturation mode. The difference in output current between each of the semiconductor devices may then provide a stable reference current.

[0025] As shown in FIG. 5, the current reference 500 may include a first current source 510 providing a first substantially temperature stable output current 512 (having a first magnitude I1) and a second current source 514 providing a second substantially temperature stable output current 516 (having a second magnitude I2). A differencing circuit 518 may be included to provide a reference output current 520 with a reference magnitude Iref approximately equal to the difference between the second magnitude I2 and a product of the first magnitude I1 and a preselected scaling constant k. As noted above, the differencing circuit 518 may include a pair of current mirrors 524, 526, with one of the current mirrors 526 constructed so that the scaling constant k=1. To ensure that the reference magnitude Iref will be a non-zero value, the second magnitude I2 may be selected so that it is shifted by a predetermined amount from the first magnitude I1.

[0026] The first current source 510 may include a first semiconductor device M1 (e.g., a MOS field effect transistor, or MOSFET) operated in saturation mode and biased by a substantially temperature stable voltage source 536, which may be a band-gap voltage reference, similar to or identical to those commonly used with digital-to-analog converters, as are well known to those skilled in the art. Similarly, the second current source 514 may include a second semiconductor device M2 (e.g., another MOSFET) operated in saturation mode and biased by a substantially temperature stable voltage source 536′, which may be similar to, or identical to the voltage source 536. In fact, if desired, a single voltage source 536 may be used to bias both devices M1, M2. As used herein, a “substantially temperature stable voltage source” means a voltage source whose output voltage varies by no more than about ±100 microvolts/° C. It should be noted that the performance of the reference 500 will improve as the output resistance of the semiconductor devices M1, M2 increases.

[0027] The current reference 500 may also be characterized as including a voltage source 536 having a substantially temperature stable output voltage (e.g. a single voltage source 536 which takes the place of voltage sources 536, 536′, such that Vref1=Vref2), and first and second semiconductor devices M1, M2, each biased by the substantially temperature stable output voltage source 536 so as to operate in the saturation mode.

[0028] In either case, the differencing circuit 518, which may include a pair of current mirrors, may be electronically coupled to the first and second semiconductor devices M1, M2. The differencing circuit and semiconductor devices M1, M2 may be fabricated on a single die 523, or as part of an integrated circuit 525, with the reference output current 520 carried by an output node 522, external to the current reference 500 circuitry. As noted above, a single voltage source 536, or more than one voltage source 536, 536′ may be used to bias the semiconductor devices M1, M2, and either one, or both of the voltage sources 536, 536′ may be a band-gap voltage source.

[0029] If MOSFETs are used to construct the current reference 500, the following design equations may be employed:

I d (P,T) =μ(T)Cox(P)Z[Vgs−Vt(T,P)]2   [4]

I ref (P1, T1)=Iref(P2, T2)   [5]

I ref (P2, T1)=Iref(P1, T2)   [6]

I ref (P1, T2)=Iref(P2, T2)   [7]

[0030] where Iref=I2−I1. Equation [4] illustrates the basic square-law equation for MOSFET saturation current, wherein the process and temperature dependent terms are highlighted, namely, μ(T)Cox(P) and Vt(T,P). Id represents the drain current through the MOSFET as a function of temperature and process, μ(T) is the mobility, Cox is the oxide capacitance, Z is the absolute width of the device, Vgs is the voltage gate-to-source, and Vt is the threshold voltage. By fitting the square-root of Id to a straight line, one may solve for μ(T)Cox(P) as the square of the slope obtained, and for Vt(T,P) as the x-intercept.

[0031] By substituting I2 and I1 in place of Id in equation [4], and setting Iref to be the same at the temperature and process extremes (i.e., at (P1, T1), (P1, T2), (P2, T1), and (P2, T2)), the equations [5], [6], and [7] can be solved as a set of simultaneous equations. That is, the design variables Zrat (the ratio of the widths of the two devices), Vgs1 (the gate-to-source voltage of one device), and Vgs2 (the gate-to-source voltage of the other device) can be determined, once μ(T)Cox(P) and Vt(T,P) are known.

[0032] It should also be noted that solving equations [5], [6], and [7] in this manner assumes that μ(T)Cox(P) and Vt(T,P) are monotonic functions of process and temperature. For example, equation [5] may be rewritten as:

μ(T1)Cox(P1)Zrat[Vgs2−Vt2(T1, P1)]2−μ(T1)Cox(P1)[Vgs1−Vt1(T1, P1)]2=μ(T2)Cox(P2)Zrat[Vgs2−Vt2(T2, P2)]2−μ(T2)Cox(P2)[Vgs1−Vt1(T2, P2)]2   [8]

[0033] However, solving all three equations simultaneously is not a very flexible process; it forces exact values for Vgs1, Vgs2, and Zrat, and renders adjustments for actual circuit element performance difficult. In practice, it is better to choose one parameter as a matter of convenience, leaving the other two parameters to be solved. For example, one may choose Zrat to be the ratio of the transistor sizes M1/M2, or M3/M4 (i.e., the k scaling factor).

[0034] FIG. 6 is a graph of the expected internal currents over a range of temperatures and processes which may be provided by a current reference constructed according various embodiments (e.g., as shown in FIG. 5). More particularly, the graph 680 illustrates the expected changes in output current 681 versus temperature 682 for I1 and I2 as the result of devices manufactured using a slow process 683; a typical process 684; and a fast process 685. In this case, the expected variation of the output currents I1 and I2 of the semiconductor devices M1, M2 across the operating temperature range is less than about three microAmperes.

[0035] FIG. 7 is a graph of the expected reference current output over a variety of processes as might be provided by a current reference constructed according to various embodiments (e.g., as shown in FIG. 5). More particularly, the graph 790 illustrates the expected changes in reference output current 791 versus temperature 792 for Iref as a result of a slow process 793, a typical process 794, and a fast process 795. Referring to graphs 680 and 790, shown in FIGS. 6 and 7 respectively, it can be seen that even though the internal currents I1 and I2 of the first and second semiconductor devices M1, M2 vary by almost three microamperes over temperature and process, the reference output current Iref varies by less than about 0.04 microAmperes over the same temperature and process variations. Thus, even though the individual device currents may vary by about ±30% when μ(T)Cox(P) and Vt(T,P) change over temperature and pressure, the compensation technique applied using the embodiment of the invention shown in FIG. 5 is expected to reduce the variation of Iref to less than about ±2%. Of course, the values of Vgs1, Vgs2, and Zrat can be further refined when actual circuitry, and its true non-ideal characteristics, are realized.

[0036] One of ordinary skill in the art will understand that the apparatus of the present invention can be used in other applications, and thus, the invention is not to be so limited. The illustrations of a reference 100, 200, 500, a die 123, 223, 523, and an integrated circuit 125, 225, 525 are intended to provide a general understanding of the structure of the present invention, and are not intended to serve as a complete description of all the elements and features of current references, dies, integrated circuits, and other devices which might make use of the structures described herein.

[0037] Applications which may include the novel current reference, dies, and integrated circuits of the present invention include electronic circuitry used in high-speed computers, communications equipment, modems, processor modules, embedded processors, and application-specific modules, including multilayer, multi-chip modules. Such references, dies, and integrated circuits may further be included as sub-components within a variety of electronic systems, such as televisions, cellular telephones, personal computers, personal radios, automobiles, aircraft, and others.

[0038] The current reference which embodies the present invention provides a temperature and process compensated source of current for use in a wide variety of applications. Designers are now free to use current references in area-critical circuits, without specifying the characteristics of, or reserving precious circuit board real estate for an additional component in the form of an external resistor.

[0039] The accompanying drawings that form a part hereof, show by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced. The embodiments illustrated are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. This Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[0040] Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same purpose may be substituted for the specific embodiments shown. P-channel FETs, N-channel FETs, bipolar transistors, and their equivalents may be substituted in place of the semiconductor devices shown in the schematics described above, given appropriate changes in bias circuits, voltages, and currents, well known to those skilled in the art. Similarly, such devices may be used in place of resistors, capacitors, and other circuit elements illustrated herein. This disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description.

[0041] The Abstract of the Disclosure is provided to comply with 37 C.F.R. §1.72(b), requiring an abstract that will allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter may lie in less than all features of a single disclosed embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

Claims

1. An apparatus, comprising: a voltage source to provide a substantially temperature stable output voltage; a first semiconductor device biased by the substantially temperature stable output voltage to provide a first output current; and a second semiconductor device biased by the substantially temperature stable output voltage to provide a second output current, the second semiconductor device to couple to the first semiconductor device to provide a reference current approximately equal to a difference between the first and the second output currents.

2. The apparatus of claim 1, wherein the first and the second semiconductor devices are biased by the substantially temperature stable output voltage to operate in a saturation mode.

3. The apparatus of claim 1, wherein the first and the second semiconductor devices are fabricated on a single die.

4. The apparatus of claim 1, further including: a differencing circuit to couple to the first and the second semiconductor devices.

5. The apparatus of claim 1, further including: a pair of current mirrors to couple to the first and the second semiconductor devices.

6. The apparatus of claim 5, wherein the first and the second semiconductor devices and the pair of current mirrors are fabricated on a single die.

7. The apparatus of claim 1, wherein a reference magnitude of the reference current is approximately equal to a difference between the second output current and a product of the first output current and a scaling constant.

8. The apparatus of claim 7, further comprising: a differencing circuit including a first current mirror selected to determine the scaling constant.

9. The integrated circuit of claim 9, wherein the voltage source comprises a band-gap voltage source.

10. An integrated circuit, comprising: a voltage source to provide a substantially temperature stable output voltage; a first semiconductor device biased by the substantially temperature stable output voltage to provide a first output current; and a second semiconductor device biased by the substantially temperature stable output voltage to provide a second output current, the second semiconductor device to couple to the first semiconductor device to provide a reference current approximately equal to a difference between the first and the second output currents; and an output node in electrical communication with the first and second semiconductor devices to carry the reference current.

11. The integrated circuit of claim 10, wherein the first and the second semiconductor devices are biased by the substantially temperature stable output voltage to operate in a saturation mode.

12. The integrated circuit of claim 10, further including: a differencing circuit to couple to the first and the second semiconductor devices.

13. The integrated circuit of claim 12, wherein the reference current has a reference magnitude approximately equal to the difference between the second output current and a product of the first output current and a scaling constant determined by a current mirror included in the differencing circuit.

14. The integrated circuit of claim 10, wherein each one of the first and the second semiconductor devices comprise a field effect transistor.

15. The integrated circuit of claim 14, further including: a pair of current mirrors to couple to the first and the second semiconductor devices, wherein each one of the pair of current mirrors includes a pair of field effect transistors, and wherein the first and the second semiconductor devices and the pair of current mirrors are fabricated on a single die.

16. The integrated circuit of claim 10, wherein the voltage source comprises a band-gap voltage source.

17. A system, comprising: a cellular telephone including a voltage source to provide a substantially temperature stable output voltage, a first semiconductor device biased by the substantially temperature stable output voltage to provide a first output current, and a second semiconductor device biased by the substantially temperature stable output voltage to provide a second output current, the second semiconductor device to couple to the first semiconductor device to provide a reference current approximately equal to a difference between the first and the second output currents.

18. The system of claim 17, further comprising a differencing circuit to couple to the first and the second semiconductor devices.

19. The system of claim 18, wherein the differencing circuit includes a first current mirror selected to determine a scaling constant.

20. The system of claim 19, wherein the reference current has a reference magnitude approximately equal to the difference between the second output current and a product of the first output current and the scaling constant.