Claims
- 1. A method of chemical vapor deposition wherein a semiconducting film comprising germanium and hydrogen and at least one element selected from the group consisting of carbon, nitrogen and oxygen in the germanium-hydrogen matrix is uniformly deposited on a substrate resulting in a deposited film having a smooth surface comprising the steps of:
- (a) supplying a germane deposition gas including a germanium hydride gas and at least one other reacting gas, wherein said at least one other reacting gas includes an element selected from the group consisting of oxygen, nitrogen and carbon to a volume adjacent a deposition surface of said substrate;
- (b) applying an excitation energy for reacting the germane deposition gas and said at least one other reaction gas and for depositing a layer of said semiconducting film on said deposition surface; and
- (c) maintaining said deposition gas at a reduced pressure during the deposition process.
- 2. The method of chemical vapor deposition according to claim 1 including employing as the reacting gas a gas selected from the group consisting of oxygen, carbon monoxide, carbon dioxide, nitrogen monoxide, nitrogen dioxide, nitrogen, ammonia, saturated hydrocarbons having 1-4 carbon atoms, ethylenic hydrocarbons having 2-4 carbon atoms, and acetylenic hydrocarbons having 2-3 carbon atoms.
- 3. The method of claim 1 including employing GeH.sub.4 as the germanium hydride gas.
- 4. The method of claim 1 including employing GeH.sub.6 as the germanium hydride gas.
- 5. The method of claim 1 including employing said reacting gas containing gas selected from hydrogen, B.sub.2 H.sub.6 and PH.sub.3.
- 6. The method of claim 1 including employing a substrate having a barrier layer on the surface where the semiconductor film is deposited.
- 7. The method of claim 1 including employing as the substrate a conductive substrate.
- 8. The method of claim 1 including employing as the substrate a metallic substrate.
- 9. The method of claim 1 including employing as the substrate a stainless steel substrate.
- 10. The method of claim 1 including employing as the substrate a synthetic resin substrate.
- 11. The method of claim 10 in which said synthetic resin for said substrate is selected from the group consisting of polyesters, polyethylene, polycarbonates, cellulose triacetate, polypropylene, polyvinyl chloride, polyvinylidene chloride, polystyrenes and polymides.
- 12. The method of claim 1 including employing as the substrate a glass substrate.
- 13. The method of claim 1 including employing as the substrate a ceramic substrate.
- 14. The method of claim 1 including employing as the substrate a conductive surface substrate.
- 15. The method of claim 1 including employing SiH.sub.4 as said silicon hydride gas.
- 16. The method of claim 15 including employing SiH.sub.6 as said silicon hydride gas.
- 17. The method of claim 15 including employing SiH.sub.6 as said silicon hydride gas.
Priority Claims (2)
Number |
Date |
Country |
Kind |
53-53605 |
May 1978 |
JPX |
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53-53606 |
May 1978 |
JPX |
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Parent Case Info
This is a continuation division of application Ser. No. 914,523, filed Oct. 3, 1986, which, in turn, is a continuation of Ser. No. 561,161 filed Dec. 14, 1983, now abandoned, which, in turn is a continuation of Application Ser. No. 418,293, filed Sept. 15, 1982 now U.S. Pat. No. 4,565,731 issued Jan. 21, 1986, which, in turn is a continuation of parent application Ser. No. 36,226 filed May 4, 1979 now U.S. Pat. No. 4,471,042, issued Sept. 11, 1984.
US Referenced Citations (16)
Non-Patent Literature Citations (4)
Entry |
"Electrical and Optical Properties of Amorphous Silicon Carbide, Silicon Nitride, and Germanium Carbide Prepared by Glow Discharge", Philosophical Magazine, vol. 35, pp. 1-16 (1977). |
M. Le Contellec, et al., "Effects of the Silcon to Carbon Ratio and the H Content of Amerp. S.C. Thin Films Prepared by Reactive Sputtering," Thin Solid Films, 58 (1979) pp. 407-411. |
Moustakas, et al., Preparation of Highly Photoconductive Amorphous Silicon by rf Sputtering, Solid State Comm., vol. 23, pp. 155-158 (1977). |
Bunshah, et al., Deposition Technologies for Films and Coatings, pp. 374-382 (1982). |
Divisions (1)
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Number |
Date |
Country |
Parent |
914523 |
Oct 1986 |
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Continuations (3)
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Number |
Date |
Country |
Parent |
561161 |
Dec 1983 |
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Parent |
418293 |
Sep 1982 |
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Parent |
36226 |
May 1979 |
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