Patent Grant
9133561
The present invention relates to a plating method and a plating apparatus for a cylinder, which are configured to perform plating using an insoluble electrode as a plating material for forming a printing surface, for example, copper plating or chromium plating, on an outer peripheral surface of a long cylinder, for example, a hollow cylindrical gravure cylinder (also called a plate-making roll) used for gravure printing. In particular, the present invention relates to a plating method and a plating apparatus for a cylinder, which are capable of adjusting a thickness of a plating layer on an outer peripheral surface of the cylinder through use of an insoluble electrode including a lower part curved inward.
In gravure printing, minute concave portions (cells) are formed on a gravure cylinder in accordance with plate-making information to produce a printing surface, and the cells are filled with ink so that the ink is transferred to an object to be printed. In a general gravure cylinder, a cylindrical iron core or aluminum core (hollow roll) is used as a base, a plurality of layers such as an underlying layer and a separation layer are formed on an outer peripheral surface of the base, and a copper plating layer (plating material) for forming a printing surface is formed on the plurality of layers. Then, cells are formed on the copper plating layer in accordance with plate-making information by a laser exposure apparatus, and thereafter, the resultant base is plated with chromium or the like for enhancing printing durability of a gravure cylinder. In this manner, plate making (production of a printing surface) is completed.
Conventionally, as a method and apparatus for performing copper plating on an outer peripheral surface of a gravure cylinder, the use of a phosphorus-containing copper ball as a soluble anode is well known. According to the conventional method and apparatus, both ends in a longitudinal direction of a gravure cylinder are held so as to be rotated and energized by a pair of roll chucks, the gravure cylinder is accommodated in a plating bath in which a plating solution is stored while the gravure cylinder is being rotated, and a current with a current density of about 10 to 15 A/dm2 is allowed to flow between the phosphorus-containing copper ball (soluble anode) in the plating solution and the gravure cylinder (cathode), to thereby deposit copper on an outer peripheral surface of the gravure cylinder, which functions as a cathode, with the result that copper plating is performed (for example, see Patent Documents 1 and 2).
However, in general, a phosphorus-containing copper ball used in a copper plating method and apparatus for a gravure cylinder contains 350 to 700 ppm of phosphorus and 2 to 5 ppm of oxygen, and the rest of the ball contains copper and impurities. Due to the impurities contained in the ball inevitably, anode sludge is generated during plating treatment, which causes defects such as rashes (minute protrusions) and pits (pinholes) on the outer peripheral surface of the gravure cylinder. Although there is a phosphorus-containing copper ball of high purity for producing a semiconductor and the like, such a ball is expensive and is not adopted for a gravure cylinder in terms of cost-efficiency. Further, in order to prevent the dissolution amount of a phosphorus-containing copper ball in a copper plating solution from increasing excessively to enhance the copper ion concentration, making it impossible to perform appropriate plating treatment, it is also necessary to dilute the solution by removing a plating solution periodically, thereby adjusting the copper ion concentration appropriately and disposing of a waste liquid. Further, a current is concentrated in the vicinity of both ends of the gravure cylinder, and hence the peripheral surface in the vicinity of both ends is plated thicker than a body portion, with the result that it is necessary to separately perform treatment for obtaining a uniform thickness of plating by follow-up polishing or the like.
On the other hand, in addition to a method using a phosphorus-containing copper ball as a soluble anode, a copper plating method using an insoluble anode is known. As a copper plating method and apparatus for a gravure cylinder using an insoluble anode, for example, a titanium plate coated on the surface with iridium oxide or the like is used as an insoluble anode, a plating bath and a copper dissolution bath are prepared, the copper plating material (e.g., copper oxides or copper carbonates) is dissolved in the dissolution bath, the resultant solution is supplied to a plating solution in the plating bath, and a current is supplied between an insoluble anode and a gravure cylinder forming a cathode. In this manner, copper plating is performed (for example, see Patent Document 3).
According to the above-mentioned method and apparatus, anode sludge is not generated so that defects such as rashes and pits are not caused, but there is still a problem that the peripheral surface in the vicinity of both ends of a gravure cylinder is plated thick. In order to solve this problem, the applicant of the present application has already proposed a copper plating method and apparatus for a gravure cylinder in which an insoluble anode positioned below a gravure cylinder is configured so as to be lifted in a plating bath, and the insoluble anode is brought close to a lower surface of the gravure cylinder with a gap of 5 mm to 30 mm in accordance with gravure cylinders of various sizes, with the result that a current is not concentrated in the vicinity of both ends of the gravure cylinder, plating with a uniform thickness can be performed over the full length of the gravure cylinder, and the concentration of copper and the concentration of sulfuric acid in the plating solution can be adjusted automatically (see Patent Document 4).
Still further, in the above-mentioned proposal, there are the following problems. That is, an insoluble anode is placed directly in the plating solution, and hence the consumption amount of additives such as a brightener and a burn prevention agent is remarkably large. A current density is about 15 to 20 A/dm2 and a voltage is about 10 to 15 V for the purpose of preventing a burn, and hence plating treatment takes a long time, which results in a large power supply cost. The uniformity of a plating thickness is insufficient. The insoluble anode is positioned below the gravure cylinder, and hence visibility and operability are poor. Considering these problems, the applicant of the present application has already proposed a copper plating method and apparatus for a gravure cylinder, in which a hollow cylindrical gravure cylinder is held at both ends in a longitudinal direction and accommodated in a plating bath filled with a copper plating solution, the gravure cylinder is rotated at a predetermined speed and supplied with a current so as to become a cathode, and a pair of anode chambers in the shape of a long box that is vertically installed slidably so as to face both sides of the gravure cylinder in the plating bath and contains insoluble anodes supplied with a current so as to become an anode are brought close to both side surfaces of the gravure cylinder with a predetermined interval to perform copper plating on an outer peripheral surface of the gravure cylinder (Patent Document 5).
According to the above-mentioned proposal, a copper plating method and apparatus for a gravure cylinder that provide good visibility and operability can be provided, in which copper plating with a uniform thickness compared to the conventional example can be performed over the full length of a gravure cylinder without generating defects such as rashes and pits irrespective of the size of the gravure cylinder, the concentration of a copper plating solution can be managed automatically, the consumption amount of additives can be reduced, plating treatment can be performed in a short period of time, and a power supply cost can be reduced. However, from the viewpoint of the uniformity of a thickness of copper plating over the full length of a gravure cylinder 300, the uniformity is not necessarily sufficient, and the following phenomenon has not been solved sufficiently. That is, in the vicinity of both ends of the gravure cylinder 300 (particularly, portions of about 50 mm to 200 mm from both ends), a current is concentrated, and hence, a peripheral surface in the vicinity of each end is plated thicker than a body portion, with a result that a thick plating layer of about 150 μm is formed.
The applicant of the present application has further continued to study extensively, and obtained a new landmark finding that, by dividing an insoluble electrode and adjusting a potential of each divided electrode, the current concentration in cylinder end portions can be prevented effectively. Thus, the applicant of the present application has provided a plating method for a cylinder and an apparatus therefor that provide good visibility and operability, in which copper plating with a more uniform thickness can be performed over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder, the concentration of a copper plating solution can be managed automatically, the consumption amount of additives can be reduced, plating treatment can be performed in a short period of time, a power supply cost can be reduced, and the vicinity of both ends of the cylinder is capable of greatly preventing from being plated thicker than the body portion, to thereby eliminate or simplify treatment for obtaining the uniform thickness of plating, such as follow-up polishing (Patent Document 6).
The above-mentioned plating method for a cylinder is a plating method for a cylinder in which a long cylinder is held at both ends in a longitudinal direction and accommodated in a plating bath filled with a plating solution, the cylinder is rotated at a predetermined speed and supplied with a current so as to become a cathode, and a pair of electrode chambers in the shape of a long box that is vertically installed slidably so as to face both sides of the cylinder in the plating bath and contains insoluble electrodes supplied with a predetermined current are brought close to both side surfaces of the cylinder with a predetermined interval to perform plating on an outer peripheral surface of the cylinder. In this method, the insoluble electrode is divided into a large number of divided electrodes, and the insoluble electrode portions at least corresponding to the vicinity of both ends in a longitudinal direction of the cylinder are respectively divided into at least three divided electrode groups. Each divided electrode group has one or more divided electrodes, and a potential of the divided electrode group is controlled so as to adjust a thickness of a plating layer on the outer peripheral surface of each end of the cylinder (Patent Document 6, claim 1).
Further, the above-mentioned plating apparatus for a cylinder includes a plating bath to be filled with a plating solution, chuck means for holding a long cylinder at both ends in a longitudinal direction so as to be rotated and energized, and accommodating the cylinder in the plating bath, and a pair of electrode chambers in the shape of a long box that is vertically installed slidably so as to face both sides of the cylinder in the plating bath and contains insoluble electrodes supplied with a predetermined current, the electrode chamber being brought close to both side surfaces of the cylinder with a predetermined interval to perform plating on an outer peripheral surface of the cylinder. The insoluble electrode is divided into a large number of divided electrodes, and the insoluble electrode portions at least corresponding to the vicinity of both ends in a longitudinal direction of the cylinder are respectively divided into at least three divided electrode groups. Each divided electrode group has one or more divided electrodes, and a potential of the divided electrode group is controlled so as to adjust a thickness of a plating layer on the outer peripheral surface of each end of the cylinder (Patent Document 6, claim 10).
Patent Document 1: JP S57-36995 B
Patent Document 2: JP H11-61488 A
Patent Document 3: JP 2005-29876 A
Patent Document 4: JP 2005-133139 A
Patent Document 5: WO 2006-126518
Patent Document 6: JP 2007-224321 A
According to the plating method and apparatus for a cylinder of the above-mentioned proposal, it is understood that the vicinity of both ends of a cylinder can be greatly prevented from being plated thicker than a body portion to eliminate or simplify treatment for obtaining the uniform thickness of plating, such as follow-up polishing. However, from the viewpoint of obtaining the uniform thickness of a plating layer, such plating method and apparatus cannot be considered to be perfect. The applicant of the present application has continuously searched for a technology capable of forming a plating layer uniform in thickness in a technology of plating a cylinder, and obtained a technical finding that a uniform thickness of a plating layer can be obtained in cylinder plating. Accordingly, the applicant of the present application has achieved the present invention.
The present invention provides a plating method for a cylinder and a plating apparatus therefor, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder.
According to the present invention, there is provided a plating method for a cylinder, including: holding a long cylinder at both ends in a longitudinal direction; accommodating the long cylinder in a plating bath filled with a plating solution; energizing the long cylinder so that the long cylinder functions as a cathode while rotating the long cylinder at a predetermined speed; bringing a pair of opposed insoluble electrodes close to both side surfaces of the long cylinder with a predetermined interval, the pair of opposed insoluble electrodes being vertically installed so as to face both the side surfaces of the long cylinder in the plating bath and supplied with a predetermined current; and performing plating on an outer peripheral surface of the long cylinder. The pair of opposed insoluble electrodes has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. A thickness of a plating layer on the outer peripheral surface of the long cylinder is adjusted by controlling an interval of closeness to the long cylinder.
According to the present invention, there is provided a plating apparatus for a cylinder, including: a plating bath to be filled with a plating solution; chuck means for holding a long cylinder at both ends in a longitudinal direction so as to be rotated and energized, and accommodating the long cylinder in the plating bath; and a pair of opposed insoluble electrodes which is vertically installed so as to face both side surfaces of the long cylinder in the plating bath, and is supplied with a predetermined current, the pair of opposed insoluble electrodes being brought close to both the side surfaces of the long cylinder with a predetermined interval to perform plating on an outer peripheral surface of the long cylinder. The pair of opposed insoluble electrodes has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. A thickness of a plating layer on the outer peripheral surface of the long cylinder is adjusted by controlling an interval of closeness to the long cylinder.
In the plating method and the plating apparatus for a cylinder of the present invention, regarding the curved shape of the lower part of the insoluble electrode, the effect is enhanced as long as the lower part is curved inward. However, it is preferred that the lower part have a curved shape so as to conform to the curved outer peripheral surface of the cylinder.
The interval at which the insoluble electrode is brought close to the gravure cylinder side surface is about 1 mm to 50 mm, preferably about 3 mm to 40 mm, most preferably about 5 mm to 30 mm. From the viewpoint of the uniformity of a plating thickness, it is preferred that the insoluble electrode be brought as close to the gravure cylinder side surface as possible. However, when the insoluble electrode is brought too close to the gravure cylinder side surface, the insoluble electrode and the gravure cylinder may come into contact with each other during plating treatment.
A copper plating solution can be used as the plating solution, and a gravure cylinder can be used as the cylinder. Further, it is preferred that the copper plating solution contain copper sulfate, sulfuric acid, chlorine, and an additive. When a gravity of the copper plating solution and a concentration of sulfuric acid are measured, in the case where the gravity is too high, it is preferred to supply water, and in the case where the concentration of sulfuric acid is too high, it is preferred to supply cupric oxide powder. Thus, it is not necessary to perform the conventional periodic maintenance of the copper plating solution and the disposal of a waste liquid. Note that, it is preferred that impurities be removed from the copper plating solution through a filter. Further, a chromium plating solution can also be used as the plating solution so as to perform chromium plating.
According to the present invention, the following remarkable effects can be achieved. That is, in a technology of plating a cylinder, a plating layer having a uniform thickness can be formed. Plating with a more uniform thickness can be performed over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The vicinity of both ends of the cylinder is greatly prevented from being plated thicker than a body portion, thereby eliminating or simplifying treatment for obtaining a uniform thickness of plating, such as follow-up polishing. The present invention can be particularly suitably used for plating treatment of a gravure cylinder.
Hereinafter, an embodiment of the present invention is described with reference to the attached drawings. Illustrated examples are shown for illustrative purposes. Therefore, it is natural that they can be modified variously as long as they do not extend beyond the technical idea of the present invention.
The chuck means 14, 14 are a roll chuck apparatus (see Patent Documents 1 to 3, 5, and 6) for holding the gravure cylinder 300 at both ends in a longitudinal direction and accommodating the gravure cylinder 300 in the plating bath 10, and include a spindle 16 axially supported by a bearing 6, and a water-resistant adapter 15 for preventing entry of the copper plating solution 304. The chuck means 14, 14 are driven to rotate at a predetermined speed (e.g., about 120 rpm) through the intermediation of a chain C and a sprocket 18 by a cylinder rotation motor 306 provided on a base 4, and can be energized so that the gravure cylinder 300 becomes a cathode (see
The feature of the present invention resides in that, as clearly illustrated in
Next, an example of a mechanism that enables the pair of insoluble electrodes 22, 22 to slide on both sides of the gravure cylinder 300, which is not essential in the present invention and is not particularly limited for a structure of the mechanism, is described with reference to
Regarding the spur gears 35, 38 that allow the racks 60, 62 to reciprocate, the spur gear 35 is fixed to the base 4 with a fixture 40 so as to rotate coaxially with a sprocket 45 on the outer wall surface side of the base 4. On the other hand, the spur gear 38 is fixed to the base 4 with a fixture 39 so as to rotate coaxially with a sprocket 48 on the outer wall surface side of the base 4. Right below the sprocket 45, a sprocket 44 is provided so as to rotate coaxially with a spur gear 34, and right below the other sprocket 48, a sprocket 47 is provided so as to rotate coaxially with a sprocket 46. On the outer wall surface of the base 4, a geared motor 30 is installed through the intermediation of a mounting angle bar 31, and a spur gear 32 is provided. A spur gear 33 is provided so as to rotate coaxially with a sprocket 43 and to be engaged with the spur gear 32. A chain C1 is engaged between the sprockets 43, 46, a chain C2 is engaged between the sprockets 44, 45, and a chain C3 is engaged between the sprockets 47, 48. Thus, due to the forward and reverse drive of the geared motor 30, the spur gears 35, 38 rotate forwardly and reversely, and the racks 60, 62 reciprocate. In synchronization therewith, the insoluble electrodes 22, 22 are slidable accurately along the linear rails 50, 52 (see
The interval at which each insoluble electrodes 22, 22 are brought close to the side surfaces of the gravure cylinder 300 is about 1 mm to 50 mm, preferably about 3 mm to 40 mm, most preferably about 5 mm to 30 mm. From the viewpoint of the uniformity of a plating thickness, it is considered to be preferred that the insoluble electrodes 22, 22 be brought as close to the side surfaces of the gravure cylinder 300 as possible. However, when the insoluble electrodes 22, 22 are brought too close to the side surfaces of the gravure cylinder 300, the insoluble electrodes 22, 22 and the gravure cylinder 300 may come into contact with each other during copper plating treatment.
It is desired that the copper plating apparatus 2 for a gravure cylinder of the present invention further include a copper plating solution automatic management mechanism and a liquid supply mechanism as described in Patent Document 6, but detailed description thereof is omitted.
The above-mentioned copper plating solution automatic management mechanism adjusts the concentrations of copper and sulfuric acid in the copper plating solution stored in the reservoir bath. In the case where the copper plating solution contains, for example, copper sulfate (CuSO4.5H2O) with a concentration of 200 to 250 g/L, sulfuric acid (H2SO4) with a concentration of 50 to 70 g/L, chlorine (CL) with a concentration of 50 to 200 ppm, and additives with a concentration of 1 to 10 mL/L such as a brightener and a burn prevention agent, as copper plating with respect to the gravure cylinder proceeds, the concentration of copper ions in the copper plating solution decreases, and free sulfuric acid increases. Thus, the copper plating solution automatic management mechanism is introduced for the purpose of adding cupric oxide (CuO) to effect a reaction: CuO+H2SO4→CuSO4+H2O to adjust the reduced concentration of copper ions. This is preferred because it is not necessary to perform the conventional periodic maintenance of the copper plating solution and the disposal of a waste liquid.
The present invention is described more specifically by way of examples below. It should be noted that these examples are shown for illustrative purposes and should not be interpreted in a limited manner.
In the following Examples 1 to 3, the following common configuration was used. As a copper plating solution, a copper sulfate plating solution was used, which had a copper sulfate concentration of 220 g/L, a sulfuric acid concentration of 60 g/L, and a chlorine concentration of 120 ppm, and contained, as additives, 5 mL/L of “Cosmo RS-MU” (produced and sold by Daiwa Special Chemical Co., Ltd.) and 2 mL/L of “Cosmo RS-1” (produced and sold by Daiwa Special Chemical Co., Ltd.). As powder supplied by the copper plating solution automatic management mechanism, cupric oxide powder “Fusible copper oxide (ES-CuO)” (produced and sold by Tsurumi Soda Co., Ltd.) was used. As an insoluble electrode, an electrode obtained by coating the surface of a titanium plate with iridium oxide was used. The lower end portion of the titanium plate was curved.
As a gravure cylinder, a cylindrical base of an aluminum core having a circumference of 500 mm and a full length of 1,100 mm was used. The gravure cylinder was mounted in a plating bath under the condition that both ends of the gravure cylinder were chucked. The lower end portions of insoluble electrodes contained in electrode chambers were brought close to gravure cylinder side surfaces up to an interval of 30 mm with a slide mechanism controlled by a computer, and the copper plating solution was overflowed so that the gravure cylinder was soaked completely. The rotation speed of the gravure cylinder was set to 120 rpm, a liquid temperature was set to 40° C., and a current density was set to 16 A/dm2 (total current of 890 A and voltage of 7 V). As illustrated in
The same result as that of Example 1 was obtained, when plating treatment was performed in the same way as in Example 1 except for using a cylindrical base of an aluminum core having a circumference of 430 mm and a full length of 1,100 mm as a gravure cylinder.
The same result as that of Example 1 was obtained, when plating treatment was performed in the same way as in Example 1 except for using a cylindrical base of an aluminum core having a circumference of 920 mm and a full length of 1,100 mm as a gravure cylinder.
In the above-mentioned embodiment of the present invention, an example is described in which copper plating is performed with respect to a gravure cylinder. However, the present invention is not limited to this example. The present invention can also be applied to the case where chromium plating is performed with respect to a gravure cylinder and to the case where plating other than copper plating is performed with respect to other cylindrical objects to be plated. For example, the present invention can be similarly applied to the case where nickel plating is performed with respect to a printing cylinder for rotary screen printing.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2010-220407 | Sep 2010 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2011/071961 | 9/27/2011 | WO | 00 | 3/4/2013 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2012/043514 | 4/5/2012 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 1918627 | Ballard | Jul 1933 | A |
| 6547936 | Metzger | Apr 2003 | B1 |
| 20080121526 | Hsiao et al. | May 2008 | A1 |
| 20090095633 | Inoue et al. | Apr 2009 | A1 |
| Number | Date | Country |
|---|---|---|
| 101184870 | May 2008 | CN |
| 1887108 | Feb 2008 | EP |
| S57-36995 | Aug 1982 | JP |
| H0198170 | Jun 1989 | JP |
| H11-61488 | Mar 1999 | JP |
| 11-117095 | Apr 1999 | JP |
| 2001-81592 | Mar 2001 | JP |
| 2005-29876 | Feb 2005 | JP |
| 2005-133139 | May 2005 | JP |
| 2007-224321 | Sep 2007 | JP |
| 2008-150675 | Jul 2008 | JP |
| 10-2007-0118694 | Dec 2007 | KR |
| 2006-126518 | Nov 2006 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 20130161196 A1 | Jun 2013 | US |
