This application claims priority of China Patent Application No. 201310201784.X filed on May. 27, 2013, the entirety of which is incorporated by reference herein.
1. Field of the Invention
The present disclosure relates to a heat dissipating device, and in particular, to a heat dissipating device with fins.
2. Description of the Related Art
Regarding the conventional manufacturing method of the heat dissipating device, the fins and the heat pipe are fixed on the substrate thereof by solder paste. However, for environmentally friendly considerations, the solder paste should be reduced through the redesigning of the structure of the heat dissipating device. Moreover, manufacturing cost may be decreased because the solder process is performed by manual labor.
To solve the described problems, the present disclosure provides a heat dissipating device assembled without solder paste.
The present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins and a heat pipe. The substrate has a plurality of retaining holes. Each of the first fins includes a heat dissipating sheet, a contacting sheet, and a retaining sheet. The heat dissipating sheet has a receiving hole. The contacting sheet is extended from the heat dissipating sheet. The retaining sheet is extended from the heat dissipating sheet, and passes through one of the retaining holes. The heat pipe is disposed on the receiving hole, and contacts with the contacting sheet.
The present disclosure provides a heat dissipating device including a substrate, a plurality of the first fins, and a heat pipe. The substrate has a retaining hole. Each of the first fins includes a heat dissipating sheet, a contacting sheet and a first retaining sheet. The heat dissipating sheet has a receiving hole. The contacting sheet is extended from the heat dissipating sheet, and has a first end. The first retaining sheet is extended from the first end, and passes through the retaining hole. The heat pipe is disposed on the receiving hole, contacting with the contacting sheet.
In the conclusion, the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure, meeting environmentally friendly considerations, and decreasing manufacturing costs.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The substrate 10 may be a printed circuit board or a supporting board in an electronic device. The supporting board is made of heat-conducting or electrically conducting material, such as metal, and is utilized for disposing a variety of electronic elements thereon, such as a printed circuit board, a power supply, or a fan. The substrate 10 may be a sheet structure, and has a plurality of retaining holes 11 arranged along an arrangement direction D1. The retaining holes 11 may be rectangular and extended along an extension direction D2, which is perpendicular to the arrangement direction D1. In the embodiment, a part of the retaining holes 11 are located at the edge of the substrate 10, and is respectively communicated with the openings 12 located at the edge of the substrate 10.
As shown in
The first heat dissipating sheet 211 is a plate structure perpendicular to the arrangement direction D1. The first heat dissipating sheet 211 has a receiving hole S1. The first contacting sheet 212, the first spacing sheet 213, and the retaining sheets 22 are disposed on a surface 2111 (as shown in
The first contacting sheet 212 is located at the edge of the receiving hole S1, and around the receiving hole S1. The first spacing sheet 213 and the retaining sheets 22 are respectively located at two opposite sides of the first heat dissipating sheet 211. The retaining sheets 22 are respectively located at the two opposite sides of the receiving hole S1 and the first contacting sheet 212. The length of the retaining sheet 22 is greater than the length of the first spacing sheet 213. In the embodiment, the length of the retaining sheet 22 is about at least two, three or four times that of the length of the first spacing sheet 213. The retaining sheets 22 and the first heat dissipating sheet 211 are respectively located at two opposite sides of the substrate 10.
As shown in
The heat pipe 40 is extended along the arrangement direction D1 and disposed in the receiving holes S1 of the first fins 20 and the second fins 30, and disposed on the substrate 10. In the embodiment, the heat pipe 40 is a thin structure having a plane 41, and thus, a heat source (not shown) may be disposed on an end of the plane 41, wherein the heat source may be an electronic element, such as a chip. The heat pipe 40 transmits the heat generated by the heat source to the first fins 20 and the second fins 30 for heat dissipation. In another embodiment, the heat pipe 40 may be a curved structure extended over the substrate 10, and the heat source may be disposed on the substrate 10.
As shown in
Further, the heat pipe 40 is disposed on the receiving holes S1 of the first fins 20 and the second fins 30, and contacts with the first contacting sheets 212 and the second contacting sheets 312. Next, the substrate 10 is disposed on the heat pipe 40, and the first fins 20 and the second fins 30. The retaining sheets 22 respectively pass through retaining holes 11. Next, the retaining sheets 22 are bent and contacted with the second surface 14, which is opposite to the first surface 13, of the substrate 10, to fasten the first fins 20 on substrate 10. Then, the assembly of the heat dissipating device 1 is finished.
It should be noted that there are many assembly and manufacturing methods for the heat dissipating device 1, and the assembly and manufacturing methods are not limited herein.
In the embodiment, since the heat pipe 40 is tightly mounted on the first contacting sheets 212 and the second contacting sheets 312, the first fins 20 and the second fins 30 are stably disposed on the heat pipe 40. Moreover, by the retaining sheets 22 contacting with the second surface 14 of the substrate 10, the first heat dissipating sheets 211 press the heat pipe 40 to clamp the heat pipe 40 between the first surface 13 of the substrate 10 and the first heat dissipating sheets 211.
In the embodiment, since the first fins 20, the second fins 30, and the heat pipe 40 are fixed on the substrate 10 by bending the retaining sheets 22, solder paste is not needed for the assembly of the heat dissipating device 1. Moreover, the assembly of the heat dissipating device 1 is able to be performed by automated equipment, and thus, labor and manufacturing costs are decreased.
In another embodiment, the first fins 20 or the second fins 30 includes a fastening element (not shown) to make the second fins 30 fix onto the first fins 20 or another adjacent second fin.
In
The substrate 10b has a retaining hole 11b extended along the arrangement direction D1. Two L-shaped fastening elements 15 are disposed on the edge of the substrate 10b, wherein the L-shaped fastening element 15 includes a first plate 151 and a second plate 152. The first plate 151 is connected to the edge of the substrate 10, and is perpendicular to the substrate 10. The second plate 152 is connected to the first plate 151, and is perpendicular to the first plate 151 and parallel to substrate 10. Moreover, the retaining holes 11, and the connection of the first plate 151 and the substrate 10 are extended along the arrangement direction D1. The heat pipe 40 is located between the L-shaped fastening elements 15 and the substrate 10.
The retaining sheets 22b and 22c of the first fins 20b are respectively extended from the first end 2121 and the second end 2122 of the first contacting sheet 212. The retaining sheet 22b and the retaining sheet 22c are extended to each other. In the first fins 20b, the first spacing sheet 213 of the first embodiment may be excluded.
The second fins 30b has a second body 31b and a fastening portion 32b. The second body 31b includes a second heat dissipating sheet 311b and a second contacting sheet 312b. In the embodiment, the second heat dissipating sheet 311b and the second contacting sheet 312b of the second fins 30b are an L-shape. The fastening portion 32b is extended from one end of the second contacting sheet 312b.
In
In conclusion, the heat dissipating device of the present disclosure is fastened on the substrate by the retaining sheets of the fins to fix the heat pipe between the fins and the substrate. Moreover, solder paste is not needed during the manufacturing process of the heat dissipating device of the present disclosure for environmentally friendly considerations, and thus, the manufacturing costs are decreased.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto.
On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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201310201784.X | May 2013 | CN | national |