The present invention relates to a deburring unit for removing burrs from a workpiece with the burrs generated or formed along kerfs cut by a cutting blade, and also to a cutting machine including the deburring unit.
In a manufacturing process of semiconductor devices, for example, a front surface of a disk-shaped semiconductor wafer (hereinafter simply called a “wafer”) is defined into numerous rectangular regions by scribe lines (hereinafter called “streets”) arrayed in a grid pattern, and such devices as integrated circuits (ICs) or large scale integration circuits (LSIs) are formed in the individual rectangular regions. A plurality of semiconductor chips are then formed by cutting the wafer, on which the numerous devices have been formed, along the streets with a cutting blade called a “dicing saw” of a cutting machine (see, for example, Japanese Patent Laid-open No. 2018-160578).
As known well, burrs occur on edges of kerfs (cut grooves) formed in a wafer, when the wafer is cut with a cutting blade of a cutting machine. As leads and electrode pads of devices such as ICs are arranged across streets of a wafer in a plurality of rectangular regions defined by the streets, the cutting of the wafer along the streets with the cutting blade also results in cutting of the leads and electrode pads, so that burrs of the leads and electrode pads are generated on the edges of kerfs of the wafer.
In Japanese Patent Laid-open No. 2016-157722 and Japanese Patent Laid-open No. 2019-096759, cutting machines are hence proposed. These cutting machines are each configured such that, during cutting processing of a plate-shaped workpiece with a cutting blade, high-pressure water is ejected toward kerfs while the kerfs are formed, thereby removing burrs generated on the edges of the kerfs. According to such cutting machines, deburring can be performed concurrently with the cutting processing of a plate-shaped workpiece.
With a cutting machine that removes burrs by ejecting high-pressure water toward kerfs while forming the kerfs during cutting processing of a plate-shaped workpiece with a cutting blade as proposed in Japanese Patent Laid-open No. 2016-157722 and Japanese Patent Laid-open No. 2019-096759, there is a problem that a large amount of high-pressure water is needed during the cutting processing.
The present invention therefore has as objects thereof the provision of a deburring unit, which can effectively remove burrs generated along kerfs on a workpiece, without using a large amount of high-pressure water, and a cutting machine including the deburring unit.
In accordance with a first aspect of the present invention, there is provided a deburring unit for removing burrs from a workpiece with the burrs formed along kerfs cut by a cutting blade. The deburring unit includes a chuck table that holds the workpiece on a holding surface thereof, an ultrasonic horn that emits ultrasonic waves from a lower surface thereof, the lower surface facing an upper surface of the workpiece held on the holding surface, a water film forming nozzle configured to supply water to the workpiece held on the holding surface and to form a water film that covers the upper surface of the workpiece in its entirety, and a controller. The controller is configured to cause the ultrasonic horn to come into contact at the lower surface thereof with the water film formed with the water supplied from the water film forming nozzle and to cause ultrasonic vibrations to propagate to the water film, to thereby remove the burrs formed along the kerfs.
In accordance with a second aspect of the present invention, there is provided a cutting machine including a cutting unit that cuts with a cutting blade a workpiece held on a holding surface of a chuck table, a moving mechanism that moves the chuck table in a cutting feed direction of the cutting blade, an ultrasonic horn having a lower surface that is facing an upper surface of the workpiece held on the holding surface of the chuck table, with a clearance therebetween, and a water film forming nozzle configured to supply water to the workpiece held on the holding surface and to form a water film that covers the upper surface of the workpiece in its entirety.
According to the present invention, the removal of burrs generated along kerfs on a workpiece is achieved by forming a water film over the entirety of an upper surface of the workpiece, causing the ultrasonic horn to come into contact at its lower surface with the water film, and allowing ultrasonic vibrations to propagate to the water film. The burrs can thus be efficiently and surely removed in a short period of time. Moreover, the removal of the burrs does not require ejection of high-pressure water toward the kerfs of the workpiece during the cutting processing of the workpiece, so that the deburring can be performed economically at low cost without wasting a large amount of high-pressure water.
The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claims with reference to the attached drawings showing some preferred embodiments of the invention.
Embodiments of the first and second aspects of the present invention and first and second modifications of the embodiment of the first aspect will hereinafter be described in reference to the attached drawings.
The cutting machine 1 illustrated in
Next, configurations of the chuck table 10, the moving mechanism 20, the cutting unit 30, the deburring unit 40, the first transfer unit 50, the second transfer unit 60, the cleaning unit 70, and the controller 80, all of which are the principal elements that make up the cutting machine 1, will hereinafter be described sequentially.
As illustrated in
Here, the workpiece W, as illustrated in
From the workpiece W configured as described above, the surplus region R2 is cut off as a cut margin by the cutting machine 1, and each device region R1 is cut along the streets L and thus divided into individual chips.
The workpiece W is not limited to a substrate with semiconductor devices formed thereon, and may be a metal substrate with light emitting diodes (LED) devices formed thereon, and further is not limited to a substrate obtained after the formation of devices thereon, and may be a substrate available before the formation of devices thereon. As the material of the protruding portions Wb of the workpiece W, epoxy resin, silicone resin, or the like is selected, for example, but any desired appropriate material can be used insofar as it can form the protruding portions Wb on the resin substrate Wa.
On the other hand, at an area of the holding surface 10a of the chuck table 10, the area corresponding to the protruding portions Wb of the workpiece W, a plurality (three in the example illustrated in
In this embodiment, as illustrated in
As illustrated in
The moving mechanism 20 illustrated in
A support stage 3 is disposed upright on a left end portion (an end portion in a −X-axis direction) of the bed 2, and the cutting unit 30 is supported on the support stage 3. At the processing station P1, this cutting unit 30 is arranged above the chuck table 10 that has moved to the processing station P1. The cutting unit 30 includes a spindle 31 that is arranged horizontally in the Y-axis direction (front-rear direction) and is rotatable, a spindle motor (not illustrated) that rotationally drives the spindle 31, the disk-shaped cutting blade 32 attached to a distal end of the spindle 31, and the like. In this embodiment, a washer blade formed by binding abrasive grits such as diamond with a binder material is used as the cutting blade 32, and an upper half portion of the cutting blade 32 is covered by a rectangular box-shaped blade cover 33.
Inside the blade cover 33, a portion of a cutting water nozzle 34 is accommodated. This cutting water nozzle 34 serves to eject cutting water as processing fluid toward the cutting blade 32 during cutting processing, and its tip portion 34A extends downward from the blade cover 33, is bent at right angle into an L-shape, and then extends in a +X-axis direction (rightward in
As also illustrated in
The cutting unit 30 configured as described above is indexing fed in the Y-axis direction (front-rear direction) by an indexing feed mechanism 36 illustrated in
The deburring unit 40 according to the embodiment of the first aspect of the present invention serves to remove burrs (not illustrated) that have occurred along kerfs (cut grooves) formed in the workpiece W by the below-mentioned cutting processing of the workpiece W, and includes an ultrasonic horn 41 that emits ultrasonic waves from a lower surface thereof facing the upper surface of the workpiece W held on the chuck table 10, the above-described cutting water nozzle 34 that functions as a water film forming nozzle to form a water film 44 (see
As illustrated in
The ultrasonic horn 41 is electrically connected to a high-frequency (HF) power supply 42, and is raised or lowered in the Z-axis direction by a lift mechanism 43 illustrated in
During the cutting processing of the workpiece W, the controller 80 supplies water from the cutting water nozzle 34 used commonly as the water film forming nozzle, covers with water the entirety of the upper surface of the workpiece W held on the chuck table 10, to form the water film 44, causes the ultrasonic horn 41 to come into contact at the lower surface thereof with the water film 44, and then allows ultrasonic vibrations to propagate to the water film 44, thereby allowing the deburring unit 40 to perform its function of removing burrs generated along kerfs on the workpiece W. Details of the controller 80 will be described later.
As illustrated in
As also illustrated in
The cleaning unit 70 is arranged at a substantially central area of the bed 2, and includes a disk-shaped cleaning table (spinner table) 71 and a cleaning water nozzle (not illustrated). The cleaning table 71 rotates at a predetermined speed about a vertical axial center with the cutting-processed workpiece W held thereon, and the cleaning water nozzle ejects cleaning water toward the workpiece W held on the cleaning table 71.
The controller 80 includes a central processing unit (CPU) that performs computation processing in accordance with a control program, memories such as a read only memory (ROM) and a random access memory (RAM), and the like. This controller 80 controls the rotating mechanism (not illustrated) that rotates the chuck table 10 about the axial center thereof, the spindle motor (not illustrated) that rotationally drives the spindle 31 of the cutting unit the indexing feed mechanism 36, the lift mechanism (not illustrated) that raises and lowers the cutting unit 30, the high-frequency power supply 42 that drives the ultrasonic horn 41 of the deburring unit the lift mechanism 43 (see
In the cutting machine 1 according to this embodiment, as illustrated in
A description will next be made of operation of the cutting machine 1 configured as described above. When cutting processing of the workpiece W is performed by the cutting machine 1, the workpiece W is placed and positioned on the paired guide rails 51 illustrated in
At the processing station P1 illustrated in
From the state described above, the cutting blade 32 is lowered by a predetermined cut-in amount by the lift mechanism (not illustrated) for the cutting unit 30 while being rotationally driven at a high speed, and at the same time, the chuck table 10 and the workpiece W held thereon are moved in a −X-axis direction by the moving mechanism 20 illustrated in
At the processing station P1, the workpiece W held on the chuck table 10 is then cut along the streel L by the cutting blade 32 while being fed with the cutting water from the cutting water nozzle 34. At this time, the cutting water ejected from the cutting water nozzle 34 and used for lubrication and cooling of the cutting blade 32 accumulates in a space inside the outer wall 12 surrounding the workpiece W, and as illustrated in
After the above-described cutting processing has been performed on the workpiece W along all the streets L in one direction, the chuck table 10 and the workpiece W held thereon are rotated by 90° by the rotating mechanism (now illustrated), followed by similar cutting processing along the streets L in the other direction orthogonal to the streets L along which the cutting has already been completed. Upon completion of the cutting along all the streets L of the workpiece W, a plurality of chips are obtained with devices formed individually thereon.
After the completion of the above-described cutting processing of the workpiece W by the cutting unit 30, the workpiece W is held and transferred by the second transfer unit 60 from the chuck table 10 to the cleaning unit 70. The workpiece W transferred to the cleaning unit 70 is then placed on the cleaning table 71, and is held under suction on the cleaning table 71 by the suction source (not illustrated). The cleaning table 71 and the workpiece W held thereon are next rotationally driven at a predetermined speed about the vertical axial center by the rotating mechanism (not illustrated), and cleaning water is ejected from the cleaning water nozzle (not illustrated) toward the workpiece W, whereby cutting debris stuck on the workpiece W is cleaned off and removed.
With the cutting machine 1 according to this embodiment, cutting processing is performed on the workpiece W through a series of processing as described above. As described above, the burrs that have occurred along the kerfs (cut grooves) formed in the workpiece W during the cutting processing are surely removed in a short period of time by ultrasonic vibrations of the water film 44 by the ultrasonic horn 41, the water film 44 being formed over the entirety of the upper surface of the workpiece W with the cutting water ejected from the cutting water nozzle 34 toward the cutting blade 32 during the cutting processing of the workpiece W.
The above embodiment adopts the configuration in which the water film 44 is formed over the entirety of the upper surface of the workpiece W during cutting processing of the workpiece W held on the chuck table 10 and the water film 44 is ultrasonically vibrated by the ultrasonic horn 41.
At the cleaning unit 70, the same advantageous effects as mentioned above can be obtained when the ultrasonic horn 41 is attached to the transfer pad 62 of the second transfer unit 60 as described above. Now, different examples of a deburring unit disposed in a cleaning unit will hereinafter be described as a first modification and a second modification.
<First Modification>
A cleaning unit 70A illustrated in
Further, the cleaning water nozzle 73 is attached to a distal end of an arm 79 extending horizontally from an upper end of a vertical shaft 78 swingably driven by an electric motor 77, and cleaning water is supplied from a cleaning water supply source (not illustrated) to the cleaning water nozzle 73.
In the workpiece set WS1, the disk-shaped workpiece (wafer) W1 and a ring-shaped frame F disposed around the workpiece W1 are integrated by a tape T bonded thereto. In the workpiece set WS2, on the other hand, the rectangular workpiece W2 and a ring-shaped frame F disposed around the workpiece W2 are integrated by a tape T bonded thereto. Each workpiece W1 or W2 is defined at a front surface (upper surface in
The deburring unit 40A according to this first modification includes an ultrasonic horn 41 having a lower surface that is facing an upper surface of the workpiece W1 (or W2) of the workpiece set WS1 (or WS2) is held on the holding surface 71a of the cleaning table 71, with a clearance therebetween, and the cleaning water nozzle 73 as the water film forming nozzle that forms the water film 44 (see
The above-described ultrasonic horn 41 includes a single circular cylindrical horn 41a, and this ultrasonic horn 41 is arranged on a central axis of the holding surface 71a of the cleaning table 71, and can be raised or lowered in the Z-axis direction by a lift mechanism 90 illustrated in
The above-described ball screw shaft 94 is supported in a rotatable manner at upper and lower ends thereof on the base plate 91 via bearings 95 and 96, and is connected at the upper end thereof to an electric motor 97 as a rotary drive source.
When the electric motor 97 is actuated and the ball screw shaft 94 is rotated in the lift mechanism 90 configured as described above, the slider 93 that is in threaded engagement with the ball screw shaft 94 is moved up or down along the guide rail 92 so that the ultrasonic horn 41 raised or lowered in the Z-axis direction together with a gantry swing arm 98 attached to the slider 93.
On one end portion in a length direction of the slider 93 arranged in the horizontal direction, the swing arm 98 is supported in a swingable manner. A vertical turning shaft portion 98a of this swing arm 98 is supported on the slider 93 in a turnable manner, and an electric motor 99 is attached as a rotary drive source to a lower end of a portion of the turning shaft 98a, the portion extending through the slider 93.
From an upper end of the turn ng shaft portion 98a of the swing arm. 98, a horizontal arm portion 98b extends horizontally, and on the horizontal arm portion 98h, a high-frequency (HF) power supply 42 is arranged to actuate the ultrasonic horn 41. Further, a vertical portion 98c extends vertically downward from an end portion in a length direction of the horizontal arm portion 98h of the swing arm 98, and the ultrasonic horn 41 is attached to a lower end of the vertical portion 98c.
In the cleaning unit 70A including the deburring unit 40A configured as described above, the electric motor 99 is actuated, the swing arm 98 is caused to horizontally swing centering around the turning shaft portion 98a, and the ultrasonic horn 41 attached to the vertical portion 98c of the swing arm 98 is positioned on a central axis of the workpiece W1 (or W2) of the workpiece set WS1 (or WS2) as illustrated in
In this first modification, the burrs that have occurred on the workpiece W1 (or W2) can be efficiently and surely removed in their entirety at once in a short period of time in the cleaning unit 70A. As the removal of the burrs is performed using the cleaning water ejected from the cleaning water nozzle 73, it is no longer necessary, unlike in the related art, to eject high-pressure water in addition to cleaning water toward the workpiece W1 (or W2). Deburring can thus be performed economically at low cost without wasting a large amount of high-pressure water.
The cleaning of the workpiece set. WS1 (or WS2) by the cleaning unit 70A is performed, as in the related art, by ejecting cleaning water from the cleaning water nozzle 73 toward the workpiece set WS1 (or WS2) while rotating the cleaning table 71 and the workpiece set WS1 (or WS2) held thereon at a predetermined speed.
<Second Modification>
In this second modification, an ultrasonic horn 41 disposed in the deburring unit 40B is configured by assembling and integrating a plurality (ten in the example illustrated in
In a cleaning unit 70B including the deburring unit 40B according to this second modification, cleaning water is ejected from the cleaning water nozzle 73 toward the workpiece W2 (or W1), and as illustrated in
In this second modification, the burrs that have occurred on the workpiece W2 (or W1) can also be efficiently and surely removed in their entirety at once in a short period of time in the cleaning unit 70B as in the first modification. As the removal of the burrs is performed using the cleaning water ejected from the cleaning water nozzle 73, it is unnecessary to eject high-pressure water in addition to cleaning water toward the workpiece W21 (or W1). Deburring can thus be performed economically at low cost without wasting a large amount of high-pressure water.
The cleaning of the workpiece set WS2 (or WS1) by the cleaning unit 70B is also performed, as in the related art, by ejecting cleaning water from the cleaning water nozzle 73 toward the workpiece set WS2 (or WS1) while rotating the cleaning table 71 and the workpiece set WS2 (or WS1) held thereon at predetermined speed.
Moreover, the practice of the present invention should not be limited to the embodiments and modifications described above, and various modifications can obviously be made within the scope of the technical concept described in the claims, specification, and drawings.
The present invention is not limited to the details of the above-described preferred embodiments. The scope of the invention is defined by the appended claims and all changes and modifications as fall within the equivalence of the scope of the claims are therefore to be embraced by the invention.
Number | Date | Country | Kind |
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2022-093687 | Jun 2022 | JP | national |