Disco Corporation

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Expanding apparatus
- Patent number 12,255,087
- Issue date Mar 18, 2025
- Disco Corporation
- Tomohito Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dryness detection method and dryness detection apparatus
- Patent number 12,253,458
- Issue date Mar 18, 2025
- Disco Corporation
- Yoshinobu Saito
- G01 - MEASURING TESTING
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting apparatus
- Patent number 12,251,768
- Issue date Mar 18, 2025
- Disco Corporation
- Takashi Fukazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding apparatus
- Patent number 12,255,071
- Issue date Mar 18, 2025
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 12,236,619
- Issue date Feb 25, 2025
- Disco Corporation
- Hironari Ohkubo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer holder
- Patent number 12,237,191
- Issue date Feb 25, 2025
- Disco Corporation
- Yoshihiro Omuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for producing diamond and method for manufacturing same
- Patent number 12,227,828
- Issue date Feb 18, 2025
- National University Corporation Nagaoka University of Technology
- Hideo Aida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protective component forming apparatus
- Patent number 12,230,520
- Issue date Feb 18, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing apparatus and testing method
- Patent number 12,222,328
- Issue date Feb 11, 2025
- Disco Corporation
- Makoto Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Inspection substrate
- Patent number 12,220,839
- Issue date Feb 11, 2025
- Disco Corporation
- Yoshikatsu Soejima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Sheet sticking apparatus
- Patent number 12,220,840
- Issue date Feb 11, 2025
- Disco Corporation
- Yoshinori Kakinuma
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting apparatus
- Patent number 12,220,782
- Issue date Feb 11, 2025
- Disco Corporation
- Zhibo Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chuck table and grinding method of workpieces
- Patent number 12,220,785
- Issue date Feb 11, 2025
- Disco Corporation
- Keisuke Nakano
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate
- Patent number 12,214,526
- Issue date Feb 4, 2025
- Disco Corporation
- Hayato Iga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,211,731
- Issue date Jan 28, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of grinding plate-shaped workpiece
- Patent number 12,208,489
- Issue date Jan 28, 2025
- Disco Corporation
- Satoshi Yamanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Tape affixing apparatus
- Patent number 12,208,984
- Issue date Jan 28, 2025
- Disco Corporation
- Takashi Uchiho
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of transferring wafer
- Patent number 12,211,732
- Issue date Jan 28, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,208,468
- Issue date Jan 28, 2025
- Disco Corporation
- Natsuko Hanamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 12,208,482
- Issue date Jan 28, 2025
- Disco Corporation
- Hiroki Aikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing monocrystalline silicon substrate
- Patent number 12,202,173
- Issue date Jan 21, 2025
- Disco Corporation
- Hayato Iga
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer forming method
- Patent number 12,194,571
- Issue date Jan 14, 2025
- Disco Corporation
- Taizo Kanezaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer and processing apparatus for wafer
- Patent number 12,191,204
- Issue date Jan 7, 2025
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method
- Patent number 12,191,213
- Issue date Jan 7, 2025
- Disco Corporation
- Naoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS
- Publication number 20250104213
- Publication date Mar 27, 2025
- Disco Corporation
- Ryosuke KUROSAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250105167
- Publication date Mar 27, 2025
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250091174
- Publication date Mar 20, 2025
- Disco Corporation
- Yujiro UMEZAWA
- B24 - GRINDING POLISHING
Information Patent Application
DIVIDING METHOD
- Publication number 20250083358
- Publication date Mar 13, 2025
- Disco Corporation
- Masahiro KOBAYASHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20250087489
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD
- Publication number 20250087490
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE SUPPORT
- Publication number 20250083269
- Publication date Mar 13, 2025
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD
- Publication number 20250087492
- Publication date Mar 13, 2025
- Disco Corporation
- Tomoaki SUGIYAMA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250073820
- Publication date Mar 6, 2025
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250073821
- Publication date Mar 6, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250079331
- Publication date Mar 6, 2025
- Disco Corporation
- Nobuki KAKIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BREAKING METHOD
- Publication number 20250069953
- Publication date Feb 27, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20250058422
- Publication date Feb 20, 2025
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20250063950
- Publication date Feb 20, 2025
- Disco Corporation
- Tomoka MORI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE
- Publication number 20250059681
- Publication date Feb 20, 2025
- Disco Corporation
- Naoki MURAZAWA
- C30 - CRYSTAL GROWTH
Information Patent Application
PROCESSING METHOD FOR WORKPIECE
- Publication number 20250050541
- Publication date Feb 13, 2025
- Disco Corporation
- Toru TANAKA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER
- Publication number 20250054815
- Publication date Feb 13, 2025
- Disco Corporation
- Mitsuru IKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250046624
- Publication date Feb 6, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD
- Publication number 20250033245
- Publication date Jan 30, 2025
- Disco Corporation
- Yuya SETO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRINDING METHOD OF WAFER
- Publication number 20250025986
- Publication date Jan 23, 2025
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20250025958
- Publication date Jan 23, 2025
- DISCO CORORATION
- Yuji HADANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20250029828
- Publication date Jan 23, 2025
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER GRINDING METHOD
- Publication number 20250018531
- Publication date Jan 16, 2025
- Disco Corporation
- Hironobu OZAWA
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD FOR WORKPIECE
- Publication number 20250018528
- Publication date Jan 16, 2025
- Disco Corporation
- Hayato KIUCHI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250014888
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION TRANSMISSION METHOD
- Publication number 20250013548
- Publication date Jan 9, 2025
- Disco Corporation
- Yoshihiro KAWAGUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
- Publication number 20250010519
- Publication date Jan 9, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE GRINDING METHOD
- Publication number 20250010430
- Publication date Jan 9, 2025
- Disco Corporation
- Yujiro UMEZAWA
- B24 - GRINDING POLISHING
Information Patent Application
TRANSPORT CARRIAGE
- Publication number 20250011098
- Publication date Jan 9, 2025
- Disco Corporation
- Masaya KOTANI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Trademarklast 30 trademarks

Information Trademark
79411586 - SCANPOLISH
- Serial number 79411586
- Filing date Jun 7, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79399632 - IN-FEED POLISHING
- Serial number 79399632
- Registration number 7683318
- Filing date May 31, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
98514378 - LEAF
- Serial number 98514378
- Filing date Apr 23, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
98514359 - LEAF
- Serial number 98514359
- Filing date Apr 23, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
98514315
- Serial number 98514315
- Filing date Apr 23, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
98514385 - LEAF
- Serial number 98514385
- Filing date Apr 23, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79390488 - DMETRO
- Serial number 79390488
- Registration number 7674279
- Filing date Jan 25, 2024
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79387671 - ABC
- Serial number 79387671
- Registration number 7554406
- Filing date Nov 22, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79382669 - SPINPOLISH
- Serial number 79382669
- Filing date Sep 15, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79382684 - NOKO
- Serial number 79382684
- Filing date Sep 15, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79382670 - ORIMIRROR
- Serial number 79382670
- Registration number 7665558
- Filing date Sep 15, 2023
- Disco Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79381083
- Serial number 79381083
- Registration number 7518510
- Filing date Aug 21, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79381082 - KKM-LINK
- Serial number 79381082
- Registration number 7518509
- Filing date Aug 21, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
98007182 - POLIGRIND
- Serial number 98007182
- Filing date May 22, 2023
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
97699887 - PRECUTPLATE
- Serial number 97699887
- Filing date Dec 1, 2022
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79361522 - STAYCLEAN
- Serial number 79361522
- Registration number 7191646
- Filing date Sep 9, 2022
- Disco Corporation
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
97182356 - PRECUTBOARD
- Serial number 97182356
- Registration number 7110513
- Filing date Dec 21, 2021
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
97073171
- Serial number 97073171
- Registration number 6946291
- Filing date Oct 13, 2021
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
97073006 - TAIKO
- Serial number 97073006
- Registration number 6916259
- Filing date Oct 13, 2021
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
97072682 - MUSUBI
- Serial number 97072682
- Registration number 6904995
- Filing date Oct 13, 2021
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79294121
- Serial number 79294121
- Registration number 6443561
- Filing date Jul 17, 2020
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
88850224 - ULTRACLEAN DICING
- Serial number 88850224
- Filing date Mar 27, 2020
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
79286368 - HOGOMAX
- Serial number 79286368
- Registration number 6344125
- Filing date Mar 10, 2020
- Disco Corporation
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
79286380 - RESIMAX
- Serial number 79286380
- Registration number 6366769
- Filing date Mar 10, 2020
- Disco Corporation
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
79279255 - ROOFWAY
- Serial number 79279255
- Registration number 6224537
- Filing date Dec 20, 2019
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
88707276 - TAIKO
- Serial number 88707276
- Filing date Nov 26, 2019
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
88707391
- Serial number 88707391
- Filing date Nov 26, 2019
- Disco Corporation
- 7 - Machines and machine tools
Information Trademark
88227403 - MAGIC SPOON
- Serial number 88227403
- Filing date Dec 12, 2018
- Discos Inc.
- 30 - Coffee, tea, cocoa and artificial coffee
Information Trademark
88983516 - MAGIC SPOON
- Serial number 88983516
- Registration number 6747498
- Filing date Dec 12, 2018
- Discos Inc.
- 30 - Coffee, tea, cocoa and artificial coffee
Information Trademark
88975646 - MAGIC SPOON
- Serial number 88975646
- Registration number 5875985
- Filing date Dec 12, 2018
- Discos Inc.
- 30 - Coffee, tea, cocoa and artificial coffee

Disco Corporation

Organization

Patents Grantslast 30 patents

Expanding apparatus

Dryness detection method and dryness detection apparatus

Processing method of wafer

Cutting apparatus

Grinding apparatus

Back grinding adhesive sheet, and method for manufacturing semicond...

Processing apparatus

Wafer holder

Structure for producing diamond and method for manufacturing same

Protective component forming apparatus

Testing apparatus and testing method

Inspection substrate

Sheet sticking apparatus

Cutting apparatus

Chuck table and grinding method of workpieces

Method of processing a workpiece and system for processing a workpiece

Method of manufacturing substrate

Processing method of wafer, protective sheet, and protective sheet...

Wafer processing method

Method of grinding plate-shaped workpiece

Tape affixing apparatus

Method of transferring wafer

Processing apparatus

Cutting apparatus

Method of manufacturing monocrystalline silicon substrate

Wafer forming method

Wafer manufacturing method and laminated device chip manufacturing...

Processing method of workpiece

Method of processing wafer and processing apparatus for wafer

Inspection method

Patents Applicationslast 30 patents

METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS

METHOD OF PROCESSING WAFER

METHOD OF MANUFACTURING WAFER

DIVIDING METHOD

CHIP MANUFACTURING METHOD

DEVICE CHIP MANUFACTURING METHOD

WORKPIECE SUPPORT

PROCESSING METHOD

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

METHOD OF MANUFACTURING WAFER

BREAKING METHOD

METHOD OF GRINDING WAFER

PROCESSING METHOD OF BONDED WAFER

METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE

PROCESSING METHOD FOR WORKPIECE

MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER

METHOD OF PROCESSING WAFER

BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD

GRINDING METHOD OF WAFER

LASER PROCESSING APPARATUS

METHOD OF PROCESSING WORKPIECE

WAFER GRINDING METHOD

PROCESSING METHOD FOR WORKPIECE

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

INFORMATION TRANSMISSION METHOD

METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS

WORKPIECE GRINDING METHOD

TRANSPORT CARRIAGE

Trademarklast 30 trademarks

79411586 - SCANPOLISH

79399632 - IN-FEED POLISHING

98514378 - LEAF

98514359 - LEAF

98514315

98514385 - LEAF

79390488 - DMETRO

79387671 - ABC

79382669 - SPINPOLISH

79382684 - NOKO

79382670 - ORIMIRROR

79381083

79381082 - KKM-LINK

98007182 - POLIGRIND

97699887 - PRECUTPLATE