Claims
- 1. A process for recycling an electronic scrap material comprising a metal provided on a polymeric substrate, which method comprises:milling flaked electronic scrap material with a bead impact material in the presence of water to produce flakes of cleaned polymeric substrate; adding water to the milled material and separating the flakes of cleaned polymeric substrate from metal-containing material; dewatering and drying the flakes of cleaned polymeric substrate; and treating the metal-containing material to recover the metal.
- 2. A process according to claim 1 wherein the electronic scrap material is a CD or DVD.
- 3. A process according to claim 1 which is carried out at a temperature from ambient up to 85° C.
- 4. A process as defined in claim 1 which is carried out at a temperature from ambient up to 120° C.
- 5. A process according to claim 1 wherein the weight ratio of water to flake is from 1:3 to 3:1.
- 6. A process according to claim 5 wherein the weight ratio of water to flake is 1:1.
- 7. A process according to claim 1 wherein the flake size is 1 to 20 mm.
- 8. A process according to claim 7 wherein the flake size is 4 to 8 mm.
- 9. A process according to claim 1 wherein the bead impact material is selected from plastics, silicon-containing materials, ceramics and metal powders.
- 10. A process according to claim 1 wherein the bead impact material is pumice or silica.
- 11. A process according to claim 10 wherein the pumice has a particle size of 300 μm or less.
- 12. A process according to claim 10 wherein the silica has a particle size of 150 μm or less.
- 13. A process according to claim 1 wherein the bead impact material is recycled polymeric substrate.
- 14. A process for recycling an electronic scrap material comprising a metal provided on a polymeric substrate, which process comprises:a. milling flaked electronic scrap material that is above a predetermined flake size with a first size diameter of bead impact material in the presence of water to produce flakes of cleaned polymeric substrate; b. milling flaked electronic scrap material that is at or below a predetermined size with a second size diameter of bead impact material in the presence of water to produce flakes of cleansed polymeric substrate; c. adding water to the milled material and separating the flakes of cleaned polymeric substrate from metal-containing material; d. dewatering and drying the flakes of cleaned polymeric substrate; and e. treating the metal-containing material to recover the metal.
- 15. A process according to claim 14 which comprises, prior to the first milling step:transporting a waste stream of electronic scrap material to a flaking station; dividing the material into flakes at the flaking station; and transporting the flakes to a milling station.
- 16. A process for recycling an electronic scrap material comprising a metal provided on a polymeric substrate, which method comprises:milling flaked electronic scrap material with a bead impact material in the presence of water to produce flakes of cleaned polymeric substrate; adding water to the milled material and separating the flakes of cleaned polymeric substrate from metal-containing material; dewatering and drying the flakes of cleaned polymeric substrate; and treating the metal-containing material to recover the metal, wherein the bead impact material comprises flakes of scrap electronic material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
PQ 7471 |
May 2000 |
AU |
|
Parent Case Info
This application is a 371 of PCT/AU01/00538 filed May 11, 2001.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/AU01/00538 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO01/85414 |
11/15/2001 |
WO |
A |
US Referenced Citations (22)
Foreign Referenced Citations (5)
Number |
Date |
Country |
2814908 |
Jan 1979 |
DE |
3511711 |
Mar 1985 |
DE |
19955139 |
Nov 1999 |
DE |
0601719 |
Jun 1994 |
EP |
09 048025 |
Feb 1997 |
JP |
Non-Patent Literature Citations (1)
Entry |
J. Y. Oldohue and N.R. Herbst “A Guide to Fluid Mixing,” Basic Concepts, p. 8, 11-21, no date. |