Claims
- 1. A novel laminate structure, comprising:
- a flexible polymeric substrate layer resistant to aqueous sodium hydroxide solution etchant,
- a layer of adhesive coextensive with said substrate resistant to aqueous sodium hydroxide solution etchant,
- a layer of an etchable metal comprising aluminum having a thickness of about 1 to about 15 microns overlying said adhesive layer in a pattern,
- a layer of aqueous sodium hydroxide solution etchant-resistant material overlying said etchable metal layer in the same pattern as said etchable metal layer, and
- a layer of detackifying material overlying said adhesive layer in regions thereof not overlied by said etchable metal layer.
- 2. The laminate of claim 1 which is formed by:
- effecting selective demetallization using an aqueous etchant of a laminate of a continuous layer of said etchable metal of thickness of about 1 to about 15 microns adhesively joined to and coextensive with said flexible polymeric material layer by said adhesive layer to which said pattern of etchant-resistant material has been applied so that said aqueous etchant completely removes metal in said etchable metal layer not protected by said etchant-resistant material, and
- subsequently applying said layer of detackifying material to the portion of said adhesive layer exposed by said selective demetallization.
- 3. The laminate of claim 1 wherein said etchable metal has a thickness of about 3 to about 10 microns.
- 4. The laminate of claim 3 wherein said etchable metal is aluminum.
Parent Case Info
This is a divisional of application Ser. No. 655,022 filed Feb. 14, 1991, now abandoned.
US Referenced Citations (3)
Divisions (1)
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Number |
Date |
Country |
Parent |
655022 |
Feb 1991 |
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