This disclosure relates to regulating the temperature of a hard drive testing system.
Disk drive manufacturers typically test manufactured disk drives for compliance with a collection of requirements. Test equipment and techniques exist for testing large numbers of disk drives serially or in parallel. Manufacturers tend to test large numbers of disk drives simultaneously in batches. Disk drive testing systems typically include one or more racks having multiple test slots that receive disk drives for testing.
During the manufacture of disk drives, it is common to control the temperature of the disk drives, e.g., to ensure that the disk drives are functional over a predetermined temperature range. For this reason, the testing environment immediately around the disk drive is closely regulated. Minimum temperature fluctuations in the testing environment can be critical for accurate test conditions and for safety of the disk drives.
In some known disk drive testing systems, the temperature of plural disk drive devices is adjusted by using cooling or heating air which is common to all of the disk drive devices.
In one aspect, a disk drive test slot thermal control system includes a test slot. The test slot includes a housing and an air mover (e.g., a blower or a fan). The housing includes an outer surface, and an internal cavity. The internal cavity includes a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing. The housing also includes an inlet aperture extending from the outer surface of the housing to the internal cavity. The air mover can be disposed outside of the internal cavity to provide an air flow towards the test compartment through the inlet aperture.
Embodiments can include one or more of the following features.
In some embodiments, in the absence of a disk drive and a disk drive transporter, the housing carries substantially no moving parts.
In some implementations, the housing defines an outlet aperture extending from the outer surface to the internal cavity. The air mover can include an air outlet in fluid communication with the inlet aperture and an air inlet in fluid communication with the outlet aperture.
In some embodiments, the air mover is mounted in an air mover housing. The air mover housing can be formed of a flexible material. In some cases, the air mover housing can include one or more isolators which connect the air mover to the air mover housing. In some examples, the disk drive test slot thermal control system can also include a test rack. The test rack can include a chassis that defines a slot bank configured to receive and support the test slot. The air mover housing can be mounted to the chassis.
In some implementations, the disk drive test slot thermal control system also includes a thermoelectric device configured to cool or heat an air flow exiting the air mover. The thermoelectric device can include a passive device. The thermoelectric device can include a thermoelectric cooler (e.g., a bulk thermoelectric cooler or a thin film thermoelectric cooler). The air mover can be mounted in an air mover housing that includes an opening configured to direct an air flow from the air mover towards the thermoelectric device. The thermoelectric device can be disposed downstream of the air mover and upstream of the inlet aperture.
In some cases, the disk drive test slot thermal control system can also include a cooling conduit. The thermoelectric device can be mounted to the cooling conduit, and the cooling conduit can be configured to absorb heat dissipated by the thermoelectric device. The cooling conduit can be liquid cooled. The disk drive test slot thermal control system can also include a heatsink connected to the thermoelectric device, and the air mover can be configured to direct an air flow towards the heatsink.
In some examples, the test slot includes a ducting conduit disposed within the internal cavity and configured to convey an air flow from the inlet aperture towards the test compartment. The ducting conduit can be configured to direct an air flow underneath a disk drive disposed within the test compartment. The disk drive test slot thermal control system can also include an electric heating device (e.g., a resistive heater) disposed within the internal cavity and configured to heat an air flow being conveyed through the ducting conduit and/or an air flow exiting the air mover. In some cases, the disk drive test slot thermal control system can also include a heatsink disposed within the ducting conduit and connected to the electric heating device, and the electric heating device can be configured to heat the heatsink.
The disk drive test slot thermal control system can also include test electronics in electrical communication with the thermoelectric device and/or the electric heating device. The test electronics can be configured to control current flows to the thermoelectric device and/or the electric heating device. In some cases, the disk drive test slot thermal control system also includes one or more temperature sensors disposed within the internal cavity. The one or more temperature sensors are electrically connected to the test electronics, and the test electronics are configured to control flows of current to the thermoelectric device and/or the electric heating device based, at least in part, on signals received from the one or more temperature sensors. The test electronics can be disposed outside of the internal cavity.
In some implementations, the electric heating device is disposed downstream of the air mover and downstream of the inlet aperture.
In some embodiments, the disk drive test slot thermal control system can include test electronics that are configured to communicate one or more test routines to a disk drive within the test compartment. A test slot connector can be disposed within the internal cavity. The test slot connector can be configured to engage a mating connector on a disk drive. In some cases, the test slot connector is electrically connected to the test electronics. In some examples, the disk drive test slot thermal control system includes a printed wiring board disposed within the internal cavity of the housing and arranged to be substantially coplanar with a disk drive within the test compartment, and the test slot connector is mounted to the printed wiring board. In some cases, the test electronics are disposed outside of the internal cavity. The disk drive test slot thermal control system can also include a connection interface circuit disposed within the internal cavity. The connection interface circuit can be configured to provide electrical communication between the test slot connector and the test electronics.
In another aspect, a method of adjusting air temperature within a disk drive test slot includes inserting a disk drive transporter carrying a disk drive into a housing of a disk drive test slot, actuating an air mover mounted externally to the housing to deliver an air flow into the housing, and actuating an thermoelectric device thereby cooling an air flow entering the housing.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, the method includes actuating an electric heating device thereby heating an air flow within the housing.
In some embodiments, the method includes actuating the thermoelectric device and thereby heating an air flow entering the housing.
In some implementations, actuating the thermoelectric device includes causing an electric current to be delivered to the thermoelectric device.
In some embodiments, the method can also include executing a test program that automatically adjusts a current flow to the thermoelectric device.
According to another aspect, a disk drive test slot thermal control system includes a test slot and an air mover. The test slot includes a housing having an outer surface, and an internal cavity. The internal cavity includes a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing. The air mover includes a rotating blade and is configured to provide an air flow towards the test compartment. The blade can mounted for out-of-plane rotation relative to a disk drive within the test compartment.
In another aspect, a disk drive test system includes a test slot assembly and an air mover assembly. The test slot assembly includes a plurality of test slots. Each of the test slots includes a housing including an outer surface, an internal cavity defined by the housing and including a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing, and an inlet aperture extending from the outer surface to the internal cavity. The air mover assembly is associated with corresponding ones of the plurality of test slots. The air mover assembly is disposed outside of the internal cavities of the associated test slots and is configured to provide corresponding air flows towards the test compartments of each of the associated test slots through the respective inlet apertures.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, the air mover assembly includes a plurality of air movers each associated with a corresponding one of the test slots. The air mover assembly can include an air mover housing, and the plurality of air movers can be mounted in the air mover housing. In some cases, the air mover housing is formed of a flexible material. In some examples, the air mover housing includes a plurality isolators which connect the air movers to the air mover housing. In some cases, the disk drive test system includes a test rack. The test rack includes a chassis defining a slot bank configured to receive and support the plurality of test slots, and the air mover housing is mounted to the chassis.
In some implementations, the disk drive test system includes one or more thermoelectric devices configured to cool or heat air flows exiting the air movers. The one or more thermoelectric coolers can include a passive component, e.g., a thermoelectric cooler, e.g., a bulk thermoelectric cooler or a thin film thermoelectric cooler
In some embodiments, the disk drive testing system includes a plurality of thermoelectric devices each associated with a corresponding one of the air movers and each configured to cool or heat an air flow exiting the associated one of the air movers. In some cases, the thermoelectric devices are disposed downstream of the air movers and upstream of the inlet apertures of associated ones of the test slots. The air mover assembly can include an air mover housing, and the plurality of air movers can be mounted in the air mover housing. In some examples, the air mover housing is configured to direct air flows from each of the air movers towards associated ones of the thermoelectric devices. The air mover housing can be formed of a flexible material and/or the air mover housing can include a plurality isolators which connect the air movers to the air mover housing.
The disk drive test system can also include a cooling conduit, and the thermoelectric devices can be mounted to the cooling conduit. In some cases, the cooling conduit is configured to absorb heat dissipated by the thermoelectric devices. The cooling conduit can be liquid cooled.
The disk drive test system can also include a plurality of heatsinks each connected to an associated one of the thermoelectric devices. Each of the air movers can be configured to direct an air flow towards the heatsink of the associated one of the thermoelectric devices.
In some implementations, the disk drive test system includes a plurality of electric heating devices (e.g., resistive heaters) each associated with a corresponding one of the test slots. Each of the electric heating devices is configured to heat an air flow being conveyed through the inlet aperture of the associated test slot. In some cases, each of the electric heating devices is disposed within the internal cavity of the associated test slot.
In some embodiments, the disk drive test system includes test electronics in electrical communication with the thermoelectric devices and/or the electric heating devices. The test electronics can be configured to control current flows to the thermoelectric devices and/or the electric heating devices. The disk drive test system can also include a plurality of temperature sensors each associated with a corresponding one of the test slots. The temperature sensors can be electrically connected to the test electronics, and the test electronics can be configured to control flows of current to the thermoelectric devices and/or the electric heating devices based, at least in part, on signals received from the temperature sensors. The temperature sensors can be disposed within the internal cavity of the associated one of the test slots. The test electronics can be disposed outside of the internal cavities of the test slots.
In some implementations, the disk drive test system includes a plurality of air mover assemblies each associated with a corresponding pair of the test slots. Each of the air mover assemblies is disposed outside of the internal cavities of the associated test slots and is configured to provide corresponding air flows towards the test compartments of the associated test slots through the respective inlet apertures. In some cases, each of the air mover assemblies includes a pair of air movers, and each of the air movers is associated with a corresponding one of the test slots. In some examples, each of the air mover assemblies includes an air mover housing in which the associated air movers are mounted. In some cases, each of the air movers includes a rotating blade that is mounted for out-of-plane rotation relative to a disk drive within the test compartment of the associated one of the test slots.
In another aspect, a disk drive testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, an inlet conduit is disposed between the cooling conduits and a liquid supply line and configured to convey a liquid flow from the liquid supply line toward the cooling conduits. The inlet conduit can include a strainer configured to remove particulate from the liquid flow. The inlet conduit can also include a forward-pressure regulator configured to control the inlet pressure of the liquid flow to the cooling conduits. The inlet conduit can also include a distribution manifold including a plurality of tee connections each configured to portion the liquid flow to a corresponding one of test racks. In some cases, the inlet conduit includes a shut-off valve configured to isolate the test racks from the liquid supply line. In some examples, the inlet conduit includes a plurality of shut-off valves each configured to isolate a corresponding one of the test racks from the liquid supply line.
In some embodiments, an outlet conduit is disposed between the heat exchangers and a liquid return line and is configured to convey a liquid flow from the heat exchangers toward the liquid return line. The outlet conduit can include a return manifold including a plurality of tee connections each providing a fluid connection between a corresponding one of the heat exchangers and the return manifold. The outlet conduit can also include a shut-off valve configured to isolate the test racks from the liquid return line. In some cases, the outlet conduit includes a plurality of shut-off valves each configured to isolate a corresponding one of the test racks from the liquid return line.
In some implementations, at least one of the test racks includes an air mover disposed within the test electronics compartment and configured to direct an air flow across the heat exchanger and toward the test electronics for cooling the test electronics.
In some embodiments, the test electronics compartments are substantially isolated from the test slot compartments such that air flow between the test electronics compartments and the test slot compartments is substantially inhibited.
According to another aspect, a disk drive testing system cooling circuit includes a test rack including a test slot compartment and a test electronics compartment. The test slot compartment includes a test slot. The test electronics compartment includes test electronics configured to communicate with the test slot for executing a test algorithm. An inlet conduit is configured to convey a liquid to the test rack from an external source. An outlet conduit is in fluid communication with the inlet conduit and is configured to convey a liquid from the test rack to a location remote from the test rack. The disk drive testing system also includes a heat exchanger including an inlet port in fluid communication with the inlet conduit, and an outlet port in fluid communication with the outlet conduit. The disk drive testing system also includes a first air mover that is configured to direct cooled air from the heat exchanger toward the test electronics for cooling the test electronics. A cooling conduit is disposed within the test slot compartment and is configured to convey a cooling liquid towards the test slot. The cooling conduit includes an inlet opening in fluid communication with the inlet conduit, and an outlet opening in fluid communication with the outlet conduit. A thermoelectric device is connected to the cooling conduit and is configured to cool an air flow entering the test slot.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, the thermoelectric device is operable to heat an air flow entering the test slot.
In some implementations, the test slot includes a housing having an outer surface, an internal cavity defined by the housing and including a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing, and an inlet aperture extending from the outer surface of the housing to the internal cavity. In some cases, a second air mover is disposed outside of the internal cavity and is configured to direct an air flow towards the test compartment through the inlet aperture. In some examples, the thermoelectric device is disposed downstream of the second air mover and upstream of the inlet aperture.
In some embodiments, the thermoelectric device is in electrical communication with the test electronics, and the test electronics are configured to control operation of the thermoelectric device. In some cases, the test slot includes a temperature sensor in electrical communication with the test electronics, and the test electronics are configured to control operation of the thermoelectric device based, at least in part, on signals received from the temperature sensor. In some examples, the test electronics are configured to control operation of the thermoelectric device based, at least part, on a predetermined test algorithm.
In another aspect, a method of controlling a temperature of a subject test slot in a cluster of test slots includes evaluating a request for a temperature change for the subject test slot to determine if sufficient power is available to achieve the requested temperature change, and inhibiting the requested temperature change unless or until sufficient power is determined to be available to achieve the requested temperature change.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, inhibiting the requested temperature change includes putting the request for the temperature change in a queue until sufficient power is determined to be available to achieve the requested temperature change.
In some embodiments, the method includes comparing a requested temperature setting to an active temperature setting. The method can also include calculating a change in power draw for the cluster of test slots expected to result from the requested temperature change.
In some implementations, the method also includes determining whether an active power draw of the cluster of test slots will be increased or decreased by the requested temperature change based, at least in part, on the calculated change in power draw.
The method can also include determining whether an active power draw of the cluster of test slots will be increased or decreased by the requested temperature change based, at least in part, on the calculated change in power draw, and upon determining that the active power draw of the cluster of test slots will increase as a result of the requested temperature change, comparing an expected total power draw of the cluster of test slots to a total power available to the cluster.
In some embodiments, the expected total power draw of the cluster of test slots is the sum of the active power draw of the cluster of test slots and the calculated change in power draw.
In some implementations, comparing the expected total power draw to the total power available to the cluster of test slots includes determining whether the expected total power draw exceeds the total power available to the cluster of test slots, and upon determining that the expected total power draw exceeds the total power available to the cluster of test slots, putting the request for the temperature change in a queue until sufficient power is determined to be available to the cluster to achieve the requested temperature change.
In some embodiments, comparing the expected total power draw to the total power available to the cluster of test slots includes determining whether the expected total power draw exceeds the total power available to the cluster of test slots, and upon determining that the expected total power draw does not exceed the total power available to the cluster of test slots, effecting the requested temperature change.
In some implementations, the method also includes determining whether an active power draw of the cluster of test slots will be increased or decreased by the requested temperature change based, at least in part, on the calculated change in power draw, and upon determining that the active power draw of the cluster of test slots will decrease as a result of the requested temperature change, effecting the requested temperature change.
In some embodiments, the method includes determining whether an active power draw of the cluster of test slots will be increased or decreased by the requested temperature change based, at least in part, on the calculated change in power draw, and upon determining that the active power draw of the cluster of test slots will decrease as a result of the requested temperature change, effecting the requested temperature change and retrieving another request for a temperature change from a queue.
According to another aspect, a method of controlling a temperature of a test slot in a disk drive testing system includes regulating temperature changes of a subject test slot based on one or more operating conditions of one or more other test slots neighboring the subject test slot.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, regulating temperature changes of the subject test slot can include comparing a request for a temperature change for the subject test slot with one or more operating temperatures of the one or more other, neighboring test slots, and inhibiting the requested temperature change based, at least in part, on the one or more operating temperatures of the one or more other, neighboring test slots.
In some implementations, the request for the temperature change includes a requested temperature setting. Comparing the request for the temperature change with the one or more operating temperatures of the one or more other, neighboring test slots can include calculating an average operating temperature of two or more test slots neighboring the subject test slot, and determining a difference between the requested temperature setting and the calculated average operating temperature.
In some embodiments, the method can include determining whether the difference between the requested temperature setting and the calculated average operating temperature is greater than a predetermined offset value, and upon determining that the difference is greater than the predetermined offset value, limiting a temperature change of the subject test slot to be equal to the calculated average operating temperature plus the predetermined offset value. The method can also include queuing a request to change a temperature setting of the subject test slot to the requested temperature setting, and/or providing feedback indicating that the temperature change for the subject test slot is limited.
In some implementations, the method can include determining whether the difference between the requested temperature setting and the calculated average operating temperature is greater than a predetermined offset value, and upon determining that the difference is not greater than the predetermined offset value, effecting the requested temperature change. The method can also include determining whether the other, neighboring test slots have a queued request for a temperature change, and upon determining that one of the other, neighboring test slots have a queued request for a temperature change, servicing the queued request.
In another aspect, a disk drive testing system includes a cluster of test slots including multiple test slots, each test slot being configured to receive a disk drive transporter carrying a disk drive for testing. The disk drive testing system also includes test electronics in electrical communication with the cluster of test slots and configured to adjust operating temperatures of the test slots by controlling power supplied to the test slots. The test electronics are configured to limit changes to the operating temperatures of the test slots based, at least in part, on a total power available to the cluster of test slots.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, the disk drive testing system includes multiple passive components (e.g., thermoelectric coolers and resistive heaters) each associated with a corresponding one of the test slots and each in electrical communication with the test electronics. The test electronics can be configured to regulate the operating temperatures of the test slots by controlling flows of electrical current to the passive components.
In some embodiments, the test slots each include at least one temperature sensor electrically connected to the test electronics, and the test electronics are configured to regulate the operating temperatures of the test slots based, at least in part, on signals received from the temperature sensors.
According to another aspect, a disk drive testing system includes at least one test rack including multiple test slots, each test slot being configured to receive a disk drive transporter carrying a disk drive for testing. The disk drive testing system also includes test electronics in electrical communication with the test slots. The test electronics are configured to adjust operating temperatures of the test slots, and the test electronics are configured to regulate changes to the operating temperature of each test slot in the test rack based, at least in part, on an operating condition of at least one other one of the test slots.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, the test electronics are configured to regulate changes to the operating temperature of each test slot in the test rack based, at least in part, on the operating temperature of at least one neighboring one of the test slots.
In some implementations, the test electronics are configured to regulate changes to the operating temperature of at least one of the test slots based, at least in part, on the operating temperatures of at least two or more neighboring ones of the test slots.
In some embodiments, the test slots each include at least one temperature sensor electrically connected to the test electronics, and the test electronics are configured to regulate the operating temperatures of the test slots based, at least in part, on signals received from the temperature sensors.
In some implementations, the temperature sensors are each operable to measure the operating temperature of the associated one of the test slots.
In some embodiments, the disk drive testing system includes multiple passive components each associated with a corresponding one of the test slots and each in electrical communication with the test electronics. The test electronics can be configured to regulate operating temperatures of the test slots by controlling flows of electrical current to the passive components.
In some implementations, the test electronics are configured to regulate the operating temperatures of the test slots based, at least in part, on a computer executable test routine.
In another aspect, a method of controlling a temperature of one or more test slots in a cluster of test slots includes calculating an active power draw of the cluster of test slots, calculating an active cooling liquid power load of the cluster of test slots, and adjusting a flow of power for heating or cooling one or more test slots of the cluster of test slots based, at least in part, on at least one of the calculated active power draw and the calculated active cooling liquid power load.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, the method can include comparing the calculated active power draw of the cluster of test slots to a total power available to the cluster of test slots, and limiting the adjustment of the flow of power if the calculated active power draw of the cluster of test slots exceeds the total power available to the cluster of test slots.
In some embodiments, the method can include comparing the calculated active cooling liquid power load of the cluster of test slots to a predetermined maximum cooling liquid power load for the cluster of test slots, and limiting the adjustment of the flow of power if the calculated active cooling liquid power load exceeds the predetermined maximum cooling liquid power load.
In some implementations, adjusting the flow of power for heating or cooling the one or more test slots in the cluster of test slots includes regulating the flow of electrical current to one or more passive devices associated with the one or more test slots.
According to another aspect, a disk drive testing system includes one or more test racks, and one or more test slots housed by the one or more test racks, each test slot being configured to receive and support a disk drive transporter carrying a disk drive for testing. The disk drive testing system also includes a transfer station for supplying disk drives to be tested. The one or more test racks and the transfer station at least partially define an operating area. The disk drive testing system can also include automated machinery that is disposed within the operating area and is configured to transfer disk drives between the transfer station and the one or more test slots, and a cover at least partially enclosing the operating area, thereby at least partially inhibiting air exchange between the operating area and an environment surrounding the test racks.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, the cover substantially encloses the operating area, thereby substantially inhibiting air exchange between the operating area and an environment surrounding the test racks.
In some implementations, the cover is connected to the test racks.
In some embodiments, the cover is connected to the transfer station.
In some implementations, the disk drive testing system includes a seal disposed between the cover and the test racks. The seal can be arranged to inhibit air exchange between the operating area and an environment surrounding the test racks.
In some embodiments, the disk drive testing system includes a seal disposed between adjacent ones of the test racks. The seal can be arranged to inhibit air exchange between the operating area and an environment surrounding the test racks.
In some implementations, a seal is disposed between the transfer station and an adjacent one of the test racks. The seal can be arranged to inhibit air exchange between the operating area and an environment surrounding the test racks.
In some embodiments, a seal is disposed between the cover and the transfer station. The seal can be arranged to inhibit air exchange between the operating area and an environment surrounding the test racks.
In some implementations, at least one of the test racks includes a test slot compartment including at least one of the test slots, a test electronics compartment including test electronics configured to communicate with at least one of the test slots for executing a test algorithm, and an air mover arranged to move an air flow between the operating area and the test electronics compartment for cooling the test electronics. In some cases, the air mover is disposed within the test electronics compartment. The disk drive testing system can also include a heat exchanger disposed within the test electronics compartment. The air mover can be configured to direct an air flow across the heat exchanger, and the heat exchanger can be configured to cool the air flow. In some cases, a drip pan is disposed within the test electronics compartment and arranged to collect condensed moisture from the heat exchanger. In some examples, a float sensor is disposed within the drip pan and is configured to detect a liquid level in the drip pan.
In some embodiments, the disk drive testing system includes at least one computer in communication with the test electronics and the float sensor, and the computer can be configured to control operation of the test rack based, at least in part, on signals received from the float sensor.
In some implementations, the test electronics compartment is substantially isolated from the test slot compartment such that air flow between the test electronics compartment and the test slot compartment is substantially inhibited.
In some embodiments, the disk drive testing system includes an air filter disposed within the test slot compartment and arranged to filter air flow passing between the operating area and the test electronics compartment.
In some implementations, the automated machinery includes at least one robotic arm.
In some embodiments, the one or more test racks and the transfer station are supported on a floor surface, and the cover, the test racks, the transfer station, and the floor surface substantially enclose the operating area such that air exchange between the operating area and an environment surrounding the test racks is substantially inhibited.
In some implementations, the test racks and the transfer station are arranged in at least a partially closed polygon about the automated machinery.
In another aspect, a disk drive test slot thermal control system includes a test slot including a housing having an outer surface, an internal cavity defined by the housing and including a test compartment for receiving and supporting a disk drive transporter carrying a disk drive for testing, and an inlet aperture extending from the outer surface of the housing to the internal cavity. The disk drive test slot thermal control system also includes a cooling conduit, and a thermoelectric device mounted to the cooling conduit. The thermoelectric device is configured to cool or heat an air flow entering the internal cavity through the inlet aperture.
Implementations of this aspect of the disclosure may include one or more of the following features.
In some implementations, the cooling conduit is configured to absorb heat dissipated by the thermoelectric device.
In some embodiments, the cooling conduit is liquid cooled.
In some implementations, the thermoelectric device includes a passive device.
In some embodiments, the thermoelectric device includes a thermoelectric cooler (e.g., a bulk thermoelectric cooler or a thin film thermoelectric cooler).
In some implementations, the disk drive test slot thermal control system includes a heatsink connected to the thermoelectric device.
In some embodiments, the test slot includes a ducting conduit disposed within the internal cavity and configured to convey an air flow from the inlet aperture towards the test compartment. The ducting conduit can be configured to direct an air flow underneath a disk drive disposed within the test compartment.
In some implementations the disk drive test slot thermal control system can include an electric heating device (e.g., a resistive heater). The electric heating device can be configured to heat an air flow within the internal cavity. In some cases, the electric heating device is disposed within the internal cavity and is configured to heat the air flow being conveyed through the ducting conduit. In some examples, a heatsink is disposed within the ducting conduit and is connected to the electric heating device, and the electric heating device is configured to heat the heatsink.
In some implementations, the disk drive test slot thermal control system can also include test electronics in electrical communication with the thermoelectric device and/or the electric heating device. The test electronics can be configured to control current flows to thermoelectric device and/or the electric heating device. One or more temperature sensors can be disposed within the internal cavity. The one or more temperature sensors can be electrically connected to the test electronics, and the test electronics can be configured to control flows of current to the thermoelectric device and/or the electric heating device based, at least in part, on signals received from the one or more temperature sensors. The test electronics can be disposed outside of the internal cavity.
In some embodiments, the disk drive test slot thermal control system can include test electronics configured to communicate one or more test routines to a disk drive within the test compartment. In some cases, a test slot connector is disposed within the internal cavity. The test slot connector can be configured to engage a mating connected on a disk drive, and the test slot connector can be electrically connected to the test electronics. The test electronics can be disposed outside of the internal cavity. In some examples, a connection interface circuit is disposed within the internal cavity, and the connection interface circuit is configured to provide electrical communication between the test slot connector and the test electronics.
In another aspect, a disk drive test rack includes multiple test slots, a cooling conduit configured to convey a liquid toward the test slots, and multiple thermoelectric devices each mounted to the cooling conduit and each associated with a corresponding one of the test slots. The thermoelectric devices are each configured to cool or heat an air flow entering the associate one of the test slots.
Embodiments of this aspect of the disclosure may include one or more of the following features.
In some embodiments, the disk drive test rack includes a test slot compartment including the test slots, the cooling conduit, and the thermoelectric devices. The disk drive test rack can also include a test electronics compartment including test electronics configured to communicate with the test slots for executing a test algorithm.
In some implementations, the disk drive test rack includes a heat exchanger disposed within the test electronics compartment and in fluid communication with the cooling conduit. The heat exchanger can be configured to cool an air flow within the test electronics compartment, thereby to the cool the test electronics.
In some embodiments, the disk drive test rack includes an air mover disposed within the test electronics compartment and configured to direct an air flow across the heat exchanger and toward the test electronics for cooling the test electronics.
In some implementations, an air filter is disposed between the air mover and the heat exchanger. The air filter can be configured to filter an air flow within the test electronics compartment.
In some embodiments, an air filter is disposed at an inlet of the air mover and is configured to filter an air flow directed toward the test electronics compartment.
In some implementations, the thermoelectric devices are in electrical communication with the test electronics, and the test electronics are configured to control operation of the thermoelectric devices.
In some embodiments, each of the test slots includes one or more temperature sensors in electrical communication with the test electronics. The test electronics can be configured to control operation of the thermoelectric devices based, at least in part, on signals received from the one or more temperature sensors.
In some implementations, the test electronics compartment is substantially isolated from the test slot compartment such that air flow between the test electronics compartment and the test slot compartment is substantially inhibited.
In some embodiments, the cooling conduit is configured to absorb heat dissipated by the thermoelectric devices.
In some implementations, the thermoelectric devices are operable to remove heat energy from the cooling conduit.
In some embodiments, the thermoelectric devices are operable to remove heat energy from a liquid flowing in the cooling conduit.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims.
Like reference symbols in the various drawings indicate like elements.
System Overview
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In some implementations, the tote presentation support systems 220 are each disposed on the same side of the transfer station housing 210 and arranged vertically with respect to each other. Each tote presentation support system 220 has a different elevation with respect to the others. In some examples, as shown in
A tote mover 230 is disposed on the transfer station housing 210 and is configured to move relative thereto. The tote mover 230 is configured to transfer the totes 260 between the tote presentation support systems 220 for servicing by the disk drive testing system 10 (e.g. by the robot 300 (
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As illustrated in
Referring to
In some examples, the test electronics 160 can also include at least one functional testing system 190 in communication with at least one test slot 500. The functional testing system 190 tests whether a received disk drive 600, held and/or supported in the test slot 500 by the disk drive transporter 400, is functioning properly. A functionality test may include testing the amount of power received by the disk drive 600, the operating temperature, the ability to read and write data, and the ability to read and write data at different temperatures (e.g. read while hot and write while cold, or vice versa). The functionality test may test every memory sector of the disk drive 600 or only random samplings. The functionality test may test an operating temperature of air around the disk drive 600 and also the data integrity of communications with the disk drive 600. The functional testing system 190 includes a cluster controller 181 and at least one functional interface circuit 191 in electrical communication with the cluster controller 181. A connection interface circuit 182 is in electrical communication with a disk drive 600 received within the test slot 500 and the functional interface circuit 191. The functional interface circuit 191 is configured to communicate a functional test routine to the disk drive 600. The functional testing system 190 may include a communication switch 192 (e.g. Gigabit Ethernet) to provide electrical communication between the cluster controller 181 and the one or more functional interface circuits 191. Preferably, the computer 130, communication switch 192, cluster controller 181, and functional interface circuit 191 communicate on an Ethernet network. However, other forms of communication may be used. The functional interface circuit 191 may communicate to the connection interface circuit 182 via Parallel AT Attachment (a hard disk interface also known as IDE, ATA, ATAPI, UDMA and PATA), SATA, or SAS (Serial Attached SCSI).
Temperature Control
As shown in
A shut-off valve 34 is located in the inlet conduit 22 and a combination shut-off and balancing valve 35 is located in the outlet conduit 24. The combination shut-off and balancing valve 35 sets the flow distribution between the test racks 100 and the valves 34, can also be used to isolate the test racks 100 from the chilled water system 26.
As shown in
As shown in
Test Slot Thermal Control System
Within each slot bank 110 the test slot assemblies 120 are arranged in pairs. As shown in
As shown in
As shown in
As shown in
As shown in
The test slot 500a, 500b may also include insulating material(s) (e.g., foam insulation) to inhibit the exchange of thermal energy from the internal cavity 517 to the surrounding environment (e.g., through the second cover 514b). For example, as shown in
As shown in
As illustrated in
As illustrated in
As shown in
As shown schematically in
As shown in
As mentioned above, each slot bank 110 also includes a plurality of second side wall sections 113. Each of the second side walls sections 113 is mounted between adjacent chassis members 104 opposite one of the first side walls 111. As shown in FIG. 35, each of the second side wall sections 113 defines a pair of intake apertures (i.e., first and second intake apertures 118a, 118b) and a pair of exhaust apertures (i.e., first and second exhaust apertures 119a, 119b). As illustrated in
Referring again to
Dependent Temperature Control
As discussed above, within each test rack 100 the test electronics 160 control the operating temperatures of the test slots 500, e.g., by controlling the flow of electrical power to the resistive heaters (
In some cases, the test racks 100 can be configured to control temperatures of the associated test slots 500 in such a way as to enhance the use of system resources. For example,
If it is determined that the active power draw of the cluster of test slots 500 will increase as a result of the requested temperature change, then the expected total power draw for the cluster (i.e., the active power draw of the cluster of test slots 500 plus the expected increase in power draw resulting from the requested temperature change) is compared 916 to the total power available to the cluster. If the expected total power draw exceeds the total power available (i.e., if sufficient power is not available to achieve the requested temperature change), then the temperature change request is placed in queue 918 until additional power becomes available to the cluster. If the expected total power draw does not exceed the total power available (i.e., if sufficient power is available to achieve the temperature change), then the temperature change is effected 920 and the power draw is updated.
If, instead, it is determined that the active power draw will decrease as a result of the requested temperature change (i.e., overall power consumption will be reduced), then the temperature change is effected 922 and the active power draw is updated. A temperature change request that reduces the active power draw also presents an opportunity to service 924 a temperature request from the queue. In this manner, temperature control of each test slot 500 in the cluster is made dependent on the total power available to the cluster.
Additional limitations can be placed on the ramp rate of the temperature, i.e., the rate of change of the temperature within a test slot, e.g., to achieve a desired temperature. For example,
If it is determined 946 that the test slot 500 is operating in an active resistive heating mode, then the algorithm 940 calculates 948 and resets the value of the resistive heating load (Res_HeatingLoad) to be equal to the sum of the current value for the resistive heating load (initially set 942 at zero) plus a heating ramp rate (Heating_Ramp_Rate). The heating ramp rate can be constant value, e.g., set by an operator or preprogrammed into test software, that corresponds to the power draw associated with heating one of the test slots at a particular rate (e.g., in degrees per unit of time). Otherwise, if it is determined 950 that the test slot 500 is operating in an active TEC heating mode, then the algorithm 940 calculates 952 the TEC heating load (TEC_HeatingLoad) to be equal to the sum of the current value for the TEC heating load (initially set 942 at zero) plus the heating ramp rate. Or, if it is determined 954 that the test slot 500 is operating in an active TEC cooling mode, then the algorithm 940 calculates 956 the TEC cooling load (TEC_CoolingLoad) to be equal to the sum of the current value for the TEC cooling load (initially set 942 at zero) plus a cooling ramp rate (Cooling_Ramp_Rate). The cooling ramp rate can be constant value, e.g., set by an operator or preprogrammed into test software, that corresponds to the power draw associated with cooling one of the test slots 500 at a particular rate (e.g., in degrees per unit of time). After each of the associated test slots 500 of the cluster has been assessed, the value of the resistive heating load will reflect the total amount of the active power draw that is associated with resistive heating (i.e., heating via the resistive heaters in the test slots) within the cluster, the value of the TEC heating load will reflect the total amount of the active power draw that is associated with TEC heating (i.e., heating via the thermoelectric coolers) within the cluster, and the value of the TEC cooling load will reflect the total amount of the active power draw that is associated with TEC cooling (i.e., cooling via the thermoelectric coolers) within the cluster.
Once the algorithm 940 has assessed 944 each of the test slots 500 in the cluster and determined how much each test slot contributes to either the resistive heating load, the TEC heating load, or the TEC cooling load, the algorithm 940 calculates 958 the active power draw (DC_Power_Load) of the cluster by summing the values of the resistive heating load, the TEC heating load, and the TEC cooling load, and then determines 960 whether the calculated value for the active power draw exceeds the total power available (DC_Load_Maximum). If it is determined that the calculated value for active power draw exceeds the total power available, the algorithm 940 calculates 962 the value for a power load scale (DC_Load_Scale), resetting the power load scale (initially set 942 to 1) to be equal to the total power available divided by the current value (i.e., previously calculated value) for the active power draw, and then computes 964 the active cooling liquid power load (H20_Power_Load) of the cluster. Otherwise, if it is determined that the calculated value for the active power draw does not exceed the total power available, the value for the power load scale is left at 1 and the algorithm 960 computes 964 the active cooling liquid power load of the cluster.
The algorithm 940 computes 964 the active cooling liquid power load of the cluster by setting the value for the active cooling liquid power load equal to the value of the TEC cooling load less the value of the TEC heating load. Thermoelectric coolers 745 (
If it is determined that the calculated value for the active cooling liquid power load of the cluster of test slots 500 exceeds the value for the maximum cooling liquid power load for the cluster of test slots 500, then the algorithm 940 calculates 968 the value for a cooling liquid load scale (H20_Load_Scale), resetting the cooling liquid load scale (initially set 942 to 1) to be equal to the maximum cooling liquid power load divided by the current value (i.e., previously calculated value) for the active cooling liquid power load. Then, referring to
Then, the power delivered to the resistive heaters and/or the thermoelectric coolers is adjusted based on the calculated value for the power load scale or the cooling liquid load scale in order to adjust the temperature ramp rate of the associated test slot, thereby to effect temperature changes for the test slots 500. More specifically, each test slot 500 in the cluster is again assessed 974 to determine whether it is in a resistive heating mode, a TEC heating mode, or a TEC cooling mode. If it is determined 976 that the test slot 500 being assessed is in a resistive heating mode, the power delivered to the associated resistive heater 729 is adjusted 978 to be equal to the product of the heating ramp rate and the power load scale. If it is determined 980 that the test slot 500 is in a TEC heating mode, then the power provided to the associated thermoelectric cooler 745 is adjusted 982 to be equal to the product of the heating ramp rate and the power load scale. If it is determined that the test slot is in a TEC cooling mode the power provided to the associated thermoelectric cooler 745 is adjusted to be equal to the product of the cooling ramp rate and the cooling liquid load scale. In this manner, the power distributed to each of the test slots 500 in the cluster is adjusted incrementally to achieve the respective desired temperatures.
In some cases, the thermal performance of the test slots 500 may be influenced by the operation of other neighboring test slots 500. For example, depending upon how much thermal insulation is provided between the test slots 500, the temperature that one test slot 500 can reach may be limited by the operating temperature(s) of one or more other, surrounding test slots 500. To account for such limitations, the temperature control of each test slot 500 can be made to be dependent on neighboring test slots 500. For example,
If the requested temperature for the subject test slot 500 is not greater than the sum of the calculated average of the operating temperatures of the neighboring test slots 500 plus the predetermined offset value, then the temperature change is effected 1014 to set the subject test slot 500 to the requested temperature. Then, after the temperature change is effected for the subject test slot 500, the algorithm 1000 determines 1016 whether the adjacent test slots 500 have any queued temperature requests, and, if so, then considers 1018 the queued requests in turn.
If the requested temperature for the subject test slot 500 is greater than the sum of the calculated average of the operating temperatures of the neighboring test slots 500 plus the predetermined offset value, then the temperature of the subject test slot 500 is limited 1020 to be the sum of the calculated average of the operating temperatures of the neighboring test slots 500 plus the predetermined offset value. A temperature change is effected 1022 to set the subject test slot 500 to that limited temperature, a request to change the temperature of the subject test slot 500 (e.g., from the limited temperature) to the requested temperature is queued 1024, and feedback is provided 1026 indicating that the temperature is limited.
If the neighboring test slot 500 under assessment is above or below the subject test slot 500, then the SurroundingTemp variable is reset (i.e., computed 1060) to be equal to the sum of the current value (i.e., previously set or previously calculated value) for the SurroundingTemp plus the product of a first constant (4 in this example) multiplied by the measured temperature (CurrentSlotTemp) of the neighboring test slot 500, as provided by the temperature sensors 526 (
If the neighboring test slot 500 under assessment is not above or below the subject test slot 500, then the algorithm 1050 determines 1062 whether the neighboring test slot is disposed immediately to the side (i.e., left or right) of the subject test slot 500. If the neighboring test slot 500 under assessment is disposed immediately to the side the subject test slot 500 then the SurroundingTemp variable is reset 1064 to be equal to the sum of the current value for the SurroundingTemp plus the product of a second constant (1 in this example) multiplied by the measured temperature (CurrentSlotTemp) of the neighboring test slot 500, as provided by the temperature sensors 526 (
The first and second constants are predetermined values and correspond generally to the thermal resistance between the subject test slot 500 and the neighboring test slots 500 immediately above and below compared to the thermal resistance between the subject test slot 500 and the neighboring test slots 500 immediately to sides. In this example, the first constant, 4, and the second constant, 1, were selected to reflect a thermal resistance between the subject test slot and the neighboring test slots immediately above and below that is one quarter than that of the thermal resistance between the subject test slot and the neighboring test slots immediately to the sides. The first and second constants may be different depending, e.g., on the amount of insulation provided between the test slots 500.
After the neighboring test slots 500 are assessed, the algorithm 1050 determines 1066 whether the subject test slot 500 is at the top or bottom of the associated test rack 100, i.e., first or last in a column of test slots 500. If the subject test slot 500 is at the top or bottom of the associated test rack 100, then the SurroundingTemp variable is reset 1068 to be equal to the sum of the current value for the SurroundingTemp plus the product of the first constant multiplied by the measured temperature (RackTemperature) of the test rack 100, as provided by the temperature sensors 48 (
Then, the algorithm 1050 determines 1070 whether the subject test slot 500 is disposed along the left or right edge (i.e., first or last in a row of test slots 500) of the associate test rack 100. If the subject test slot is disposed along the left or right edge of the associated test rack 100, then the SurroundingTemp variable is reset 1072 to be equal to the sum of the current value for the SurroundingTemp plus the product of the second constant multiplied by the measured temperature (RackTemperature) of the test rack 100.
Next, the algorithm 1050 averages the SurroundingTemp over the sum of twice the value of the first constant plus twice the value of the second constant, in the example shown (2×4)+(2×1)=10, and resets 1074 the value of the SurroundingTemp to equal this calculated average. Then, the algorithm 1050 calculates 1076 a temperature difference (DeltaTemp) equal to difference between the requested temperature (RequestedTemperature) and the value for the SurroundingTemp. Then, the calculated temperature difference is compared 1078 to a predetermined maximum heating temperature difference (MaxHeatDeltaTemp). If the calculated temperature difference is greater than the predetermined maximum heating temperature difference, then the value for the RequestedTemperature is reset 1080 to equal the sum of the SurroundingTemp plus the predetermined maximum temperature difference.
Then, the calculated temperature difference is compared 1082 to a predetermined maximum cooling temperature difference (MaxCoolDeltaTemp). If the calculated temperature difference is less than the predetermined maximum cooling temperature difference, then the value for the RequestedTemperature is reset 1084 to equal the sum of the SurroundingTemp plus the predetermined maximum cooling temperature difference.
Then a temperature change is effected 1086 for the subject test slot 500 based on the current value for the RequestedTemperature.
Methods of Operation
In use, the robotic arm 310 removes a disk drive transporter 400 from one of the test slots 500 with the manipulator 312, then picks up a disk drive 600 from one the disk drive receptacles 264 at the transfer station 200 with the disk drive transporter 400, and then returns the disk drive transporter 400, with a disk drive 600 therein, to the associated test slot 500 for testing of the disk drive 600. During testing, the test electronics 160 execute a test algorithm that includes, inter alia, adjusting the temperature of air flowing to the disk drive 600 under test. For example, during testing the disk drives 600 are each tested over a temperature range from about 20° C. to about 70° C. The blowers (i.e., the first and second blowers 722a, 722b of each pair of test slot assemblies 120a, 120b) each provide an isolated air flow past the associated electric heatpump assembly 724a, 724b and into the associated test slot 500a, 500b. After the air flow enters the test slot 500a, 500b it is directed underneath the disk drive 600 being tested by the ducting conduit 532. A return air flow passes over the disk drive 600 and is exhausted out of the outlet aperture 529 of the test slot 500a, 500b at least part of which is directed back towards the blower 722a, 722b for recirculation. The test electronics 160 can monitor the temperature of the air flow in each of the test slots 500a, 500b based on feedback received from the temperature sensors 526. The test electronics 160 can also adjust the temperature of the air flow (e.g., based on a predetermined test algorithm and/or based on feedback from the temperature sensors 526) by controlling the flow of electrical current to the associated thermoelectric cooler 742 and resistive heater 729. During testing, the blower 722a, 722b can be maintained at a constant velocity, which may help to minimize vibrations associated with the rotation of the blades 732 (particularly vibrations associated with acceleration of the blades 732). Thus, temperature of the air flow in each test slot assembly 120a, 120b can be adjusted using primarily only passive components (e.g., the thermoelectric coolers 742 and resistive heaters 729), thereby limiting the need for moving parts. Furthermore, since the blowers 722a, 722b are mounted external to the test slot, nothing is vibrating in the test slots 500a, 500b except the disk drive being tested. After testing, the robotic arm 310 retrieves the disk drive transporter 400, along with the supported disk drive 600, from the test slot 500 and returns it to one of the disk drive receptacles 224 at the transfer station 200 (or moves it to another one of the test slots 500) by manipulation of the disk drive transporter 400 (i.e., with the manipulator 312).
Other details and features combinable with those described herein may be found in the following U.S. patent applications filed Dec. 18, 2007, entitled “DISK DRIVE TESTING”, inventors: Edward Garcia et al., and having assigned Ser. No. 11/958,817; and “DISK DRIVE TESTING”, inventors: Edward Garcia et al., and having assigned Ser. No. 11/958,788. Other details and features combinable with those described herein may also be found in the following U.S. patent applications filed Apr. 17, 2008, entitled “Disk Drive Emulator And Method Of Use Thereof”, inventors: Edward Garcia, and having assigned Ser. No. 12/104,594; “Transferring Disk Drives Within Disk Drive Testing Systems”, inventors: Evgeny Polyakov et al., and having assigned Ser. No. 12/104,536; “Bulk Feeding Disk Drives To Disk Drive Testing Systems”, inventors: Scott Noble et al., and having assigned Ser. No. 12/104,869; and “Vibration Isolation within Disk Drive Testing Systems”, inventor: Brian Merrow, and having assigned Ser. No. 12/105,105. The entire contents of the aforementioned applications are hereby incorporated by reference.
A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure. For example,
As shown in
As shown in
As shown in
While the air mover assemblies described above include an air mover housing formed of a flexible, damping material for mounting the associated pair of blowers, the blowers need not be mounted in such a flexible air mover housing. For example, in another embodiment, illustrated in
As illustrated in
As shown in
While test slot thermal control systems have been described above in which an air flow enters the test slot through the inlet aperture, then is directed underneath a disk drive in the test compartment via the ducting conduit, and then is exhausted through the outlet aperture, in some cases, the air flow pattern can be different, e.g., the air flow pattern can be reversed. For example, in some cases, the blower can be arranged to direct an air flow into an associated one of the test slots through the outlet aperture, where it will then pass over a disk drive within the test compartment, and then be directed out of the inlet aperture via the ducting conduit.
While test slot thermal control systems have been described above in which the first and second blowers 722a, 722b (
This application is a continuation and claims the benefit of priority under 35 U.S.C. §120 of U.S. application Ser. No. 12/105,069, filed Apr. 17, 2008. The disclosure of the prior application is considered part of, and is incorporated by reference in, the disclosure of this application.
Number | Name | Date | Kind |
---|---|---|---|
557186 | Cahill | Mar 1896 | A |
2224407 | Passur | Dec 1940 | A |
2380026 | Clarke | Jul 1945 | A |
2631775 | Gordon | Mar 1953 | A |
2635524 | Jenkins | Apr 1953 | A |
3120166 | Lyman | Feb 1964 | A |
3360032 | Sherwood | Dec 1967 | A |
3364838 | Bradley | Jan 1968 | A |
3517601 | Courchesne | Jun 1970 | A |
3845286 | Aronstein et al. | Oct 1974 | A |
4147299 | Freeman | Apr 1979 | A |
4233644 | Hwang et al. | Nov 1980 | A |
4336748 | Martin et al. | Jun 1982 | A |
4379259 | Varadi et al. | Apr 1983 | A |
4477127 | Kume | Oct 1984 | A |
4495545 | Dufresne et al. | Jan 1985 | A |
4526318 | Fleming et al. | Jul 1985 | A |
4620248 | Gitzendanner | Oct 1986 | A |
4648007 | Garner | Mar 1987 | A |
4654732 | Mesher | Mar 1987 | A |
4665455 | Mesher | May 1987 | A |
4683424 | Cutright et al. | Jul 1987 | A |
4685303 | Branc et al. | Aug 1987 | A |
4688124 | Scribner et al. | Aug 1987 | A |
4713714 | Gatti et al. | Dec 1987 | A |
4739444 | Zushi et al. | Apr 1988 | A |
4754397 | Varaiya et al. | Jun 1988 | A |
4768285 | Woodman, Jr. | Sep 1988 | A |
4778063 | Ueberreiter | Oct 1988 | A |
4801234 | Cedrone | Jan 1989 | A |
4809881 | Becker | Mar 1989 | A |
4817273 | Lape et al. | Apr 1989 | A |
4817934 | McCormick et al. | Apr 1989 | A |
4851965 | Gabuzda et al. | Jul 1989 | A |
4881591 | Rignall | Nov 1989 | A |
4888549 | Wilson et al. | Dec 1989 | A |
4911281 | Jenkner | Mar 1990 | A |
4967155 | Magnuson | Oct 1990 | A |
5012187 | Littlebury | Apr 1991 | A |
5045960 | Eding | Sep 1991 | A |
5061630 | Knopf et al. | Oct 1991 | A |
5119270 | Bolton et al. | Jun 1992 | A |
5122914 | Hanson | Jun 1992 | A |
5127684 | Klotz et al. | Jul 1992 | A |
5128813 | Lee | Jul 1992 | A |
5136395 | Ishii et al. | Aug 1992 | A |
5158132 | Guillemot | Oct 1992 | A |
5168424 | Bolton et al. | Dec 1992 | A |
5171183 | Pollard et al. | Dec 1992 | A |
5173819 | Takahashi et al. | Dec 1992 | A |
5176202 | Richard | Jan 1993 | A |
5205132 | Fu | Apr 1993 | A |
5206772 | Hirano et al. | Apr 1993 | A |
5207613 | Ferchau et al. | May 1993 | A |
5210680 | Scheibler | May 1993 | A |
5237484 | Ferchau et al. | Aug 1993 | A |
5263537 | Plucinski et al. | Nov 1993 | A |
5269698 | Singer | Dec 1993 | A |
5295392 | Hensel et al. | Mar 1994 | A |
5309323 | Gray et al. | May 1994 | A |
5325263 | Singer et al. | Jun 1994 | A |
5349486 | Sugimoto et al. | Sep 1994 | A |
5368072 | Cote | Nov 1994 | A |
5374395 | Robinson et al. | Dec 1994 | A |
5379229 | Parsons et al. | Jan 1995 | A |
5398058 | Hattori | Mar 1995 | A |
5412534 | Cutts et al. | May 1995 | A |
5414591 | Kimura et al. | May 1995 | A |
5426581 | Kishi et al. | Jun 1995 | A |
5469037 | McMurtrey, Sr. et al. | Nov 1995 | A |
5477416 | Schkrohowsky et al. | Dec 1995 | A |
5484012 | Hiratsuka | Jan 1996 | A |
5486681 | Dagnac et al. | Jan 1996 | A |
5491610 | Mok et al. | Feb 1996 | A |
5543727 | Bushard et al. | Aug 1996 | A |
5546250 | Diel | Aug 1996 | A |
5557186 | McMurtrey, Sr. et al. | Sep 1996 | A |
5563768 | Perdue | Oct 1996 | A |
5570740 | Flores et al. | Nov 1996 | A |
5593380 | Bittikofer | Jan 1997 | A |
5601141 | Gordon et al. | Feb 1997 | A |
5604662 | Anderson et al. | Feb 1997 | A |
5610893 | Soga et al. | Mar 1997 | A |
5617430 | Angelotti et al. | Apr 1997 | A |
5644705 | Stanley | Jul 1997 | A |
5646918 | Dimitri et al. | Jul 1997 | A |
5654846 | Wicks et al. | Aug 1997 | A |
5673029 | Behl et al. | Sep 1997 | A |
5694290 | Chang | Dec 1997 | A |
5718627 | Wicks | Feb 1998 | A |
5718628 | Nakazato et al. | Feb 1998 | A |
5731928 | Jabbari et al. | Mar 1998 | A |
5751549 | Eberhardt et al. | May 1998 | A |
5754365 | Beck et al. | May 1998 | A |
5761032 | Jones | Jun 1998 | A |
5793610 | Schmitt et al. | Aug 1998 | A |
5811678 | Hirano | Sep 1998 | A |
5812761 | Seki et al. | Sep 1998 | A |
5819842 | Potter et al. | Oct 1998 | A |
5831525 | Harvey | Nov 1998 | A |
5851143 | Hamid | Dec 1998 | A |
5859409 | Kim et al. | Jan 1999 | A |
5859540 | Fukumoto | Jan 1999 | A |
5862037 | Behl | Jan 1999 | A |
5870630 | Reasoner et al. | Feb 1999 | A |
5886639 | Behl et al. | Mar 1999 | A |
5890959 | Pettit et al. | Apr 1999 | A |
5912799 | Grouell et al. | Jun 1999 | A |
5913926 | Anderson et al. | Jun 1999 | A |
5914856 | Morton et al. | Jun 1999 | A |
5927386 | Lin | Jul 1999 | A |
5956301 | Dimitri et al. | Sep 1999 | A |
5959834 | Chang | Sep 1999 | A |
5999356 | Dimitri et al. | Dec 1999 | A |
5999365 | Hasegawa et al. | Dec 1999 | A |
6000623 | Blatti et al. | Dec 1999 | A |
6005404 | Cochran et al. | Dec 1999 | A |
6005770 | Schmitt | Dec 1999 | A |
6008636 | Miller et al. | Dec 1999 | A |
6008984 | Cunningham et al. | Dec 1999 | A |
6011689 | Wrycraft | Jan 2000 | A |
6031717 | Baddour et al. | Feb 2000 | A |
6034870 | Osborn et al. | Mar 2000 | A |
6042348 | Aakalu et al. | Mar 2000 | A |
6045113 | Itakura | Apr 2000 | A |
6055814 | Song | May 2000 | A |
6066822 | Nemoto et al. | May 2000 | A |
6067225 | Reznikov et al. | May 2000 | A |
6069792 | Nelik | May 2000 | A |
6084768 | Bolognia | Jul 2000 | A |
6094342 | Dague et al. | Jul 2000 | A |
6104607 | Behl | Aug 2000 | A |
6115250 | Schmitt | Sep 2000 | A |
6122131 | Jeppson | Sep 2000 | A |
6122232 | Schell et al. | Sep 2000 | A |
6124707 | Kim et al. | Sep 2000 | A |
6130817 | Flotho et al. | Oct 2000 | A |
6144553 | Hileman et al. | Nov 2000 | A |
6166901 | Gamble et al. | Dec 2000 | A |
6169413 | Paek et al. | Jan 2001 | B1 |
6169930 | Blachek et al. | Jan 2001 | B1 |
6177805 | Pih | Jan 2001 | B1 |
6178835 | Orriss et al. | Jan 2001 | B1 |
6181557 | Gatti | Jan 2001 | B1 |
6185065 | Hasegawa et al. | Feb 2001 | B1 |
6185097 | Behl | Feb 2001 | B1 |
6188191 | Frees et al. | Feb 2001 | B1 |
6192282 | Smith et al. | Feb 2001 | B1 |
6193339 | Behl et al. | Feb 2001 | B1 |
6209842 | Anderson et al. | Apr 2001 | B1 |
6227516 | Webster, Jr. et al. | May 2001 | B1 |
6229275 | Yamamoto | May 2001 | B1 |
6231145 | Liu | May 2001 | B1 |
6233148 | Shen | May 2001 | B1 |
6236563 | Buican et al. | May 2001 | B1 |
6247944 | Bolognia et al. | Jun 2001 | B1 |
6249824 | Henrichs | Jun 2001 | B1 |
6252769 | Tullstedt et al. | Jun 2001 | B1 |
6262863 | Ostwald et al. | Jul 2001 | B1 |
6272007 | Kitlas et al. | Aug 2001 | B1 |
6272767 | Botruff et al. | Aug 2001 | B1 |
6281677 | Cosci et al. | Aug 2001 | B1 |
6282501 | Assouad | Aug 2001 | B1 |
6285524 | Boigenzahn et al. | Sep 2001 | B1 |
6289678 | Pandolfi | Sep 2001 | B1 |
6297950 | Erwin | Oct 2001 | B1 |
6298672 | Valicoff, Jr. | Oct 2001 | B1 |
6302714 | Bolognia et al. | Oct 2001 | B1 |
6304839 | Ho et al. | Oct 2001 | B1 |
6307386 | Fowler et al. | Oct 2001 | B1 |
6327150 | Levy et al. | Dec 2001 | B1 |
6330154 | Fryers et al. | Dec 2001 | B1 |
6351379 | Cheng | Feb 2002 | B1 |
6354792 | Kobayashi et al. | Mar 2002 | B1 |
6356409 | Price et al. | Mar 2002 | B1 |
6356415 | Kabasawa | Mar 2002 | B1 |
6384995 | Smith | May 2002 | B1 |
6388437 | Wolski et al. | May 2002 | B1 |
6388875 | Chen | May 2002 | B1 |
6388878 | Chang | May 2002 | B1 |
6389225 | Malinoski et al. | May 2002 | B1 |
6411584 | Davis et al. | Jun 2002 | B2 |
6421236 | Montoya et al. | Jul 2002 | B1 |
6434000 | Pandolfi | Aug 2002 | B1 |
6434498 | Ulrich et al. | Aug 2002 | B1 |
6434499 | Ulrich et al. | Aug 2002 | B1 |
6464080 | Morris et al. | Oct 2002 | B1 |
6467153 | Butts et al. | Oct 2002 | B2 |
6473297 | Behl et al. | Oct 2002 | B1 |
6473301 | Levy et al. | Oct 2002 | B1 |
6476627 | Pelissier et al. | Nov 2002 | B1 |
6477044 | Foley et al. | Nov 2002 | B2 |
6477442 | Valerino, Sr. | Nov 2002 | B1 |
6480380 | French et al. | Nov 2002 | B1 |
6480382 | Cheng | Nov 2002 | B2 |
6487071 | Tata et al. | Nov 2002 | B1 |
6489793 | Jones et al. | Dec 2002 | B2 |
6494663 | Ostwald et al. | Dec 2002 | B2 |
6525933 | Eland | Feb 2003 | B2 |
6526841 | Wanek et al. | Mar 2003 | B1 |
6535384 | Huang | Mar 2003 | B2 |
6537013 | Emberty et al. | Mar 2003 | B2 |
6544309 | Hoefer et al. | Apr 2003 | B1 |
6546445 | Hayes | Apr 2003 | B1 |
6553532 | Aoki | Apr 2003 | B1 |
6560107 | Beck et al. | May 2003 | B1 |
6565163 | Behl et al. | May 2003 | B2 |
6566859 | Wolski et al. | May 2003 | B2 |
6567266 | Ives et al. | May 2003 | B2 |
6570734 | Ostwald et al. | May 2003 | B2 |
6577586 | Yang et al. | Jun 2003 | B1 |
6577687 | Hall et al. | Jun 2003 | B2 |
6618254 | Ives | Sep 2003 | B2 |
6626846 | Spencer | Sep 2003 | B2 |
6628518 | Behl et al. | Sep 2003 | B2 |
6635115 | Fairbairn et al. | Oct 2003 | B1 |
6640235 | Anderson | Oct 2003 | B1 |
6644982 | Ondricek et al. | Nov 2003 | B1 |
6651192 | Viglione et al. | Nov 2003 | B1 |
6654240 | Tseng et al. | Nov 2003 | B1 |
6679128 | Wanek et al. | Jan 2004 | B2 |
6693757 | Hayakawa et al. | Feb 2004 | B2 |
6718164 | Korneluk et al. | Apr 2004 | B1 |
6741529 | Getreuer | May 2004 | B1 |
6746648 | Mattila et al. | Jun 2004 | B1 |
6751093 | Hsu et al. | Jun 2004 | B1 |
6791785 | Messenger et al. | Sep 2004 | B1 |
6791799 | Fletcher | Sep 2004 | B2 |
6798651 | Syring et al. | Sep 2004 | B2 |
6798972 | Ito et al. | Sep 2004 | B1 |
6801834 | Konshak et al. | Oct 2004 | B1 |
6806700 | Wanek et al. | Oct 2004 | B2 |
6811427 | Garrett et al. | Nov 2004 | B2 |
6826046 | Muncaster et al. | Nov 2004 | B1 |
6830372 | Liu et al. | Dec 2004 | B2 |
6832929 | Garrett et al. | Dec 2004 | B2 |
6861861 | Song et al. | Mar 2005 | B2 |
6862173 | Konshak et al. | Mar 2005 | B1 |
6867939 | Katahara et al. | Mar 2005 | B2 |
6892328 | Klein et al. | May 2005 | B2 |
6904479 | Hall et al. | Jun 2005 | B2 |
6908330 | Garrett et al. | Jun 2005 | B2 |
6928336 | Peshkin et al. | Aug 2005 | B2 |
6937432 | Sri-Jayantha et al. | Aug 2005 | B2 |
6957291 | Moon et al. | Oct 2005 | B2 |
6965811 | Dickey et al. | Nov 2005 | B2 |
6974017 | Oseguera | Dec 2005 | B2 |
6976190 | Goldstone | Dec 2005 | B1 |
6980381 | Gray et al. | Dec 2005 | B2 |
6982872 | Behl et al. | Jan 2006 | B2 |
7006325 | Emberty et al. | Feb 2006 | B2 |
7039924 | Goodman et al. | May 2006 | B2 |
7054150 | Orriss et al. | May 2006 | B2 |
7070323 | Wanek et al. | Jul 2006 | B2 |
7076391 | Pakzad et al. | Jul 2006 | B1 |
7077614 | Hasper et al. | Jul 2006 | B1 |
7088541 | Orriss et al. | Aug 2006 | B2 |
7092251 | Henry | Aug 2006 | B1 |
7106582 | Albrecht et al. | Sep 2006 | B2 |
7123477 | Coglitore et al. | Oct 2006 | B2 |
7126777 | Flechsig et al. | Oct 2006 | B2 |
7130138 | Lum et al. | Oct 2006 | B2 |
7134553 | Stephens | Nov 2006 | B2 |
7139145 | Archibald et al. | Nov 2006 | B1 |
7164579 | Muncaster et al. | Jan 2007 | B2 |
7167360 | Inoue et al. | Jan 2007 | B2 |
7181458 | Higashi | Feb 2007 | B1 |
7203021 | Ryan et al. | Apr 2007 | B1 |
7203060 | Kay et al. | Apr 2007 | B2 |
7206201 | Behl et al. | Apr 2007 | B2 |
7216968 | Smith et al. | May 2007 | B2 |
7219028 | Bae et al. | May 2007 | B2 |
7219273 | Fisher et al. | May 2007 | B2 |
7227746 | Tanaka et al. | Jun 2007 | B2 |
7232101 | Wanek et al. | Jun 2007 | B2 |
7243043 | Shin | Jul 2007 | B2 |
7248467 | Sri-Jayantha et al. | Jul 2007 | B2 |
7259966 | Connelly, Jr. et al. | Aug 2007 | B2 |
7273344 | Ostwald et al. | Sep 2007 | B2 |
7280353 | Wendel et al. | Oct 2007 | B2 |
7289885 | Basham et al. | Oct 2007 | B2 |
7304855 | Milligan et al. | Dec 2007 | B1 |
7315447 | Inoue et al. | Jan 2008 | B2 |
7349205 | Hall et al. | Mar 2008 | B2 |
7353524 | Lin et al. | Apr 2008 | B1 |
7385385 | Magliocco et al. | Jun 2008 | B2 |
7395133 | Lowe | Jul 2008 | B2 |
7403451 | Goodman et al. | Jul 2008 | B2 |
7437212 | Farchmin et al. | Oct 2008 | B2 |
7447011 | Wade et al. | Nov 2008 | B2 |
7457112 | Fukuda et al. | Nov 2008 | B2 |
7467024 | Flitsch | Dec 2008 | B2 |
7476362 | Angros | Jan 2009 | B2 |
7483269 | Marvin, Jr. et al. | Jan 2009 | B1 |
7505264 | Hall et al. | Mar 2009 | B2 |
7554811 | Scicluna et al. | Jun 2009 | B2 |
7568122 | Mechalke et al. | Jul 2009 | B2 |
7570455 | Deguchi et al. | Aug 2009 | B2 |
7573715 | Mojaver et al. | Aug 2009 | B2 |
7584851 | Hong et al. | Sep 2009 | B2 |
7612996 | Atkins et al. | Nov 2009 | B2 |
7625027 | Kiaie et al. | Dec 2009 | B2 |
7630196 | Hall et al. | Dec 2009 | B2 |
7643289 | Ye et al. | Jan 2010 | B2 |
7646596 | Ng | Jan 2010 | B2 |
7729107 | Atkins et al. | Jun 2010 | B2 |
20010006453 | Glorioso et al. | Jul 2001 | A1 |
20010044023 | Johnson et al. | Nov 2001 | A1 |
20010046118 | Yamanashi et al. | Nov 2001 | A1 |
20010048590 | Behl et al. | Dec 2001 | A1 |
20020030981 | Sullivan et al. | Mar 2002 | A1 |
20020044416 | Harmon, III et al. | Apr 2002 | A1 |
20020051338 | Jiang et al. | May 2002 | A1 |
20020071248 | Huang et al. | Jun 2002 | A1 |
20020079422 | Jiang | Jun 2002 | A1 |
20020090320 | Burow et al. | Jul 2002 | A1 |
20020116087 | Brown | Aug 2002 | A1 |
20020161971 | Dimitri et al. | Oct 2002 | A1 |
20020172004 | Ives et al. | Nov 2002 | A1 |
20030035271 | Lelong et al. | Feb 2003 | A1 |
20030043550 | Ives | Mar 2003 | A1 |
20030206397 | Allgeyer et al. | Nov 2003 | A1 |
20040165489 | Goodman et al. | Aug 2004 | A1 |
20040230399 | Shin | Nov 2004 | A1 |
20040236465 | Butka et al. | Nov 2004 | A1 |
20040264121 | Orriss et al. | Dec 2004 | A1 |
20050004703 | Christie, Jr. | Jan 2005 | A1 |
20050010836 | Bae et al. | Jan 2005 | A1 |
20050018397 | Kay et al. | Jan 2005 | A1 |
20050055601 | Wilson et al. | Mar 2005 | A1 |
20050057849 | Twogood et al. | Mar 2005 | A1 |
20050069400 | Dickey et al. | Mar 2005 | A1 |
20050109131 | Wanek et al. | May 2005 | A1 |
20050116702 | Wanek et al. | Jun 2005 | A1 |
20050131578 | Weaver | Jun 2005 | A1 |
20050179457 | Min et al. | Aug 2005 | A1 |
20050207059 | Cochrane | Sep 2005 | A1 |
20050219809 | Muncaster et al. | Oct 2005 | A1 |
20050225338 | Sands et al. | Oct 2005 | A1 |
20050270737 | Wilson et al. | Dec 2005 | A1 |
20060010353 | Haugh | Jan 2006 | A1 |
20060023331 | Flechsig et al. | Feb 2006 | A1 |
20060028802 | Shaw et al. | Feb 2006 | A1 |
20060066974 | Akamatsu et al. | Mar 2006 | A1 |
20060130316 | Takase et al. | Jun 2006 | A1 |
20060190205 | Klein et al. | Aug 2006 | A1 |
20060227517 | Zayas et al. | Oct 2006 | A1 |
20060250766 | Blaalid et al. | Nov 2006 | A1 |
20060269384 | Kiaie et al. | Nov 2006 | A1 |
20070034368 | Atkins et al. | Feb 2007 | A1 |
20070035874 | Wendel et al. | Feb 2007 | A1 |
20070035875 | Hall et al. | Feb 2007 | A1 |
20070053154 | Fukuda et al. | Mar 2007 | A1 |
20070082907 | Canada et al. | Apr 2007 | A1 |
20070127202 | Scicluna et al. | Jun 2007 | A1 |
20070127206 | Wade et al. | Jun 2007 | A1 |
20070195497 | Atkins | Aug 2007 | A1 |
20070248142 | Rountree et al. | Oct 2007 | A1 |
20070253157 | Atkins et al. | Nov 2007 | A1 |
20070286045 | Onagi et al. | Dec 2007 | A1 |
20080007865 | Orriss et al. | Jan 2008 | A1 |
20080030945 | Mojaver et al. | Feb 2008 | A1 |
20080112075 | Farquhar et al. | May 2008 | A1 |
20080239564 | Farquhar et al. | Oct 2008 | A1 |
20080282275 | Zaczek et al. | Nov 2008 | A1 |
20080282278 | Barkley | Nov 2008 | A1 |
20090028669 | Rebstock | Jan 2009 | A1 |
20090082907 | Stuvel et al. | Mar 2009 | A1 |
20090122443 | Farquhar et al. | May 2009 | A1 |
20090142169 | Garcia et al. | Jun 2009 | A1 |
20090153992 | Garcia et al. | Jun 2009 | A1 |
20090153993 | Garcia et al. | Jun 2009 | A1 |
20090153994 | Merrow et al. | Jun 2009 | A1 |
20090175705 | Nakao et al. | Jul 2009 | A1 |
20090261047 | Merrow | Oct 2009 | A1 |
20090261228 | Merrow | Oct 2009 | A1 |
20090261229 | Merrow | Oct 2009 | A1 |
20090262444 | Polyakov et al. | Oct 2009 | A1 |
20090262445 | Noble et al. | Oct 2009 | A1 |
20090262454 | Merrow | Oct 2009 | A1 |
20090262455 | Merrow | Oct 2009 | A1 |
20090265032 | Toscano et al. | Oct 2009 | A1 |
20090265043 | Merrow et al. | Oct 2009 | A1 |
20090265136 | Garcia et al. | Oct 2009 | A1 |
20090297328 | Slocum, III | Dec 2009 | A1 |
Number | Date | Country |
---|---|---|
583716 | May 1989 | AU |
1177187 | Mar 1998 | CN |
2341188 | Sep 1999 | CN |
1114109 | Jul 2003 | CN |
1192544 | Mar 2005 | CN |
3786944 | Nov 1993 | DE |
69111634 | May 1996 | DE |
69400145 | Oct 1996 | DE |
19701548 | Aug 1997 | DE |
19804813 | Sep 1998 | DE |
69614460 | Jun 2002 | DE |
69626584 | Dec 2003 | DE |
19861388 | Aug 2007 | DE |
0210497 | Jul 1986 | EP |
0242970 | Oct 1987 | EP |
0 277 634 | Aug 1988 | EP |
0356977 | Aug 1989 | EP |
0442642 | Feb 1991 | EP |
0466073 | Jul 1991 | EP |
0776009 | Nov 1991 | EP |
0242970 | Aug 1993 | EP |
0582017 | Feb 1994 | EP |
0617570 | Sep 1994 | EP |
0635836 | Jan 1995 | EP |
741508 | Nov 1996 | EP |
0757320 | Feb 1997 | EP |
0757351 | Feb 1997 | EP |
0840476 | May 1998 | EP |
1 045 301 | Oct 2000 | EP |
1209557 | May 2002 | EP |
1422713 | May 2004 | EP |
1234308 | May 2006 | EP |
1760722 | Mar 2007 | EP |
1612798 | Nov 2007 | EP |
2241118 | Aug 1991 | GB |
2276275 | Sep 1994 | GB |
2299436 | Oct 1996 | GB |
2312984 | Nov 1997 | GB |
2328782 | Mar 1999 | GB |
2439844 | Jul 2008 | GB |
61-115279 | Jun 1986 | JP |
62-177621 | Aug 1987 | JP |
62-239394 | Oct 1987 | JP |
62-251915 | Nov 1987 | JP |
63-002160 | Jan 1988 | JP |
63-004483 | Jan 1988 | JP |
63-016482 | Jan 1988 | JP |
63-062057 | Mar 1988 | JP |
63-201946 | Aug 1988 | JP |
63-214972 | Sep 1988 | JP |
63-269376 | Nov 1988 | JP |
64-089034 | Apr 1989 | JP |
2-091565 | Mar 1990 | JP |
2-098197 | Apr 1990 | JP |
2-185784 | Jul 1990 | JP |
2-199690 | Aug 1990 | JP |
2-278375 | Nov 1990 | JP |
2-297770 | Dec 1990 | JP |
3-008086 | Jan 1991 | JP |
3-078160 | Apr 1991 | JP |
3-105704 | May 1991 | JP |
3-207947 | Sep 1991 | JP |
3-210662 | Sep 1991 | JP |
3-212859 | Sep 1991 | JP |
3-214490 | Sep 1991 | JP |
3-240821 | Oct 1991 | JP |
3-295071 | Dec 1991 | JP |
4-017134 | Jan 1992 | JP |
4-143989 | May 1992 | JP |
4-172658 | Jun 1992 | JP |
4-214288 | Aug 1992 | JP |
4-247385 | Sep 1992 | JP |
4-259956 | Sep 1992 | JP |
4-307440 | Oct 1992 | JP |
4-325923 | Nov 1992 | JP |
5-035053 | Feb 1993 | JP |
5-035415 | Feb 1993 | JP |
5-066896 | Mar 1993 | JP |
5-068257 | Mar 1993 | JP |
5-073566 | Mar 1993 | JP |
5-073803 | Mar 1993 | JP |
5-101603 | Apr 1993 | JP |
5-173718 | Jul 1993 | JP |
5-189163 | Jul 1993 | JP |
5-204725 | Aug 1993 | JP |
5-223551 | Aug 1993 | JP |
6-004220 | Jan 1994 | JP |
6-004981 | Jan 1994 | JP |
6-162645 | Jun 1994 | JP |
6-181561 | Jun 1994 | JP |
6-215515 | Aug 1994 | JP |
6-274943 | Sep 1994 | JP |
6-314173 | Nov 1994 | JP |
7-007321 | Jan 1995 | JP |
7-029364 | Jan 1995 | JP |
7-037376 | Feb 1995 | JP |
7-056654 | Mar 1995 | JP |
7-111078 | Apr 1995 | JP |
7-115497 | May 1995 | JP |
7-201082 | Aug 1995 | JP |
7-226023 | Aug 1995 | JP |
7-230669 | Aug 1995 | JP |
7-257525 | Oct 1995 | JP |
7-307059 | Nov 1995 | JP |
8007994 | Jan 1996 | JP |
8-030398 | Feb 1996 | JP |
8-030407 | Feb 1996 | JP |
8-079672 | Mar 1996 | JP |
8-106776 | Apr 1996 | JP |
8-110821 | Apr 1996 | JP |
8-167231 | Jun 1996 | JP |
8-212015 | Aug 1996 | JP |
8-244313 | Sep 1996 | JP |
8-263525 | Oct 1996 | JP |
8-263909 | Oct 1996 | JP |
8-297957 | Nov 1996 | JP |
2553315 | Nov 1996 | JP |
9-044445 | Feb 1997 | JP |
9-064571 | Mar 1997 | JP |
9-082081 | Mar 1997 | JP |
2635127 | Jul 1997 | JP |
9-306094 | Nov 1997 | JP |
9-319466 | Dec 1997 | JP |
10-040021 | Feb 1998 | JP |
10-049365 | Feb 1998 | JP |
10-064173 | Mar 1998 | JP |
10-098521 | Apr 1998 | JP |
2771297 | Jul 1998 | JP |
10-275137 | Oct 1998 | JP |
10-281799 | Oct 1998 | JP |
10-320128 | Dec 1998 | JP |
10-340139 | Dec 1998 | JP |
2862679 | Mar 1999 | JP |
11-134852 | May 1999 | JP |
11-139839 | May 1999 | JP |
2906930 | Jun 1999 | JP |
11-203201 | Jul 1999 | JP |
11-213182 | Aug 1999 | JP |
11-327800 | Nov 1999 | JP |
11-353128 | Dec 1999 | JP |
11-353129 | Dec 1999 | JP |
2000-056935 | Feb 2000 | JP |
2000-066845 | Mar 2000 | JP |
2000-112831 | Apr 2000 | JP |
2000-113563 | Apr 2000 | JP |
2000-114759 | Apr 2000 | JP |
2000-125290 | Apr 2000 | JP |
3052183 | Apr 2000 | JP |
2000-132704 | May 2000 | JP |
2000-149431 | May 2000 | JP |
2000-228686 | Aug 2000 | JP |
2000-235762 | Aug 2000 | JP |
2000-236188 | Aug 2000 | JP |
2000-242598 | Sep 2000 | JP |
2000-278647 | Oct 2000 | JP |
3097994 | Oct 2000 | JP |
2000-305860 | Nov 2000 | JP |
2001-005501 | Jan 2001 | JP |
2001-023270 | Jan 2001 | JP |
2001-100925 | Apr 2001 | JP |
2002-42446 | Feb 2002 | JP |
2007-188615 | Jul 2007 | JP |
2007-220184 | Aug 2007 | JP |
2007-293936 | Nov 2007 | JP |
2007-305206 | Nov 2007 | JP |
2007-305290 | Nov 2007 | JP |
2007-328761 | Dec 2007 | JP |
2008-503824 | Feb 2008 | JP |
10-1998-0035445 | Aug 1998 | KR |
10-0176527 | Nov 1998 | KR |
10-0214308 | Aug 1999 | KR |
10-0403039 | Oct 2003 | KR |
45223 | Jan 1998 | SG |
387574 | Apr 2000 | TW |
WO 8901682 | Aug 1988 | WO |
WO 9706532 | Feb 1997 | WO |
WO 0049487 | Feb 2000 | WO |
WO 0067253 | Nov 2000 | WO |
WO 0109627 | Feb 2001 | WO |
WO 0141148 | Jun 2001 | WO |
WO 03013783 | Feb 2003 | WO |
WO 03 021597 | Mar 2003 | WO |
WO 03021598 | Mar 2003 | WO |
WO 03067385 | Aug 2003 | WO |
WO 2004006260 | Jan 2004 | WO |
WO 2004114286 | Dec 2004 | WO |
WO 2005024830 | Mar 2005 | WO |
WO 2005024831 | Mar 2005 | WO |
WO 2005109131 | Nov 2005 | WO |
WO 2006030185 | Mar 2006 | WO |
WO 2006048611 | May 2006 | WO |
WO 2006100441 | Sep 2006 | WO |
WO 2006100445 | Sep 2006 | WO |
WO 2007031729 | Mar 2007 | WO |
Number | Date | Country | |
---|---|---|---|
20100165498 A1 | Jul 2010 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 12105069 | Apr 2008 | US |
Child | 12727207 | US |