Claims
- 1. A process for depositing a metal having a standard potential E.sub.o of >-2V onto an electrically conductive polymeric carrier having the formula:
- [M"y (P)].sub.x II
- where M" is Li, Na, K, Rb or Cs, where P is --CH--, --C.sub.6 H.sub.4 --, --C.sub.4 --H.sub.2 S--, --C.sub.6 --H.sub.4 S--, --C.sub.4 H.sub.2 O--, --C.sub.4 H.sub.2 NH--, --C.sub.6 H.sub.4 O--, or --C.sub.5 H.sub.3 N--, y is a numeral from 0.001 to 0.6 and x is a numeral from 5 to 1000; or the formula:
- [(P) (X).sub.y ].sub.x III
- where P is as identified in the above formula II, X is ClO.sub.4, AsF.sub.6, PF.sub.6, SbF.sub.6, BF.sub.4, HSO.sub.4, CF.sub.3 SO.sub.3, or Br, y is a numeral from 0.001 to 0.6 and x is a numeral from 5 to 1000; from a solution of a metal cation compound by reduction of the metal cation dissolved in an aprotic polar or nonpolar solvent, said metal cation being selected from the group consisting of Au.sup.+, Au.sup.+++, Pt.sup.++, Pd.sup.++, Ag.sup.+, Hg.sup.++, Hg.sub.2.sup.++, Cu.sup.+, Cu.sup.++, Re.sup.+++, Bi.sup.+++, Fe.sup.+++, Pb.sup.++, Ni.sup.++, Co.sup.++, Fe.sup.++, Zn.sup.++, and Mn.sup.++, the anion of the metal cation compound being selected from the group consisting of F.sup.-, Cl.sup.-, Br.sup.-, I.sup.-, CN.sup.-, NO.sub.3.sup.-, CH.sub.3 COO.sup.-, CH.sub.3 SO.sub.3.sup.-, H.sub.3 PO.sub.2.sup.- and ClO.sub.4.sup.-, said metal cation compound optionally containing a substituent selected from the group consisting of RCN where R is an alkyl, cycloalkyl or aryl of from 1-6 carbon atoms, OPR.sup.1 R.sup.2 R.sup.3 where R.sup.1, R.sup.2 and R.sup.3 are the same or different with each being selected from the group consisting of an alkyl, cycloalkyl, aryl, alkoxy, cycloalkoxy or aryloxy of from 1-6 carbon atoms, pyridyl, hexamethylphosphoramide, NH.sub.3 and CO, and where P is defined as in the formula II.
- 2. A process as set forth in claim 1, wherein the deposition of the metal M onto an electrically conductive, polymeric carrier of the general formula (II), where y is from 0.1 to 0.6 and x is from 5 to 1,000, is carried out chemically, or a metal compound of the general formula (I) which can be decomposed thermally to the metal is used.
- 3. The process of claim 1 wherein the deposition of the metal onto an electrically conductive, polymeric carrier of the general formula (II) or (III), where y is from 0.001 to 0.1 and x is from 5 to 1,000, is carried out electrochemically, and the carrier is made the cathode in an electrolytic cell or is applied to a cathode.
- 4. The process of claim 1, wherein the aprotic polar solvent is acetonitrile, sulfolane, propanediol 1,2-carbonate, acetone, acetylacetone, ethyl acetate, diethyl ether, trimethyl phosphate, tributyl phosphate, dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide or hexamethylphosphoramide, and the aprotic non-polar solvent is n-hexane, n-heptane, n-octane, ligroin, benzene, toluene or xylene.
- 5. The process of claim 1 wherein the deposition of the metal onto the electrically conductive, polymeric carrier of the general formula (II) is carried out at from -100.degree. to +100.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3132218 |
Aug 1981 |
DEX |
|
Parent Case Info
This is a continuation of application Ser. No. 401,348, filed on July 23, 1982, now abandoned.
US Referenced Citations (5)
Non-Patent Literature Citations (3)
Entry |
A. McDiarmid & A. G. Heeger, "Synthetic Metals", vol. 1, (1980), pp. 101-118. |
R. H. Baugham et al, "Journal of Chemical Physics", vol. 73, No. 8, (1980), pp. 4098-4102. |
F. E. Karasz et al, "Nature", vol. 282, No. 5736, (1979), pp. 286-288. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
401348 |
Jul 1982 |
|