The present invention relates to a device and a method for obtaining a morphology spatially structured on micrometric and nanometric scale, formed by motifs and/or structures of micrometric and/or nanometric dimensions, formed on a substrate, as a consequence of a molding process.
Some of the possible fields of application are for example: optical devices, information storage devices, including labels containing a high density of information, sensors and others.
Currently, many micro- and nanomanufacturing processes are based on molding the surface of the material.
Many industrial manufacturing processes with submicrometric or nanometric treatments use lithography based on photons, electrons or other particles (typically ions).
One of the crucial steps in lithography entails depositing a thin film on a substrate and generating a contact mask thereat, so that in subsequent processes the template of the mask can be transferred onto the substrate by removing the material of which the substrate is made or by depositing another material.
The thin film must have limited surface roughness, in order to prevent scattering of the incident ray, with consequent loss of spatial resolution.
A typical, known process of lithography in submicrometric or nanometric work for producing details consists in depositing a low-roughness film on a medium and subsequently exposing the film, with the corresponding medium, to a beam of high-energy particles such as electrons, photons or ions, optionally through a mask which is provided with a selected template.
Other types of lithography are based on the use of particle beams.
Such particle beam changes the chemical structure of the exposed region of the film and leaves unchanged the unexposed region.
By immersing the substrate and the film in a developer, the region of film that has been exposed to the energy beam, or alternatively the portion that has not been exposed, is removed, obtaining a film which reproduces the template, or the corresponding negative, traced in such mask.
The printing resolution that can be obtained in lithographic processes is limited by the wavelength of the particles used to etch the film, by the properties of said film and by the developing process.
Lithographic methods based on beams of ions or electrons allow a high spatial resolution (tens of nanometers) but are serial methods, i.e., the motifs are written one by one by means of the beam of particles or photons.
These techniques are limited by the scanning rate of the beam of particles and accordingly are scarcely suitable both for large-scale processing and for mass production and in any case require a developing step.
In order to obviate the cited drawbacks, alternative lithographic techniques have been developed which have the requirement of being parallel and at the same time allow to manufacture details of submicrometric and nanometric dimensions on films simply and at low cost.
An example is given in U.S. Pat. No. 5,772,905 by S. Y. Chou, which discloses and proposes a lithographic method which combines conventional lithographic technologies with the less expensive method, already known with resolutions on the order of one millimeter, of pressure imprinting (imprinting), providing imprintings on nanometric or sub-micrometric scales (nanoimprinting) of thermoplastic polymers.
Such US patent discloses a low-cost but high-resolution lithographic approach which abandons the use of energy beams or particle beams.
Such nanoimprinting entails placing an appropriately contoured mold on a polymeric film which is arranged on a rigid medium and applying pressure, optionally accompanied by suitable heating of the medium.
The imprinting generates on the film a series of parts in relief and recesses which correspond to the respective recesses and parts in relief of the mold.
In nanoimprinting, the roughness of the film affects the resolution that can be obtained with this method. An evolution of such nanoimprinting, disclosed for example in U.S. Pat. No. 6,518,189 by S. Y. Chou, entails that as a consequence of the molding of the polymer the portions of film at the recesses are removed by subsequent developing, obtaining on the substrate a film template which matches the recesses of the mold.
A further evolution of nanoimprinting, disclosed for example in U.S. Pat. No. 6,818,139 by H. H. Lee, provides for the preliminary treatment of the polymer with a solvent in order to make the layer of polymer easier to imprint.
A further evolution of nanoimprinting, disclosed for example in US patent application 20040192041 by J.-H. Jeong, provides for treatment with ultraviolet rays during the imprinting step. This irradiation can either be extended to the entire region being imprinted or localized spatially.
A possible alternative to nanoimprinting, disclosed for example in U.S. Pat. No. 6,342,178 by M. Yasuhiko, relates to the replica molding process. In the replica process, a solution in which a polymer or other material has been dissolved is deposited onto a mold, and once the evaporation of the solvent has ended the polymer cures and assumes the shape of the mold.
Other patents related to micrometric or nanometric scale manufacturing, for example U.S. Pat. No. 6,375,870 (N. J. Visovsky et al.), entail providing on a medium a thin film which is morphologically structured, by molding the nanometric motifs on a substrate with known replica molding methods.
Other processes, such as for example the one disclosed in international patent application PCT WO 2005078521 by M. Cavallini et al., provide for molding a film of a mixture obtained by dispersing a material in the medium, which is for example polymeric, obtaining by subsequent developing a chemical structure which is spatially defined on a microscale and/or nanoscale.
The greatest disadvantages and drawbacks of the known solutions mentioned in the cited patents are due to the need to perform a developing step after the imprinting step. Such developing step entails at least one additional process step and requires the use of chemical reagents and/or irradiation systems.
Another disadvantage of known solutions mentioned in the cited patents relates to the processes themselves, since nanostructured motifs must be etched into the mold itself.
The aim of the present invention is to overcome the drawbacks of the background art cited above.
An object is to obtain a spatially structured model or pattern of nanometric and micrometric size on the surface of a substrate, characterized in that it is obtained according to the method described hereinafter.
Another object is to obtain a memory element which can be read optically on a substrate, characterized in that it is obtained according to the described method, said substrate being defined by a material having optical and/or spectroscopic properties.
All the cited methods for industrial manufacture with submicrometric or nanometric processes provide devices and/or articles by direct manufacturing or molding of the motifs and use thin films with low surface roughness.
According to the present invention, a manufacturing method is provided to obtain a product which is defined by rough motifs of nanometric and micrometric size on the surface of a substrate, characterized in that it comprises reducing the roughness of the surface of said substrate in definite regions of said substrate.
The present invention relates to a device and a method for providing a structured molding or pattern on a medium in a manner described as indirect, and in particular a method for providing a surface whose morphology is spatially structured on a micrometric and nanometric scale and which is defined by motifs and/or structures of micrometric and/or nanometric size, formed on a rough substrate as a consequence of a process for smoothing or flattening regions of the substrate.
The device consists of the molded substrate which contains spatially structured regions with different roughnesses. Said device, for example, lit with white and/or colored and/or ultraviolet and/or grazing light exhibits an optically detectable contrast. Such contrast can be attributed to the different roughness and can be either optically positive (rougher regions appear lighter than the others) or optically negative (rougher regions appear darker than the others). The type of contrast depends on how the device is lit (for example grazing light instead of light from above).
Contrast also can be detected with any technique which is sensitive to surface roughness variation, either by measuring chemical and/or physical properties directly correlated to roughness (for example a measurement, with any technique, of the area per unit surface) and by measuring properties which are indirectly correlated (for example a change in color caused by optical and/or diffraction phenomena).
The term “roughness” as used here references the property of the surface of a body, constituted by geometric micro- and nanoimperfections which are normally present on the surface or are also the result of mechanical processes; these imperfections generally have the appearance of grooves, scratches or bumps which have a variable or oriented shape, depth and direction.
The measurement of roughness, expressed in microns or nanometers, is the average value of the variations of the actual profile of the surface with respect to the average height of such surface. This measurement refers to a base length of the profile being analyzed in order to avoid the influence of other types of unevenness.
Depending on the chemical and/or physical properties of the material, such device can therefore be an electronic component (for example by using a substrate material which is a conductor, an electrode), an electro-optical component (for example by using a substrate material which is electro-active with spectroscopic properties), an optical memory element (for example by using a substrate material which has optical and/or spectroscopic properties), a magnetic memory element (for example by using a substrate material which has magnetic properties) or another device.
Advantageously, the nano- and/or microstructuring of the products of the process according to the present invention is the one that is naturally or artificially present on the surface of the substrate, differently from what occurs for example in the patents of the background art cited above.
The technical features of the invention, according to the above aim and objects, are clearly observable from the content of the appended claims, and its advantages will become better apparent in the detailed description that follows, given with reference to the accompanying drawings and photographs, which illustrate preferred and merely exemplifying embodiments thereof, wherein:
a, 1b, and 1c show, in a schematic enlarged-scale side view, a sequence of operations for molding the surface of a naturally rough material by pressure imprinting according to the invention;
d is a schematic enlarged-scale side view of a portion of the corresponding device;
a, 2b and 2c are schematic enlarged-scale side views of a sequence of operations for molding the surface of a material which is initially molded artificially by pressure imprinting;
d is a schematic enlarged-scale side view of a portion of the corresponding device;
In accordance with the accompanying drawings, with particular reference to
In the continuation of the present description, merely by way of example, reference will be made, without thereby losing generality, to a substrate 1 which is formed by a polymer, particularly polycarbonate.
This material is taken as an example to describe the method, but such method can be applied to a wide range of materials and substrates, including biological molecules such as for example biopolymers, proteins and the like, copolymers, molecular materials, metals, semiconductors, composites, alloys or other materials; likewise, reference will be made to micrometric and nanometric spatial scales, since this is the field of greatest interest in the application of the described method, which however remains valid and effective also for larger dimensions.
With particular reference to
Such surfaces formed with artificial roughness can also be constituted by ordered gratings with particular optical properties, including diffraction gratings and/or holographic gratings.
Subsequently, the surface of the medium is molded by smoothing and/or flattening portions of such surface.
According to what is shown in
The range of pressures, temperatures, treatment times and any use of other chemical and/or physical agents depends on the nature of the material being molded. Merely by way of non-limiting example, the pressures applied during the process can vary in a range from 1 N/cm2 to 100 MN/cm2. The temperature range is from 10 to 5000° K.
In all the cited cases, these methods are known in the molding, for example, of polymers and therefore are referenced exclusively for comprehension of the text, since they are applied to the substrate as if it were a polymer.
With particular reference to
In this case, the artificial surface roughness, constituted by parallel lines which are spaced by 1.5 micrometers and are 250 nanometers deep, is visible. Such roughness is therefore greater at the square structures.
Advantageously, the step for molding the surface can occur in any way, for example also by simple etching or any method which produces flattening of the morphology on the surface.
With particular reference to
This contrast defines, in the particular case, a possible permanent memory element.
In general, therefore, a method is defined for organizing in a spatially controlled manner, on a submicrometric and/or nanometric scale, a substrate so that the morphological properties of the material of which the substrate is made define the characteristics of the product obtained with such method.
The spatially controlled distribution of the structures is in itself a useful product, such as for example a high-density memory element which can be read optically, or a label.
The reduction in roughness induces a different behavior which is spatially distributed on the surface of the substrate as regards the intensity and conditions of the phenomenon of light reflection and absorption.
This difference in optical behavior produces an optical contrast which can even be very sharp between the regions with reduced roughness and the regions with unmodified roughness. This contrast allows to read patterns which are imprinted with the method according to the present invention with optical readers.
The roughness of the substrates can be both the natural surface roughness of the substrate (which generally has a random appearance) or can be a roughness which is generated specifically with different imprinting and/or etching methods for several purposes. The requirement for providing sharp optical contrast between regions with unmodified roughness and regions with reduced roughness is that the horizontal extension of the oscillations of the value of the height of the surface of the substrate with respect to the average height of said surface must be much lower than the horizontal extension of the typical dimension of the pattern that one wishes to imprint.
For example, when the ratio between the lateral dimension of the surface micro-bumps and the dimension of the structures is smaller than 1 (one).
Specifically, for a square pattern with a side measuring 20 microns, the lateral dimension of the surface micro-bumps can be less than 2 microns.
For the sake of simplicity, reference is made in the present description to this method, which is a preferred embodiment of the present invention and is known as “inverse embossing”.
An example of product provided according to this method is a small film (with sides measuring from fractions of a millimeter to a few centimeters) formed with thin polymeric film on which a holographic grating has already been imprinted with any known method, such holographic grating being characterized by one- or two-dimensional periodic variations of the height of the surface (
The mold (see
It is possible to use all materials having a natural roughness of more than 10 nm and/or on which it is possible to imprint advantageously a pattern: for example, most mono- and multilayer polymeric films, advantageously including multilayer films which contain a metallic reflective film and polymeric films which contain a holographic grating.
Merely by way of example, in order to allow easy decoding of the binary information contained in a succession of regions having a different optical contrast, it has been selected to adapt an encoding standard which is known and used extensively to provide dot matrix, which is known as Aztec. Of course, any form of information encoding which produces a succession of “light” and “dark” regions, which are to be matched with the binary values, is perfectly suitable for the provision of the labels described here.
The label shown in
4. En-Code™ Label The embodiment of a label obtained according to the present invention and known as En-Code™ label is constituted by a film of polypropylene-Al-polypropylene multilayer which measures 15×10 millimeters and has a thickness of 80 microns. A uniform one-dimension holographic relief is imprinted on a face of said film by means of known methods and is constituted by parallel grooves which have a depth of approximately 250 nm and are mutually spaced by 1 micron. With a subsequent imprinting step, performed with inverse imprinting techniques, portions of the holographic relief are flattened selectively with a mold (flat if made of silicon or cylindrical if made of nickel). Such mold bears in relief patterns which correspond to dot matrix modules according to the Aztec standard of 151×151 bits, each bit having a square shape and sides 20 microns long. Each Aztec module therefore measures 3.02×3.02 mm and bears information equal to 2850 bytes. It is possible to provide on each En-Code™ label 1 to 12 Aztec modules (
Advantageously, the proposed method can also be used with organic, inorganic or biological media.
This method can also be used with any type of material and medium in order to obtain other devices without losing generality.
The present invention also relates to:
The invention achieves the intended aim and objects, and in particular this method allows to manufacture directly motifs in a substrate without having to resort to lithographic processes.
This method utilizes in a new manner the process of smoothing and flattening protrusions provided on a surface.
The method as described works on a micrometric and nanometric scale and is fully within the field of micro- and nanotechnologies.
The invention thus conceived is susceptible of evident industrial application; it can also be the subject of numerous modifications and variations, all of which are within the scope of the inventive concept; all the details may further be replaced with technically equivalent elements.
The disclosures in Italian Patent Application no. BO2006A000340, from which this application claims priority, are incorporated herein by reference.
Where technical features mentioned in any claim are followed by reference signs, those reference signs have been included for the sole purpose of increasing the intelligibility of the claims and accordingly such reference signs do not have any limiting effect on the interpretation of each element identified by way of example by such reference signs.
Number | Date | Country | Kind |
---|---|---|---|
BO2006A000340 | May 2006 | IT | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/IT2007/000331 | 5/4/2007 | WO | 00 | 10/31/2008 |