Preferred embodiments of the invention are explained based on the enclosed figures. The following are illustrated:
FIG. 1 a schematic view of a device for the testing of electronic components;
FIG. 2 various possible configurations for transfer elements in the loading and test positions;
FIG. 3 a detail view of a transfer element;
FIG. 4 a three-dimensional schematic view of a transfer element with guides;
FIG. 5 possible embodiments of the drive and the guide of transfer elements;
FIG. 6 a schematic view of feed and removal channels together with transfer elements;
FIG. 7 a schematic view of a number of transfer elements arranged adjacently and one above the other;
FIG. 8 an alternative embodiment with a common loading position;
FIG. 9 various states during a run through the process.