DEVICE AND METHOD FOR TESTING ELECTRONIC COMPONENTS

Information

  • Patent Application
  • 20070212201
  • Publication Number
    20070212201
  • Date Filed
    March 07, 2007
    18 years ago
  • Date Published
    September 13, 2007
    17 years ago
Abstract
The invention relates to a device for testing electronic components (3) with at least two mechanical transfer elements (5a, 5b), of which each can be loaded in each case at a dedicated loading position with an electronic component (3) and with a common test position (7), into which the two transfer elements (5a, 5b) can be brought. Furthermore, the invention relates to a device for testing electronic components with at least two mechanical transfer elements (80a, 80b), of which each can be loaded in each case at a common loading position (88) with an electronic component (3) and with a common test position (89), into which the two transfer elements (80a, 80b) can be brought. The invention also relates to the associated method.
Description

Preferred embodiments of the invention are explained based on the enclosed figures. The following are illustrated:



FIG. 1 a schematic view of a device for the testing of electronic components;



FIG. 2 various possible configurations for transfer elements in the loading and test positions;



FIG. 3 a detail view of a transfer element;



FIG. 4 a three-dimensional schematic view of a transfer element with guides;



FIG. 5 possible embodiments of the drive and the guide of transfer elements;



FIG. 6 a schematic view of feed and removal channels together with transfer elements;



FIG. 7 a schematic view of a number of transfer elements arranged adjacently and one above the other;



FIG. 8 an alternative embodiment with a common loading position;



FIG. 9 various states during a run through the process.


Claims
  • 1. Device for the testing of electronic components (3) comprising: at least two mechanical transfer elements (5a, 5b), of which each can be loaded in each case at a dedicated loading position with an electronic component (3), and which can be brought to a common test position (7).
  • 2. Device according to claim 1, wherein a the path from a loading position (5a, 5b) to the test position (7) is straight (16a, 16b), curved (14a, 14b, 21a, 12b, 23a, 23b), S-shaped (14a, 14b) or is composed of straight and curved sections.
  • 3. Device according to claim 1, wherein at least one or two transfer elements (5a, 5b) exhibit same orientation in the loading position as in the test position (7).
  • 4. Device according to claim 3, wherein at least one or two transfer elements (5a, 5b) on the path between the loading position and test position (7) always exhibit the orientation as in the loading and test positions.
  • 5. Device according to claim 3, wherein one or two transfer elements (5a, 5b) at least on one or more parts of the path between the loading position and test position (7) or also on the complete path exhibit a rotated orientation in relationship to the orientation as in the loading and test positions (7).
  • 6. Device according to claim 1, wherein at least one or two transfer elements (20a, 20b, 23a, 23b) exhibit a different orientation in the loading position and in the test position.
  • 7. Device according to claim 1, wherein the paths between the two loading positions and the test position run congruently at least in the region (19) directly in front of the test position (7).
  • 8. Device according to claim 1, wherein the paths for the transfer elements (24, 43a, 43b) between the loading position and test position are defined by guides such as rods (32), rails, grooves (41, 42) or cranks.
  • 9. Device according to claim 1, wherein the transfer elements (50a, 50b) are moved between the loading position and test position in each case by a single, dual or multi-axle drive (52, 53, 54).
  • 10. Device according to claim 1, wherein the two transfer elements (43a, 43b) are connected to a common driving means (47, 49).
  • 11. Device according to claim 10, wherein the two transfer elements (43a, 43b) are joined via mechanically rigid joining elements such as rods (46a, 46b) or shaped elements to the common driving means (47, 49).
  • 12. Device according to claim 10 or 11, wherein the common driving means comprises a rotating element (47) such as a rotary table or a rotating cylinder, which can be driven pneumatically, electrically, hydraulically, with a stepper motor or servomotor (49).
  • 13. Device according to claim 1, wherein electronic components can be fed to the two loading positions independently of one another or that the two loading positions can be fed with electronic components via an at least partially common channel (60).
  • 14. Device according to claim 1, wherein at least one or two transfer elements (5) are coupled in each case to a further transfer element.
  • 15. Device according to claim 1, characterised in that the device is a gravity handler.
  • 16. Device for the testing of electronic components comprising: at least two mechanical transfer elements (80a, 80b), of which each can be loaded in each case at a common loading position (88) with an electronic component (3), and with a common test position (89) into which the two transfer elements (80a, 80b) can be brought.
  • 17. Device according to claim 16, wherein each transfer element (80a, 80b) exhibits the same orientation in the common loading position (88) and in the common test position (89).
  • 18. Device according to claim 16, wherein at least one or two transfer elements (80a, 80b) can be transferred with just one drive element (83) causing a movement of the transfer element (80a, 80b) from the loading position (88) into the test position (89).
  • 19. Device according to claim 16, wherein the device is a gravity handler.
  • 20. Method for the testing of electronic components (3) comprising the steps: a first transfer element is loaded with an electronic component in a first loading position of the first transfer element;an electronic component in a second transfer element, which is located in a test position, is tested at least partially simultaneously;after the testing of the electronic component of the second transfer element, it is passed to a second loading position;thereafter or at least partially simultaneously, the first transfer element is passed to the common test position.
  • 21. Method for the testing of electronic components comprising the steps: a first transfer element (80a, 80b) is loaded in a loading position with an electronic component;at least partially simultaneously an electronic component of a second transfer element is tested in a test position;then the second transfer element is passed to the common loading position, while the first transfer element is passed to the test position.
  • 22. Method according to claim 20, wherein it is executed with a gravity handler.
Priority Claims (2)
Number Date Country Kind
06004765.1 Mar 2006 EP regional
06024651.9 Nov 2006 EP regional