Patent Application
20080171401
This invention relates to a device for repairing conducting lines of semiconductor integrated circuit (IC) chips and a repairing method employing the device.
With the advent of modern day electronics, circuits on a printed circuit board (PCB) or ceramic modules or semiconductor IC chips have become more and more dense. As a result, electrical lines or conducting lines are thinner and narrower so that more of them can be placed in a given area.
In a typical process for manufacturing ceramic modules or chips, conducting materials such as aluminum or aluminum alloy are widely used to make conducting lines or repair semiconductor IC chips. In order to get thinner and narrower conducting lines without increasing the inner resistance, copper replaces aluminum or aluminum alloy because copper has a low resistivity, a high melting point, a high thermal conductivity, and can be deposited by processes such as a chemical vapor deposition (CVD) method.
Normally, in a typical method for repairing conducting lines of a PCB, an operator can observe and find a broken point of a conducting line, and then repair the broken conducting line with solder by a hot press method.
Because the conducting lines of the PCB become thinner and narrower, the operator has more difficulties in finding the broken point of a conducting line by his or her eyes, thus the operation of the operator for soldering the broken line is hard to be performed.
It is desired to provide a device which can overcome the above-described deficiency.
In one preferred embodiment, a repairing method includes providing a substrate having a plurality of conducting lines; detecting a broken position of one of the conducting lines; switching on a nozzle; and forming a copper layer at the broken position on the substrate.
Other novel features and advantages will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Referring to
The shell 100 has the shape of a cuboid, and includes a hollow box 101 having an opening and a cover 102 covering the opening of the box 101. The box 101 and a cover 102 form a space for accommodating the main body 120.
Referring also to
A second through hole 1021 and a third through hole 1022 are defined in the cover 102.
Referring also to
The localizer 170 is positioned at the top of the main body 120, and includes two parallel glide paths 173, a shift bar 172, and a shift lump 171. The two parallel glide paths 173 are arranged parallel to the bottom plate 1015, and are supported by the supporting arms 1017, 1018 respectively. The shift bar 172 is arranged perpendicular to the glide paths 173, and engaged with the glide paths 173 at two ends such that the shift bar 172 can move along the glide paths 173 in a first direction. The shift lump 171 includes two slide arms (not labeled) that are extended at two opposite sides thereof for holding the shift bar 172. A base surface of the shift lump 171 is fixed with a top surface of the chamber 130 such that the chamber 130 and the shift lump 171 can move along the shift bar 172 in a second direction perpendicular to the first direction. An operation of the localizer 170 can be controlled by a stepper motor (not shown).
The chamber 130 includes an air pressure regulating hole 133, a fourth through hole (not shown) in a first side of the chamber 130, and a fifth through hole (not shown) in a second side of the chamber 130. A end of the first air pipe 131 is received in the second through hole 1021 of the cover 120 and the other end of the first air pipe 131 is connected to fourth through hole of the chamber 130. An end of the second air pipe 132 is received in the third through hole 1022, and the other end of the second air pipe 132 is connected to the fifth through hole of the chamber 130. The first and second air pipes 131, 132 are used to input two different kinds of gases into the chamber 130. The air pressure regulating hole 133 is used to regulate an air pressure in the chamber 130.
The nozzle 140 is fixed at a base surface of the chamber 130, and includes an inner channel connected to an inner space of the chamber 130. A button for switching on or switching off the nozzle 140 is arranged at a middle part of the nozzle 140.
The microscope 150 is fixed with the nozzle 140 by the connector 160 such that the microscope 150 can move around the nozzle 140. A diameter of a tip of the nozzle 140 is approximately equal to 1.0×10−6 m˜1.0×10−6 m.
Referring to
In step S1, the substrate can be a printed circuit board (PCB) or a substrate of a liquid crystal display (LCD). The provided substrate is placed on the bottom plate 101 of the box 101 after the cover 102 is opened.
In step S2, the microscope 150 is used to detect the broken position of the conducting line on the substrate. The localizer 170 moves the nozzle 140 to the broken position.
In step S3, the button 141 is pressed in order to switch on the nozzle 140 when the tip of the nozzle 140 is aligned with the broken position. At the same time, the inner channel of the nozzle 140 is communicated with the inner space of the chamber 130.
In step S4, a chemical vapor deposition (CVD) method is performed to form a copper layer at the broken position. In this process, a first reaction gas is a precursor Cu(β-diketonate)2 of cupric compound CuII such as Cu(hfac)2, and a second reaction gas is a reducing gas such as H2. The first and second reaction gases react as the following formula (1):
Cu(β-diketonate)2+H2→Cu+2(β-diketonate)+H2O (1).
The first reaction gases Cu(β-diketonate)2 can be obtained by dissolving Cu(β-diketonate)2 into isopropyl alcohol to generate vapor of the Cu(β-diketonate)2. The first reaction gas is provided into the chamber 130 via the first air pipe 131. The second reaction gas is provided into the chamber 130 via the second air pipe 132. In the chamber 130, when the temperature is in the range from 250° C.-350° C., the chemical reaction as formula (1) taken place to form a plurality of copper atoms. The copper atoms are deposited at the broken position by the nozzle 140 to form the copper layer covering the broken defect. Thus the conducting line having the broken defect is repaired by the copper layer. The air pressure regulating hole 133 of the chamber 130 and the vacuum pump 110 are used to adjust an air pressure of the first space higher than that of a second space defined in the chamber 130.
In step S5, the button 141 is released for switching off the nozzle 140 after the broken defect is repaired. Thus the inner channel of the nozzle 140 is disconnected with the inner space of the chamber 130. Once another broken defect needs to be repaired, the above steps S3-S5 are repeated.
In an alternative embodiment, aluminum (Al) can be used in the repairing method to form a aluminum layer at a position of the broken defect of one of the conducting line for repairing the conducting line. The aluminum layer can also be formed by performing a CVD method.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set out at the foregoing description, together with details of structures and functions relating to the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts and processes within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 96101399 | Jan 2007 | TW | national |
