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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
12,308,294
Issue date
May 20, 2025
Tokyo Electron Limited
Tetsuya Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light source apparatus and inspection apparatus
Patent number
12,308,600
Issue date
May 20, 2025
Lasertec Corporation
Jun Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic device
Patent number
12,308,289
Issue date
May 20, 2025
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method for manufacturing the same
Patent number
12,300,556
Issue date
May 13, 2025
Innolux Corporation
Chih-Yuan Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing system
Patent number
12,300,524
Issue date
May 13, 2025
Tokyo Electron Limited
Yoshifumi Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor structure
Patent number
12,300,551
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal oxide film and method for forming metal oxide film
Patent number
12,302,639
Issue date
May 13, 2025
Semiconductor Energy Laboratory Co., Ltd.
Masahiro Takahashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Autonomous operation of plasma processing tool
Patent number
12,300,477
Issue date
May 13, 2025
Tokyo Electron Limited
Jun Shinagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for evaluating semiconductor wafer, method for selecting sem...
Patent number
12,300,553
Issue date
May 13, 2025
Shin-Etsu Handotai Co., Ltd.
Junya Suzuki
C30 - CRYSTAL GROWTH
Information
Patent Grant
Method of manufacturing semiconductor devices
Patent number
12,300,506
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Chen Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for additive manufacturing operations
Patent number
12,292,384
Issue date
May 6, 2025
Divergent Technologies, Inc.
Vivek R. Dave
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package inspection with predictive model for wirebond...
Patent number
12,293,504
Issue date
May 6, 2025
Viasat, Inc.
Ian A. Cleary
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor structure
Patent number
12,288,689
Issue date
Apr 29, 2025
Winbond Electronics Corp.
Pei-Hsiu Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Region classification of film non-uniformity based on processing of...
Patent number
12,288,724
Issue date
Apr 29, 2025
Applied Materials, Inc.
Dominic J. Benvegnu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Critical dimension error analysis method
Patent number
12,288,725
Issue date
Apr 29, 2025
Shanghai IC R&D Center Co., Ltd.
Xueru Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inspection layer to improve the detection of defects through optica...
Patent number
12,281,991
Issue date
Apr 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
I-Che Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Characterizing and measuring in small boxes using XPS with multiple...
Patent number
12,281,893
Issue date
Apr 22, 2025
NOVA MEASURING INSTRUMENTS INC.
Heath Pois
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a cleaved semiconductor wafer
Patent number
12,270,768
Issue date
Apr 8, 2025
GlobalWafers Co., Ltd.
Benjamin Michael Meyer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of enhancing contrast while imaging high aspect ratio struct...
Patent number
12,272,607
Issue date
Apr 8, 2025
Applied Materials, Inc.
Geetika Bajaj
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Method of measuring mask overlay using test patterns
Patent number
12,271,116
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Tseng Chin Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Measuring apparatus
Patent number
12,264,908
Issue date
Apr 1, 2025
Disco Corporation
Keiji Nomaru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chips bonding auxiliary structure
Patent number
12,266,578
Issue date
Apr 1, 2025
United Microelectronics Corp.
Sheng Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, system, and method for non-contact temperature monitorin...
Patent number
12,266,551
Issue date
Apr 1, 2025
Applied Materials, Inc.
Bhaskar Prasad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical heating apparatus with angled light holding substrate and h...
Patent number
12,261,061
Issue date
Mar 25, 2025
Ushio Denki Kabushiki Kaisha
Tomonori Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate inspection system and a method of use thereof
Patent number
12,258,665
Issue date
Mar 25, 2025
JNK TECH
Youngjin Choi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Overlay mark, overlay marking method and overlay measuring method
Patent number
12,259,661
Issue date
Mar 25, 2025
NEXCHIP SEMICONDUCTOR CORPORATION
Kuotung Yang
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Splash resistant laser wafer singulation by crack length control
Patent number
12,255,097
Issue date
Mar 18, 2025
Texas Instruments Incorporated
Yang Liu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
Patent number
12,255,109
Issue date
Mar 18, 2025
Kulicke and Soffa Industries, Inc.
Gary S. Gillotti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment method and alignment device
Patent number
12,255,113
Issue date
Mar 18, 2025
STAR TECHNOLOGIES (WUHAN) CO., LTD.
Choon Leong Lou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
Patent number
12,255,172
Issue date
Mar 18, 2025
Kulicke and Soffa Industries, Inc.
Gary S. Gillotti
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL
Publication number
20250167050
Publication date
May 22, 2025
ADVANCED MICRO DEVICES, INC.
Srividhya Venkataraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE FOR PREDICTING CHARACTERISTIC OF SEMICONDUCTOR DE...
Publication number
20250167051
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Seonghyeon Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POSITION RECONSTRUCTION OF SEMICONDUCTOR COMPONENTS ON A WAFER
Publication number
20250167052
Publication date
May 22, 2025
ROBERT BOSCH GmbH
Eric Sebastian Schmidt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
Publication number
20250167031
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Hosin SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER SUPPORT FOR MEASURING WAFER GEOMETRY
Publication number
20250167024
Publication date
May 22, 2025
TOKYO ELECTRON LIMITED
Daniel FULFORD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATFORM WITH TRENCH FOR OPTICAL FIBER WITH SENSORS
Publication number
20250164330
Publication date
May 22, 2025
iSenseCloud, Inc.
Huy D. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FinFET Device and Method of Forming and Monitoring Quality of the Same
Publication number
20250169101
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Yin CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...
Publication number
20250167022
Publication date
May 22, 2025
TOKYO ELECTRON LIMITED
Keita Hirase
B08 - CLEANING
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...
Publication number
20250157826
Publication date
May 15, 2025
InnoLux Corporation
Kuang-Ming FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR WAFER BONDING
Publication number
20250154000
Publication date
May 15, 2025
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Chien-Wei CHANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
Publication number
20250157836
Publication date
May 15, 2025
SCREEN Holdings Co., Ltd.
Shinji SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...
Publication number
20250155234
Publication date
May 15, 2025
Applied Materials, Inc.
Mohsin Waqar
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR EMISSIVITY-CORRECTED PYROMETRY
Publication number
20250154655
Publication date
May 15, 2025
AIXTRON SE
Karsten ROJEK
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TRENCH STRUCTURE, MANUFACTURING MET...
Publication number
20250157907
Publication date
May 15, 2025
SK HYNIX INC.
In Young JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250157947
Publication date
May 15, 2025
Advanced Semiconductor Engineering, Inc.
Wen Hung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER METROLOGY TECHNOLOGIES
Publication number
20250155486
Publication date
May 15, 2025
FemtoMetrix, Inc.
Viktor Koldiaev
G01 - MEASURING TESTING
Information
Patent Application
COMPUTER IMPLEMENTED METHOD FOR DEFECT DETECTION IN AN IMAGING DATA...
Publication number
20250155378
Publication date
May 15, 2025
Carl Zeiss SMT GMBH
Alexander Freytag
G01 - MEASURING TESTING
Information
Patent Application
WAFER WOBBLING DETECTION METHOD AND WAFER WOBBLING DETECTION SYSTEM
Publication number
20250157021
Publication date
May 15, 2025
GSF Solution Co., Ltd.
Seungwon SEO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149424
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...
Publication number
20250149343
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ya-Wen YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
Publication number
20250149362
Publication date
May 8, 2025
Micron Technology, Inc.
Nagasubramaniyan Chandrasekaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION
Publication number
20250149387
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
I-Che Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
Publication number
20250149390
Publication date
May 8, 2025
Xilinx, Inc.
Andy WIDJAJA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250149464
Publication date
May 8, 2025
KIOXIA Corporation
Yoichi MIZUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT
Publication number
20250147430
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Chih HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METH...
Publication number
20250147432
Publication date
May 8, 2025
Resonac Corporation
Tetsuya KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149425
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS
Publication number
20250140614
Publication date
May 1, 2025
TOKYO ELECTRON LIMITED
Anthony R. SCHEPIS
G01 - MEASURING TESTING
Information
Patent Application
WAFER INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METH...
Publication number
20250139762
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Hyunchul KIM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
Publication number
20250140569
Publication date
May 1, 2025
Applied Materials, Inc.
Sony Varghese
H01 - BASIC ELECTRIC ELEMENTS