for structural parameters

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H01L22/12

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selection of measurement locations for patterning processes
- Patent number 12,228,862
- Issue date Feb 18, 2025
- ASML Netherlands B.V.
- Hans Van Der Laan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of evaluating SiC substrate, method of manufacturing SiC epi...
- Patent number 12,228,523
- Issue date Feb 18, 2025
- Resonac Corporation
- Ling Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor devices using directional pro...
- Patent number 12,230,507
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer registration and overlay measurement systems and related methods
- Patent number 12,230,546
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Nikolay A. Mirin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,224,214
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Seongkeun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for measurement of misregistration and ameliora...
- Patent number 12,222,199
- Issue date Feb 11, 2025
- KLA Corporation
- Roie Volkovich
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,224,199
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Takafumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the acoustic detection of cracks in a semicon...
- Patent number 12,222,322
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Oliver Nagler
- G01 - MEASURING TESTING
Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for non-destructive inspection of cell etch redeposition
- Patent number 12,218,014
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Frequency-picked methodology for diffraction-based overlay measurement
- Patent number 12,216,412
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement apparatus, measuring method using the same, and...
- Patent number 12,215,974
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Seung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring a lateral depth in a microstructure
- Patent number 12,216,057
- Issue date Feb 4, 2025
- Imec VZW
- Thomas Nuytten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized stress modulation by implant to back of wafer
- Patent number 12,217,974
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of optical inspection of electronic device manu...
- Patent number 12,215,966
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact apparatus for measuring wafer thickness
- Patent number 12,209,853
- Issue date Jan 28, 2025
- Fujikoshi Machinery Corp.
- Chihiro Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform with trench for optical fiber with sensors
- Patent number 12,209,923
- Issue date Jan 28, 2025
- iSenseCloud, Inc.
- Huy D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a lighting device
- Patent number 12,211,826
- Issue date Jan 28, 2025
- Osram Opto Semiconductors GmbH
- Laura Kreiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having closed loop IR camera heat detection system and me...
- Patent number 12,205,835
- Issue date Jan 21, 2025
- Illinois Tool Works Inc.
- Eric Wayne Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical mode optimization for wafer inspection
- Patent number 12,204,842
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bing-Siang Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Recessed structure capable of being conveniently monitored online a...
- Patent number 12,205,268
- Issue date Jan 21, 2025
- Shanghai IC R&D Center Co., Ltd.
- Xiaoxu Kang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of training deep learning model for predicting pattern chara...
- Patent number 12,205,040
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yoonsung Bae
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lithography measurement machine and operating method thereof
- Patent number 12,197,124
- Issue date Jan 14, 2025
- Hon Hai Precision Industry Co., Ltd.
- Kuo-Kuei Fu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
X-ray based measurements in patterned structure
- Patent number 12,196,691
- Issue date Jan 14, 2025
- Nova Ltd.
- Gilad Barak
- G01 - MEASURING TESTING
Information Patent Grant
Execution device and execution method
- Patent number 12,198,954
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kippei Sugita
- G01 - MEASURING TESTING
Information Patent Grant
Deposition system and method
- Patent number 12,198,927
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS
- Publication number 20250063641
- Publication date Feb 20, 2025
- Cornell University
- James C. M. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Modulation Through Implantation and the Structures Thereof
- Publication number 20250062247
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...
- Publication number 20250051959
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Masayuki TSUJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER
- Publication number 20250054815
- Publication date Feb 13, 2025
- Disco Corporation
- Mitsuru IKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING STEP HEIGHT OF EPITAXIAL LAYER OF CMOS DEVICE
- Publication number 20250054814
- Publication date Feb 13, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zexiao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING A DIODE WAFER AND A WAFER TO BE PROCESSED
- Publication number 20250054816
- Publication date Feb 13, 2025
- KSEC CO., LTD.
- SHIH-CHING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL
- Publication number 20250054878
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Sujie Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR NON-DESTRUCTIVE METROLOGY OF THIN LAYERS
- Publication number 20250052704
- Publication date Feb 13, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Wei Ti LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...
- Publication number 20250041988
- Publication date Feb 6, 2025
- SK SILTRON CO., LTD.
- Sangho LEE
- B24 - GRINDING POLISHING
Information Patent Application
OVERLAY METROLOGY BASED ON TEMPLATE MATCHING WITH ADAPTIVE WEIGHTING
- Publication number 20250044710
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Jiyou FU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR DEFORMING AN EFFECTIVE STRUCTURE
- Publication number 20250048939
- Publication date Feb 6, 2025
- NELUMBO DIGITAL
- Yves-Matthieu Le Vaillant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTO PARAMETER TUNING FOR CHARGED PARTICLE INSPECTION IMAGE ALIGNMENT
- Publication number 20250036030
- Publication date Jan 30, 2025
- ASML NETHERLANDS B.V.
- Haoyi LIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250038005
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250038016
- Publication date Jan 30, 2025
- AP SYSTEMS INC.
- Dae Ryong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...
- Publication number 20250029850
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Kim Ramkumar VELLORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...
- Publication number 20250029853
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Christopher Cillie
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT
- Publication number 20250027766
- Publication date Jan 23, 2025
- KOH YOUNG TECHNOLOGY INC.
- Chan Kwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
- Publication number 20250022953
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Takafumi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET DATA CORRECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURIN...
- Publication number 20250022713
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Joongsuk Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, INFORMATION PROCESSING APPAR...
- Publication number 20250022757
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tadashi ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR PROCESS
- Publication number 20250022720
- Publication date Jan 16, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Jianmin JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT
- Publication number 20250012565
- Publication date Jan 9, 2025
- KOH YOUNG TECHNOLOGY INC.
- Chan Kwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF EXTRACTING DEFECT...
- Publication number 20250015184
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Hagyoul BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20250015012
- Publication date Jan 9, 2025
- Macronix International Co., Ltd.
- Chin-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY SLOT PLATES
- Publication number 20250014922
- Publication date Jan 9, 2025
- Applied Materials Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Pass Optical Measurements Of Semiconductor Structures
- Publication number 20250012734
- Publication date Jan 9, 2025
- KLA Corporation
- Zhengquan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION
- Publication number 20250012737
- Publication date Jan 9, 2025
- ONTO INNOVATION INC.
- Yiliang LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...
- Publication number 20250014915
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- SANGJINE PARK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selection of measurement locations for patterning processes

Method of evaluating SiC substrate, method of manufacturing SiC epi...

Method of manufacturing semiconductor devices using directional pro...

Wafer registration and overlay measurement systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Method of fabricating a semiconductor device

Systems and methods for measurement of misregistration and ameliora...

Semiconductor manufacturing apparatus and method for manufacturing...

System and method for the acoustic detection of cracks in a semicon...

Interferometer systems and methods for real time etch process compe...

Method for non-destructive inspection of cell etch redeposition

Frequency-picked methodology for diffraction-based overlay measurement

Optical measurement apparatus, measuring method using the same, and...

Method and apparatus for measuring a lateral depth in a microstructure

Semiconductor device and method for manufacturing the same

Localized stress modulation by implant to back of wafer

Methods and systems of optical inspection of electronic device manu...

Non-contact apparatus for measuring wafer thickness

Platform with trench for optical fiber with sensors

Method for producing a lighting device

Process tool for analyzing bonded workpiece interface

Apparatus having closed loop IR camera heat detection system and me...

Optical mode optimization for wafer inspection

Recessed structure capable of being conveniently monitored online a...

Method of training deep learning model for predicting pattern chara...

Lithography measurement machine and operating method thereof

X-ray based measurements in patterned structure

Execution device and execution method

Deposition system and method

Methods of forming microelectronic device assemblies and packages

Patents Applicationslast 30 patents

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS

Warpage Modulation Through Implantation and the Structures Thereof

EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...

MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER

CONTROLLING FIN-THINNING THROUGH FEEDBACK

METHOD FOR MONITORING STEP HEIGHT OF EPITAXIAL LAYER OF CMOS DEVICE

METHODS FOR FABRICATING A DIODE WAFER AND A WAFER TO BE PROCESSED

WARPAGE CONTROL

METHOD AND SYSTEM FOR NON-DESTRUCTIVE METROLOGY OF THIN LAYERS

DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...

OVERLAY METROLOGY BASED ON TEMPLATE MATCHING WITH ADAPTIVE WEIGHTING

SYSTEM FOR DEFORMING AN EFFECTIVE STRUCTURE

AUTO PARAMETER TUNING FOR CHARGED PARTICLE INSPECTION IMAGE ALIGNMENT

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...

DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...

APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...

OFFSET DATA CORRECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURIN...

SEMICONDUCTOR MANUFACTURING APPARATUS, INFORMATION PROCESSING APPAR...

TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR PROCESS

APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT

FERROELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF EXTRACTING DEFECT...

SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...

METROLOGY SLOT PLATES

Multiple Pass Optical Measurements Of Semiconductor Structures

OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...