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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Prediction of electrical properties of a semiconductor specimen
- Patent number 12,250,503
- Issue date Mar 11, 2025
- Applied Materials Israel Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using spectroscopic measurements for substrate temperature monitoring
- Patent number 12,249,525
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting damaged semiconductor wafers utilizing a semiconductor wa...
- Patent number 12,249,526
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and material deposition systems for forming semiconductor l...
- Patent number 12,249,506
- Issue date Mar 11, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer metrology technologies
- Patent number 12,241,924
- Issue date Mar 4, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backside power rail for physical failure analysis (PFA)
- Patent number 12,237,233
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer storage devices configured to measure physical properties of...
- Patent number 12,237,189
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming and monitoring quality of the same
- Patent number 12,237,417
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method and inspection method th...
- Patent number 12,237,176
- Issue date Feb 25, 2025
- Innolux Corporation
- Kuang-Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selection of measurement locations for patterning processes
- Patent number 12,228,862
- Issue date Feb 18, 2025
- ASML Netherlands B.V.
- Hans Van Der Laan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of evaluating SiC substrate, method of manufacturing SiC epi...
- Patent number 12,228,523
- Issue date Feb 18, 2025
- Resonac Corporation
- Ling Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor devices using directional pro...
- Patent number 12,230,507
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer registration and overlay measurement systems and related methods
- Patent number 12,230,546
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Nikolay A. Mirin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,224,214
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Seongkeun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for measurement of misregistration and ameliora...
- Patent number 12,222,199
- Issue date Feb 11, 2025
- KLA Corporation
- Roie Volkovich
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,224,199
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Takafumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the acoustic detection of cracks in a semicon...
- Patent number 12,222,322
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Oliver Nagler
- G01 - MEASURING TESTING
Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for non-destructive inspection of cell etch redeposition
- Patent number 12,218,014
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical measurement apparatus, measuring method using the same, and...
- Patent number 12,215,974
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Seung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring a lateral depth in a microstructure
- Patent number 12,216,057
- Issue date Feb 4, 2025
- Imec VZW
- Thomas Nuytten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency-picked methodology for diffraction-based overlay measurement
- Patent number 12,216,412
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized stress modulation by implant to back of wafer
- Patent number 12,217,974
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of optical inspection of electronic device manu...
- Patent number 12,215,966
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact apparatus for measuring wafer thickness
- Patent number 12,209,853
- Issue date Jan 28, 2025
- Fujikoshi Machinery Corp.
- Chihiro Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform with trench for optical fiber with sensors
- Patent number 12,209,923
- Issue date Jan 28, 2025
- iSenseCloud, Inc.
- Huy D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DETECTING DEFECTS IN A PACKAGE
- Publication number 20250076216
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250073820
- Publication date Mar 6, 2025
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250079331
- Publication date Mar 6, 2025
- Disco Corporation
- Nobuki KAKIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250079395
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ACCURACY MEASUREMENT
- Publication number 20250079242
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsuen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION
- Publication number 20250076212
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING O...
- Publication number 20250068195
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Wolfgang R. ADERHOLD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN-SITU ION BEAM ANGLE MEASUREMENT
- Publication number 20250069850
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Daniel Distaso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING RUPTURE OF BONDING BUBBLE IN WAFER BONDING PR...
- Publication number 20250069957
- Publication date Feb 27, 2025
- Shanghal Hual Integrated Circuit Corporation
- Yurong Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Analyzing Wafer Angle in Semiconductor Integr...
- Publication number 20250069955
- Publication date Feb 27, 2025
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Ying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM INSPECTION AND REPAIR WITH INCREASED SECONDARY ELECTRON YIELD
- Publication number 20250069956
- Publication date Feb 27, 2025
- Carl Zeiss SMT GMBH
- Brett Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS
- Publication number 20250063641
- Publication date Feb 20, 2025
- Cornell University
- James C. M. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Modulation Through Implantation and the Structures Thereof
- Publication number 20250062247
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER
- Publication number 20250054815
- Publication date Feb 13, 2025
- Disco Corporation
- Mitsuru IKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...
- Publication number 20250051959
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Masayuki TSUJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING STEP HEIGHT OF EPITAXIAL LAYER OF CMOS DEVICE
- Publication number 20250054814
- Publication date Feb 13, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zexiao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING A DIODE WAFER AND A WAFER TO BE PROCESSED
- Publication number 20250054816
- Publication date Feb 13, 2025
- KSEC CO., LTD.
- SHIH-CHING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL
- Publication number 20250054878
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Sujie Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR NON-DESTRUCTIVE METROLOGY OF THIN LAYERS
- Publication number 20250052704
- Publication date Feb 13, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Wei Ti LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...
- Publication number 20250041988
- Publication date Feb 6, 2025
- SK SILTRON CO., LTD.
- Sangho LEE
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM FOR DEFORMING AN EFFECTIVE STRUCTURE
- Publication number 20250048939
- Publication date Feb 6, 2025
- NELUMBO DIGITAL
- Yves-Matthieu Le Vaillant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY METROLOGY BASED ON TEMPLATE MATCHING WITH ADAPTIVE WEIGHTING
- Publication number 20250044710
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Jiyou FU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTO PARAMETER TUNING FOR CHARGED PARTICLE INSPECTION IMAGE ALIGNMENT
- Publication number 20250036030
- Publication date Jan 30, 2025
- ASML NETHERLANDS B.V.
- Haoyi LIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...
- Publication number 20250038005
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Yoshihide YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250038016
- Publication date Jan 30, 2025
- AP SYSTEMS INC.
- Dae Ryong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...
- Publication number 20250029850
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Kim Ramkumar VELLORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...
- Publication number 20250029853
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Christopher Cillie
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT
- Publication number 20250027766
- Publication date Jan 23, 2025
- KOH YOUNG TECHNOLOGY INC.
- Chan Kwon LEE
- H01 - BASIC ELECTRIC ELEMENTS

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Prediction of electrical properties of a semiconductor specimen

Using spectroscopic measurements for substrate temperature monitoring

Detecting damaged semiconductor wafers utilizing a semiconductor wa...

Methods and material deposition systems for forming semiconductor l...

Dynamic bonding gap control and tool for wafer bonding

Wafer metrology technologies

Methods for wafer bonding

Backside power rail for physical failure analysis (PFA)

Wafer storage devices configured to measure physical properties of...

FinFET device and method of forming and monitoring quality of the same

Electronic device and manufacturing method and inspection method th...

Selection of measurement locations for patterning processes

Method of evaluating SiC substrate, method of manufacturing SiC epi...

Method of manufacturing semiconductor devices using directional pro...

Wafer registration and overlay measurement systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Method of fabricating a semiconductor device

Systems and methods for measurement of misregistration and ameliora...

Semiconductor manufacturing apparatus and method for manufacturing...

System and method for the acoustic detection of cracks in a semicon...

Interferometer systems and methods for real time etch process compe...

Method for non-destructive inspection of cell etch redeposition

Optical measurement apparatus, measuring method using the same, and...

Method and apparatus for measuring a lateral depth in a microstructure

Frequency-picked methodology for diffraction-based overlay measurement

Semiconductor device and method for manufacturing the same

Localized stress modulation by implant to back of wafer

Methods and systems of optical inspection of electronic device manu...

Non-contact apparatus for measuring wafer thickness

Platform with trench for optical fiber with sensors

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR DETECTING DEFECTS IN A PACKAGE

WAFER PROCESSING METHOD

METHOD OF MANUFACTURING WAFER

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

VIA ACCURACY MEASUREMENT

MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION

SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING O...

IN-SITU ION BEAM ANGLE MEASUREMENT

METHOD FOR MONITORING RUPTURE OF BONDING BUBBLE IN WAFER BONDING PR...

Method and System for Analyzing Wafer Angle in Semiconductor Integr...

ION BEAM INSPECTION AND REPAIR WITH INCREASED SECONDARY ELECTRON YIELD

MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

Warpage Modulation Through Implantation and the Structures Thereof

MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER

EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...

CONTROLLING FIN-THINNING THROUGH FEEDBACK

METHOD FOR MONITORING STEP HEIGHT OF EPITAXIAL LAYER OF CMOS DEVICE

METHODS FOR FABRICATING A DIODE WAFER AND A WAFER TO BE PROCESSED

WARPAGE CONTROL

METHOD AND SYSTEM FOR NON-DESTRUCTIVE METROLOGY OF THIN LAYERS

DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...

SYSTEM FOR DEFORMING AN EFFECTIVE STRUCTURE

OVERLAY METROLOGY BASED ON TEMPLATE MATCHING WITH ADAPTIVE WEIGHTING

AUTO PARAMETER TUNING FOR CHARGED PARTICLE INSPECTION IMAGE ALIGNMENT

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFAC...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...

DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...

APPARATUS AND METHOD FOR DETERMINING THREE-DIMENSIONAL SHAPE OF OBJECT