for structural parameters

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H01L22/12

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transfer apparatus and transfer method
- Patent number 12,341,046
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- G01 - MEASURING TESTING
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus match detection method, detection system, prewarning meth...
- Patent number 12,341,070
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Weigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Training method for semiconductor process prediction model, semicon...
- Patent number 12,339,632
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing target material in deposition chamber with ti...
- Patent number 12,341,042
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsuan-Chih Chu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,334,401
- Issue date Jun 17, 2025
- Kokusai Electric Corporation
- Hideto Tateno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for inspecting semiconductor wafer and method of...
- Patent number 12,332,186
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Q-Han Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 12,334,402
- Issue date Jun 17, 2025
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
System for automatic diagnostics and monitoring of semiconductor de...
- Patent number 12,332,182
- Issue date Jun 17, 2025
- KLA Corporation
- David W. Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling etching tool
- Patent number 12,326,714
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method, semiconductor device manufacturing method,...
- Patent number 12,327,766
- Issue date Jun 10, 2025
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical inspection apparatus in semiconductor process system
- Patent number 12,327,767
- Issue date Jun 10, 2025
- CHROMA ATE INC.
- Shih-Yao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to determine a patterning process parameter
- Patent number 12,322,660
- Issue date Jun 3, 2025
- ASML Netherlands B.V.
- Adriaan Johan Van Leest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-scale autoencoders for semiconductor workpiece understanding
- Patent number 12,322,087
- Issue date Jun 3, 2025
- Wolfspeed, Inc.
- Matthew David Conrad
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dimension measurement apparatus, semiconductor manufacturing appara...
- Patent number 12,320,630
- Issue date Jun 3, 2025
- HITACHI HIGH-TECH CORPORATION
- Pushe Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor inspection tool system and method for wafer edge insp...
- Patent number 12,320,757
- Issue date Jun 3, 2025
- Camtek Ltd.
- Carmel Yehuda Drillman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive control of variability in device performance in advanced s...
- Patent number 12,322,618
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Samer Banna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel classification of film non-uniformity based on processing of...
- Patent number 12,322,659
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flat bonding method of light emitting device and flat bonder for li...
- Patent number 12,317,643
- Issue date May 27, 2025
- SEOUL VIOSYS CO., LTD.
- Ik Kyu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling deposition tool
- Patent number 12,314,032
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafers
- Patent number 12,313,578
- Issue date May 27, 2025
- Siltronic AG
- Michael Boy
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus and method for measuring the gap
- Patent number 12,313,392
- Issue date May 27, 2025
- Semes Co., Ltd.
- Chung Woo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,294
- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source apparatus and inspection apparatus
- Patent number 12,308,600
- Issue date May 20, 2025
- Lasertec Corporation
- Jun Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,300,556
- Issue date May 13, 2025
- Innolux Corporation
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide film and method for forming metal oxide film
- Patent number 12,302,639
- Issue date May 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Masahiro Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Autonomous operation of plasma processing tool
- Patent number 12,300,477
- Issue date May 13, 2025
- Tokyo Electron Limited
- Jun Shinagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAULT ISOLATION FOR SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20250208061
- Publication date Jun 26, 2025
- Intel Corporation
- Megan KNAPP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250205846
- Publication date Jun 26, 2025
- EBARA CORPORATION
- Kohei OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SENSOR FUSION
- Publication number 20250210417
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR CONDUCTIVE FILM, MANUFACTURING METHOD FOR...
- Publication number 20250208500
- Publication date Jun 26, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Shunsuke KANAME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250212444
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20250201639
- Publication date Jun 19, 2025
- Sony Semiconductor Solutions Corporation
- HIROTAKA YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INSPECTING GROUP-III ELEMENT NITRIDE SUBSTRATE, METHOD OF...
- Publication number 20250201636
- Publication date Jun 19, 2025
- NGK Insulators, Ltd.
- Yoshitaka KURAOKA
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS OF OPERATING WIRE BONDING SYSTEMS, INCLUDING METHODS OF DET...
- Publication number 20250201765
- Publication date Jun 19, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CHARACTERIZATION METHOD AND MANUFACTURING OF SEMICONDUCTOR...
- Publication number 20250201633
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250201635
- Publication date Jun 19, 2025
- EBARA CORPORATION
- Issei SUGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Measurements Of Complex Semiconductor Structures Based On Component...
- Publication number 20250198942
- Publication date Jun 19, 2025
- KLA Corporation
- Zhengquan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING EDGE ECCENTRICITY WHILE WAFER IS ON PRE-ALIGNER
- Publication number 20250198748
- Publication date Jun 19, 2025
- Canon Kabushiki Kaisha
- Logan L. Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR IDENTIFYING DEFECTIVE ELECTRICAL CONNEC...
- Publication number 20250201634
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Bernhard G. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND DETECTION DEVICE
- Publication number 20250191174
- Publication date Jun 12, 2025
- InnoLux Corporation
- Hui-Teng LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MATCHING BASED DEFECT EXAMINATION FOR SEMICONDUCTOR SPECIMENS
- Publication number 20250191177
- Publication date Jun 12, 2025
- APPLIED MATERIALS ISRAEL LTD.
- Yuval ALFASSI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT
- Publication number 20250191917
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Qintao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIA...
- Publication number 20250191979
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kimiharu KUROKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUPPRESSING FORMATION OF STACKING FAULT, STRUCTURE PRODU...
- Publication number 20250188643
- Publication date Jun 12, 2025
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- C30 - CRYSTAL GROWTH
Information Patent Application
PATTERN INSPECTION METHOD, METHOD FOR MANUFACTURING RESIST PATTERN,...
- Publication number 20250191978
- Publication date Jun 12, 2025
- Resonac Corporation
- Tetsuya KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST METHOD FOR A WAFER AND WAFER
- Publication number 20250189461
- Publication date Jun 12, 2025
- United Microelectronics Corp.
- Ying TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method thereof
- Publication number 20250183148
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING ETCHING TOOL
- Publication number 20250181059
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- Publication number 20250183072
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Daisuke MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ONLINE INSPECTION OF SURFACE CONDITION OF POL...
- Publication number 20250178157
- Publication date Jun 5, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Zhe YANG
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND MATERIAL DEPOSITION SYSTEMS FOR FORMING SEMICONDUCTOR L...
- Publication number 20250183033
- Publication date Jun 5, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION APPARATUS, EVALUATION METHOD, AND STORAGE MEDIUM
- Publication number 20250183101
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Tsuyoshi MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...
- Publication number 20250183073
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER ARRANGEMENTS WITH UPPER AND LOWER PYROMETERS, SEMICONDUCTOR...
- Publication number 20250183070
- Publication date Jun 5, 2025
- ASM IP HOLDING B.V.
- Yanfu Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF MULTIPLE-LEVEL INTERCONNECT STRUCTURE
- Publication number 20250183102
- Publication date Jun 5, 2025
- United Microelectronics Corp.
- Jia Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transfer apparatus and transfer method

Resin shaping device

Apparatus match detection method, detection system, prewarning meth...

Training method for semiconductor process prediction model, semicon...

Method for depositing target material in deposition chamber with ti...

Substrate processing apparatus, method of manufacturing semiconduct...

Method and system for inspecting semiconductor wafer and method of...

Fabrication of thin-film encapsulation layer for light-emitting device

System for automatic diagnostics and monitoring of semiconductor de...

Method for controlling etching tool

Laser processing method, semiconductor device manufacturing method,...

Optical inspection apparatus in semiconductor process system

Method and apparatus to determine a patterning process parameter

Multi-scale autoencoders for semiconductor workpiece understanding

Dimension measurement apparatus, semiconductor manufacturing appara...

Semiconductor inspection tool system and method for wafer edge insp...

Adaptive control of variability in device performance in advanced s...

Pixel classification of film non-uniformity based on processing of...

Flat bonding method of light emitting device and flat bonder for li...

Method for controlling deposition tool

Method for producing semiconductor wafers

Apparatus and method for measuring the gap

Bonding apparatus and bonding method

Light source apparatus and inspection apparatus

Method for manufacturing an electronic device

Electronic device and method for manufacturing the same

Substrate processing system

Method for forming semiconductor structure

Metal oxide film and method for forming metal oxide film

Autonomous operation of plasma processing tool

Patents Applicationslast 30 patents

FAULT ISOLATION FOR SEMICONDUCTOR DEVICE MANUFACTURING

POLISHING APPARATUS AND POLISHING METHOD

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

THERMAL SENSOR FUSION

MANUFACTURING METHOD FOR CONDUCTIVE FILM, MANUFACTURING METHOD FOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD OF INSPECTING GROUP-III ELEMENT NITRIDE SUBSTRATE, METHOD OF...

METHODS OF OPERATING WIRE BONDING SYSTEMS, INCLUDING METHODS OF DET...

THERMAL CHARACTERIZATION METHOD AND MANUFACTURING OF SEMICONDUCTOR...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Measurements Of Complex Semiconductor Structures Based On Component...

METHOD OF MEASURING EDGE ECCENTRICITY WHILE WAFER IS ON PRE-ALIGNER

METHODS AND APPARATUSES FOR IDENTIFYING DEFECTIVE ELECTRICAL CONNEC...

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND DETECTION DEVICE

MATCHING BASED DEFECT EXAMINATION FOR SEMICONDUCTOR SPECIMENS

WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT

SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIA...

METHOD FOR SUPPRESSING FORMATION OF STACKING FAULT, STRUCTURE PRODU...

PATTERN INSPECTION METHOD, METHOD FOR MANUFACTURING RESIST PATTERN,...

TEST METHOD FOR A WAFER AND WAFER

Electronic Device and Manufacturing Method thereof

METHOD FOR CONTROLLING ETCHING TOOL

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

METHOD AND SYSTEM FOR ONLINE INSPECTION OF SURFACE CONDITION OF POL...

METHODS AND MATERIAL DEPOSITION SYSTEMS FOR FORMING SEMICONDUCTOR L...

EVALUATION APPARATUS, EVALUATION METHOD, AND STORAGE MEDIUM

DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...

CHAMBER ARRANGEMENTS WITH UPPER AND LOWER PYROMETERS, SEMICONDUCTOR...

MANUFACTURING METHOD OF MULTIPLE-LEVEL INTERCONNECT STRUCTURE