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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Automatic optical inspection system and method
- Patent number 12,367,569
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Hsuan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,365,987
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for diagnosing semiconductor equipment
- Patent number 12,367,379
- Issue date Jul 22, 2025
- Semes Co., Ltd.
- Dong Hyun Jun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid metrology method and system
- Patent number 12,366,533
- Issue date Jul 22, 2025
- Gilad Barak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controllable bonder equipment for substrate bonding
- Patent number 12,368,129
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-side power rail design and method of making same
- Patent number 12,368,078
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming method and semiconductor production apparatus
- Patent number 12,359,308
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yusuke Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for measuring a sample by x-ray reflectance scatt...
- Patent number 12,360,063
- Issue date Jul 15, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Heath Pois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit chip including a back-sid...
- Patent number 12,362,236
- Issue date Jul 15, 2025
- Imec VZW
- Anabela Veloso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for detecting semiconductor device
- Patent number 12,362,240
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of calculating thickness of graphene layer and method of mea...
- Patent number 12,359,911
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Eunkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer thermal removal control
- Patent number 12,350,784
- Issue date Jul 8, 2025
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of package circuit
- Patent number 12,354,919
- Issue date Jul 8, 2025
- INNOLUX CORPORATION
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming optical proximity correction model and method of...
- Patent number 12,354,920
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Sang Chul Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress and overlay management for semiconductor processing
- Patent number 12,354,973
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Pradeep K. Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Large-particle monitoring with laser power control for defect inspe...
- Patent number 12,345,658
- Issue date Jul 1, 2025
- KLA Corporation
- Anatoly Romanovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating crystal defects in silicon carbide single cry...
- Patent number 12,345,660
- Issue date Jul 1, 2025
- Shin-Etsu Handotai Co., Ltd.
- Yutaka Shiga
- C30 - CRYSTAL GROWTH
Information Patent Grant
Examination of a hole formed in a semiconductor specimen
- Patent number 12,347,734
- Issue date Jul 1, 2025
- Applied Materials Israel Ltd.
- Rafael Bistritzer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transfer apparatus and transfer method
- Patent number 12,341,046
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- G01 - MEASURING TESTING
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus match detection method, detection system, prewarning meth...
- Patent number 12,341,070
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Weigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Training method for semiconductor process prediction model, semicon...
- Patent number 12,339,632
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing target material in deposition chamber with ti...
- Patent number 12,341,042
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsuan-Chih Chu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,334,401
- Issue date Jun 17, 2025
- Kokusai Electric Corporation
- Hideto Tateno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 12,334,402
- Issue date Jun 17, 2025
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method and system for inspecting semiconductor wafer and method of...
- Patent number 12,332,186
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Q-Han Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for automatic diagnostics and monitoring of semiconductor de...
- Patent number 12,332,182
- Issue date Jun 17, 2025
- KLA Corporation
- David W. Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling etching tool
- Patent number 12,326,714
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER FOCUS RING FOR PLASMA SEMICONDUCTOR PROCESSING
- Publication number 20250239438
- Publication date Jul 24, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yulin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING SYSTEM
- Publication number 20250239454
- Publication date Jul 24, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEFORMATION CONTROL FOR DIE-TO-WAFER AND DIE-TO-DIE BONDING IN DEVI...
- Publication number 20250239492
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- San-Kuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO OBTAIN INFORMATION TO CONTROL A MANUFACTURING PROCESS FOR...
- Publication number 20250239494
- Publication date Jul 24, 2025
- Carl Zeiss SMT GMBH
- Christian Lutzweiler
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE
- Publication number 20250241090
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dae Hong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND ELE...
- Publication number 20250233025
- Publication date Jul 17, 2025
- SAMSUNG DISPLAY CO., LTD.
- YONG-WOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250233024
- Publication date Jul 17, 2025
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING OVERLAY MEASUREMENT SYSTEM
- Publication number 20250233022
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Ilseok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND WAFER PR...
- Publication number 20250233023
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jewon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME
- Publication number 20250232998
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250223703
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Toshiyuki KIKUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREDICTING AND PRESENTING HAZARDOUS CONDITIONS OF MANUFACTURING EQU...
- Publication number 20250224707
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Rony David MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU, PRE-IMPLANT WAFER CHARACTERIZATION SYSTEM AND METHOD
- Publication number 20250226266
- Publication date Jul 10, 2025
- Axcelis Technologies, Inc.
- Scott Edwin Galica
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONLINEAR OPTICAL STOKES ELLIPSOMETERS
- Publication number 20250224327
- Publication date Jul 10, 2025
- FemtoMetrix, Inc.
- Ken James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTING OF DESIGN AND MASK SHAPE POSITION DUE TO DIE AND WAFER D...
- Publication number 20250226265
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Dave POWER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inspection Layer to Improve The Detection of Defects Through Optica...
- Publication number 20250216342
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250218776
- Publication date Jul 3, 2025
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCURRENT SEMICONDUCTOR PROCESSING AND INSPECTION
- Publication number 20250218828
- Publication date Jul 3, 2025
- DR Laser Singapore Pte Ltd.
- Chi Hang KWOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT DETECTION AND CLASSIFICATION (FDC) FOR ENDPOINT DETECTION (EP...
- Publication number 20250216336
- Publication date Jul 3, 2025
- TOKYO ELECTRON LIMITED
- Colin PILCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO DETECT DEFECTS IN GATE-ALL-AROUND TRANSIST...
- Publication number 20250217962
- Publication date Jul 3, 2025
- Intel Corporation
- Manish Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL SENSOR WAFER TEMPERATURE MEASUREMENT SYSTEM
- Publication number 20250216268
- Publication date Jul 3, 2025
- LAM RESEARCH CORPORATION
- Ilia Kalinovski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING AND DETECTING APPARATUS
- Publication number 20250218873
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250205846
- Publication date Jun 26, 2025
- EBARA CORPORATION
- Kohei OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT ISOLATION FOR SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20250208061
- Publication date Jun 26, 2025
- Intel Corporation
- Megan KNAPP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SENSOR FUSION
- Publication number 20250210417
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250212444
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR CONDUCTIVE FILM, MANUFACTURING METHOD FOR...
- Publication number 20250208500
- Publication date Jun 26, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Shunsuke KANAME
- H01 - BASIC ELECTRIC ELEMENTS

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Automatic optical inspection system and method

Method of processing substrate, method of manufacturing semiconduct...

Apparatus and method for diagnosing semiconductor equipment

Hybrid metrology method and system

Temperature controllable bonder equipment for substrate bonding

Dual-side power rail design and method of making same

Film forming method and semiconductor production apparatus

System and method for measuring a sample by x-ray reflectance scatt...

Stack type semiconductor device and method of testing the stack typ...

Method of producing an integrated circuit chip including a back-sid...

Method and system for detecting semiconductor device

Method of calculating thickness of graphene layer and method of mea...

Semiconductor wafer thermal removal control

Manufacturing method of package circuit

Method of forming optical proximity correction model and method of...

Stress and overlay management for semiconductor processing

Signal routing between memory die and logic die for performing oper...

Large-particle monitoring with laser power control for defect inspe...

Method for evaluating crystal defects in silicon carbide single cry...

Examination of a hole formed in a semiconductor specimen

Transfer apparatus and transfer method

Resin shaping device

Apparatus match detection method, detection system, prewarning meth...

Training method for semiconductor process prediction model, semicon...

Method for depositing target material in deposition chamber with ti...

Substrate processing apparatus, method of manufacturing semiconduct...

Fabrication of thin-film encapsulation layer for light-emitting device

Method and system for inspecting semiconductor wafer and method of...

System for automatic diagnostics and monitoring of semiconductor de...

Method for controlling etching tool

Patents Applicationslast 30 patents

MULTI-LAYER FOCUS RING FOR PLASMA SEMICONDUCTOR PROCESSING

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING SYSTEM

DEFORMATION CONTROL FOR DIE-TO-WAFER AND DIE-TO-DIE BONDING IN DEVI...

METHOD TO OBTAIN INFORMATION TO CONTROL A MANUFACTURING PROCESS FOR...

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND ELE...

METHOD OF MANUFACTURING ELECTRONIC DEVICE

WAFER BONDING OVERLAY MEASUREMENT SYSTEM

PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND WAFER PR...

WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

PREDICTING AND PRESENTING HAZARDOUS CONDITIONS OF MANUFACTURING EQU...

IN-SITU, PRE-IMPLANT WAFER CHARACTERIZATION SYSTEM AND METHOD

NONLINEAR OPTICAL STOKES ELLIPSOMETERS

CORRECTING OF DESIGN AND MASK SHAPE POSITION DUE TO DIE AND WAFER D...

Inspection Layer to Improve The Detection of Defects Through Optica...

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

CONCURRENT SEMICONDUCTOR PROCESSING AND INSPECTION

FAULT DETECTION AND CLASSIFICATION (FDC) FOR ENDPOINT DETECTION (EP...

METHODS AND APPARATUS TO DETECT DEFECTS IN GATE-ALL-AROUND TRANSIST...

DUAL SENSOR WAFER TEMPERATURE MEASUREMENT SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

PROCESSING AND DETECTING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

FAULT ISOLATION FOR SEMICONDUCTOR DEVICE MANUFACTURING

THERMAL SENSOR FUSION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD FOR CONDUCTIVE FILM, MANUFACTURING METHOD FOR...