for structural parameters

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H01L22/12

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,294
- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source apparatus and inspection apparatus
- Patent number 12,308,600
- Issue date May 20, 2025
- Lasertec Corporation
- Jun Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,300,556
- Issue date May 13, 2025
- Innolux Corporation
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide film and method for forming metal oxide film
- Patent number 12,302,639
- Issue date May 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Masahiro Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Autonomous operation of plasma processing tool
- Patent number 12,300,477
- Issue date May 13, 2025
- Tokyo Electron Limited
- Jun Shinagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor wafer, method for selecting sem...
- Patent number 12,300,553
- Issue date May 13, 2025
- Shin-Etsu Handotai Co., Ltd.
- Junya Suzuki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,300,506
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for additive manufacturing operations
- Patent number 12,292,384
- Issue date May 6, 2025
- Divergent Technologies, Inc.
- Vivek R. Dave
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package inspection with predictive model for wirebond...
- Patent number 12,293,504
- Issue date May 6, 2025
- Viasat, Inc.
- Ian A. Cleary
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 12,288,689
- Issue date Apr 29, 2025
- Winbond Electronics Corp.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region classification of film non-uniformity based on processing of...
- Patent number 12,288,724
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Critical dimension error analysis method
- Patent number 12,288,725
- Issue date Apr 29, 2025
- Shanghai IC R&D Center Co., Ltd.
- Xueru Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection layer to improve the detection of defects through optica...
- Patent number 12,281,991
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Characterizing and measuring in small boxes using XPS with multiple...
- Patent number 12,281,893
- Issue date Apr 22, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Heath Pois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of enhancing contrast while imaging high aspect ratio struct...
- Patent number 12,272,607
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Geetika Bajaj
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of measuring mask overlay using test patterns
- Patent number 12,271,116
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring apparatus
- Patent number 12,264,908
- Issue date Apr 1, 2025
- Disco Corporation
- Keiji Nomaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips bonding auxiliary structure
- Patent number 12,266,578
- Issue date Apr 1, 2025
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for non-contact temperature monitorin...
- Patent number 12,266,551
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- Bhaskar Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical heating apparatus with angled light holding substrate and h...
- Patent number 12,261,061
- Issue date Mar 25, 2025
- Ushio Denki Kabushiki Kaisha
- Tomonori Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and a method of use thereof
- Patent number 12,258,665
- Issue date Mar 25, 2025
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlay mark, overlay marking method and overlay measuring method
- Patent number 12,259,661
- Issue date Mar 25, 2025
- NEXCHIP SEMICONDUCTOR CORPORATION
- Kuotung Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Splash resistant laser wafer singulation by crack length control
- Patent number 12,255,097
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL
- Publication number 20250167050
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Srividhya Venkataraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FOR PREDICTING CHARACTERISTIC OF SEMICONDUCTOR DE...
- Publication number 20250167051
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Seonghyeon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION RECONSTRUCTION OF SEMICONDUCTOR COMPONENTS ON A WAFER
- Publication number 20250167052
- Publication date May 22, 2025
- ROBERT BOSCH GmbH
- Eric Sebastian Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
- Publication number 20250167031
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hosin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT FOR MEASURING WAFER GEOMETRY
- Publication number 20250167024
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM WITH TRENCH FOR OPTICAL FIBER WITH SENSORS
- Publication number 20250164330
- Publication date May 22, 2025
- iSenseCloud, Inc.
- Huy D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Method of Forming and Monitoring Quality of the Same
- Publication number 20250169101
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...
- Publication number 20250167022
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Keita Hirase
- B08 - CLEANING
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...
- Publication number 20250157826
- Publication date May 15, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WAFER BONDING
- Publication number 20250154000
- Publication date May 15, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Wei CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20250157836
- Publication date May 15, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...
- Publication number 20250155234
- Publication date May 15, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR EMISSIVITY-CORRECTED PYROMETRY
- Publication number 20250154655
- Publication date May 15, 2025
- AIXTRON SE
- Karsten ROJEK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TRENCH STRUCTURE, MANUFACTURING MET...
- Publication number 20250157907
- Publication date May 15, 2025
- SK HYNIX INC.
- In Young JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER METROLOGY TECHNOLOGIES
- Publication number 20250155486
- Publication date May 15, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- G01 - MEASURING TESTING
Information Patent Application
COMPUTER IMPLEMENTED METHOD FOR DEFECT DETECTION IN AN IMAGING DATA...
- Publication number 20250155378
- Publication date May 15, 2025
- Carl Zeiss SMT GMBH
- Alexander Freytag
- G01 - MEASURING TESTING
Information Patent Application
WAFER WOBBLING DETECTION METHOD AND WAFER WOBBLING DETECTION SYSTEM
- Publication number 20250157021
- Publication date May 15, 2025
- GSF Solution Co., Ltd.
- Seungwon SEO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...
- Publication number 20250149343
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
- Publication number 20250149362
- Publication date May 8, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION
- Publication number 20250149387
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
- Publication number 20250149390
- Publication date May 8, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149464
- Publication date May 8, 2025
- KIOXIA Corporation
- Yoichi MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT
- Publication number 20250147430
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METH...
- Publication number 20250147432
- Publication date May 8, 2025
- Resonac Corporation
- Tetsuya KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS
- Publication number 20250140614
- Publication date May 1, 2025
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METH...
- Publication number 20250139762
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
- Publication number 20250140569
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Light source apparatus and inspection apparatus

Method for manufacturing an electronic device

Electronic device and method for manufacturing the same

Substrate processing system

Method for forming semiconductor structure

Metal oxide film and method for forming metal oxide film

Autonomous operation of plasma processing tool

Method for evaluating semiconductor wafer, method for selecting sem...

Method of manufacturing semiconductor devices

Systems and methods for additive manufacturing operations

Semiconductor package inspection with predictive model for wirebond...

Semiconductor structure

Region classification of film non-uniformity based on processing of...

Critical dimension error analysis method

Inspection layer to improve the detection of defects through optica...

Characterizing and measuring in small boxes using XPS with multiple...

Method of processing a cleaved semiconductor wafer

Method of enhancing contrast while imaging high aspect ratio struct...

Method of measuring mask overlay using test patterns

Measuring apparatus

Chips bonding auxiliary structure

Apparatus, system, and method for non-contact temperature monitorin...

Optical heating apparatus with angled light holding substrate and h...

Substrate inspection system and a method of use thereof

Overlay mark, overlay marking method and overlay measuring method

Splash resistant laser wafer singulation by crack length control

Methods of detecting bonding between a bonding wire and a bonding l...

Alignment method and alignment device

Methods of detecting bonding between a bonding wire and a bonding l...

Patents Applicationslast 30 patents

LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL

ELECTRONIC DEVICE FOR PREDICTING CHARACTERISTIC OF SEMICONDUCTOR DE...

POSITION RECONSTRUCTION OF SEMICONDUCTOR COMPONENTS ON A WAFER

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...

WAFER SUPPORT FOR MEASURING WAFER GEOMETRY

PLATFORM WITH TRENCH FOR OPTICAL FIBER WITH SENSORS

FinFET Device and Method of Forming and Monitoring Quality of the Same

SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...

ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...

METHODS FOR WAFER BONDING

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...

METHOD FOR EMISSIVITY-CORRECTED PYROMETRY

SEMICONDUCTOR PACKAGE INCLUDING TRENCH STRUCTURE, MANUFACTURING MET...

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

WAFER METROLOGY TECHNOLOGIES

COMPUTER IMPLEMENTED METHOD FOR DEFECT DETECTION IN AN IMAGING DATA...

WAFER WOBBLING DETECTION METHOD AND WAFER WOBBLING DETECTION SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS

METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION

WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT

RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METH...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS

WAFER INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METH...

LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER