for structural parameters

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H01L22/12

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/12for structural parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for additive manufacturing operations
- Patent number 12,292,384
- Issue date May 6, 2025
- Divergent Technologies, Inc.
- Vivek R. Dave
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package inspection with predictive model for wirebond...
- Patent number 12,293,504
- Issue date May 6, 2025
- Viasat, Inc.
- Ian A. Cleary
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 12,288,689
- Issue date Apr 29, 2025
- Winbond Electronics Corp.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region classification of film non-uniformity based on processing of...
- Patent number 12,288,724
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Critical dimension error analysis method
- Patent number 12,288,725
- Issue date Apr 29, 2025
- Shanghai IC R&D Center Co., Ltd.
- Xueru Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection layer to improve the detection of defects through optica...
- Patent number 12,281,991
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Characterizing and measuring in small boxes using XPS with multiple...
- Patent number 12,281,893
- Issue date Apr 22, 2025
- NOVA MEASURING INSTRUMENTS INC.
- Heath Pois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of enhancing contrast while imaging high aspect ratio struct...
- Patent number 12,272,607
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Geetika Bajaj
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of measuring mask overlay using test patterns
- Patent number 12,271,116
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring apparatus
- Patent number 12,264,908
- Issue date Apr 1, 2025
- Disco Corporation
- Keiji Nomaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips bonding auxiliary structure
- Patent number 12,266,578
- Issue date Apr 1, 2025
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for non-contact temperature monitorin...
- Patent number 12,266,551
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- Bhaskar Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical heating apparatus with angled light holding substrate and h...
- Patent number 12,261,061
- Issue date Mar 25, 2025
- Ushio Denki Kabushiki Kaisha
- Tomonori Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and a method of use thereof
- Patent number 12,258,665
- Issue date Mar 25, 2025
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlay mark, overlay marking method and overlay measuring method
- Patent number 12,259,661
- Issue date Mar 25, 2025
- NEXCHIP SEMICONDUCTOR CORPORATION
- Kuotung Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Splash resistant laser wafer singulation by crack length control
- Patent number 12,255,097
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, electronic device and operating method of electronic device...
- Patent number 12,254,621
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Do-Nyun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Grinding apparatus
- Patent number 12,255,071
- Issue date Mar 18, 2025
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Multiple-level interconnect structure and manufacturing method thereof
- Patent number 12,255,111
- Issue date Mar 18, 2025
- United Microelectronics Corp.
- Jia Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prediction of electrical properties of a semiconductor specimen
- Patent number 12,250,503
- Issue date Mar 11, 2025
- Applied Materials Israel Ltd.
- Ofer Adan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using spectroscopic measurements for substrate temperature monitoring
- Patent number 12,249,525
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Ian McDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting damaged semiconductor wafers utilizing a semiconductor wa...
- Patent number 12,249,526
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and material deposition systems for forming semiconductor l...
- Patent number 12,249,506
- Issue date Mar 11, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer metrology technologies
- Patent number 12,241,924
- Issue date Mar 4, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...
- Publication number 20250149343
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT
- Publication number 20250147430
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METH...
- Publication number 20250147432
- Publication date May 8, 2025
- Resonac Corporation
- Tetsuya KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
- Publication number 20250149362
- Publication date May 8, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION
- Publication number 20250149387
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
- Publication number 20250149390
- Publication date May 8, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149464
- Publication date May 8, 2025
- KIOXIA Corporation
- Yoichi MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS
- Publication number 20250140614
- Publication date May 1, 2025
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METH...
- Publication number 20250139762
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
- Publication number 20250140569
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORM...
- Publication number 20250138427
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- JUNYA TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING EMBRITTLEMENT OF AN INTERFACE BETWEEN A SUBST...
- Publication number 20250137928
- Publication date May 1, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric MAZEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YIELD IMPROVEMENTS IN STACKED PACKAGING
- Publication number 20250140615
- Publication date May 1, 2025
- KLA Corporation
- Xuewen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO...
- Publication number 20250132285
- Publication date Apr 24, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20250132148
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250133868
- Publication date Apr 24, 2025
- Innolux Corporation
- Yu-Jhou Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL METROLOGY FOR ENHANCED WINDOW TEMPERATURE CONTROL
- Publication number 20250132179
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMAN SPECTROSCOPY BASED MEASUREMENTS IN PATTERNED STRUCTURES
- Publication number 20250123210
- Publication date Apr 17, 2025
- NOVA LTD
- Gilad Barak
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SEMICONDUCTOR S...
- Publication number 20250118554
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Yuta AOKI
- C30 - CRYSTAL GROWTH
Information Patent Application
ULTRASONIC DETECTION OF VOIDS AND CRACKS IN SUBSTRATES
- Publication number 20250116632
- Publication date Apr 10, 2025
- ORBOTECH LTD.
- Yuri Paskover
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY SYSTEM WITH TWIN PLANAR MOTOR STAGE
- Publication number 20250118602
- Publication date Apr 10, 2025
- KLA Corporation
- Michel Pharand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED OPTICAL ACCESS FOR SPECTROSCOPIC MONITORING OF SEMICONDUCT...
- Publication number 20250118603
- Publication date Apr 10, 2025
- Verity Instruments, Inc.
- Mark Meloni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20250118604
- Publication date Apr 10, 2025
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM
- Publication number 20250118578
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Ajith Karonnan Ramapurath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER METHOD FOR MICRO FLIP CHIPS
- Publication number 20250120233
- Publication date Apr 10, 2025
- XIAMEN UNIVERSITY
- Xu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inspection Method
- Publication number 20250112096
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Hiroyuki NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PROCESSING APPARATUS, AND MONITORING METHOD
- Publication number 20250112066
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Shinichi MIZUSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...
- Publication number 20250113682
- Publication date Apr 3, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengfei WANG
- H01 - BASIC ELECTRIC ELEMENTS

for structural parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for additive manufacturing operations

Semiconductor package inspection with predictive model for wirebond...

Semiconductor structure

Region classification of film non-uniformity based on processing of...

Critical dimension error analysis method

Inspection layer to improve the detection of defects through optica...

Characterizing and measuring in small boxes using XPS with multiple...

Method of processing a cleaved semiconductor wafer

Method of enhancing contrast while imaging high aspect ratio struct...

Method of measuring mask overlay using test patterns

Measuring apparatus

Chips bonding auxiliary structure

Apparatus, system, and method for non-contact temperature monitorin...

Optical heating apparatus with angled light holding substrate and h...

Substrate inspection system and a method of use thereof

Overlay mark, overlay marking method and overlay measuring method

Splash resistant laser wafer singulation by crack length control

Methods of detecting bonding between a bonding wire and a bonding l...

Alignment method and alignment device

Methods of detecting bonding between a bonding wire and a bonding l...

Method, electronic device and operating method of electronic device...

Grinding apparatus

Multiple-level interconnect structure and manufacturing method thereof

Prediction of electrical properties of a semiconductor specimen

Using spectroscopic measurements for substrate temperature monitoring

Detecting damaged semiconductor wafers utilizing a semiconductor wa...

Methods and material deposition systems for forming semiconductor l...

Dynamic bonding gap control and tool for wafer bonding

Wafer metrology technologies

Methods for wafer bonding

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT

RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METH...

WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS

METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION

WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS

WAFER INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METH...

LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER

INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORM...

METHOD FOR MONITORING EMBRITTLEMENT OF AN INTERFACE BETWEEN A SUBST...

YIELD IMPROVEMENTS IN STACKED PACKAGING

METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO...

DEPOSITION SYSTEM AND METHOD

MANUFACTURING METHOD OF ELECTRONIC DEVICE

VIRTUAL METROLOGY FOR ENHANCED WINDOW TEMPERATURE CONTROL

RAMAN SPECTROSCOPY BASED MEASUREMENTS IN PATTERNED STRUCTURES

MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SEMICONDUCTOR S...

ULTRASONIC DETECTION OF VOIDS AND CRACKS IN SUBSTRATES

METROLOGY SYSTEM WITH TWIN PLANAR MOTOR STAGE

IMPROVED OPTICAL ACCESS FOR SPECTROSCOPIC MONITORING OF SEMICONDUCT...

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM

TRANSFER METHOD FOR MICRO FLIP CHIPS

Inspection Method

LIQUID PROCESSING APPARATUS, AND MONITORING METHOD

MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...