BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will be understood and appreciated more fully from the following detailed description taken in conjunction with the drawings in which:
FIGS. 1A and 1B illustrates two cross sectional views of a portion of a device according to an embodiment of the invention;
FIG. 2 illustrates a cross section of a portion of a non-volatile memory cell according to an embodiment of the invention;
FIG. 3 illustrates a cross section of a portion of a non-volatile memory cell according to an embodiment of the invention;
FIGS. 4 and 5 are energy band diagrams that illustrates programming of a floating gate memory cell by hot electron injection and by tunneling of photo-generated electrons according to various embodiments of the invention;
FIG. 6 is a cross sectional view of a device according to an embodiment of the invention;
FIG. 7 illustrates a relationship between the gate current and between the gate voltage of an n-channel MOS transistor, according to an embodiment of the invention; and
FIGS. 8-9 illustrate methods for affecting a state of a non-volatile memory cell, according to an embodiment of the invention.