connecting the wire to a bond pad of the item

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H01L2224/48247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48247connecting the wire to a bond pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die with solder restraining wall
- Patent number 12,266,624
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 12,211,959
- Issue date Jan 28, 2025
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated shielding in a current sensor
- Patent number 12,210,040
- Issue date Jan 28, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component package
- Patent number 12,205,873
- Issue date Jan 21, 2025
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,191,435
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 12,187,601
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,819
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 12,142,892
- Issue date Nov 12, 2024
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Tablet ultrasound system
- Patent number 12,115,023
- Issue date Oct 15, 2024
- Teratech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,808
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS
- Publication number 20250112130
- Publication date Apr 3, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
- Publication number 20250107305
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20250096081
- Publication date Mar 20, 2025
- Alpha and Omega Semiconductor International LP
- Madhur Bobde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20250098551
- Publication date Mar 20, 2025
- Ambature Inc.
- Douglas J. GILBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Integrated Shielding in a Current Sensor
- Publication number 20250067778
- Publication date Feb 27, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20250062198
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Matthew Hein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20250054845
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...
- Publication number 20250046683
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046687
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...
- Publication number 20250006601
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alternating Lead Configuration for Semiconductor Package
- Publication number 20250006599
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dolores P. Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIGHTING DEVICE
- Publication number 20240401761
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Kwang Ho PARK
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
- Publication number 20240387443
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die with solder restraining wall

Semiconductor device and method for manufacturing the same

Semiconductor package having side wall plating

DC and AC magnetic field protection for MRAM device using magnetic-...

Light emitting device, resin package, resin-molded body, and method...

Package-on-package assembly with wire bond vias

Power module and related methods

Systems and methods for integrated shielding in a current sensor

Transient liquid phase bonding compositions and power electronics a...

Electronic component package

Semiconductor light-emitting device

Electronic sensors with sensor die in package structure cavity

Multi-channel gate driver package with grounded shield metal

Semiconductor device

Semiconductor device

Floating die package

Semiconductor device

Semiconductor light emitting device and method for manufacturing th...

Flat no-lead package with surface mounted structure

Semiconductor device

Semiconductor laser device

Heat sink, semiconductor package and semiconductor module

Tablet ultrasound system

Methods and apparatus for an improved integrated circuit package

Low pressure sintering powder

Semiconductor device

Leadframe package with pre-applied filler material

Semiconductor device

QFN device having a mechanism that enables an inspectable solder jo...

Spring bar leadframe, method and packaged electronic device with ze...

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

DAM LAMINATE ISOLATION SUBSTRATE

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

SEMICONDUCTOR DEVICE

Systems and Methods for Integrated Shielding in a Current Sensor

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

SEMICONDUCTOR DEVICE

STACKED-DIE MEMS RESONATOR

Power Package With Galvanic Isolation

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...

Alternating Lead Configuration for Semiconductor Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

LOW PRESSURE SINTERING POWDER

LIGHTING DEVICE

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME