The invention generally relates to diamond growth and, more particularly, to diamond growth using diamondoids.
Aside from its exceptional beauty, diamond possesses other desirable characteristics, including its mechanical hardness, thermal conductivity, high refractive index, and wide band gap. These characteristics can be leveraged for a number of practical applications. For example, mechanical hardness of diamond can be exploited as coatings for electronic devices, glasses, high end watches and jewelries, chemical-mechanical polishing tools, drills, and cutting tools. Thermal conductivity with little or no electrical conductivity is a useful characteristic for addressing heat dissipation bottleneck in electronic devices from laptops to light emitting diodes (“LEDs”). The high refractive index of diamond can be exploited in fiber optics for information processing and anti-reflection coatings of optical devices such as solar cells. Wide band gap, unusual surface characteristics, and high endurance of diamond can be exploited in power electronic devices and photocathodes operating under harsh environments. The wide band gap of diamond allows stable quantum states to be produced by a doping and annealing process, leading to doped nanostructures useful for quantum information processing, high resolution magnetic field measurements for next generation memory devices metrology, and life science and drug delivery applications.
Despite its tremendous potential, the introduction of diamond into practical applications has been hampered by difficulties in material synthesis. Attempts to achieve diamond growth include a seeding technique using ultra-dispersed diamonds (“UDDs”), which are particles of diamond with sizes on the order of about 10 nm formed by detonation of an oxygen-deficient mixture in a closed chamber. Unfortunately, diamond particles formed by detonation can have non-uniform sizes and significant surface defects, and a concentration of nitrogen and other impurities in the particles is often not well controlled. Also, UDD seeding typically involves abrasion against a substrate by ultra-sonication or mechanical scratching. Such an invasive process is unsuitable for electronic devices, and can produce defective grain boundaries for phonon transport and can adversely impact thermal transport characteristics. Moreover, UDD seeding has failed to achieve a sufficiently high seeding density, and uniformity of diamond growth can be lacking as a result of the use of intrinsically defective seeding particles.
It is against this background that a need arose to develop the fabrication methods and related devices described herein.
Embodiments of this disclosure relate to the use of diamondoids as seeding agents or molecules for growth of diamond nanoparticles and diamond films. In some embodiments, diamondoids are chemically functionalized to allow covalent bonding to silicon, metal, oxide, and other types of surfaces, allowing the diamondoids to remain intact at diamond growth temperatures and act as nucleation sites. Since diamondoids are not produced from detonation, these seeding agents can be substantially nitrogen-free, substantially graphite-free, and substantially free of surface defects.
In some embodiments, chemically functionalized diamondoids are used as seeding agents to initiate growth of ultra-small diamond nanoparticles. Seeded substrates are subjected to Plasma Enhanced Chemical Vapor Deposition (“PECVD”) for nucleation and growth of diamond nanoparticles. Different structures and sizes of diamondoids can be used to achieve a seeding effect. The resulting diamond nanoparticles can have sizes below about 5 nm, with a high degree of uniformity in sizes, and a high seeding density exceeding about 5×1012 cm−2 in some embodiments. In addition, diamond nanoparticles with Nitrogen-Vacancy (“NV”) centers can be formed using diamondoid seeding, followed by nitrogen implantation and annealing. Ultra-small diamond nanoparticles formed using diamondoid seeding can have a wide range of practical applications, such as in fine particle polishing for semiconductors, fine cutting tools, tribology, drug delivery, bio-imaging, tissue engineering, quantum information processing, and metrology. For example, optical properties of diamond nanoparticles with NV centers, with their bio-compatibility, can be used for bio-sensing, bio-imaging, diagnostics, and drug delivery.
In other embodiments, monolayers of chemically functionalized diamondoids are covalently bonded onto substrates as seed layers to grow ultra-thin diamond films. This seeding technique can avoid the use of abrasion against a substrate. Moreover, chemical functionalization can reduce scattering at grain boundaries, yielding a high thermal conductivity interface and attaining greater benefit of diamond's superior thermal conductivity for heat dissipation applications. Using diamondoid seeding, diamond films can be formed on substrates by PECVD at moderate temperatures, such as at or below about 360° C. or at or below about 300° C., rendering this seeding technique compatible with electronic devices. Both Raman spectroscopy and Transmission Electron Microscopy (“TEM”) analysis demonstrate the formation of high-quality crystalline diamond that is substantially defect-free, continuous, and conformal. Scanning Tunneling Microscopy (“STM”) analysis reveals that a seeding density attained in some embodiments can exceed about 1012 cm−2, which allows uniform growth of diamond films with a reduced thickness, such as in the range of about 10 nm to about 20 nm. The ultra-high seeding density and the resulting uniformity and continuity of the diamond films allow a desired thermal, mechanical, or other effect to be attained with a reduced thickness of the films, thus reducing a growth time by an order of magnitude or more in some embodiments. Furthermore, a size and a shape of diamondoid molecules can be selected to control a crystalline orientation of a diamond film. Resulting diamond films can be used to address the heat dissipation problem that is encountered in a number of microelectronic devices, by using diamond as a heat sink and using a growth technique that is compatible with complementary metal-oxide-semiconductor (“CMOS”) technology and other semiconductor processing technologies. The growth technique also can allow the incorporation of diamond into microelectromechanical system (“MEMS”) devices, bio-sensors, and photonic crystal structures.
One aspect of this disclosure relates to a method of growing diamond. In one embodiment, the method includes: (1) anchoring diamondoids to a substrate via chemical bonding between the diamondoids and the substrate; (2) forming a protective layer over the diamondoids; and (3) performing chemical vapor deposition using a carbon source to induce diamond growth over the protective layer and the diamondoids.
Another aspect of this disclosure relates to a diamond nanoparticle or a population of diamond nanoparticles. In one embodiment, the population of diamond nanoparticles is formed by: (1) anchoring diamondoids to a substrate via chemical bonding between the diamondoids and the substrate; (2) forming a protective layer over the diamondoids; and (3) performing chemical vapor deposition using a carbon source to induce diamond growth over the protective layer and the diamondoids.
A further aspect of this disclosure relates to a diamond film. In one embodiment, the diamond film is formed by: (1) anchoring diamondoids to a substrate via chemical bonding between the diamondoids and the substrate; (2) forming a protective layer over the diamondoids; and (3) performing chemical vapor deposition using a carbon source to induce diamond growth over the protective layer and the diamondoids.
Other aspects and embodiments of the invention are also contemplated. The foregoing summary and the following detailed description are not meant to restrict the invention to any particular embodiment but are merely meant to describe some embodiments of the invention.
For a better understanding of the nature and objects of some embodiments of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.
The following definitions apply to some of the aspects described with respect to some embodiments of this disclosure. These definitions may likewise be expanded upon herein.
As used herein, the singular terms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to an object can include multiple objects unless the context clearly dictates otherwise.
As used herein, the term “set” refers to a collection of one or more objects. Thus, for example, a set of objects can include a single object or multiple objects. Objects of a set can also be referred to as members of the set. Objects of a set can be the same or different. In some instances, objects of a set can share one or more common characteristics.
As used herein, the term “aspect ratio” refers to a ratio of a largest dimension or extent of an object and an average of remaining dimensions or extents of the object, where the remaining dimensions are orthogonal with respect to one another and with respect to the largest dimension. In some instances, remaining dimensions of an object can be substantially the same, and an average of the remaining dimensions can substantially correspond to either of the remaining dimensions. For example, an aspect ratio of a cylinder refers to a ratio of a length of the cylinder and a cross-sectional diameter of the cylinder. As another example, an aspect ratio of a spheroid refers to a ratio of a major axis of the spheroid and a minor axis of the spheroid.
As used herein, the term “size” refers to a characteristic dimension of an object. Thus, for example, a size of an object that is spherical can refer to a diameter of the object. In the case of an object that is non-spherical, a size of the non-spherical object can refer to a diameter of a corresponding spherical object, where the corresponding spherical object exhibits or has a particular set of derivable or measurable characteristics that are substantially the same as those of the non-spherical object. Thus, for example, a size of a non-spherical object can refer to a diameter of a corresponding spherical object that exhibits optical characteristics that are substantially the same as those of the non-spherical object. Alternatively, or in conjunction, a size of a non-spherical object can refer to an average of various orthogonal dimensions of the object. Thus, for example, a size of an object that is a spheroidal can refer to an average of a major axis and a minor axis of the object. When referring to a set of objects as having a particular size, it is contemplated that the objects can have a distribution of sizes around the particular size. Thus, as used herein, a size of a set of objects can refer to a typical size of a distribution of sizes, such as an average size, a median size, or a peak size.
As used herein, the term “nanostructure” refers to an object that has at least one dimension in the range of about 0.5 nm to about 100 nm, such as from about 0.5 nm to about 50 nm, from about 0.5 nm to about 20 nm, from about 0.5 nm to about 10 nm, from about 0.5 nm to about 5 nm, or less than about 5 nm. A nanostructure can have any of a wide variety of shapes, and can be formed of a wide variety of materials.
As used herein, the term “nanoparticle” refers to a spherical or spheroidal nanostructure. Typically, each dimension of a nanoparticle is in the range of about 0.5 nm to about 100 nm, the nanoparticle has a size in the range of about 0.5 nm to about 100 nm, and the nanoparticle also has an aspect ratio that is less than about 5, such as no greater than about 3, no greater than about 2, no greater than about 1.5, or about 1.
Embodiments of this disclosure relate to the use of diamondoids for seeded growth of diamond nanoparticles and diamond films. Diamondoids refer to bridged-ring cycloalkanes, which can include sp3 hybridized carbon atoms, and carbon arrangements that are superimposable on a fragment of a face-centered cubic diamond crystalline lattice. As such, diamondoids can be viewed as molecular-scale fragments of diamond, and can have sizes spanning a range between small molecules and larger diamond particles, such as in the range of about 0.5 nm to about 2 nm. Diamondoids can be extracted and purified from petroleum, and, unlike UDDs, diamondoids can be substantially free of impurities, such as nitrogen and graphite, can be substantially free of surface defects, and can be substantially uniformly sized.
Diamondoids include lower diamondoids, which include adamantane, diamantane, and triamantane, and are composed of 1, 2, and 3 diamond crystal cages respectively as shown in
Diamondoids, whether lower diamondoids or higher diamondoids, can be un-substituted or substituted. Substituted diamondoids can be chemically functionalized by replacing one or more terminal hydrogen atoms with one or more functional groups. In some embodiments, chemical functionalization of diamondoids allows for covalent bonding to a variety of substrates for seeded growth of diamond. A suitable functional group can be selected according to a desired target substrate for diamond growth. Examples of substituted diamondoids include:
(1) Thiol-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —SH (thiol group) and -L-SH, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(2) Carboxy-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —COOH (carboxy group) and -L-COOH, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(3) Halo-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —X (halo group, such as fluoro, chloro, bromo, or iodo) and -L-X, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(4) Hydroxy-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —OH (hydroxy group) and -L-OH, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(5) Cyano-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —CN (cyano group) and -L-CN, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(6) Nitro-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —NO2 (nitro group) and -L-NO2, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(7) Amino-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —NH2 (amino group) and -L-NH2, where L is a linking group such as a C1-C10 alkylene group, a C2-C10 alkenylene group, or a C2-C10 alkynylene group.
(8) Silyl-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —SiR(1)R(2)R(3), where R(1), R(2), and R(3) are independently selected from a hydride group, a halo group, a hydroxy group, an alkyl group, an alkenyl group, and an alkynyl group. An example of a silyl-functionalized diamondoid is a silanol-functionalized diamondoid, in which at least one terminal hydrogen atom is replaced with —Si(OH)3. Another example of a silyl-functionalized diamondoid is one in which R(1), R(2), and R(3) are independently selected from a halo group and a hydroxy group.
(9) Phosphoryl-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —(P═O)R(1)R(2), where R(1) and R(2) are independently selected from a hydride group, a halo group, a hydroxy group, an alkyl group, an alkenyl group, and an alkynyl group. An example of a phosphoryl-functionalized diamondoid is one in which R(1) and R(2) are independently selected from a halo group and a hydroxy group.
(10) Sulfonic acid-functionalized diamondoids, in which one or more terminal hydrogen atoms are replaced with one or more functional groups selected from —SO2R, where R is selected from a hydride group, a halo group, a hydroxy group, an alkyl group, an alkenyl group, and an alkynyl group. An example of a sulfonic acid-functionalized diamondoid is one in which R is selected from a halo group and a hydroxy group.
Chemically functionalization of a diamondoid can be performed at or near a top of the molecule, yielding an apical-functionalized diamondoid, at or near a base of the molecule, yielding a medial-functionalized diamondoid, or at another location or a combination of different locations along the molecule.
Diamondoids, whether lower diamondoids or higher diamondoids, can be un-doped or doped. Doping of diamondoids can be performed by replacing one or more carbon atoms with one or more heteroatoms, such as boron, nitrogen, silicon, sulfur, oxygen, and phosphorus atoms.
The substrate 402 can be formed of a metal, such as gold or another noble metal; a semiconductor, such as silicon or gallium arsenide; an oxide, such as silicon oxide (e.g., SiO2), tungsten oxide (e.g., WO3), or another metal or non-metal oxide; or a combination of such materials. The substrate 402 can be a single-layered substrate, or can be multi-layered, such as including a base and a bonding layer disposed over the base, where the bonding layer forms covalent bonds with the chemically functionalized diamondoids 400. An example of such a multi-layered substrate includes a silicon base, such as a silicon wafer, and an oxide layer disposed over the silicon base, such as a silicon oxide layer.
Chemical bonding of diamondoids to a surface can be attained via a number of mechanisms. One example of attaining such chemical bonding is via silylation reactions, such as involving condensation reactions between silanol groups of diamondoids and hydroxy groups exposed on an oxidized silicon surface, as shown in
Chemical bonding of diamondoids to a surface can be performed so as to control orientations of the diamondoids and control surfaces of the diamondoids that are exposed for subsequent diamond growth. For example, diamondoids can be chemically bonded to a substrate so as to expose the diamond (111) facet, the diamond (110) facet, the diamond (100) facet, or a combination of such facets.
Because the quality of diamond growth is a function of seeding density, diamondoids, with their small and substantially uniform sizes, promote a high seeding density and a greater uniformity in diamond growth. Referring back to
Next, referring to
Next, referring to
Growth conditions, such as growth time, can be adjusted to form the diamond nanoparticles 406 (as shown in
In the case of
The following examples describe specific aspects of some embodiments of the invention to illustrate and provide a description for those of ordinary skill in the art. The examples should not be construed as limiting the invention, as the examples merely provide specific methodology useful in understanding and practicing some embodiments of the invention.
For confirmation of diamond nanoparticle formation, TEM analysis was performed, and results are shown in
For confirmation of diamond nanoparticle formation, EELS analysis was performed, and results are shown in
While the invention has been described with reference to the specific embodiments thereof, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the invention as defined by the appended claims. In addition, many modifications may be made to adapt a particular situation, material, composition of matter, method, operation or operations, to the objective, spirit and scope of the invention. All such modifications are intended to be within the scope of the claims appended hereto. In particular, while certain methods may have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the invention. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the invention.
This application claims the benefit of U.S. Provisional Application Ser. No. 61/660,725 filed on Jun. 16, 2012, the disclosure of which is incorporated herein by reference in its entirety.
This invention was made with Government support under contract DE-AC02-765F00515 awarded by the Department of Energy. The Government has certain rights in this invention.
Number | Date | Country | |
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61660725 | Jun 2012 | US |