Claims
- 1. A composition comprising a mixture of a polyamic acid material of reduced acidity comprising a polyamic acid having the general formula ##STR7## wherein Q is C or C=O, R is a divalent aromatic or aliphatic radical having no active hydrogen, R.sub.1 is a hydrogen or an alkyl group containing 1 to 3 carbon atoms, and R.sub.2 and R.sub.3 are independently selected from H, CH.sub.3, C.sub.n H.sub.2n+1 where n is a positive integer, and CF.sub.3, m is an integer from 0 to 1 and p is a positive integer, which is reacted or blended to form (a) a polyamic acid material having a level of acidity which is reduced by from about 10 to about 40 percent of the original polyamic acid and (b) a diazoquinone photosensitizer, each of (a) and (b) being present in sufficient quantity to form a photoresist composition which after radiation exposure and development in alkaline solution, produces a resist image of fine line resolution.
- 2. The composition of claim 1 wherein, before having its acidity reduced, the polyamic acid has the formula ##STR8##
- 3. The composition of claim 1 wherein the polyamic acid is partially imidized to an imidization level of from about 20 to about 40 percent.
- 4. The composition of claim 1 wherein the polyamic acid of reduced material comprises a carboxylate amine salt formed by the reaction product of a polyamic acid and a basic organic compound.
- 5. The composition of claim 1 wherein the polyamic acid of reduced acidity a polyamic acid wherein a portion of the free carboxylic acid groups of the polyamic acid have been neutralized by reaction with an organic base.
- 6. The composition of claim 5 wherein the organic base is triethylamine.
- 7. The composition of claim 1 wherein the polyamic acid material is selected from the group consisting of a polyamic acid with (a) an ester derivative thereof, (b) a copolymer of the polyamic acid and an ester derivative thereof and (c) mixtures thereof.
- 8. The composition of claim 1 wherein the diazoquinone photosensitizer is 2,3,4-tri[(6-diazo -5,6-dihydro-5-oxo-napthalenyl) sulfonyl-oxy]-benzophenone.
- 9. The composition of claim 1 wherein the diazoquinone photosensitizer is 4,8 bis [(6-diazo -5,6-dihydro-5-oxo-1-naphthalenyl) sulfonyl-oxy methyl]tricyclo [5.2.1.0.sup.2,6 ]decane.
- 10. The composition of claim 1 wherein the diazoquinone sensitizer is incorporated in the photoresist composition at a concentration of about 5 to about 25 percent by weight.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. Ser. No. 804,869 filed Dec. 5, 1985, abandoned.
US Referenced Citations (18)
Non-Patent Literature Citations (1)
Entry |
De Forest, W. S., "Photoresist Materials and Processes", McGraw-Hill Book Co., 1975, pp. 147-149. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
804869 |
Dec 1985 |
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