The present invention relates to a dicing device, and particularly to a dicing device that performs groove processing and cutting processing on a workpiece such as a wafer on which semiconductor devices and electronic components are formed.
In a dicing device that performs groove processing and cutting processing on a workpiece such as a wafer on which semiconductor devices, electronic components and the like are formed, the dicing device processes the workpiece placed on a worktable with a blade rotating at a high speed while applying a grinding fluid or a cleaning solution.
The dicing device includes a worktable on which the workpiece is placed, a blade that cuts the workpiece, a worktable feeding mechanism that moves the worktable relative to the blade, a spindle to which the blade is rotatably attached, a spindle moving mechanism movably supporting the spindle, and imaging means (an alignment camera) for observing an upper surface of the workpiece (see, for example, Patent Literature 1).
The dicing device described in Patent Literature 1 includes a square housing formed in a square shape in plan view. In this dicing device, the worktable feeding mechanism is installed on one diagonal line of the square housing, and the spindle moving mechanism is installed on the other diagonal line of the square housing. That is, the worktable feeding mechanism and the spindle moving mechanism are arranged perpendicularly to each other. Then, a substantially middle part of the square housing, that is, a part of the square housing in which the worktable feeding mechanism crosses the spindle moving mechanism at right angles is a part where the workpiece is processed.
Furthermore, the dicing device described in Patent Literature 1 has an oblique line edge part formed by obliquely cutting out a corner part of the square housing. The oblique line edge part of the square housing is a part corresponding to a stroke end of the worktable feeding mechanism and is configured such that workpiece replacement and maintenance work may be performed from an opening provided in the oblique line edge part. That is, in this dicing device, the cutout part of the square housing is a work area (hereinafter referred to as a “maintenance area”) for performing the workpiece replacement and maintenance work.
When a maintenance area is disposed at a stroke end of a worktable feeding mechanism as in the dicing device described in Patent Literature 1 described above, a blade attached to a spindle is disposed at a position away from the maintenance area in consideration of safety.
In such a dicing device, it is necessary to design a longer stroke of the worktable feeding mechanism (movable range of the worktable) for performing processing while moving a workpiece placed on the worktable relative to the blade and imaging means. In particular, in recent years, with increase in size of the workpiece, the worktable has also increased in size, and the stroke of the worktable feeding mechanism accordingly tends to become longer.
However, when a distance from the maintenance area to the blade increases as the worktable feeding mechanism increases the stroke, there is a problem that accessibility to the blade becomes worse in a maintenance work and that efficiency of a blade replacement work decreases.
In view of such circumstances, the present invention aims to provide a dicing device having improved accessibility to a blade during the maintenance work.
To achieve the object of the present invention, a dicing device according to a first aspect of the present invention includes a housing configured to accommodate inside thereof, a worktable configured to hold and move a workpiece, and a spindle configured to be rotatable while holding a blade, wherein the housing includes: an end face provided in a moving direction of the worktable, the end face being on a side where a maintenance work of the dicing device is performed; and a slider constituting a part of the end face, and the slider is configured to be freely slidable in a direction to shorten a distance from the end face to the spindle.
According to a second aspect of the present invention, in the dicing device of the first aspect of the present invention, the slider is located at a protruding position during dicing processing and is located at a retracted position that is a position closer to the blade than the protruding position during the maintenance work.
According to a third aspect of the present invention, the dicing device according to the second aspect of the present invention includes a fixture configured to removably fix the slider at the protruding position.
According to the present invention, it is possible to improve accessibility to a blade during a maintenance work.
Hereinafter, a preferable embodiment of the present invention will be described with reference to the accompanying drawings. In the following drawings, an X-axis direction, a Y-axis direction, and a Z-axis direction are mutually perpendicular directions, the X-axis direction is a horizontal direction, the Y-axis direction is a horizontal direction perpendicular to the X-axis direction, the Z-axis direction is a vertical direction (perpendicular direction), and a θ-direction is a rotating direction about the Z-axis direction.
The worktable 12 is parallel to a horizontal direction (XY-direction) and includes an unshown suction device. A substantially disk-shaped workpiece W is held on the worktable 12 so that the center of the workpiece W is almost coincident with the center of the worktable 12, in a state where the workpiece W is fixed to a substantially annular frame 13 with a dicing processing tape (not shown) interposed between the workpiece and the frame.
The pair of blades 14 are arranged opposing each other, to cut the workpiece W that is on the worktable 12.
The worktable feeding mechanism 16 includes a ball screw (not shown), a motor (not shown) and a pair of X-axis guide rails 17. The X-axis guide rails 17 are guide members that are provided below the worktable 12 and guide movement of the worktable 12 along the X-axis direction. The worktable feeding mechanism 16 moves the worktable 12 (workpiece W) on the X-axis guide rails 17, to move the worktable 12 relative to the blades 14 in the X-axis direction (grind feeding). Furthermore, the worktable feeding mechanism 16 may rotate the worktable 12 in the θ-direction with an unshown mechanism.
Furthermore, if necessary, a retractable waterproof cover 26 (see
The pair of spindles 18 incorporate high-frequency motors and rotatably hold the blades 14. The spindle moving mechanism 20 movably supports the spindles 18. The spindle moving mechanism 20 includes a ball screw (not shown), a motor (not shown), a gate-shaped guide base (Y-base) 45, a pair of Y-axis guide rails 29, and a pair of Y-axis tables 28. The Y-axis guide rails 29 are guide members that are provided on a side surface of the guide base 45 and guide the Y-axis tables 28 along the Y-axis direction. The spindle moving mechanism 20 moves the Y-axis tables 28 on the Y-axis guide rails 29, to move the blades 14 relative to the worktable 12 in the Y-axis direction (index feeding).
Each Y-axis table 28 is provided with a Z-axis table 30 driven in the Z-axis direction by a guide mechanism and a drive mechanism that are not shown. Then, each spindle 18 is fixed to the Z-axis table 30, and the blade 14 is attached to a tip each spindle 18. The spindle moving mechanism 20 moves the Z-axis table 30 along an unshown guide mechanism, to move the blade 14 relative to the worktable 12 in the Z-axis direction (cut depth feeding).
Furthermore, imaging means (an alignment camera) 34 for observing an upper surface of the workpiece W is attached to the Z-axis table 30. The imaging means 34 includes an unshown imaging element. Examples of the imaging element include a charged coupled device (CCD), a complementary metal oxide semiconductor (CMOS), and the like. Note that the imaging element is not limited to this example. Any type of imaging element may be appropriately selected and used depending on the type of illumination light, the type of workpiece W, an observation site, and the like.
The imaging means 34 captures an image of the workpiece W that is on the worktable 12 and transmits the captured image of the workpiece W to a controller 32. The controller 32 uses the image of the workpiece W for alignment.
The controller 32 controls an operation of each part of the dicing device 10. The controller 32 includes an arithmetic device (computation device) such as a personal computer, for example, and examples of various processors include a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), and a programmable logic device. Also, examples of the programmable logic device include a simple programmable logic device (SPLD), a complex programmable logic device (CPLD), and a field programmable gate array (FPGA). Furthermore, various functions of the controller 32 may be achieved by one processor or may be achieved by processors of the same type or diverse types.
As shown in
A position opposing the end face 52a of the housing 52 serves as a work area (maintenance area) where the worker stands when performing the workpiece replacement or maintenance work. The dicing device 10 in the present embodiment includes a slider 54 constituting a part of the end face 52a of the housing 52 on a maintenance area side, as will be described later in detail. The slider 54 is a member constituting an outermost surface (the surface at a position farthest from the blades 14) in the X-axis direction (moving direction of the worktable 12) in the end face 52a of the housing 52. The slider 54 is a movable member configured to slide freely in the X-axis direction. A position of the slider in the X-axis direction may be changed between when dicing processing and when the maintenance work. As a result, while acquiring a predetermined stroke of the worktable 12 during the dicing processing, the worker may stand at a position closer to the maintenance space M during the maintenance work than during the dicing processing so as to shorten an access distance to the blade 14, thereby improving efficiency of a replacement work of the blade 14.
In the comparative example designated by the sign 4A in
In a configuration in which the end face 52a of the housing 52 is fixedly disposed as in the comparative example, when the stroke of the worktable feeding mechanism 16 increases as the workpiece W increases in size, the access distance D1 from the end face 52a of the housing 52 to the blade 14 accordingly increases. As a result, accessibility to the blade 14 during the maintenance work becomes worse, and the efficiency of the replacement work of the blade 14 decreases.
In contrast, as designated by the sign 4B in
According to the present embodiment, since the slider 54 is located at the protruding position P1 during the dicing processing, the worktable 12 is movable to the same position as in the above comparative example. That is, the stroke of the worktable feeding mechanism 16, which must be acquired during the dicing processing, is not impaired (not shortened).
Furthermore, in the present embodiment, during the maintenance work, it is not necessary to move the worktable 12 to the stroke end of the worktable feeding mechanism 16 in the dicing processing, and therefore the slider 54 is moved from the protruding position P1 to the retracted position P2 and the worktable 12 is stopped at a position (intermediate position) before the stroke end of the worktable feeding mechanism 16. As a result, an access distance D2 from the end face 52a of the housing 52 to the blade 14 during the maintenance work is shorter than the access distance D1 in the above comparative example (because the distance decreases by an amount of a slidable distance C of the slider 54), so that it is possible to improve accessibility to the blade 14 during the maintenance work and to improve the efficiency of the replacement work of the blade 14. The slidable distance C of the slider 54 is, as an example, from about 60 mm to 150 mm.
Furthermore, during the workpiece replacement, the slider 54 may be at either the protruding position P1 or the retracted position P2, as long as the slider does not interfere with the worktable 12 or workpiece W (including the frame 13) moved to a workpiece replacement position (lower position in the maintenance space M).
Thus, in the dicing device 10 according to the present embodiment, while acquiring the stroke of the worktable feeding mechanism 16 that is equivalent to the stroke in the above comparative example during the dicing processing, the accessibility to the blade 14 during the maintenance work is improved, and the blade 14 may therefore be replaced efficiently.
Furthermore, the dicing device 10 according to the present embodiment may be achieved by incorporating the slider 54 so that the slider slides freely in the X-axis direction (in the moving direction of the worktable 12) with respect to the housing 52 without changing the internal layout of the dicing device 10, and hence the dicing device may be achieved comparatively inexpensively.
Hereinafter, the configuration of the slider 54 will be described in more detail with reference to
As shown in
The front plate part 550 has a flat plate shape perpendicular to the X-axis direction and constitutes a part of the end face 52a of the housing 52. The side plate parts 555 have a flat plate shape substantially parallel to an XZ-plane. The side plate parts 555 are coupled to opposite ends of the front plate part 550 in the Y-axis direction. The bottom plate part 570 has a flat plate shape substantially parallel to an XY-plane (horizontal direction) and is disposed in a bottom part of a region surrounded by the front plate part 550 and a pair of side plate parts 555.
On a back side of the bottom plate part 570 (lower surface in
Each of the retaining plate parts 590 (shaded in
As shown in
Here, regarding the end face 52a located below the slider 54 in the Z-axis direction, it is desirable to determine a position of the end face 52a of the housing 52 in the X-axis direction so as to correspond to the position P2 of the slider 54 during the maintenance work.
Specifically, preferably the position of the end face 52a of the housing 52 in the X-axis direction is about the same as the retracted position P2 of the slider 54 during the maintenance work or is on an inner side of the dicing device 10 than the retracted position P2. When the slider 54 is moved to the retracted position P2 during the maintenance work, a position of worker's feet may correspond to the retracted position P2 so that workability may be further improved.
Subsequently, the movement of the slider 54 in the X-axis direction will be described in more detail with reference to
During the dicing processing, to acquire the stroke of the worktable feeding mechanism 16 (movable range of the worktable 12), the slider 54 is at the protruding position P1 where the slider 54 is protruding toward the maintenance area side, as designated by the sign 7A. In this case, the fixing side member 552 is engaged with the fixed side member 554 in each fixture 560 so as to fix the slider 54 to the housing 52, thereby preventing sliding movement of the slider 54.
When performing a maintenance work, as designated by the sign 7B, first the worktable 12 is stopped at the position (intermediate position) before the stroke end of the worktable feeding mechanism 16. Subsequently, as designated by the sign 7C, the engagement between the fixing side member 552 and the fixed side member 554 in each fixture 560 is released so that the slider 54 may slidingly move in the X-axis direction, and the slider 54 is pushed toward an interior of the housing 52 and moved (slid) to the retracted position P2. As a result, the slider 54 moves to be at the retracted position P2.
As a result, during the maintenance work, the access distance to the blade 14 decreases by an amount of the slidable distance C between the protruding position P1 and the retracted position P2 in the slider 54, so that accessibility to the blade 14 is improved, and the replacement work of the blade 14 may be efficiently performed.
As described above, in the dicing device 10 according to the present embodiment, during a maintenance work, a slider 54 constituting a part of the end face 52a of the housing 52 may be pushed in more than during dicing processing. Therefore, when performing the maintenance work, accessibility from a maintenance area side (side on which the end face 52a of the housing 52 is formed) to a blade 14 is improved, and efficiency of a replacement work of the blade 14 may be improved.
As above, the embodiment of the present invention has been described, but the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the gist of the present invention.
10 . . . dicing device, 12 . . . worktable, 13 . . . frame, 14 . . . blade, 16 . . . worktable feeding mechanism, 17 . . . X-axis guide rail, 18 . . . spindle, 26 . . . waterproof cover, 28 . . . Y-axis table, 29 . . . Y-axis guide rail, 30 . . . Z-axis table, 34 . . . imaging means, 52 . . . housing, 52a . . . end face, 54 . . . slider, 72 . . . operation unit, 74 . . . monitor, 520 . . . stopper surface, 540 . . . guide rail block, 550 . . . front plate part, 552 . . . fixing side member, 554 . . . fixed side member, 555 . . . side plate part, 560 . . . fixture, 570 . . . bottom plate part, 580 . . . guide rail, 590 . . . retaining plate part, W . . . workpiece, M . . . maintenance space
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-056678 | Mar 2022 | JP | national |
The present application is a Continuation of PCT International Application No. PCT/JP2023/010554 filed on Mar. 17, 2023 claiming priority under 35 U.S.C. § 119(a) to Japanese Patent Application No. 2022-056678 filed on Mar. 30, 2022. Each of the above applications is hereby expressly incorporated by reference, in its entirety, into the present application.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2023/010554 | Mar 2023 | WO |
| Child | 18900013 | US |