with a plurality of cutting blades

Industry

CPC
B28D5/029

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/029with a plurality of cutting blades

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Edge alignment method
- Patent number 12,151,401
- Issue date Nov 26, 2024
- Disco Corporation
- Atsushi Komatsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cutting apparatus, cutting blade replacement method, and board repl...
- Patent number 11,491,669
- Issue date Nov 8, 2022
- Disco Corporation
- Kazuki Terada
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Transfer jig and cutting blade changing method
- Patent number 11,318,573
- Issue date May 3, 2022
- Disco Corporation
- Kazuki Terada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED wafer processing method
- Patent number 10,843,381
- Issue date Nov 24, 2020
- Disco Corporation
- Makiko Ohmae
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting system and method for a cutting system
- Patent number 10,507,593
- Issue date Dec 17, 2019
- D. SWAROVSKI KG
- Johannes Schweigl
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor mounti...
- Patent number 10,181,460
- Issue date Jan 15, 2019
- Toray Engineering Co., Ltd.
- Noboru Asahi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Singulation apparatus and method
- Patent number 9,508,570
- Issue date Nov 29, 2016
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for multiple cutoff machining of rare earth ma...
- Patent number 9,314,892
- Issue date Apr 19, 2016
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Device for separating electronic components
- Patent number 8,813,349
- Issue date Aug 26, 2014
- Fico B.V.
- Frederik Hendrik In 'T Veld
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for multiple cutoff machining of rare earth ma...
- Patent number 8,753,174
- Issue date Jun 17, 2014
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for multiple cutoff machining of rare earth ma...
- Patent number 8,567,383
- Issue date Oct 29, 2013
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for multiple cutoff machining of rare earth ma...
- Patent number 8,568,203
- Issue date Oct 29, 2013
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of configuring a dicing device, and a dicing apparatus for d...
- Patent number 8,538,576
- Issue date Sep 17, 2013
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for manufacturing seeds for polycrystalline silicon manuf...
- Patent number 8,425,279
- Issue date Apr 23, 2013
- Misubishi Polycrystalline Silicon America Corporation (MIPSA)
- Larry Gurley
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Dicing method
- Patent number 8,116,893
- Issue date Feb 14, 2012
- Tokyo Seimitsu Co., Ltd.
- Takeo Tsushima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Dicing saw blade positioning apparatus and methods independent of b...
- Patent number 7,533,665
- Issue date May 19, 2009
- Micron Technology, Inc.
- Ernest J. Hamilton
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Cutting device with a pair of cutting blades and elements for detec...
- Patent number 7,484,444
- Issue date Feb 3, 2009
- Disco Corporation
- Naoya Tokumitsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Dicing saw with variable indexing capability
- Patent number 7,387,119
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine
- Patent number 7,338,345
- Issue date Mar 4, 2008
- Disco Corporation
- Koichi Fujinami
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine for plate-shaped material
- Patent number 7,316,174
- Issue date Jan 8, 2008
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Saw singulation
- Patent number 7,281,535
- Issue date Oct 16, 2007
- Towa Intercon Technology, Inc.
- Chris Mihai
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Bidirectional singulation saw and method
- Patent number 7,267,037
- Issue date Sep 11, 2007
- David Walter Smith
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for aligning a center of mass with a rotation...
- Patent number 7,051,729
- Issue date May 30, 2006
- Micron Technology, Inc.
- Ernest J. Hamilton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for grinding magnetic member and method and ap...
- Patent number 7,040,969
- Issue date May 9, 2006
- Neomax Co., Ltd.
- Masanori Chikuba
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 7,018,270
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for using a blade assembly cover
- Patent number 6,990,880
- Issue date Jan 31, 2006
- Micron Technology, Inc.
- Ernest J. Hamilton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing saw blade positioning apparatus and methods independent of b...
- Patent number 6,962,147
- Issue date Nov 8, 2005
- Ernest J. Hamilton
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 6,939,199
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,932,077
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and methods for aligning a center of mass with a rotation...
- Patent number 6,929,000
- Issue date Aug 16, 2005
- Micron Technology, Inc.
- Ernest J. Hamilton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DICING DEVICE
- Publication number 20250018605
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Yusuke KANESHIRO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS, CUTTING BLADE REPLACEMENT METHOD, AND BOARD REPL...
- Publication number 20210316468
- Publication date Oct 14, 2021
- Disco Corporation
- Kazuki TERADA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
EDGE ALIGNMENT METHOD
- Publication number 20210291404
- Publication date Sep 23, 2021
- Disco Corporation
- Atsushi KOMATSU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
TRANSFER JIG AND CUTTING BLADE CHANGING METHOD
- Publication number 20190358757
- Publication date Nov 28, 2019
- Disco Corporation
- Kazuki TERADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM
- Publication number 20180104852
- Publication date Apr 19, 2018
- D. SWAROVSKI KG
- Johannes Schweigl
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20140260884
- Publication date Sep 18, 2014
- LIEN DING SYSTEMS CO., LTD.
- Ha-Dih HSIEH
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
IMPROVED SYSTEM FOR SUBSTRATE PROCESSING
- Publication number 20130344629
- Publication date Dec 26, 2013
- ROKKO SYSTEMS PTE LTD
- Seung Ho Baek
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and Method for the Singulation of a Semiconductor Wafer
- Publication number 20130273717
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...
- Publication number 20130217307
- Publication date Aug 22, 2013
- Shin-Etsu Chemical Co., Ltd.
- Koji SATO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SAW BLADE AND METHOD FOR MULTIPLE SAWING OF RARE EARTH MAGNET
- Publication number 20130137343
- Publication date May 30, 2013
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor...
- Publication number 20130014738
- Publication date Jan 17, 2013
- MEMC ELECTRONIC MATERIALS SPA
- Paolo Molino
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...
- Publication number 20120282847
- Publication date Nov 8, 2012
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...
- Publication number 20120282848
- Publication date Nov 8, 2012
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF CONFIGURING A DICING DEVICE, AND A DICING APPARATUS FOR D...
- Publication number 20120259444
- Publication date Oct 11, 2012
- ASM Technology Singapore Pte Ltd
- Chi Wah CHENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND DEVICE FOR PRODUCING THIN SILICON RODS
- Publication number 20120151969
- Publication date Jun 21, 2012
- WACKER CHEMIE AG
- Bruno LICHTENEGGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and Method for Sawing Electronic Components
- Publication number 20110197727
- Publication date Aug 18, 2011
- FICO B.V.
- Frederik Hendrik In 'T Veld
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DICING METHOD
- Publication number 20110054657
- Publication date Mar 3, 2011
- Takeo Tsushima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Erodible Spacer Dicing Blade Gang Assembly
- Publication number 20110041308
- Publication date Feb 24, 2011
- VEECO INSTRUMENTS, INC.
- Kent A. Swanson
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS
- Publication number 20110045656
- Publication date Feb 24, 2011
- ROKKO VENTURES PTE, LTD.
- Chong Chen Lim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...
- Publication number 20100112904
- Publication date May 6, 2010
- Shin-Etsu Chemical Co., Ltd.
- Koji Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUF...
- Publication number 20100077897
- Publication date Apr 1, 2010
- Mitsubishi Polycrystalline Silicon America Corporation
- Larry Gurley
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070284139
- Publication date Dec 13, 2007
- Chee Keong Chin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Nozzle assembly for a saw for semiconductors
- Publication number 20070175304
- Publication date Aug 2, 2007
- Koninklijke Philips Electronics, N.V.
- Frederik Hendrik In't Veld
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20070068504
- Publication date Mar 29, 2007
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20070062511
- Publication date Mar 22, 2007
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Blade assembly cover
- Publication number 20060169113
- Publication date Aug 3, 2006
- Ernest J. Hamilton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and methods for aligning a center of mass with a rotation...
- Publication number 20060162717
- Publication date Jul 27, 2006
- Ernest J. Hamilton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cutting machine
- Publication number 20060112802
- Publication date Jun 1, 2006
- DISCO CORPORATION
- Koichi Fujinami
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20060065262
- Publication date Mar 30, 2006
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Sawing and sorting system
- Publication number 20060056955
- Publication date Mar 16, 2006
- Yong-Kuk Kim
- B28 - WORKING CEMENT, CLAY, OR STONE

with a plurality of cutting blades

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge alignment method

Cutting apparatus, cutting blade replacement method, and board repl...

Transfer jig and cutting blade changing method

LED wafer processing method

Cutting system and method for a cutting system

Method for manufacturing semiconductor device, semiconductor mounti...

Singulation apparatus and method

Method and apparatus for multiple cutoff machining of rare earth ma...

Device for separating electronic components

Method and apparatus for multiple cutoff machining of rare earth ma...

Method and apparatus for multiple cutoff machining of rare earth ma...

Method and apparatus for multiple cutoff machining of rare earth ma...

Method of configuring a dicing device, and a dicing apparatus for d...

Apparatus for manufacturing seeds for polycrystalline silicon manuf...

Dicing method

Dicing saw blade positioning apparatus and methods independent of b...

Cutting device with a pair of cutting blades and elements for detec...

Dicing saw with variable indexing capability

Cutting machine

Cutting machine for plate-shaped material

Saw singulation

Bidirectional singulation saw and method

Apparatus and methods for aligning a center of mass with a rotation...

Method and apparatus for grinding magnetic member and method and ap...

Method and apparatus for cutting semiconductor wafers

Method for using a blade assembly cover

Dicing saw blade positioning apparatus and methods independent of b...

Method and apparatus for cutting semiconductor wafers

Method for sawing wafers employing multiple indexing techniques for...

Apparatus and methods for aligning a center of mass with a rotation...

Patents Applicationslast 30 patents

DICING DEVICE

CUTTING APPARATUS, CUTTING BLADE REPLACEMENT METHOD, AND BOARD REPL...

EDGE ALIGNMENT METHOD

TRANSFER JIG AND CUTTING BLADE CHANGING METHOD

CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM

SUBSTRATE PROCESSING METHOD

IMPROVED SYSTEM FOR SUBSTRATE PROCESSING

Apparatus and Method for the Singulation of a Semiconductor Wafer

METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...

SAW BLADE AND METHOD FOR MULTIPLE SAWING OF RARE EARTH MAGNET

Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor...

METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...

METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...

METHOD OF CONFIGURING A DICING DEVICE, AND A DICING APPARATUS FOR D...

METHOD AND DEVICE FOR PRODUCING THIN SILICON RODS

Device and Method for Sawing Electronic Components

DICING METHOD

Erodible Spacer Dicing Blade Gang Assembly

SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS

METHOD AND APPARATUS FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MA...

APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUF...

SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM

Nozzle assembly for a saw for semiconductors

Group encapsulated dicing chuck

Group encapsulated dicing chuck

Blade assembly cover

Apparatus and methods for aligning a center of mass with a rotation...

Cutting machine

Group encapsulated dicing chuck

Sawing and sorting system