Claims
- 1. A method for bonding an electronic die to a substance comprising:
- picking up a die at a supply location;
- moving said die over a roller having a surface which rotates into and out of a reservoir of bonding paste a desired layer of bonding paste on a surface of said die;
- controlling the speed at which said die passed over said roller and the speed of rotation of said roller;
- varying the height of said die above said roller as said die passed over said roller in a first direction; and
- positioning said die surface having the layer of bonding paste on a bonding site on a substrate.
- 2. A method according to claim 1 wherein varying the height of said die above said roller as said die passes over said roller further includes pulsing said die in a second direction at an angle to said first direction.
- 3. A method according to claim 1 wherein said bonding paste is silver glass.
- 4. A method according to claim 1 wherein said bonding paste is epoxy.
- 5. A method according to claim 1 including controlling the orientation at which said die passes over said roller and the orientation of said die at said bonding site.
- 6. A method of applying a bonding paste to an electronic die to be bonded to a substrate comprising:
- providing a first layer of bonding paste; and
- moving a die and said first layer into contact at a first surface of said die in first direction along said first surface and subsequently relative to each other in a second direction at an angle to said first direction to create a shear in said first layer sufficient to form a second layer of bonding paste on said first surface of said die.
- 7. A method according to claim 6 wherein moving includes moving said die and said first layer in the same first direction along said surface.
- 8. A method according to claim 7 wherein moving includes moving said die and said first layer at substantially the same speed in said first direction.
- 9. A method according to claim 7 wherein said moving is performed to form said second layer as a plateau displaced from the edges of said first surface.
- 10. A method according to claim 6 moving includes moving said first layer at a different speed than said die in said first direction.
- 11. A method according to claim 6 wherein moving includes moving said die and said first layer in opposite first directions along said surface.
- 12. A method according to claim 6 wherein moving includes pulsing said die and said first layer relative to each other in said second direction.
- 13. A method according to claim 12 wherein said die and said first layer are moved relative to each other in said first direction simultaneously with moving in said second direction.
- 14. A method according to claim 12 wherein the pulsing of said die and said first layer relative to each other in said second and direction is repeated along said first surface wherein each sequence forms a portion of said second layer on said first surface.
- 15. A method according to claim 6 wherein said bonding paste is silver glass.
- 16. A method according to claim 6 including orientating said die so that relative motive movement of said die and said first layer is along the shortest dimension of said first surface.
- 17. A method according to claim 6 wherein said providing includes rotating a roller into and out of a reservoir of said bonding paste to provide said first layer on said roller.
- 18. A method of applying a bonding paste to an electronic die to be bonded to a substrate comprising:
- moving a die in a first direction parallel to a first surface of said die;
- moving a first layer of bonding paste along a first surface of said die;
- moving said die and said first layer toward each other in a second direction at an angle to said first direction to bring said surface into contact with said first layer;
- subsequently moving said die and said first layer away from each other in a third direction at an angle to said first direction; and
- moving said die and said first layer along said first surface simultaneously with moving in said second and third directions to form a second layer of bonding paste on said first surface of said die.
- 19. A method according to claim 18 wherein the sequence of moving said die and said first layer relative to each other in said second and third directions is repeated along said first surface wherein each sequence forms a portion of said second layer on said first surface.
- 20. A method for bonding an electronic die to a substrate comprising:
- picking up a die at a supply location;
- moving said die over a roller having a surface which rotates into and out of a reservoir of bonding paste to provide a desired layer of bonding paste on a surface of said die;
- controlling the speed and selectively adjusting the rotational orientation at which said die passed over said roller and the speed of rotation of said roller;
- selectively adjusting the rotation orientation of said die at a bond site on a substrate; and
- positioning said die surface having the layer of bonding paste on said bonding site on said substrate.
Parent Case Info
This is a div. of application Ser. No. 07/885,847, filed May 20, 1992, now U.S. Pat. No. 5,348,611.
US Referenced Citations (17)
Foreign Referenced Citations (9)
Number |
Date |
Country |
2140116 |
Feb 1973 |
DEX |
3019-081 |
Feb 1981 |
DEX |
3218-105 |
Dec 1982 |
DEX |
3309-731 |
Oct 1983 |
DEX |
236-700 |
Jun 1986 |
DEX |
58-59064 |
Apr 1983 |
JPX |
64-66998 |
Mar 1989 |
JPX |
3-211849 |
Sep 1991 |
JPX |
4-342144 |
Nov 1992 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
885847 |
May 1992 |
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