Chip component

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CPC
Y10T29/53178

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/53178Chip component

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Patents Grantslast 30 patents

Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,255,007
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular-design component handling device with component gripping to...
- Patent number 11,956,901
- Issue date Apr 9, 2024
- ASMPT GMBH & CO. KG
- Sebastian Lohmeier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 11,848,147
- Issue date Dec 19, 2023
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and manufacturing method therefor
- Patent number 11,621,117
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Tetsuya Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component supply device and surface mounting machine
- Patent number 11,606,891
- Issue date Mar 14, 2023
- Yamaha Hatsudoki Kabushiki Kaisha
- Tomoharu Kurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method for making thereof
- Patent number 11,569,208
- Issue date Jan 31, 2023
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus with feeder control device
- Patent number 11,570,940
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Koichiro Sugimoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer coil component and electronic device
- Patent number 11,469,029
- Issue date Oct 11, 2022
- Taiyo Yuden Co., Ltd.
- Takayuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information management device
- Patent number 11,452,251
- Issue date Sep 20, 2022
- FUJI CORPORATION
- Kimio Fujii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Board working system
- Patent number 11,432,449
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 11,302,617
- Issue date Apr 12, 2022
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device, information processing device, and mounting method
- Patent number 11,304,351
- Issue date Apr 12, 2022
- FUJI CORPORATION
- Kosei Baba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component mounting machine
- Patent number 11,266,051
- Issue date Mar 1, 2022
- FUJI CORPORATION
- Kazuma Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pickup head with touch down sensor
- Patent number 11,219,151
- Issue date Jan 4, 2022
- Facebook Technologies, LLC
- Pooya Saketi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,172,600
- Issue date Nov 9, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tape feeder
- Patent number 11,147,199
- Issue date Oct 12, 2021
- FUJI CORPORATION
- Hidekazu Asao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component supply device
- Patent number 11,051,440
- Issue date Jun 29, 2021
- Yamaha Hatsudoki Kabushiki Kaisha
- Kazuyoshi Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Working machine, storing-target-body supply device, and method for...
- Patent number 11,039,560
- Issue date Jun 15, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Yukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device
- Patent number 10,966,358
- Issue date Mar 30, 2021
- FUJI CORPORATION
- Shigeto Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,964,676
- Issue date Mar 30, 2021
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding device and bonding method
- Patent number 10,903,105
- Issue date Jan 26, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting using feedback correction
- Patent number 10,893,639
- Issue date Jan 12, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiro Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,847,499
- Issue date Nov 24, 2020
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component mounting system
- Patent number 10,806,037
- Issue date Oct 13, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiro Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COIL COMPONENT
- Publication number 20250182954
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Yoshifumi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20240079178
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Yoshifumi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION
- Publication number 20210175162
- Publication date Jun 10, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...
- Publication number 20210035955
- Publication date Feb 4, 2021
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20200144170
- Publication date May 7, 2020
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
BOARD WORKING SYSTEM
- Publication number 20180332748
- Publication date Nov 15, 2018
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20180068938
- Publication date Mar 8, 2018
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING AN OPTICAL COMMUNICATION DEVICE
- Publication number 20170331557
- Publication date Nov 16, 2017
- Cisco Technology, Inc.
- Stefan Pfnuer
- G02 - OPTICS
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20170312841
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND ELECTRONIC COMPONE...
- Publication number 20140373323
- Publication date Dec 25, 2014
- Katsunori OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20140352141
- Publication date Dec 4, 2014
- SHIBUYA KOGYO CO., LTD.
- Hiroyuki YASUYOSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...
- Publication number 20140304984
- Publication date Oct 16, 2014
- VALEO ETUDES ELECTRONIQUES
- Laurent VIVET
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE MOUNTING APPARATUS
- Publication number 20140290047
- Publication date Oct 2, 2014
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FOR CAPILLARY SELF-ASSEMBLY WITH HORIZONTAL STABILISATION,...
- Publication number 20140283367
- Publication date Sep 25, 2014
- STMicroelectronics (Crolles 2) SAS
- Jean Berthier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SYSTEM
- Publication number 20140259648
- Publication date Sep 18, 2014
- Eiji TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER FRAME FIXTURE
- Publication number 20140237815
- Publication date Aug 28, 2014
- Advanced Micro Devices, Inc.
- Wei-Chin Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT MOUNTING METHOD, AND...
- Publication number 20140239331
- Publication date Aug 28, 2014
- Nichia Corporation.
- Takahiro OYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PRECISE ASSEMBLY OF LIGHT RECEIVER ON SUBSTRATE
- Publication number 20140215814
- Publication date Aug 7, 2014
- CHIH-CHEN LAI
- F21 - LIGHTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS
- Publication number 20140196279
- Publication date Jul 17, 2014
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Kiyotaka SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...
- Publication number 20140196280
- Publication date Jul 17, 2014
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE
- Publication number 20140170812
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PNP APPARATUS WITH PICK-UP TIP AND RELATED METHODS
- Publication number 20140105717
- Publication date Apr 17, 2014
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Hk LOOI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS

Chip component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D system integration

Secure semiconductor integration and method for making thereof

Coil component

Chip-transferring system and chip-transferring method

3D integrations and methods of making thereof

Systems of applying materials to components

Modular-design component handling device with component gripping to...

Stacking integrated circuits containing serializer and deserializer...

Coil component

Coil component and manufacturing method therefor

Component supply device and surface mounting machine

Semiconductor structure and method for making thereof

Component mounting apparatus with feeder control device

Multilayer coil component and electronic device

Information management device

Board working system

Scalable semiconductor interposer integration

Mounting device, information processing device, and mounting method

Component mounting machine

Pickup head with touch down sensor

Mounting device

Tape feeder

Component supply device

Working machine, storing-target-body supply device, and method for...

Component mounting device

Semiconductor structure and a method of making thereof

Flip chip bonding device and bonding method

Component mounting using feedback correction

Stacking integrated circuits containing serializer and deserializer...

Component mounting system

Patents Applicationslast 30 patents

COIL COMPONENT

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

3D SYSTEM INTEGRATION

COIL COMPONENT

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

SECURE SEMICONDUCTOR INTEGRATION

STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

BOARD WORKING SYSTEM

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

METHOD AND SYSTEM FOR MANUFACTURING AN OPTICAL COMMUNICATION DEVICE

CHIP JOINING BY INDUCTION HEATING

ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND ELECTRONIC COMPONE...

BONDING DEVICE

DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...

WORKPIECE MOUNTING APPARATUS

SUPPORT FOR CAPILLARY SELF-ASSEMBLY WITH HORIZONTAL STABILISATION,...

BONDING SYSTEM

STIFFENER FRAME FIXTURE

LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT MOUNTING METHOD, AND...

DEVICE FOR PRECISE ASSEMBLY OF LIGHT RECEIVER ON SUBSTRATE

ELECTRONIC COMPONENT MOUNTING APPARATUS

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH...

METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE

PNP APPARATUS WITH PICK-UP TIP AND RELATED METHODS

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...