Claims
- 1. An improved dielectric imaging member for receiving electrostatic latent images in the absence of an externally applied voltage so as to provide sharp density images consisting essentially of a transparent resin film substrate, a conductive layer on said substrate, and dielectric resin film in which said dielectric film has a thickness in the range of about 1.4-10 micrometers on said conductive layer for receiving said latent images.
- 2. An improved dielectric imaging member in accordance with claim 1 in which said dielectric film has a thickness of about 4-5 micrometers.
- 3. An improved dielectric imaging member in accordance with claim 1 wherein said imaging member is transparent.
- 4. An improved dielectric imaging member in accordance with claim 1 wherein said conductive layer is an organic conductive layer.
- 5. An improved dielectric imaging member in accordance with claim 1 wherein said substrate had a thickness between about 75-175 micrometers and is selected from the group consisting of polyvinyl acetate, acrylics, styrenated acrylics, polyesters, polyvinyl butyral and polycarbonates.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of copending application Ser. No. 669675 filed Mar. 23, 1976, abandoned.
US Referenced Citations (6)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
669675 |
Mar 1976 |
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