Information
-
Patent Grant
-
6538536
-
Patent Number
6,538,536
-
Date Filed
Wednesday, September 27, 200024 years ago
-
Date Issued
Tuesday, March 25, 200321 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Pascal; Robert
- Jones; Stephen E.
Agents
- Ingrassia Fisher & Lorenz
-
CPC
-
US Classifications
Field of Search
US
- 333 2191
- 333 235
- 331 96
- 331 99
- 331 107 DP
- 331 117 D
-
International Classifications
-
Abstract
A dielectric resonator oscillator (DRO) (200, FIG. 2; 600, FIG. 6; 900, FIG. 9) includes a dielectric resonator (202, 602, 902) that is held in a fixed position with respect to the housing lid (206, 606, 906). In one embodiment, the resonator is attached to the housing lid using one or more support legs (208). In another embodiment, the resonator is attached to the housing lid using a ring structure (608). In still another embodiment, the resonator is attached to the lid and housing (904) using a lid tuner (914) and lid pedestal (908), and a housing tuner (915) and housing pedestal (909). Resonator positioning within the DRO cavity (222, 622, 922) is simplified by accurately aligning and attaching the support structure to the resonator.
Description
TECHNICAL FIELD
The invention relates generally to dielectric resonator oscillators (DROs) and methods of their assembly and, more specifically, to DROs having dielectric resonators that are attached to the DRO housing in such a manner that the DRO operation is not substantially affected by mechanical vibration.
BACKGROUND OF THE INVENTION
Dielectric resonator oscillators (DROs) are commonly used in high-precision RF and microwave systems to generate high-frequency signals of extremely good spectral purity. For example, DROs have been used in radars, transponders, and communication systems, among other systems, to generate microwave signals with extremely low phase noise and good temperature stability. Generally, in these systems, the DRO is used to generate a frequency that is locked to a reference oscillator within a phase-locked loop circuit.
FIG. 1
illustrates a cross-sectional, side view of a DRO
100
in accordance with the prior art. DRO
100
includes dielectric resonator
102
, housing
104
, housing lid
106
, dielectric pedestal
108
, printed wiring board substrate
110
, microstrips
112
, tuning screw
114
, and wall mounted electric tuner
116
. Dielectric resonator
102
is used as a frequency determining circuit element. Dielectric resonator
102
is made of a rigid ceramic material, having a very high dielectric value.
Housing
104
and housing lid
106
are made of a metallic material. Housing
104
is a structure having a bottom
118
and sides
120
. When assembled, housing
104
and housing lid
106
create a resonant cavity
122
.
During operation, electromagnetic energy is coupled into cavity
122
and resonator
102
at the resonant frequency via microstrips
112
located on substrate
110
, which is located on the housing bottom
114
. Likewise, energy at the resonant frequency can be extracted from cavity
122
via microstrips
112
.
The relative position of dielectric resonator
102
within resonant cavity
122
affects the frequency characteristics and the Q of the DRO. The position of resonator
102
is defined by the height of pedestal
108
and the horizontal placement of dielectric resonator
102
on pedestal
108
. Pedestal
108
is made of a solid, low-loss, low-dielectric constant material.
During a typical assembly process, substrate
110
and microstrips
112
are first attached to the housing bottom
118
. Then, pedestal
108
is attached to the substrate
110
using an epoxy material, which requires a high-temperature, heat-curing process. In some prior art processes, pedestal
108
is attached directly to housing bottom
118
using an epoxy, after substrate
110
is attached to the housing bottom
118
.
After pedestal
108
is attached to housing
104
(or substrate
110
) and heat-cured, resonator
102
is placed on pedestal
108
, and an iterative position adjustment process is performed. This is necessary because the oscillator circuit will oscillate only over a fairly narrow range of resonator positions on pedestal
108
. The position adjustment process involves assembling housing lid
106
to housing
104
, and testing the frequency. The lid
106
is then removed, and if the frequency is not accurate enough, the resonator position on pedestal
108
is adjusted along the horizontal plane. This testing and position adjustment process is repeated until the desired performance is attained. Resonator
102
is then carefully removed, applied with epoxy, and re-positioned on pedestal
108
. The assembly is again heat-cured and tested for performance. Coarse frequency adjustments are then performed using tuning screw
114
, as is described below.
As the above description indicates, the entire DRO
100
is heated at least twice during assembly. This double-heating process decreases the yield of acceptable DROs, because the circuitry within DRO
100
is cumulatively affected by the heating processes. In addition, it can be difficult and time consuming to accurately adjust the position of resonator
102
on pedestal
108
, and to accurately re-position resonator
102
on pedestal
108
after application of the epoxy to resonator
102
.
The dimensions of resonator
102
define the resonant frequency of resonator
102
. This frequency can be varied by a small percentage using tuning screw
114
and/or electric tuner
116
, both of which capacitively load resonator
102
. Tuning screw
114
is used to coarsely tune resonator
102
(e.g., within about one percent of the resonant frequency), and wall mounted electric tuner
116
is used to finely tune resonator
102
(e.g., by tenths of a percent).
The frequency characteristics of resonator
102
are adversely affected if tuning screw
114
makes contact with resonator
102
. Accordingly, an air gap
128
must exist between the bottom of tuning screw
114
and the top of resonator
102
in prior art systems.
In this prior art configuration, resonator
102
is held in position only by pedestal
108
. Accordingly, when DRO
100
is subject to mechanical vibration, pedestal
108
and resonator
102
can sway. When the vibration is sufficient, the movement of resonator
102
within cavity
122
can be enough to adversely affect the frequency characteristics of the DRO
100
. In some cases, the movement can be severe enough to cause frequency fluctuations in the megahertz range, which can cause a DRO that is used in conjunction with a phase-locked loop circuit to lose lock with the reference oscillator. If the vibration is more than momentary, the circuit will continue to lose lock. Because prior art DROs are so sensitive to resonator position, prior art DROs are unsuitable, in many cases, for use in mobile apparatus, or other apparatus that may experience vibration conditions.
What are needed are DROs and methods of their assembly that simplify the process of positioning the dielectric resonator within the DRO cavity. In addition, what are needed are methods of assembling a DRO that eliminate the need to subject the DRO circuitry to multiple heating processes. Finally, what are needed are DROs that have resonators mounted in a manner that the DRO operation is not substantially affected by mechanical vibration.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
illustrates a cross-sectional, side view of a dielectric resonator oscillator (DRO) in accordance with the prior art;
FIG. 2
illustrates a cross-sectional, side view of a DRO in accordance with one embodiment of the present invention;
FIG. 3
illustrates a view of the DRO of
FIG. 2
taken along line
1
—
1
of FIG.
2
and looking in the direction of the arrows;
FIG. 4
illustrates a view of the housing lid of the DRO of
FIG. 2
taken along line
2
—
2
of FIG.
2
and looking in the direction of the arrows;
FIG. 5
illustrates a flowchart of a method for assembling the DRO shown in
FIG. 2
in accordance with one embodiment of the present invention;
FIG. 6
illustrates a cross-sectional, side view of a DRO in accordance with a second embodiment of the present invention;
FIG. 7
illustrates a top view of a ring structure in accordance with the embodiment shown in
FIG. 6
;
FIG. 8
illustrates a flowchart of a method for assembling the DRO shown in
FIG. 6
in accordance with one embodiment of the present invention;
FIG. 9
illustrates a cross-sectional, side view of a DRO in accordance with a third embodiment of the present invention; and
FIG. 10
illustrates a flowchart of a method for assembling the DRO shown in
FIG. 9
in accordance with one embodiment of the present invention.
DETAILED DESCRIPTION
Embodiments of the present invention provide a dielectric resonator oscillator (DRO) having a dielectric resonator that is held in a fixed position with respect to the DRO housing lid using a support structure that extends downward from the housing lid. This firm attachment results in a DRO whose operation is not substantially affected by mechanical vibration.
In one embodiment, the resonator is attached to the housing lid using one or more support legs that contact portions of the top and side of the resonator. In another embodiment, the resonator is attached to the housing lid using a ring structure that contacts the top of the resonator. In still another embodiment, the resonator is attached to the housing and housing lid using two support structures that contact the top and bottom of the resonator, each structure including a tuning screw and a dielectric pedestal. During assembly of each of these embodiments, the accurate alignment of the resonator within the DRO cavity is much simpler than with prior art DROs. In addition, the DRO circuitry is not subject to multiple heating processes, as is done in prior art DRO assembly methods.
FIG. 2
illustrates a cross-sectional, side view of a DRO in accordance with one embodiment of the present invention. DRO
200
includes dielectric resonator
202
, housing
204
, housing lid
206
, support legs
208
, printed wiring board substrate
210
, microstrips
212
, tuning screw
214
, and electric tuner
216
.
Dielectric resonator
202
is used as a frequency determining circuit element. Dielectric resonator
202
is made of a rigid ceramic material, having a very high dielectric value. Resonator
202
is often referred to as a “disk” or “puck” because it typically has a cylindrical shape, although resonators of other shapes are also used. The dimensions of resonator
202
define its resonant frequency. For example, a resonator having dimensions of 0.75 cm in diameter by 0.3 cm in height would have a resonant frequency of about 6 GHz. Typical resonators have resonant frequencies in a range of 2-30 GHz, although resonators with higher or lower resonant frequencies also could be used.
Housing
204
and housing lid
206
comprise a metallic material, such as aluminum, copper, silver or another conductive material, or a mixture thereof. Housing
204
is a structure having a bottom
218
and sides
220
. When assembled, housing
204
and housing lid
206
create a resonant cavity
222
. Typically, the dimensions of cavity
222
are chosen so that the natural resonant frequency of resonator
202
is unperturbed when placed inside cavity
222
. The width
224
of cavity
222
is typically from two to three times the diameter of resonator
202
, and the height
226
of cavity
222
is typically up to about two times the thickness of resonator
202
, although cavities
222
having different dimensions could be used as well. During operation, electromagnetic energy is coupled into cavity
222
and resonator
202
at the resonant frequency via microstrips
212
located on substrate
210
on the housing bottom
218
.
FIG. 3
illustrates a view of the DRO of
FIG. 2
taken along line
1
—
1
of FIG.
2
and looking in the direction of the arrows. Microstrips
212
, which are formed (e.g. through deposition) on the printed wiring board substrate
210
, are shown to have a “U” shaped configuration, although other configurations could be used as well. When current is passed through microstrips
212
, a magnetic field is formed through resonator
202
, causing energy to be coupled into resonator
202
. Resonator
202
then resonates at a sharp resonance, based on the Q of resonator
202
. The Q of resonator
202
is typically from 8,000-12,000, although the Q could be higher or lower than this range as well. Energy at the resonant frequency can be extracted from the resonant cavity (e.g., cavity
222
,
FIG. 2
) via microstrips
212
. In general, DRO
200
enables only a very narrow band of frequencies to pass through, making it particularly useful as a very narrow-band filter.
Generally, the farther resonator
202
is away from the printed wiring board substrate
210
and microstrips
212
, the higher the Q of the resonant network and the lower the phase noise, resulting in a narrower band of frequencies allowed to pass through the DRO (i.e., a more pure tone). Referring back to
FIG. 2
, the position of resonator
202
is defined by the location and height of support legs
208
. The height of supports
208
is typically chosen to position resonator
202
such that performance near the desired frequency is maintained, although resonator
202
could be positioned closer to or farther from microstrips
212
as well.
Each of support legs
208
includes a step, in one embodiment, where the step has a first surface
240
and a second surface
242
. When resonator
202
is seated on support legs
208
, the first surface
240
is substantially parallel to and contacts the top surface
244
of resonator
202
and the second surface
242
is substantially parallel to and contacts the side surface
246
of resonator
202
. In one embodiment, resonator
202
is seated on and attached to support legs
208
using an adhesive, such as an epoxy, or using some other attachment mechanism (e.g., friction, one or more clips, or a bottom support member).
FIG. 4
illustrates a view of the housing lid of the DRO of
FIG. 2
taken along line
2
—
2
of FIG.
2
and looking in the direction of the arrows. In one embodiment, support legs
208
are evenly spaced around the circumference of resonator
202
. In other embodiments, legs
208
could be unevenly spaced.
Referring again to
FIG. 2
, in one embodiment, support legs
208
are integrally attached to housing lid
206
. Accordingly, support legs
208
are composed of the same material (e.g., a metallic material) as housing lid
206
. Support legs
208
are machined to machine tolerances on the bottom surface of housing lid
206
, in one embodiment, so their position and dimensions can be extremely accurate. Accordingly, support legs
208
can be designed so that, when resonator
202
is seated within them, resonator
202
will be aligned exactly where it should be within cavity
222
. In this manner, the desired frequency characteristics, phase noise, and Q of the DRO
200
are achieved. This eliminates the need for the iterative position adjustment process that is used in prior art DRO assembly processes. In one embodiment, the resonator height is pre-determined to result in the desired stability characteristics throughout a desired temperature range. As is described later, during a tuning process, the resonant frequency is tested, and the frequency of DRO
200
is adjusted by moving tuning screw
214
into or out of cavity
222
until the desired frequency is obtained.
This results in a solid assembly, in which the resonator
202
will not sway, as with prior art systems. Support legs
208
lock resonator
202
down so that DRO
200
can withstand substantial vibration without experiencing unacceptable frequency changes, and thus maintaining lock.
In another embodiment, support legs
208
are coupled to housing lid
206
using an adhesive, such as an epoxy, or some other connection mechanism (e.g., friction, one or more clips or solder). In such an embodiment, support legs
208
could be composed of the same or a different material as housing lid
206
. For example, support legs
208
could be a metallic material, a dielectric material, or some other material.
To aid in the accurate positioning and attachment of support legs
208
, a notch (not shown) of a complementary size to house support legs
208
is formed (e.g. by machining) into the bottom surface of housing lid
206
, in one embodiment. Each support leg
208
is then seated in the complementary notch when the leg is connected to the housing lid
206
. The notches are machined, in one embodiment, so that accurate positioning of resonator
202
within cavity
222
is easily achievable.
In the embodiment shown in
FIGS. 2 and 4
, three, evenly-spaced support legs
208
are used to provide three points of support to resonator
202
. In alternate embodiments, more or fewer support legs
208
could be used, and support legs
208
could be spaced unevenly. For example, in one embodiment, a single support leg could form a whole or partial ring, which includes a step upon which resonator
202
is seated. In other embodiments, two support legs could be used, or four or more support legs could be used. In addition, if resonator
202
has a shape other than a cylindrical shape (e.g., square, rectangle, oval, triangle, hexagon, or other multi-sided or free-form shape), then a number of support legs necessary to provide adequate support should be used.
In an embodiment where support legs
208
are composed of a metallic material, the metallic material contacts resonator
202
. Because the field within resonator
202
is concentrated in the center of resonator
202
, the metallic material contacting the corners of resonator
202
does not result in a decrease in the electrical performance of resonator
202
, as long as the first and second surfaces
240
,
242
of the support leg step are sufficiently narrow. In another embodiment, a dielectric material (not shown) that shields resonator
202
from the metallic legs
208
is disposed between the first and/or second surfaces
240
,
242
and resonator
202
. This enables the first and/or second surfaces
240
,
242
to be wider, if desired, than they should be for the unshielded embodiment.
As described previously, the dimensions of resonator
202
defined the resonant frequency of resonator
202
. This frequency can be varied by a small percentage using tuning screw
214
and/or electric tuner
216
, both of which capacitively load resonator
202
.
Tuning screw
214
is used to coarsely tune resonator
202
(e.g., within about one percent of the resonant frequency). Tuning screw
214
is electrically conductive and is engaged with and extends through lid
206
for selective vertical movement into cavity
222
along the vertical axis of resonator
202
. When tuning screw
214
is withdrawn, thus increasing air gap
250
, the resonant frequency of resonator
202
is substantially a function of the size and composition of resonator
202
and the dimensions of cavity
222
. Cavity
222
can be tuned to other frequencies by advancing screw
214
into cavity
222
. Moving screw
214
into cavity
222
causes air gap
250
to be decreased, and cavity
222
to be resonant at a higher center frequency.
Electric tuner
216
is used to finely tune resonator
202
(e.g., by tenths of a percent) by capacitively loading resonator
202
. In one embodiment, electric tuner
216
is located along a portion of one or more sides
220
of housing
204
. Electric tuner
216
includes microstrip
228
coupled in series with varactor diode
230
, in one embodiment. Together, microstrip
228
and diode
230
perturb the tuning of cavity
222
when diode
230
is biased with a DC voltage. A conductor (not shown) is coupled to microstrip
228
on one side of diode
230
, and extends to the exterior of cavity
222
. The DC biasing voltage is applied to diode
230
via the conductor and an end portion of microstrip
228
. When biased, diode
230
introduces a series capacitance into microstrip
228
. The value of the capacitance, and thus the resonant frequency of DRO
200
, is adjusted by adjusting the DC bias voltage on diode
230
.
In another embodiment in which DRO
200
is electrically tunable, one side of varactor diode
230
is coupled in parallel with microstrip
228
, and the other side of diode
230
is coupled to a grounded conductor (not shown). A DC bias voltage applied to an end portion of microstrip
228
causes microstrip
228
to be capacitively coupled to ground. In this regard, the capacitance is a function of the DC bias voltage on diode
230
. As such, the resonant frequency of DRO
200
is electrically tuned by adjusting the DC bias voltage.
FIG. 5
illustrates a flowchart of a method for assembling the DRO shown in
FIG. 2
in accordance with one embodiment of the present invention. The method begins, in block
502
, by attaching a resonator (e.g., resonator
202
,
FIG. 2
) to support legs (e.g., legs
208
) in accordance with one of the various embodiments of the invention, described above. As mentioned previously, the support legs could be formed with or coupled to the housing lid. In one embodiment, attachment is achieved by applying an adhesive, such as an epoxy, to portions of the resonator and/or to the first and/or second surfaces (e.g., surfaces
240
,
242
) of the support legs. If necessary, the adhesive is then cured, in block
504
, by heating the lid assembly. In other embodiments, the resonator could be attached to the support legs using some other mechanism, such as friction, one or more clips, a bottom support member, an adhesive that requires no curing, or some other suitable technique.
In block
506
, a lid tuner (e.g., tuner
214
) is installed in a complementary tuner hole in the housing lid. This is done, for example, by screwing the lid tuner into the tuner hole.
In block
508
, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity
222
) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips
212
) and an electronic tuner (e.g., tuner
216
), in one embodiment.
The resonant frequency of the DRO is then measured, in block
510
, and the lid tuner is adjusted to achieve the desired frequency, if necessary. The method then ends.
One advantage to the method described above is that it is not necessary for the DRO circuitry (e.g., microstrips
212
and electronic tuner
216
) to be subjected to the high-temperature, heat curing processes that were necessary in prior art systems. Only the lid assembly is cured, in one embodiment. Thus, the method of the present invention results in a higher yield, because the DRO circuitry is not affected by the heating processes necessary using prior art methods. In addition, because the support legs can be machined to machine tolerances, in one embodiment, they can be designed to seat the dielectric resonator at the exact position within the resonant cavity that will yield the desired frequency. Thus, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.
FIG. 6
illustrates a cross-sectional, side view of a DRO
600
in accordance with a second embodiment of the present invention. DRO
600
is similar to the DRO
200
described in conjunction with
FIG. 2
, in that it includes dielectric resonator
602
, housing
604
, housing lid
606
, printed wiring board substrate
610
, microstrips
612
, tuning screw
614
, and electric tuner
616
. Each of these components functions much in the same manner as the embodiments described in conjunction with FIG.
2
.
The embodiment shown in
FIG. 6
differs from the embodiment shown in
FIG. 2
, however, in that a ring structure
608
is used to hold resonator
602
in a fixed position with respect to housing lid
606
. A top surface
630
of ring structure
608
is attached to the bottom surface
632
of housing lid
606
, and a bottom surface
634
of ring structure
608
is attached to a top surface
636
of resonator
602
.
Ring structure
608
can be designed so that, when resonator
602
is aligned with and coupled to it, resonator
602
will be positioned exactly where it should be, within resonant cavity
622
, in a manner that the desired frequency characteristics, phase noise, and Q of the DRO
600
are achieved. This eliminates the need for the iterative position adjustment process that is used in prior art DRO assembly processes. In one embodiment, the resonator height is pre-determined to result in the desired stability characteristics throughout a desired temperature range.
In one embodiment, ring structure
608
comprises a solid, low-loss, low-dielectric constant material, such as alumina, sapphire, Eco-foam, lithium niabate or boron nitride, for example. In such an embodiment, the width of the bottom surface
634
of ring structure
608
can be wider than the width of the step in the embodiment shown in
FIG. 2
, although it is not necessarily so. In another embodiment, ring structure
608
could comprise a metallic material, which is integrally attached to or coupled to housing lid
606
. In such an embodiment, a shielding material could be used between ring structure
608
and resonator
602
.
FIG. 6
shows a ring structure
608
having a rectangular cross-section. In other embodiments, ring structure
608
could have a round, oval, triangular, hexagonal, or other multi-sided or free-form cross-sectional shape.
Housing lid
606
includes a notch
640
in its bottom surface
632
, in one embodiment, into which ring structure
608
is seated, enabling ring structure
608
to be accurately connected during assembly. In another embodiment, no notch is used for alignment, and ring structure
608
is otherwise positioned on housing lid
606
.
FIG. 7
illustrates a top view of a ring structure
702
in accordance with the embodiment shown in FIG.
6
. In one embodiment, an outer diameter
704
of ring structure
702
is approximately equal to a diameter of resonator
602
. During assembly, this enables ring structure
702
and resonator
602
to be easily and accurately aligned and coupled together. In other embodiments, where resonator
602
is not cylindrical in shape, an outer circumference of ring structure
702
is made to match the circumference of resonator
602
, whatever that shape may be. In still other embodiments, the circumference of ring structure
702
may not match the circumference of resonator
602
.
An opening
706
exists in the center of ring structure
702
. When ring structure
702
is assembled with housing lid
606
and resonator
602
, the opening
706
provides an air gap and a space into which tuner
614
may advance to adjust the resonant frequency. Although the embodiment shown in
FIG. 7
illustrates circular inner and outer circumferences, the inner or outer circumferences could have other shapes as well.
The attachment of resonator
602
to ring structure
608
and housing lid
606
results in a solid assembly, in which the resonator
602
will not sway, as with prior art systems. Thus, DRO
600
can withstand substantial vibration without experiencing unacceptable frequency changes, and thus maintaining lock.
FIG. 8
illustrates a flowchart of a method for assembling the DRO shown in
FIG. 6
in accordance with one embodiment of the present invention. The method begins, in block
802
, by aligning and attaching together a ring structure (e.g., ring structure
608
) and a resonator (e.g., resonator
602
). In one embodiment, this is done by applying an adhesive, such as an epoxy, to portions of the resonator and/or to the bottom surface of the ring structure, accurately aligning the resonator and ring structure, and pressing them together. In one embodiment, the components are accurately aligned using a sleeve or other alignment mechanism, which is designed to align components of the size and shape of the ring structure and resonator.
If necessary, the adhesive is then cured, in block
804
, by heating the resonator and ring structure. In other embodiments, the resonator could be attached to the ring structure using some other mechanism, such as an adhesive that requires no curing or some other suitable technique.
In block
806
, the ring structure is then aligned and attached to the housing lid (e.g., lid
606
). In one embodiment, this is done by applying an adhesive, such as an epoxy, to the top surface of the ring structure and/or within a notch (e.g., notch
640
) on the bottom surface of the housing lid. The ring structure is then pressed into the notch. The adhesive is cured, if necessary, in block
808
, by heating the housing lid, ring structure, and resonator. In other embodiments, the ring structure could be attached to the housing lid using some other mechanism, such as friction, one or more clips, a bottom support, an adhesive that requires no curing, or some other suitable technique. In addition, in another embodiment, no notch
640
may be present in the bottom surface
632
of the housing lid
606
, and alignment of the ring structure
608
could be performed in another manner.
In block
810
, a lid tuner (e.g., tuner
614
) is installed in a complementary tuner hole in the housing lid. This is done, for example, by screwing the lid tuner into the tuner hole.
In block
812
, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity
622
) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips
612
) and an electronic tuner (e.g., tuner
616
), in one embodiment.
The resonant frequency of the DRO is then measured, in block
814
, and the lid tuner is adjusted to achieve the desired frequency, if necessary. The method then ends.
As with the embodiments described in conjunction with
FIGS. 2-5
, one advantage to the method described above is that it is not necessary for the DRO circuitry (e.g., microstrips
612
and electronic tuner
616
) to be subjected to the high-temperature, heat curing processes that were necessary in prior art systems. In addition, because the ring structure can be accurately positioned using a complementary notch in the housing lid, and the ring structure height can be pre-designed to yield the desired phase noise, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.
FIG. 9
illustrates a cross-sectional, side view of a DRO in accordance with a third embodiment of the present invention. DRO
900
is similar to the DRO
200
described in conjunction with
FIG. 2
, in that it includes dielectric resonator
902
, housing
904
, housing lid
906
, printed wiring board substrate
910
, microstrips
912
, and electric tuner
916
. Each of these components functions much in the same manner as the embodiments described in conjunction with FIG.
2
.
The embodiment shown in
FIG. 9
differs from the embodiment shown in
FIG. 2
, however, in that two tuning screws
914
,
915
and two dielectric pedestals
908
,
909
are used to hold resonator
902
in a fixed position with respect to housing
904
and housing lid
906
. Pedestals
908
,
909
are made of a solid, low-loss, low-dielectric constant material, such as alumina, sapphire, Eco-foam, lithium niabate or boron nitride, for example.
Tuning screws
914
,
915
are electrically conductive, and they are used to coarsely tune resonator
902
(e.g., within about one percent of the resonant frequency). The first tuning screw
914
, referred to as the “lid tuner,” is engaged with and extends through lid
906
for selective vertical movement into cavity
922
along the vertical axis of resonator
902
. Rather than having an air gap (e.g., air gap
250
,
FIG. 2
) between the tuning screw
914
and resonator
902
, a first dielectric pedestal
908
, referred to a the “lid pedestal,” contacts the end of tuning screw
914
and a center portion of the top surface of resonator
902
, providing capacitive spacing between screw
914
and resonator
902
.
The second tuning screw
915
, referred to as the “housing tuner,” is engaged with and extends through the bottom
920
of housing
904
, also for selective vertical movement into cavity
922
along the vertical axis of resonator
902
. A second dielectric pedestal
909
, referred to as the “housing pedestal,” contacts the end of tuning screw
915
and a center portion of the bottom surface of resonator
902
, also providing capacitive spacing between screw
915
and resonator
902
. Once assembled, the tuning screws
914
,
915
and pedestals
908
,
909
result in a solid assembly, in which the resonator
902
will not sway.
During a tuning process, the resonant frequency of DRO
900
is tested, and the stability of DRO
900
is adjusted by moving tuning screws
914
,
915
into and out of cavity
922
until the desired frequency is obtained. As one screw is moved into cavity
922
, the other screw is moved out of cavity
922
, so that the resonator
902
continues to be supported by both tuning screws
914
,
915
and pedestals
908
,
909
.
FIG. 10
illustrates a flowchart of a method for assembling the DRO
900
shown in
FIG. 9
in accordance with one embodiment of the present invention. The method begins, in block
1002
, by aligning and attaching together the housing tuner (e.g., tuner
915
, FIG.
9
), housing pedestal (e.g., pedestal
909
), and resonator (e.g., resonator
902
). In one embodiment, this is done by applying an adhesive, such as an epoxy, to the end of the housing tuner, the top and bottom of the housing pedestal, and/or the center portion of the bottom of the resonator. The three components are then aligned and pressed together. In one embodiment, the components are accurately aligned using a sleeve or other alignment mechanism, which is designed to align components of the size and shape of the tuner, pedestal, and resonator.
If necessary, the adhesive is then cured, in block
1004
, by heating the housing tuner, housing pedestal, and resonator, referred to as the “housing assembly.” In other embodiments, the components could be attached together using some other mechanism, such as an adhesive that requires no curing or some other suitable technique.
In block
1006
, the lid pedestal (e.g., pedestal
908
) and lid tuner (e.g., tuner
914
) are aligned and attached together. In one embodiment, this is done in a manner similar to aligning and attaching the housing tuner and the housing pedestal. If necessary, the adhesive used to attach the lid pedestal and lid tuner is cured, in block
1008
, by heating the lid tuner and lid pedestal, referred to as the “lid assembly.”
In block
1010
, the housing assembly is attached to the housing by installing the housing tuner in a complementary tuner hole in the bottom of the housing. Similarly, the lid assembly is attached to the lid by installing the lid tuner in a complementary tuner hole in the lid. This is done, for example, by screwing the housing tuner and the lid tuner into the tuner holes.
In block
1012
, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity
922
) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips
912
) and an electronic tuner (e.g., tuner
916
), in one embodiment.
The resonant frequency of the DRO is then measured, in block
1014
, and the housing tuner is adjusted to achieve the desired frequency, if necessary. In one embodiment, the resonator height is initially set to a pre-defined height that is known to have the desired stability characteristics throughout a desired temperature range, and then that height is adjusted, if necessary.
Once the desired frequency is achieved, the lid tuner is advanced into the cavity, in block
1016
, until the lid assembly makes contact with the resonator. This may affect the resonant frequency. Accordingly, the resonant frequency is again measured, in block
1018
, and the housing and lid tuners are adjusted, if necessary, until the desired resonant frequency is obtained. Adjustment of the housing and lid tuners is done in a complementary manner, so that the resonator remains clamped between the housing and lid pedestals. In other words, as one tuner is backed out of the resonant cavity, the other tuner is advanced into the resonant cavity, so that both pedestals continue to contact the resonator.
Once the desired resonant frequency is attained, the lid is removed, in block
1020
, adhesive is applied to the bottom of the lid pedestal and/or the center portion of the top of the resonator. The housing and lid are then re-assembled, and the lid tuner is advanced until the lid pedestal makes contact with the resonator. If necessary, the adhesive used to attach the lid pedestal and resonator is cured, in block
1022
, by heating the DRO. After block
1022
, the method ends.
In an alternate embodiment, prior to block
1010
, the resonator could be attached to the lid assembly, rather than to the housing assembly. Then, the lid tuner could be adjusted, in block
1014
, to initially achieve the resonant frequency. Finally, the bottom pedestal and resonator would be attached together, in block
1020
.
Where prior art methods require the DRO to be cured twice, only a single curing process is performed in this embodiment. Therefore, one advantage to the present invention is that the DRO circuitry (e.g., microstrips
912
and electronic tuner
916
) is subjected to fewer heating processes, thus increasing the yield. As described previously, in other embodiments, the components could be attached together using some other mechanism, such as an adhesive that requires no curing or some other suitable attachment technique. In such embodiments, it would not be necessary to subject the DRO circuitry to any heating process.
Still another advantage to this embodiment is that the resonator can be accurately positioned in the horizontal plane within the resonant cavity, because the tuning screw locations can be set to machine tolerances, and because the resonator, pedestals, and tuning screws can be accurately aligned using a sleeve or other alignment method. Thus, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.
A significant advantage to all of the embodiments described above is that the support structures of the various embodiments hold the resonator in a fixed position with respect to the housing. This results in a DRO that is much less susceptible to performance degradation in the presence of mechanical vibration. This makes the DROs of the various embodiments useful in mobile and other applications for which prior art DROs were not practical.
In the foregoing detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. The foregoing detailed description uses terms that are provided in order to make the detailed description more easily understandable. It is to be understood that these terms and the phraseology employed in the description should not be construed to limit the scope of the invention.
It will be understood by those skilled in the art that the operations of the methods shown and described herein can be carried out in a different order than those described with reference to the drawings. It will be further understood that the various elements illustrated in the drawings are merely representational and are not drawn to scale. Certain proportions thereof may be exaggerated, while others may be minimized. The drawings are intended to illustrate various implementations of the invention, which can be understood and appropriately carried out by those of ordinary skill in the art.
It will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiment shown. For example, although the description refers to resonators, pedestals, and support structures of various materials and having particular shapes, numerous other materials and component shapes could be used without departing from the spirit and scope of the present invention.
This application is intended to cover any adaptations or variations of the present invention that fall within its scope. The foregoing detailed description, therefore, is not to be taken in a limiting sense, and it will be readily understood by those skilled in the art that various changes in the details, materials, and arrangements of the parts and operations which have been described and illustrated in order to explain the nature of this invention may be made without departing from the spirit and scope of the invention as expressed in the adjoining claims.
Claims
- 1. A dielectric resonator oscillator (DRO) comprising:a housing; a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing; a dielectric resonator positioned within the resonant cavity; and a support structure comprising a conductive material and extending downward from the bottom surface of the housing lid, which contacts a top surface of the dielectric resonator, holding the dielectric resonator in a fixed position with respect to the housing lid, wherein the support structure comprises one or more support legs, and wherein each of the one or more support legs includes a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
- 2. The DRO as claimed in claim 1, wherein the support structure comprises a ring structure having a bottom surface that contacts the top surface of the dielectric resonator.
- 3. The DRO as claimed in claim 2, wherein an outer circumference of the ring structure is approximately equal to a circumference of the dielectric resonator.
- 4. The DRO as claimed in claim 2, wherein the ring structure is coupled to the housing lid, and the housing lid comprises a notch on the bottom surface of the housing lid within which the ring structure is seated when it is coupled to the housing lid.
- 5. The DRO as claimed in claim 1, wherein the one or more support legs are integrally attached to the housing lid.
- 6. The DRO as claimed in claim 1, wherein the one or more support legs are coupled to the housing lid.
- 7. The DRO as claimed in claim 6, wherein the housing lid comprises a notch on the bottom surface within which the one or more support legs are seated when they are coupled to the housing lid.
- 8. The DRO as claimed in claim 1, wherein the one or more support legs include at least three support legs that provide at least three points of support to the dielectric resonator.
- 9. A dielectric resonator oscillator (DRO) comprising:a housing; a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing; a dielectric resonator positioned within the resonant cavity; and one or more support legs comprised of a conductive material and integrally attached to and extending downward from the bottom surface of the housing lid, which contact a top surface of the dielectric resonator, holding the dielectric resonator in a fixed position with respect to the housing lid, wherein each of the one or more support legs includes a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
- 10. The DRO as claimed in claim 9, wherein the one or more support legs include at least three support legs that provide at least three points of support to the dielectric resonator.
- 11. A method of assembling a dielectric resonator oscillator (DRO) that includes a housing and a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing, the method comprising:attaching a top surface of a dielectric resonator to a first support structure comprised of a conductive material that extends downward from the bottom surface of the housing lid, so that the dielectric resonator is held in a fixed position with respect to the housing lid; assembling the housing and the housing lid; and adjusting one or more tuners until the DRO has a desired frequency.
- 12. The method as claimed in claim 11, wherein the first support structure comprises one or more support legs, and attaching the top surface of the dielectric resonator to the first support structure comprises attaching the top surface of the dielectric resonator to the one or more support legs, each of the one or more support legs including a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
- 13. The method as claimed in claim 11, wherein the first support structure comprises a ring structure having a bottom surface, and attaching the top surface of the dielectric resonator to the first support structure comprises attaching the top surface of the dielectric resonator to the bottom surface of the ring structure.
US Referenced Citations (7)