Dielectric resonator oscillator and methods of assembly therefor

Information

  • Patent Grant
  • 6538536
  • Patent Number
    6,538,536
  • Date Filed
    Wednesday, September 27, 2000
    24 years ago
  • Date Issued
    Tuesday, March 25, 2003
    21 years ago
Abstract
A dielectric resonator oscillator (DRO) (200, FIG. 2; 600, FIG. 6; 900, FIG. 9) includes a dielectric resonator (202, 602, 902) that is held in a fixed position with respect to the housing lid (206, 606, 906). In one embodiment, the resonator is attached to the housing lid using one or more support legs (208). In another embodiment, the resonator is attached to the housing lid using a ring structure (608). In still another embodiment, the resonator is attached to the lid and housing (904) using a lid tuner (914) and lid pedestal (908), and a housing tuner (915) and housing pedestal (909). Resonator positioning within the DRO cavity (222, 622, 922) is simplified by accurately aligning and attaching the support structure to the resonator.
Description




TECHNICAL FIELD




The invention relates generally to dielectric resonator oscillators (DROs) and methods of their assembly and, more specifically, to DROs having dielectric resonators that are attached to the DRO housing in such a manner that the DRO operation is not substantially affected by mechanical vibration.




BACKGROUND OF THE INVENTION




Dielectric resonator oscillators (DROs) are commonly used in high-precision RF and microwave systems to generate high-frequency signals of extremely good spectral purity. For example, DROs have been used in radars, transponders, and communication systems, among other systems, to generate microwave signals with extremely low phase noise and good temperature stability. Generally, in these systems, the DRO is used to generate a frequency that is locked to a reference oscillator within a phase-locked loop circuit.





FIG. 1

illustrates a cross-sectional, side view of a DRO


100


in accordance with the prior art. DRO


100


includes dielectric resonator


102


, housing


104


, housing lid


106


, dielectric pedestal


108


, printed wiring board substrate


110


, microstrips


112


, tuning screw


114


, and wall mounted electric tuner


116


. Dielectric resonator


102


is used as a frequency determining circuit element. Dielectric resonator


102


is made of a rigid ceramic material, having a very high dielectric value.




Housing


104


and housing lid


106


are made of a metallic material. Housing


104


is a structure having a bottom


118


and sides


120


. When assembled, housing


104


and housing lid


106


create a resonant cavity


122


.




During operation, electromagnetic energy is coupled into cavity


122


and resonator


102


at the resonant frequency via microstrips


112


located on substrate


110


, which is located on the housing bottom


114


. Likewise, energy at the resonant frequency can be extracted from cavity


122


via microstrips


112


.




The relative position of dielectric resonator


102


within resonant cavity


122


affects the frequency characteristics and the Q of the DRO. The position of resonator


102


is defined by the height of pedestal


108


and the horizontal placement of dielectric resonator


102


on pedestal


108


. Pedestal


108


is made of a solid, low-loss, low-dielectric constant material.




During a typical assembly process, substrate


110


and microstrips


112


are first attached to the housing bottom


118


. Then, pedestal


108


is attached to the substrate


110


using an epoxy material, which requires a high-temperature, heat-curing process. In some prior art processes, pedestal


108


is attached directly to housing bottom


118


using an epoxy, after substrate


110


is attached to the housing bottom


118


.




After pedestal


108


is attached to housing


104


(or substrate


110


) and heat-cured, resonator


102


is placed on pedestal


108


, and an iterative position adjustment process is performed. This is necessary because the oscillator circuit will oscillate only over a fairly narrow range of resonator positions on pedestal


108


. The position adjustment process involves assembling housing lid


106


to housing


104


, and testing the frequency. The lid


106


is then removed, and if the frequency is not accurate enough, the resonator position on pedestal


108


is adjusted along the horizontal plane. This testing and position adjustment process is repeated until the desired performance is attained. Resonator


102


is then carefully removed, applied with epoxy, and re-positioned on pedestal


108


. The assembly is again heat-cured and tested for performance. Coarse frequency adjustments are then performed using tuning screw


114


, as is described below.




As the above description indicates, the entire DRO


100


is heated at least twice during assembly. This double-heating process decreases the yield of acceptable DROs, because the circuitry within DRO


100


is cumulatively affected by the heating processes. In addition, it can be difficult and time consuming to accurately adjust the position of resonator


102


on pedestal


108


, and to accurately re-position resonator


102


on pedestal


108


after application of the epoxy to resonator


102


.




The dimensions of resonator


102


define the resonant frequency of resonator


102


. This frequency can be varied by a small percentage using tuning screw


114


and/or electric tuner


116


, both of which capacitively load resonator


102


. Tuning screw


114


is used to coarsely tune resonator


102


(e.g., within about one percent of the resonant frequency), and wall mounted electric tuner


116


is used to finely tune resonator


102


(e.g., by tenths of a percent).




The frequency characteristics of resonator


102


are adversely affected if tuning screw


114


makes contact with resonator


102


. Accordingly, an air gap


128


must exist between the bottom of tuning screw


114


and the top of resonator


102


in prior art systems.




In this prior art configuration, resonator


102


is held in position only by pedestal


108


. Accordingly, when DRO


100


is subject to mechanical vibration, pedestal


108


and resonator


102


can sway. When the vibration is sufficient, the movement of resonator


102


within cavity


122


can be enough to adversely affect the frequency characteristics of the DRO


100


. In some cases, the movement can be severe enough to cause frequency fluctuations in the megahertz range, which can cause a DRO that is used in conjunction with a phase-locked loop circuit to lose lock with the reference oscillator. If the vibration is more than momentary, the circuit will continue to lose lock. Because prior art DROs are so sensitive to resonator position, prior art DROs are unsuitable, in many cases, for use in mobile apparatus, or other apparatus that may experience vibration conditions.




What are needed are DROs and methods of their assembly that simplify the process of positioning the dielectric resonator within the DRO cavity. In addition, what are needed are methods of assembling a DRO that eliminate the need to subject the DRO circuitry to multiple heating processes. Finally, what are needed are DROs that have resonators mounted in a manner that the DRO operation is not substantially affected by mechanical vibration.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

illustrates a cross-sectional, side view of a dielectric resonator oscillator (DRO) in accordance with the prior art;





FIG. 2

illustrates a cross-sectional, side view of a DRO in accordance with one embodiment of the present invention;





FIG. 3

illustrates a view of the DRO of

FIG. 2

taken along line


1





1


of FIG.


2


and looking in the direction of the arrows;





FIG. 4

illustrates a view of the housing lid of the DRO of

FIG. 2

taken along line


2





2


of FIG.


2


and looking in the direction of the arrows;





FIG. 5

illustrates a flowchart of a method for assembling the DRO shown in

FIG. 2

in accordance with one embodiment of the present invention;





FIG. 6

illustrates a cross-sectional, side view of a DRO in accordance with a second embodiment of the present invention;





FIG. 7

illustrates a top view of a ring structure in accordance with the embodiment shown in

FIG. 6

;





FIG. 8

illustrates a flowchart of a method for assembling the DRO shown in

FIG. 6

in accordance with one embodiment of the present invention;





FIG. 9

illustrates a cross-sectional, side view of a DRO in accordance with a third embodiment of the present invention; and





FIG. 10

illustrates a flowchart of a method for assembling the DRO shown in

FIG. 9

in accordance with one embodiment of the present invention.











DETAILED DESCRIPTION




Embodiments of the present invention provide a dielectric resonator oscillator (DRO) having a dielectric resonator that is held in a fixed position with respect to the DRO housing lid using a support structure that extends downward from the housing lid. This firm attachment results in a DRO whose operation is not substantially affected by mechanical vibration.




In one embodiment, the resonator is attached to the housing lid using one or more support legs that contact portions of the top and side of the resonator. In another embodiment, the resonator is attached to the housing lid using a ring structure that contacts the top of the resonator. In still another embodiment, the resonator is attached to the housing and housing lid using two support structures that contact the top and bottom of the resonator, each structure including a tuning screw and a dielectric pedestal. During assembly of each of these embodiments, the accurate alignment of the resonator within the DRO cavity is much simpler than with prior art DROs. In addition, the DRO circuitry is not subject to multiple heating processes, as is done in prior art DRO assembly methods.





FIG. 2

illustrates a cross-sectional, side view of a DRO in accordance with one embodiment of the present invention. DRO


200


includes dielectric resonator


202


, housing


204


, housing lid


206


, support legs


208


, printed wiring board substrate


210


, microstrips


212


, tuning screw


214


, and electric tuner


216


.




Dielectric resonator


202


is used as a frequency determining circuit element. Dielectric resonator


202


is made of a rigid ceramic material, having a very high dielectric value. Resonator


202


is often referred to as a “disk” or “puck” because it typically has a cylindrical shape, although resonators of other shapes are also used. The dimensions of resonator


202


define its resonant frequency. For example, a resonator having dimensions of 0.75 cm in diameter by 0.3 cm in height would have a resonant frequency of about 6 GHz. Typical resonators have resonant frequencies in a range of 2-30 GHz, although resonators with higher or lower resonant frequencies also could be used.




Housing


204


and housing lid


206


comprise a metallic material, such as aluminum, copper, silver or another conductive material, or a mixture thereof. Housing


204


is a structure having a bottom


218


and sides


220


. When assembled, housing


204


and housing lid


206


create a resonant cavity


222


. Typically, the dimensions of cavity


222


are chosen so that the natural resonant frequency of resonator


202


is unperturbed when placed inside cavity


222


. The width


224


of cavity


222


is typically from two to three times the diameter of resonator


202


, and the height


226


of cavity


222


is typically up to about two times the thickness of resonator


202


, although cavities


222


having different dimensions could be used as well. During operation, electromagnetic energy is coupled into cavity


222


and resonator


202


at the resonant frequency via microstrips


212


located on substrate


210


on the housing bottom


218


.





FIG. 3

illustrates a view of the DRO of

FIG. 2

taken along line


1





1


of FIG.


2


and looking in the direction of the arrows. Microstrips


212


, which are formed (e.g. through deposition) on the printed wiring board substrate


210


, are shown to have a “U” shaped configuration, although other configurations could be used as well. When current is passed through microstrips


212


, a magnetic field is formed through resonator


202


, causing energy to be coupled into resonator


202


. Resonator


202


then resonates at a sharp resonance, based on the Q of resonator


202


. The Q of resonator


202


is typically from 8,000-12,000, although the Q could be higher or lower than this range as well. Energy at the resonant frequency can be extracted from the resonant cavity (e.g., cavity


222


,

FIG. 2

) via microstrips


212


. In general, DRO


200


enables only a very narrow band of frequencies to pass through, making it particularly useful as a very narrow-band filter.




Generally, the farther resonator


202


is away from the printed wiring board substrate


210


and microstrips


212


, the higher the Q of the resonant network and the lower the phase noise, resulting in a narrower band of frequencies allowed to pass through the DRO (i.e., a more pure tone). Referring back to

FIG. 2

, the position of resonator


202


is defined by the location and height of support legs


208


. The height of supports


208


is typically chosen to position resonator


202


such that performance near the desired frequency is maintained, although resonator


202


could be positioned closer to or farther from microstrips


212


as well.




Each of support legs


208


includes a step, in one embodiment, where the step has a first surface


240


and a second surface


242


. When resonator


202


is seated on support legs


208


, the first surface


240


is substantially parallel to and contacts the top surface


244


of resonator


202


and the second surface


242


is substantially parallel to and contacts the side surface


246


of resonator


202


. In one embodiment, resonator


202


is seated on and attached to support legs


208


using an adhesive, such as an epoxy, or using some other attachment mechanism (e.g., friction, one or more clips, or a bottom support member).





FIG. 4

illustrates a view of the housing lid of the DRO of

FIG. 2

taken along line


2





2


of FIG.


2


and looking in the direction of the arrows. In one embodiment, support legs


208


are evenly spaced around the circumference of resonator


202


. In other embodiments, legs


208


could be unevenly spaced.




Referring again to

FIG. 2

, in one embodiment, support legs


208


are integrally attached to housing lid


206


. Accordingly, support legs


208


are composed of the same material (e.g., a metallic material) as housing lid


206


. Support legs


208


are machined to machine tolerances on the bottom surface of housing lid


206


, in one embodiment, so their position and dimensions can be extremely accurate. Accordingly, support legs


208


can be designed so that, when resonator


202


is seated within them, resonator


202


will be aligned exactly where it should be within cavity


222


. In this manner, the desired frequency characteristics, phase noise, and Q of the DRO


200


are achieved. This eliminates the need for the iterative position adjustment process that is used in prior art DRO assembly processes. In one embodiment, the resonator height is pre-determined to result in the desired stability characteristics throughout a desired temperature range. As is described later, during a tuning process, the resonant frequency is tested, and the frequency of DRO


200


is adjusted by moving tuning screw


214


into or out of cavity


222


until the desired frequency is obtained.




This results in a solid assembly, in which the resonator


202


will not sway, as with prior art systems. Support legs


208


lock resonator


202


down so that DRO


200


can withstand substantial vibration without experiencing unacceptable frequency changes, and thus maintaining lock.




In another embodiment, support legs


208


are coupled to housing lid


206


using an adhesive, such as an epoxy, or some other connection mechanism (e.g., friction, one or more clips or solder). In such an embodiment, support legs


208


could be composed of the same or a different material as housing lid


206


. For example, support legs


208


could be a metallic material, a dielectric material, or some other material.




To aid in the accurate positioning and attachment of support legs


208


, a notch (not shown) of a complementary size to house support legs


208


is formed (e.g. by machining) into the bottom surface of housing lid


206


, in one embodiment. Each support leg


208


is then seated in the complementary notch when the leg is connected to the housing lid


206


. The notches are machined, in one embodiment, so that accurate positioning of resonator


202


within cavity


222


is easily achievable.




In the embodiment shown in

FIGS. 2 and 4

, three, evenly-spaced support legs


208


are used to provide three points of support to resonator


202


. In alternate embodiments, more or fewer support legs


208


could be used, and support legs


208


could be spaced unevenly. For example, in one embodiment, a single support leg could form a whole or partial ring, which includes a step upon which resonator


202


is seated. In other embodiments, two support legs could be used, or four or more support legs could be used. In addition, if resonator


202


has a shape other than a cylindrical shape (e.g., square, rectangle, oval, triangle, hexagon, or other multi-sided or free-form shape), then a number of support legs necessary to provide adequate support should be used.




In an embodiment where support legs


208


are composed of a metallic material, the metallic material contacts resonator


202


. Because the field within resonator


202


is concentrated in the center of resonator


202


, the metallic material contacting the corners of resonator


202


does not result in a decrease in the electrical performance of resonator


202


, as long as the first and second surfaces


240


,


242


of the support leg step are sufficiently narrow. In another embodiment, a dielectric material (not shown) that shields resonator


202


from the metallic legs


208


is disposed between the first and/or second surfaces


240


,


242


and resonator


202


. This enables the first and/or second surfaces


240


,


242


to be wider, if desired, than they should be for the unshielded embodiment.




As described previously, the dimensions of resonator


202


defined the resonant frequency of resonator


202


. This frequency can be varied by a small percentage using tuning screw


214


and/or electric tuner


216


, both of which capacitively load resonator


202


.




Tuning screw


214


is used to coarsely tune resonator


202


(e.g., within about one percent of the resonant frequency). Tuning screw


214


is electrically conductive and is engaged with and extends through lid


206


for selective vertical movement into cavity


222


along the vertical axis of resonator


202


. When tuning screw


214


is withdrawn, thus increasing air gap


250


, the resonant frequency of resonator


202


is substantially a function of the size and composition of resonator


202


and the dimensions of cavity


222


. Cavity


222


can be tuned to other frequencies by advancing screw


214


into cavity


222


. Moving screw


214


into cavity


222


causes air gap


250


to be decreased, and cavity


222


to be resonant at a higher center frequency.




Electric tuner


216


is used to finely tune resonator


202


(e.g., by tenths of a percent) by capacitively loading resonator


202


. In one embodiment, electric tuner


216


is located along a portion of one or more sides


220


of housing


204


. Electric tuner


216


includes microstrip


228


coupled in series with varactor diode


230


, in one embodiment. Together, microstrip


228


and diode


230


perturb the tuning of cavity


222


when diode


230


is biased with a DC voltage. A conductor (not shown) is coupled to microstrip


228


on one side of diode


230


, and extends to the exterior of cavity


222


. The DC biasing voltage is applied to diode


230


via the conductor and an end portion of microstrip


228


. When biased, diode


230


introduces a series capacitance into microstrip


228


. The value of the capacitance, and thus the resonant frequency of DRO


200


, is adjusted by adjusting the DC bias voltage on diode


230


.




In another embodiment in which DRO


200


is electrically tunable, one side of varactor diode


230


is coupled in parallel with microstrip


228


, and the other side of diode


230


is coupled to a grounded conductor (not shown). A DC bias voltage applied to an end portion of microstrip


228


causes microstrip


228


to be capacitively coupled to ground. In this regard, the capacitance is a function of the DC bias voltage on diode


230


. As such, the resonant frequency of DRO


200


is electrically tuned by adjusting the DC bias voltage.





FIG. 5

illustrates a flowchart of a method for assembling the DRO shown in

FIG. 2

in accordance with one embodiment of the present invention. The method begins, in block


502


, by attaching a resonator (e.g., resonator


202


,

FIG. 2

) to support legs (e.g., legs


208


) in accordance with one of the various embodiments of the invention, described above. As mentioned previously, the support legs could be formed with or coupled to the housing lid. In one embodiment, attachment is achieved by applying an adhesive, such as an epoxy, to portions of the resonator and/or to the first and/or second surfaces (e.g., surfaces


240


,


242


) of the support legs. If necessary, the adhesive is then cured, in block


504


, by heating the lid assembly. In other embodiments, the resonator could be attached to the support legs using some other mechanism, such as friction, one or more clips, a bottom support member, an adhesive that requires no curing, or some other suitable technique.




In block


506


, a lid tuner (e.g., tuner


214


) is installed in a complementary tuner hole in the housing lid. This is done, for example, by screwing the lid tuner into the tuner hole.




In block


508


, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity


222


) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips


212


) and an electronic tuner (e.g., tuner


216


), in one embodiment.




The resonant frequency of the DRO is then measured, in block


510


, and the lid tuner is adjusted to achieve the desired frequency, if necessary. The method then ends.




One advantage to the method described above is that it is not necessary for the DRO circuitry (e.g., microstrips


212


and electronic tuner


216


) to be subjected to the high-temperature, heat curing processes that were necessary in prior art systems. Only the lid assembly is cured, in one embodiment. Thus, the method of the present invention results in a higher yield, because the DRO circuitry is not affected by the heating processes necessary using prior art methods. In addition, because the support legs can be machined to machine tolerances, in one embodiment, they can be designed to seat the dielectric resonator at the exact position within the resonant cavity that will yield the desired frequency. Thus, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.





FIG. 6

illustrates a cross-sectional, side view of a DRO


600


in accordance with a second embodiment of the present invention. DRO


600


is similar to the DRO


200


described in conjunction with

FIG. 2

, in that it includes dielectric resonator


602


, housing


604


, housing lid


606


, printed wiring board substrate


610


, microstrips


612


, tuning screw


614


, and electric tuner


616


. Each of these components functions much in the same manner as the embodiments described in conjunction with FIG.


2


.




The embodiment shown in

FIG. 6

differs from the embodiment shown in

FIG. 2

, however, in that a ring structure


608


is used to hold resonator


602


in a fixed position with respect to housing lid


606


. A top surface


630


of ring structure


608


is attached to the bottom surface


632


of housing lid


606


, and a bottom surface


634


of ring structure


608


is attached to a top surface


636


of resonator


602


.




Ring structure


608


can be designed so that, when resonator


602


is aligned with and coupled to it, resonator


602


will be positioned exactly where it should be, within resonant cavity


622


, in a manner that the desired frequency characteristics, phase noise, and Q of the DRO


600


are achieved. This eliminates the need for the iterative position adjustment process that is used in prior art DRO assembly processes. In one embodiment, the resonator height is pre-determined to result in the desired stability characteristics throughout a desired temperature range.




In one embodiment, ring structure


608


comprises a solid, low-loss, low-dielectric constant material, such as alumina, sapphire, Eco-foam, lithium niabate or boron nitride, for example. In such an embodiment, the width of the bottom surface


634


of ring structure


608


can be wider than the width of the step in the embodiment shown in

FIG. 2

, although it is not necessarily so. In another embodiment, ring structure


608


could comprise a metallic material, which is integrally attached to or coupled to housing lid


606


. In such an embodiment, a shielding material could be used between ring structure


608


and resonator


602


.





FIG. 6

shows a ring structure


608


having a rectangular cross-section. In other embodiments, ring structure


608


could have a round, oval, triangular, hexagonal, or other multi-sided or free-form cross-sectional shape.




Housing lid


606


includes a notch


640


in its bottom surface


632


, in one embodiment, into which ring structure


608


is seated, enabling ring structure


608


to be accurately connected during assembly. In another embodiment, no notch is used for alignment, and ring structure


608


is otherwise positioned on housing lid


606


.





FIG. 7

illustrates a top view of a ring structure


702


in accordance with the embodiment shown in FIG.


6


. In one embodiment, an outer diameter


704


of ring structure


702


is approximately equal to a diameter of resonator


602


. During assembly, this enables ring structure


702


and resonator


602


to be easily and accurately aligned and coupled together. In other embodiments, where resonator


602


is not cylindrical in shape, an outer circumference of ring structure


702


is made to match the circumference of resonator


602


, whatever that shape may be. In still other embodiments, the circumference of ring structure


702


may not match the circumference of resonator


602


.




An opening


706


exists in the center of ring structure


702


. When ring structure


702


is assembled with housing lid


606


and resonator


602


, the opening


706


provides an air gap and a space into which tuner


614


may advance to adjust the resonant frequency. Although the embodiment shown in

FIG. 7

illustrates circular inner and outer circumferences, the inner or outer circumferences could have other shapes as well.




The attachment of resonator


602


to ring structure


608


and housing lid


606


results in a solid assembly, in which the resonator


602


will not sway, as with prior art systems. Thus, DRO


600


can withstand substantial vibration without experiencing unacceptable frequency changes, and thus maintaining lock.





FIG. 8

illustrates a flowchart of a method for assembling the DRO shown in

FIG. 6

in accordance with one embodiment of the present invention. The method begins, in block


802


, by aligning and attaching together a ring structure (e.g., ring structure


608


) and a resonator (e.g., resonator


602


). In one embodiment, this is done by applying an adhesive, such as an epoxy, to portions of the resonator and/or to the bottom surface of the ring structure, accurately aligning the resonator and ring structure, and pressing them together. In one embodiment, the components are accurately aligned using a sleeve or other alignment mechanism, which is designed to align components of the size and shape of the ring structure and resonator.




If necessary, the adhesive is then cured, in block


804


, by heating the resonator and ring structure. In other embodiments, the resonator could be attached to the ring structure using some other mechanism, such as an adhesive that requires no curing or some other suitable technique.




In block


806


, the ring structure is then aligned and attached to the housing lid (e.g., lid


606


). In one embodiment, this is done by applying an adhesive, such as an epoxy, to the top surface of the ring structure and/or within a notch (e.g., notch


640


) on the bottom surface of the housing lid. The ring structure is then pressed into the notch. The adhesive is cured, if necessary, in block


808


, by heating the housing lid, ring structure, and resonator. In other embodiments, the ring structure could be attached to the housing lid using some other mechanism, such as friction, one or more clips, a bottom support, an adhesive that requires no curing, or some other suitable technique. In addition, in another embodiment, no notch


640


may be present in the bottom surface


632


of the housing lid


606


, and alignment of the ring structure


608


could be performed in another manner.




In block


810


, a lid tuner (e.g., tuner


614


) is installed in a complementary tuner hole in the housing lid. This is done, for example, by screwing the lid tuner into the tuner hole.




In block


812


, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity


622


) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips


612


) and an electronic tuner (e.g., tuner


616


), in one embodiment.




The resonant frequency of the DRO is then measured, in block


814


, and the lid tuner is adjusted to achieve the desired frequency, if necessary. The method then ends.




As with the embodiments described in conjunction with

FIGS. 2-5

, one advantage to the method described above is that it is not necessary for the DRO circuitry (e.g., microstrips


612


and electronic tuner


616


) to be subjected to the high-temperature, heat curing processes that were necessary in prior art systems. In addition, because the ring structure can be accurately positioned using a complementary notch in the housing lid, and the ring structure height can be pre-designed to yield the desired phase noise, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.





FIG. 9

illustrates a cross-sectional, side view of a DRO in accordance with a third embodiment of the present invention. DRO


900


is similar to the DRO


200


described in conjunction with

FIG. 2

, in that it includes dielectric resonator


902


, housing


904


, housing lid


906


, printed wiring board substrate


910


, microstrips


912


, and electric tuner


916


. Each of these components functions much in the same manner as the embodiments described in conjunction with FIG.


2


.




The embodiment shown in

FIG. 9

differs from the embodiment shown in

FIG. 2

, however, in that two tuning screws


914


,


915


and two dielectric pedestals


908


,


909


are used to hold resonator


902


in a fixed position with respect to housing


904


and housing lid


906


. Pedestals


908


,


909


are made of a solid, low-loss, low-dielectric constant material, such as alumina, sapphire, Eco-foam, lithium niabate or boron nitride, for example.




Tuning screws


914


,


915


are electrically conductive, and they are used to coarsely tune resonator


902


(e.g., within about one percent of the resonant frequency). The first tuning screw


914


, referred to as the “lid tuner,” is engaged with and extends through lid


906


for selective vertical movement into cavity


922


along the vertical axis of resonator


902


. Rather than having an air gap (e.g., air gap


250


,

FIG. 2

) between the tuning screw


914


and resonator


902


, a first dielectric pedestal


908


, referred to a the “lid pedestal,” contacts the end of tuning screw


914


and a center portion of the top surface of resonator


902


, providing capacitive spacing between screw


914


and resonator


902


.




The second tuning screw


915


, referred to as the “housing tuner,” is engaged with and extends through the bottom


920


of housing


904


, also for selective vertical movement into cavity


922


along the vertical axis of resonator


902


. A second dielectric pedestal


909


, referred to as the “housing pedestal,” contacts the end of tuning screw


915


and a center portion of the bottom surface of resonator


902


, also providing capacitive spacing between screw


915


and resonator


902


. Once assembled, the tuning screws


914


,


915


and pedestals


908


,


909


result in a solid assembly, in which the resonator


902


will not sway.




During a tuning process, the resonant frequency of DRO


900


is tested, and the stability of DRO


900


is adjusted by moving tuning screws


914


,


915


into and out of cavity


922


until the desired frequency is obtained. As one screw is moved into cavity


922


, the other screw is moved out of cavity


922


, so that the resonator


902


continues to be supported by both tuning screws


914


,


915


and pedestals


908


,


909


.





FIG. 10

illustrates a flowchart of a method for assembling the DRO


900


shown in

FIG. 9

in accordance with one embodiment of the present invention. The method begins, in block


1002


, by aligning and attaching together the housing tuner (e.g., tuner


915


, FIG.


9


), housing pedestal (e.g., pedestal


909


), and resonator (e.g., resonator


902


). In one embodiment, this is done by applying an adhesive, such as an epoxy, to the end of the housing tuner, the top and bottom of the housing pedestal, and/or the center portion of the bottom of the resonator. The three components are then aligned and pressed together. In one embodiment, the components are accurately aligned using a sleeve or other alignment mechanism, which is designed to align components of the size and shape of the tuner, pedestal, and resonator.




If necessary, the adhesive is then cured, in block


1004


, by heating the housing tuner, housing pedestal, and resonator, referred to as the “housing assembly.” In other embodiments, the components could be attached together using some other mechanism, such as an adhesive that requires no curing or some other suitable technique.




In block


1006


, the lid pedestal (e.g., pedestal


908


) and lid tuner (e.g., tuner


914


) are aligned and attached together. In one embodiment, this is done in a manner similar to aligning and attaching the housing tuner and the housing pedestal. If necessary, the adhesive used to attach the lid pedestal and lid tuner is cured, in block


1008


, by heating the lid tuner and lid pedestal, referred to as the “lid assembly.”




In block


1010


, the housing assembly is attached to the housing by installing the housing tuner in a complementary tuner hole in the bottom of the housing. Similarly, the lid assembly is attached to the lid by installing the lid tuner in a complementary tuner hole in the lid. This is done, for example, by screwing the housing tuner and the lid tuner into the tuner holes.




In block


1012


, the housing and lid are then assembled, forming a resonant cavity (e.g., cavity


922


) within which the resonator is positioned. The housing includes microstrips (e.g., microstrips


912


) and an electronic tuner (e.g., tuner


916


), in one embodiment.




The resonant frequency of the DRO is then measured, in block


1014


, and the housing tuner is adjusted to achieve the desired frequency, if necessary. In one embodiment, the resonator height is initially set to a pre-defined height that is known to have the desired stability characteristics throughout a desired temperature range, and then that height is adjusted, if necessary.




Once the desired frequency is achieved, the lid tuner is advanced into the cavity, in block


1016


, until the lid assembly makes contact with the resonator. This may affect the resonant frequency. Accordingly, the resonant frequency is again measured, in block


1018


, and the housing and lid tuners are adjusted, if necessary, until the desired resonant frequency is obtained. Adjustment of the housing and lid tuners is done in a complementary manner, so that the resonator remains clamped between the housing and lid pedestals. In other words, as one tuner is backed out of the resonant cavity, the other tuner is advanced into the resonant cavity, so that both pedestals continue to contact the resonator.




Once the desired resonant frequency is attained, the lid is removed, in block


1020


, adhesive is applied to the bottom of the lid pedestal and/or the center portion of the top of the resonator. The housing and lid are then re-assembled, and the lid tuner is advanced until the lid pedestal makes contact with the resonator. If necessary, the adhesive used to attach the lid pedestal and resonator is cured, in block


1022


, by heating the DRO. After block


1022


, the method ends.




In an alternate embodiment, prior to block


1010


, the resonator could be attached to the lid assembly, rather than to the housing assembly. Then, the lid tuner could be adjusted, in block


1014


, to initially achieve the resonant frequency. Finally, the bottom pedestal and resonator would be attached together, in block


1020


.




Where prior art methods require the DRO to be cured twice, only a single curing process is performed in this embodiment. Therefore, one advantage to the present invention is that the DRO circuitry (e.g., microstrips


912


and electronic tuner


916


) is subjected to fewer heating processes, thus increasing the yield. As described previously, in other embodiments, the components could be attached together using some other mechanism, such as an adhesive that requires no curing or some other suitable attachment technique. In such embodiments, it would not be necessary to subject the DRO circuitry to any heating process.




Still another advantage to this embodiment is that the resonator can be accurately positioned in the horizontal plane within the resonant cavity, because the tuning screw locations can be set to machine tolerances, and because the resonator, pedestals, and tuning screws can be accurately aligned using a sleeve or other alignment method. Thus, the iterative position adjustment process that was necessary using prior art systems is not necessary using the present invention.




A significant advantage to all of the embodiments described above is that the support structures of the various embodiments hold the resonator in a fixed position with respect to the housing. This results in a DRO that is much less susceptible to performance degradation in the presence of mechanical vibration. This makes the DROs of the various embodiments useful in mobile and other applications for which prior art DROs were not practical.




In the foregoing detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. The foregoing detailed description uses terms that are provided in order to make the detailed description more easily understandable. It is to be understood that these terms and the phraseology employed in the description should not be construed to limit the scope of the invention.




It will be understood by those skilled in the art that the operations of the methods shown and described herein can be carried out in a different order than those described with reference to the drawings. It will be further understood that the various elements illustrated in the drawings are merely representational and are not drawn to scale. Certain proportions thereof may be exaggerated, while others may be minimized. The drawings are intended to illustrate various implementations of the invention, which can be understood and appropriately carried out by those of ordinary skill in the art.




It will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiment shown. For example, although the description refers to resonators, pedestals, and support structures of various materials and having particular shapes, numerous other materials and component shapes could be used without departing from the spirit and scope of the present invention.




This application is intended to cover any adaptations or variations of the present invention that fall within its scope. The foregoing detailed description, therefore, is not to be taken in a limiting sense, and it will be readily understood by those skilled in the art that various changes in the details, materials, and arrangements of the parts and operations which have been described and illustrated in order to explain the nature of this invention may be made without departing from the spirit and scope of the invention as expressed in the adjoining claims.



Claims
  • 1. A dielectric resonator oscillator (DRO) comprising:a housing; a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing; a dielectric resonator positioned within the resonant cavity; and a support structure comprising a conductive material and extending downward from the bottom surface of the housing lid, which contacts a top surface of the dielectric resonator, holding the dielectric resonator in a fixed position with respect to the housing lid, wherein the support structure comprises one or more support legs, and wherein each of the one or more support legs includes a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
  • 2. The DRO as claimed in claim 1, wherein the support structure comprises a ring structure having a bottom surface that contacts the top surface of the dielectric resonator.
  • 3. The DRO as claimed in claim 2, wherein an outer circumference of the ring structure is approximately equal to a circumference of the dielectric resonator.
  • 4. The DRO as claimed in claim 2, wherein the ring structure is coupled to the housing lid, and the housing lid comprises a notch on the bottom surface of the housing lid within which the ring structure is seated when it is coupled to the housing lid.
  • 5. The DRO as claimed in claim 1, wherein the one or more support legs are integrally attached to the housing lid.
  • 6. The DRO as claimed in claim 1, wherein the one or more support legs are coupled to the housing lid.
  • 7. The DRO as claimed in claim 6, wherein the housing lid comprises a notch on the bottom surface within which the one or more support legs are seated when they are coupled to the housing lid.
  • 8. The DRO as claimed in claim 1, wherein the one or more support legs include at least three support legs that provide at least three points of support to the dielectric resonator.
  • 9. A dielectric resonator oscillator (DRO) comprising:a housing; a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing; a dielectric resonator positioned within the resonant cavity; and one or more support legs comprised of a conductive material and integrally attached to and extending downward from the bottom surface of the housing lid, which contact a top surface of the dielectric resonator, holding the dielectric resonator in a fixed position with respect to the housing lid, wherein each of the one or more support legs includes a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
  • 10. The DRO as claimed in claim 9, wherein the one or more support legs include at least three support legs that provide at least three points of support to the dielectric resonator.
  • 11. A method of assembling a dielectric resonator oscillator (DRO) that includes a housing and a housing lid having a bottom surface that completes a resonant cavity when the housing lid is attached to the housing, the method comprising:attaching a top surface of a dielectric resonator to a first support structure comprised of a conductive material that extends downward from the bottom surface of the housing lid, so that the dielectric resonator is held in a fixed position with respect to the housing lid; assembling the housing and the housing lid; and adjusting one or more tuners until the DRO has a desired frequency.
  • 12. The method as claimed in claim 11, wherein the first support structure comprises one or more support legs, and attaching the top surface of the dielectric resonator to the first support structure comprises attaching the top surface of the dielectric resonator to the one or more support legs, each of the one or more support legs including a step with a first surface and a second surface, and the first surface is substantially parallel to and contacts the top surface of the dielectric resonator and the second surface is substantially parallel to and contacts a side surface of the dielectric resonator.
  • 13. The method as claimed in claim 11, wherein the first support structure comprises a ring structure having a bottom surface, and attaching the top surface of the dielectric resonator to the first support structure comprises attaching the top surface of the dielectric resonator to the bottom surface of the ring structure.
US Referenced Citations (7)
Number Name Date Kind
5027090 Gueble et al. Jun 1991 A
5233319 Mizan et al. Aug 1993 A
5323129 Harris Jun 1994 A
5608363 Cameron et al. Mar 1997 A
5612655 Stronks et al. Mar 1997 A
5714920 Ivanov et al. Feb 1998 A
6002311 Wey et al. Dec 1999 A