Digital camera module using stacked chip package

Abstract

A digital camera module (10) includes a chip package (101) and a lens module (103) mounted on the chip package. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present digital camera module using stacked chip package can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the digital camera using stacked chip package. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a first preferred embodiment;

FIG. 2 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a second preferred embodiment;

FIG. 3 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a third preferred embodiment;

FIG. 4 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a fourth preferred embodiment;

FIG. 5 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a fifth preferred embodiment;

FIG. 6 is a schematic, cross-sectional view of a digital camera module, using a stacked chip package, according to a sixth preferred embodiment; and

FIG. 7 is a cross-sectional view of a conventional stacked chip package.

Claims

1. A digital camera module, comprising: a chip package, comprising: a substrate having a plurality of top contacts arranged thereon;a first chip attached to the substrate, the first chip including a plurality of first pads disposed on an upper surface thereof;a second chip disposed above the first chip, the second chip comprising a bottom surface facing the first chip and an upper surface provided with a plurality of second pads thereon;a plurality of wires, the wires respectively electrically connecting one of the first and second contacts to corresponding top contacts of the substrate, each wire forming a wire loop; anda cover disposed above the second chip, the cover having a bottom surface facing the second chip;wherein the bottom surface of the second chip is positioned above the wire loops of the wires connected with the first chip, and the bottom surface of the cover is above the wire loops of the wires connected with the second chip; anda lens module mounted to the chip package.

2. The digital camera module as claimed in claim 1, wherein the chip package further comprises an adhesive applied to the upper surface of the first chip and to a periphery of an upper surface of the second chip, wherein the adhesive applied to the first chip holds the second chip above the wire loops of the wires connected with the first chip to fix the bottom surface of the second chip on the first chip, and the adhesive applied to the second chip holds the cover above the wire loops of the wires connected with the second chip to fix the bottom surface of the cover on the second chip.

3. The digital camera module as claimed in claim 2, wherein the adhesive is further applied to the wires to cover the whole of each wire.

4. The digital camera module as claimed in claim 1, wherein the substrate comprises a board portion and a frame portion attached to the board portion, and the board portion and the frame portion cooperatively define a receiving cavity therein in which to receive the first and second chip.

5. The digital camera module as claimed in claim 4, wherein the top contacts includes a plurality of first top contacts and a plurality of second top contacts, the first top contacts are arranged on the board portion and are exposed to the cavity, the first top contacts are electrically connected with the first pads of the first chip, and the second top contacts are arranged on the frame portion and are electrically connected with the second pads of the second chip.

6. The digital camera module as claimed in claim 1, wherein the substrate comprises a board portion, a first frame portion, and a second frame portion arranged in that order, and the board portion and the first and second frame portion cooperatively define a receiving cavity therein in which to receive the first and second chip.

7. The digital camera module as claimed in claim 6, wherein the chip package further comprises an adhesive, wherein the adhesive is alternatively applied to one of the upper surface of the first chip and an inner periphery of an upper surface of the first frame portion to fix the second chip to the one thereof, and the adhesive holds the second chip above the wire loops of the wires connected with the first chip.

8. The digital camera module as claimed in claim 7, wherein the adhesive is further applied to a periphery of the second chip and holds the cover above the wire loops of the wires connected with the second chip.

9. The digital camera module as claimed in claim 8, wherein the adhesive is further applied to the wires to cover the whole of each wire.

10. The digital camera module as claimed in claim 8, wherein the adhesive is further applied to the top of the second frame portion to adhere the bottom surface of the cover thereon.

11. The digital camera module as claimed in claim 8, wherein the substrate further comprises a third frame portion, the third frame portion is attached to the second frame portion, and the adhesive is further applied to the top of the third frame portion to fix the bottom surface of the cover thereto.

12. The digital camera module as claimed in claim 6, wherein the top contacts comprise a plurality of first top contacts and a plurality of second top contacts, and the first top contacts are alternatively arranged on one of the board portion and the first frame portion and are electrically connected with the first pads of the first chip, and the second top contacts are alternatively arranged on one of the first frame portion and the second frame portion and are electrically connected with the second pads of the second chip.

13. The digital camera module as claimed in claim 1, wherein the lens module comprises a holder, the holder has a seat portion and a cylinder portion, the seat portion is mounted on and thereby engages the chip package, and the cylinder portion projects from the seat portion.

14. The digital camera module as claimed in claim 13, wherein the cylinder portion of the holder receives at least one lens therein.

15. The digital camera module as claimed in claim 13, wherein the lens module further comprises a lens barrel and at least one lens disposed in the lens barrel, and the lens barrel is adjustably mounted within the cylinder portion via screw-threading.

16. The digital camera module as claimed in claim 13, wherein the seat section has a step surface and an end opposite thereto, the cylinder portion projects from the step surface, an inner surface of the step surface is adhered to the cover of the chip package, and the end of the seat section is adhered to the substrate.

17. A digital camera module, comprising: a chip package, comprising: a substrate;a first chip mounted on the substrate, the first chip being electrically connected with the substrate via a first plurality of wires;a second chip mounted above the first chip and the wires connected with the first chip, the second chip being electrically connected with the substrate via a second plurality of wires; anda cover mounted above the second chip and the wires connected with the second chip; anda lens module mounted to the chip package.