Applying permanent coating

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H01L2224/8592

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8592Applying permanent coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 11,808,436
- Issue date Nov 7, 2023
- Epistar Corporation
- Chi-Chih Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode (LED) components and methods
- Patent number 11,769,757
- Issue date Sep 26, 2023
- CreeLED, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,699,672
- Issue date Jul 11, 2023
- Denso Corporation
- Mariko Fujieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device including RGB light emitting diodes and phosphor
- Patent number 11,605,762
- Issue date Mar 14, 2023
- Seoul Semiconductor Co., Ltd.
- Chung-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting devices and components having improved chemical resi...
- Patent number 11,563,156
- Issue date Jan 24, 2023
- CreeLED, Inc.
- Shaow B. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 11,557,566
- Issue date Jan 17, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 11,552,051
- Issue date Jan 10, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper corrosion inhibitors
- Patent number 11,282,757
- Issue date Mar 22, 2022
- Infineon Technologies Austria AG
- Sabine Reither
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,255,524
- Issue date Feb 22, 2022
- Epistar Corporation
- Chi-Chih Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-tier bonding wires and component...
- Patent number 11,257,780
- Issue date Feb 22, 2022
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a mems transducer
- Patent number 11,225,408
- Issue date Jan 18, 2022
- Infineon Technologies AG
- Andreas Wiesbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
X-ray system, semiconductor package, and tray having X-ray absorpti...
- Patent number 11,217,495
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- G01 - MEASURING TESTING
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device
- Patent number 11,171,261
- Issue date Nov 9, 2021
- Nichia Corporation
- Yuichi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and backlight
- Patent number 11,168,865
- Issue date Nov 9, 2021
- Nichia Corporation
- Masafumi Kuramoto
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230299030
- Publication date Sep 21, 2023
- DENSO CORPORATION
- Kazuaki MAWATARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20230121780
- Publication date Apr 20, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220208623
- Publication date Jun 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20210375728
- Publication date Dec 2, 2021
- Mitsubishi Electric Corporation
- Shuhei YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210335740
- Publication date Oct 28, 2021
- DENSO CORPORATION
- Mariko FUJIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20210323816
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20200402864
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20200313043
- Publication date Oct 1, 2020
- Nichia Corporation.
- Yuichi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200243408
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...
- Publication number 20200235069
- Publication date Jul 23, 2020
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20200227376
- Publication date Jul 16, 2020
- Shih-Chi CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20200227374
- Publication date Jul 16, 2020
- Shih-Chi CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20200227382
- Publication date Jul 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR A MEMS TRANSDUCER
- Publication number 20200148531
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Wiesbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
- Publication number 20200139705
- Publication date May 7, 2020
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIGHT SOURCE WITH TUNABLE CRI
- Publication number 20200126958
- Publication date Apr 23, 2020
- Bench Walk Lighting LLC
- Keat Chuan Ng
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS
- Publication number 20200043905
- Publication date Feb 6, 2020
- Cree, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION SENSOR BASED ON DIFFERENTIAL MEASUREMENT, AND PRODUCTION METHOD
- Publication number 20200025710
- Publication date Jan 23, 2020
- Consejo Superior de Investigaciones Cientificas (CSIC)
- Antoni BALDI COLL
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20200013756
- Publication date Jan 9, 2020
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20190382262
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMALLY INSULATED MICROSYSTEM
- Publication number 20190331626
- Publication date Oct 31, 2019
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Thomas LISEC
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM LIGHT EMITTING DIODE
- Publication number 20190267516
- Publication date Aug 29, 2019
- LG Innotek Co., Ltd.
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and a method of manufacturing the same

Floating die package

Method for forming an electrical connection between an electronic c...

Semiconductor device and method for manufacturing same

Chip package, method of forming a chip package and method of formin...

Sensor package and manufacturing method thereof

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device package and a method of manufacturing the same

Method of manufacturing a semiconductor device having a bond wire o...

Stacked semiconductor die assemblies with die support members and a...

Light emitting apparatus

Light emitting diode (LED) components and methods

Semiconductor device and method for manufacturing same

Sensor package and manufacturing method thereof

Light emitting device including RGB light emitting diodes and phosphor

Light emitting devices and components having improved chemical resi...

Method for forming an electrical connection between an electronic c...

Electronic device package

Multi-die package with bridge layer

Light emitting device and method of manufacturing the light emittin...

Semiconductor device with copper corrosion inhibitors

Semiconductor device package and a method of manufacturing the same

Light emitting device

Semiconductor package having multi-tier bonding wires and component...

Light emitting device and method of manufacturing the light emittin...

System and method for a mems transducer

X-ray system, semiconductor package, and tray having X-ray absorpti...

Sensor package and manufacturing method thereof

Light emitting device

Light-emitting device and backlight

Patents Applicationslast 30 patents

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SELECTIVE WIRE COATING DURING WIRE BONDING

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

FLOATING DIE PACKAGE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

LIGHT EMITTING DEVICE

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING MULTI-TIER BONDING WIRES AND COMPONENT...

FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METH...

FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METH...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SYSTEM AND METHOD FOR A MEMS TRANSDUCER

Encapsulating a Bonded Wire with Low Profile Encapsulation

LIGHT SOURCE WITH TUNABLE CRI

LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS

ION SENSOR BASED ON DIFFERENTIAL MEASUREMENT, AND PRODUCTION METHOD

ELECTRONIC DEVICE PACKAGE

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

THERMALLY INSULATED MICROSYSTEM

THIN FILM LIGHT EMITTING DIODE