Number | Name | Date | Kind |
---|---|---|---|
3710251 | Hagge et al. | Jan 1973 | A |
3761808 | Ryan | Sep 1973 | A |
4782291 | Blandin | Nov 1988 | A |
4791364 | Kufis et al. | Dec 1988 | A |
4820976 | Brown | Apr 1989 | A |
4870355 | Kufis et al. | Sep 1989 | A |
4945302 | Janum | Jul 1990 | A |
4954774 | Binet | Sep 1990 | A |
4982153 | Collins et al. | Jan 1991 | A |
5084671 | Miyata et al. | Jan 1992 | A |
5115858 | Fitch et al. | May 1992 | A |
5198753 | Hamburgen | Mar 1993 | A |
5397997 | Tuckerman et al. | Mar 1995 | A |
5451884 | Sauerland | Sep 1995 | A |
5847293 | Jones | Dec 1998 | A |
5847366 | Grunfeld | Dec 1998 | A |
6072325 | Sano | Jun 2000 | A |
6191599 | Stevens | Feb 2001 | B1 |
6288561 | Leedy | Sep 2001 | B1 |
Entry |
---|
Marston, Kenneth C., and Glenn, G. Daves, “Thermal Management of High Power Single and Multi-Chip Modules During Test and Burn-In”, Third Annual Manufacturing Test, SemiconWest, pp. 140-149 (1994). |