related to heating

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CPC
G01R31/2875

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/2875related to heating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Work press assembly for test handler
- Patent number 12,241,929
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Neng Chang
- G01 - MEASURING TESTING
Information Patent Grant
Heating structure and wafer test device
- Patent number 12,237,184
- Issue date Feb 25, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test system support component exchange system and method
- Patent number 12,235,315
- Issue date Feb 25, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Paul Ferrari
- G01 - MEASURING TESTING
Information Patent Grant
Active thermal interposer device
- Patent number 12,216,154
- Issue date Feb 4, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Grant
Massively independent testers system
- Patent number 12,153,085
- Issue date Nov 26, 2024
- Hsu Kai Yang
- G01 - MEASURING TESTING
Information Patent Grant
Inspection system and inspection method
- Patent number 12,117,483
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Kentaro Konishi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal control wafer with integrated heating-sensing elements
- Patent number 12,085,609
- Issue date Sep 10, 2024
- AEM SINGAPORE PTE. LTD.
- Carl L. Ostrowski
- G01 - MEASURING TESTING
Information Patent Grant
Heat spreaders for use in semiconductor device testing, such as bur...
- Patent number 12,078,672
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- G01 - MEASURING TESTING
Information Patent Grant
Control method of inspection apparatus and inspection apparatus
- Patent number 12,075,537
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Hiroaki Agawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support device, test system, and method of controlling support device
- Patent number 12,061,226
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Kentaro Konishi
- G01 - MEASURING TESTING
Information Patent Grant
Integrated heater and temperature measurement
- Patent number 12,061,227
- Issue date Aug 13, 2024
- AEM SINGAPORE PTE. LTD.
- Carl L. Ostrowski
- G01 - MEASURING TESTING
Information Patent Grant
Small-sized fast cold and hot shock test devices
- Patent number 12,061,225
- Issue date Aug 13, 2024
- HITOP INSTRUMENT (JIANGSU) CO., LTD.
- Dongxi Liu
- G01 - MEASURING TESTING
Information Patent Grant
Thermal control wafer with integrated heating-sensing elements
- Patent number 12,013,432
- Issue date Jun 18, 2024
- AEM SINGAPORE PTE. LTD.
- Carl L. Ostrowski
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,007,451
- Issue date Jun 11, 2024
- AEHR Test Systems
- Jovan Jovanovic
- G01 - MEASURING TESTING
Information Patent Grant
Test socket having an automated lid
- Patent number 12,007,411
- Issue date Jun 11, 2024
- Teradyne, Inc.
- John P. Toscano
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing device with coupled control of thermal s...
- Patent number 12,000,884
- Issue date Jun 4, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- G01 - MEASURING TESTING
Information Patent Grant
Multiplexed thermal control wafer and coldplate
- Patent number 12,000,885
- Issue date Jun 4, 2024
- AEM SINGAPORE PTE. LTD.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid circuit thermal test vehicles, systems, and methods
- Patent number 11,965,928
- Issue date Apr 23, 2024
- Juniper Networks, Inc.
- Marshall J. Lise
- G01 - MEASURING TESTING
Information Patent Grant
Thermal solution for massively parallel testing
- Patent number 11,940,487
- Issue date Mar 26, 2024
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test device including temperature control module and...
- Patent number 11,927,623
- Issue date Mar 12, 2024
- SK Hynix Inc.
- Nack Hyun Kim
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in board including strip socket with integrated heating for hi...
- Patent number 11,913,989
- Issue date Feb 27, 2024
- Microchip Technology Incorporated
- Joseph Rascon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test system
- Patent number 11,852,677
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Kentaro Konishi
- G01 - MEASURING TESTING
Information Patent Grant
Active thermal interposer device
- Patent number 11,846,669
- Issue date Dec 19, 2023
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Grant
Integrated test cell using active thermal interposer (ATI) with par...
- Patent number 11,841,392
- Issue date Dec 12, 2023
- Advantest Test Solutiions, Inc.
- Karthik Ranganathan
- G01 - MEASURING TESTING
Information Patent Grant
Placement table, testing device, and testing method
- Patent number 11,828,794
- Issue date Nov 28, 2023
- Tokyo Electron Limited
- Shigeru Kasai
- G01 - MEASURING TESTING
Information Patent Grant
Test system with a thermal head comprising a plurality of adapters...
- Patent number 11,828,795
- Issue date Nov 28, 2023
- AEM Holdings Ltd.
- Thomas P. Jones
- G01 - MEASURING TESTING
Information Patent Grant
Integrated heater and temperature measurement
- Patent number 11,828,796
- Issue date Nov 28, 2023
- AEM Holdings Ltd.
- Carl L. Ostrowski
- G01 - MEASURING TESTING
Information Patent Grant
Thermal head for independent control of zones
- Patent number 11,796,589
- Issue date Oct 24, 2023
- AEM Holdings Ltd.
- Thomas P. Jones
- G01 - MEASURING TESTING
Information Patent Grant
Lifetime estimating system and method for heating source, and inspe...
- Patent number 11,796,400
- Issue date Oct 24, 2023
- Tokyo Electron Limited
- Masahito Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Test system including active thermal interposer device
- Patent number 11,774,492
- Issue date Oct 3, 2023
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF HAVING GOOD THERMAL ISOLATION IN WAFER TEST CASSETTE
- Publication number 20250093407
- Publication date Mar 20, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
SHELL FOR WAFER LEVEL BURN-IN (WLBI) CHIP TEST, METHOD FOR LOADING...
- Publication number 20250093405
- Publication date Mar 20, 2025
- Microtest S.p.A.
- Giuseppe AMELIO
- G01 - MEASURING TESTING
Information Patent Application
ACTIVE THERMAL INTERPOSER DEVICE
- Publication number 20250093408
- Publication date Mar 20, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER HANDLING APPARATUS AND SEMICONDUCTOR WAFER TEST...
- Publication number 20250076367
- Publication date Mar 6, 2025
- Advantest Corporation
- Aritomo Kikuchi
- G01 - MEASURING TESTING
Information Patent Application
THERMAL CONTROL WAFER WITH INTEGRATED HEATING-SENSING ELEMENTS
- Publication number 20250067797
- Publication date Feb 27, 2025
- AEM SINGAPORE PTE. LTD.
- Carl L. OSTROWSKI
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE ADJUSTMENT SYSTEM AND ELECTRONIC COMPONENT TESTING APPA...
- Publication number 20250027988
- Publication date Jan 23, 2025
- Advantest Corporation
- Yuya Yamada
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS TO DISENGAGE A TEST HEAD FROM AN INTEGRATED C...
- Publication number 20250012853
- Publication date Jan 9, 2025
- Intel Corporation
- David Daniel Wieneke
- G01 - MEASURING TESTING
Information Patent Application
TEST DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING TES...
- Publication number 20250012854
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jihyun CHOI
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER
- Publication number 20240426938
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240426939
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ADJUSTING SYSTEM, CONTROLLER, ELECTRONIC DEVICE HANDLIN...
- Publication number 20240402240
- Publication date Dec 5, 2024
- Advantest Corporation
- Yuya Yamada
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND THERMAL TESTER FOR THERMAL TESTING DIES OF AN INTEGRATED...
- Publication number 20240385237
- Publication date Nov 21, 2024
- AEM SINGAPORE PTE. LTD.
- See Jean Chan
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED HEATER AND TEMPERATURE MEASUREMENT
- Publication number 20240369621
- Publication date Nov 7, 2024
- AEM SINGAPORE PTE. LTD.
- Carl L. OSTROWSKI
- G01 - MEASURING TESTING
Information Patent Application
HIGH TEMPERATURE TEST DEVICE OF SEMICONDUCTOR MEMORY MODULE AND MET...
- Publication number 20240369622
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SUNHEE KIM
- G01 - MEASURING TESTING
Information Patent Application
SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES
- Publication number 20240361379
- Publication date Oct 31, 2024
- HITOP INSTRUMENT (JIANGSU) CO., LTD.
- Dongxi LIU
- G01 - MEASURING TESTING
Information Patent Application
SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES
- Publication number 20240361378
- Publication date Oct 31, 2024
- HITOP INSTRUMENT (JIANGSU) CO., LTD.
- Dongxi LIU
- G01 - MEASURING TESTING
Information Patent Application
WORK PRESS ASSEMBLY FOR TEST HANDLER
- Publication number 20240353477
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Neng Chang
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT AND INTEGRATED CIRCUIT TESTING METHOD
- Publication number 20240329119
- Publication date Oct 3, 2024
- Realtek Semiconductor Corp.
- Yu-Chen Hsieh
- G01 - MEASURING TESTING
Information Patent Application
THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...
- Publication number 20240329120
- Publication date Oct 3, 2024
- AEM SINGAPORE PTE. LTD.
- Thomas P. JONES
- G01 - MEASURING TESTING
Information Patent Application
PROBE MOUNTING STRUCTURE AND RELIABILITY TEST SYSTEM FOR WAFER-LEVE...
- Publication number 20240310433
- Publication date Sep 19, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240302451
- Publication date Sep 12, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASSIVELY INDEPENDENT TESTERS SYSTEM
- Publication number 20240302429
- Publication date Sep 12, 2024
- Hsu Kai YANG
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE CONTROL APPARATUS, TEST APPARATUS, TEMPERATURE CONTROL...
- Publication number 20240288491
- Publication date Aug 29, 2024
- Advantest Corporation
- Aritomo KIKUCHI
- G01 - MEASURING TESTING
Information Patent Application
THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...
- Publication number 20240230752
- Publication date Jul 11, 2024
- AEM Singapore Pte, LTD.
- Thomas P. JONES
- G01 - MEASURING TESTING
Information Patent Application
TEST SUBSTRATE, TEST APPARATUS, AND TEST METHOD FOR SEMICONDUCTOR I...
- Publication number 20240192269
- Publication date Jun 13, 2024
- KIOXIA Corporation
- Taisuke ICHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
WAFER SCALE ACTIVE THERMAL INTERPOSER WITH THERMAL ISOLATION STRUCT...
- Publication number 20240183897
- Publication date Jun 6, 2024
- ADVANTEST TEST SOLUTIONS, INC.
- Karthik Ranganathan
- G01 - MEASURING TESTING
Information Patent Application
ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES
- Publication number 20240183898
- Publication date Jun 6, 2024
- ADVANTEST TEST SOLUTIONS, INC.
- Karthik Ranganathan
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240168084
- Publication date May 23, 2024
- United Microelectronics Corp.
- Jih-Shun Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES
- Publication number 20240142514
- Publication date May 2, 2024
- HITOP INSTRUMENT (JIANGSU) CO., LTD.
- Dongxi LIU
- G01 - MEASURING TESTING
Information Patent Application
THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...
- Publication number 20240133946
- Publication date Apr 25, 2024
- AEM Holdings Ltd.
- Thomas P. JONES
- G01 - MEASURING TESTING

related to heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Work press assembly for test handler

Heating structure and wafer test device

Test system support component exchange system and method

Active thermal interposer device

Massively independent testers system

Inspection system and inspection method

Thermal control wafer with integrated heating-sensing elements

Heat spreaders for use in semiconductor device testing, such as bur...

Control method of inspection apparatus and inspection apparatus

Support device, test system, and method of controlling support device

Integrated heater and temperature measurement

Small-sized fast cold and hot shock test devices

Thermal control wafer with integrated heating-sensing elements

Method and system for thermal control of devices in an electronics...

Test socket having an automated lid

Integrated circuit testing device with coupled control of thermal s...

Multiplexed thermal control wafer and coldplate

Hybrid circuit thermal test vehicles, systems, and methods

Thermal solution for massively parallel testing

Semiconductor test device including temperature control module and...

Burn-in board including strip socket with integrated heating for hi...

Test system

Active thermal interposer device

Integrated test cell using active thermal interposer (ATI) with par...

Placement table, testing device, and testing method

Test system with a thermal head comprising a plurality of adapters...

Integrated heater and temperature measurement

Thermal head for independent control of zones

Lifetime estimating system and method for heating source, and inspe...

Test system including active thermal interposer device

Patents Applicationslast 30 patents

METHOD OF HAVING GOOD THERMAL ISOLATION IN WAFER TEST CASSETTE

SHELL FOR WAFER LEVEL BURN-IN (WLBI) CHIP TEST, METHOD FOR LOADING...

ACTIVE THERMAL INTERPOSER DEVICE

SEMICONDUCTOR WAFER HANDLING APPARATUS AND SEMICONDUCTOR WAFER TEST...

THERMAL CONTROL WAFER WITH INTEGRATED HEATING-SENSING ELEMENTS

TEMPERATURE ADJUSTMENT SYSTEM AND ELECTRONIC COMPONENT TESTING APPA...

METHODS AND APPARATUS TO DISENGAGE A TEST HEAD FROM AN INTEGRATED C...

TEST DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING TES...

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

TEMPERATURE ADJUSTING SYSTEM, CONTROLLER, ELECTRONIC DEVICE HANDLIN...

DEVICE AND THERMAL TESTER FOR THERMAL TESTING DIES OF AN INTEGRATED...

INTEGRATED HEATER AND TEMPERATURE MEASUREMENT

HIGH TEMPERATURE TEST DEVICE OF SEMICONDUCTOR MEMORY MODULE AND MET...

SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES

SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES

WORK PRESS ASSEMBLY FOR TEST HANDLER

INTEGRATED CIRCUIT AND INTEGRATED CIRCUIT TESTING METHOD

THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...

PROBE MOUNTING STRUCTURE AND RELIABILITY TEST SYSTEM FOR WAFER-LEVE...

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

MASSIVELY INDEPENDENT TESTERS SYSTEM

TEMPERATURE CONTROL APPARATUS, TEST APPARATUS, TEMPERATURE CONTROL...

THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...

TEST SUBSTRATE, TEST APPARATUS, AND TEST METHOD FOR SEMICONDUCTOR I...

WAFER SCALE ACTIVE THERMAL INTERPOSER WITH THERMAL ISOLATION STRUCT...

ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES

SEMICONDUCTOR STRUCTURE

SMALL-SIZED FAST COLD AND HOT SHOCK TEST DEVICES

THERMAL HEAD COMPRISING A PLURALITY OF ADAPTERS FOR INDEPENDENT THE...