Number | Name | Date | Kind |
---|---|---|---|
3977071 | Jarman | Aug 1976 | |
4169008 | Kurth | Sep 1979 | |
4269653 | Wada et al. | May 1981 | |
4514896 | Dixon et al. | May 1985 | |
4628576 | Giachino et al. | Dec 1986 | |
4647013 | Giachino et al. | Mar 1987 | |
4733823 | Waggener et al. | Mar 1988 | |
4758368 | Thompson | Jul 1988 | |
4765864 | Holland et al. | Aug 1988 |
Entry |
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IBM Tech. Dis. Bulletin, "High Density Josephson Board Tech. Using Two-Sided Etching", vol. 22, No. 12, 1980, pp. 5558-5560. |
IEEE Transactions on Elect. Devices, "Fabrication of Novel . . . (100) and (110) Silicon", vol. ED-25, No. 10, 10/78. |
IBM Technical Disclosure Bulletin, vol. 14, No. 2, Jul. 1971, pp. 417-418, "Fabricating Shaped Grid and Aperture Holes". |