Claims
- 1. A digital thermometer comprising:
a housing having first and second portions, the first portion defining a cavity; a waterproof seal disposed between the first and second portions of the housing; temperature conversion logic disposed within the cavity of said housing, said temperature conversion logic being encapsulated by a material having low thermal conductivity; an insulating member disposed in the cavity of said housing; a probe connected to said housing; and a temperature sensing element disposed in said probe.
- 2. The digital thermometer of claim 1 wherein the waterproof seal includes an ultrasonic weld.
- 3. The digital thermometer of claim 1 wherein the water proof seal includes a temperature resistant glue.
- 4. The digital thermometer of claim 1 wherein the waterproof seal includes a gasket and a screw interconnecting the first and second portions of the housing.
- 5. The digital thermometer of claim 1 wherein the temperature conversion logic is encapsulated by epoxy.
- 6. The digital thermometer of claim 1 wherein the insulating member comprises foam.
- 7. The digital thermometer of claim 1 wherein the insulating member comprises polystyrene.
- 8. A method of making a digital thermometer comprising:
encapsulating a microprocessor in a material having low thermal conductivity; inserting the microprocessor in a cavity of a first portion of a thermometer housing; applying a sufficient amount of insulation to the cavity to fill the cavity; sealing a second portion of the thermometer housing to the first portion of the thermometer housing; and connecting a probe to the thermometer housing.
Parent Case Info
[0001] This application claims the benefit of Provisional Patent Application No. 60/459,256 filed Apr. 2, 2003.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60459256 |
Apr 2003 |
US |