Patent Application
20160048045
The present invention relates to a display component, a display device, and a method of producing the display component.
A liquid crystal panel used for a liquid crystal display device includes liquid crystals held between a pair of boards. One of the boards is an array board including TFTs that are active components for controlling the operation of pixels. The array board has a number of gate lines and source lines formed in a matrix within a display area thereof, and has the TFT disposed at each intersection of the gate line and the source line. A pixel electrode is disposed in a region surrounded by the gate lines and the source lines. The region including the pixel electrode corresponds to a unit display region, that is, a pixel. A drain electrode included in the TFT is connected to a drain line. A contact hole is formed at a position overlapping both the drain line and the pixel electrode. The contact hole runs through an insulator that insulates the drain line from the pixel electrode. The drain line is connected to the pixel electrode via the contact hole. Alignment films for controlling the alignment of liquid crystal molecules are formed on inner surfaces of the boards that are in contact with the liquid crystals.
To form the alignment film on the array board, an inkjet device may be used. An example of the device is disclosed in Patent Document 1. According to Patent Document 1, the contact holes of the pixels are in irregular arrangement within the surface of the array board. This is to reduce moire resulting from a depressed portion that may be formed in the alignment film when droplets of the solution discharged from an inkjet head for forming the alignment film enter the contact hole.
According to Patent Document 1, when the droplets of the solution for forming the alignment film enter the contact hole, the depressed portion may be formed in a portion of the alignment film corresponding to the contact hole and the moire may occur due to the depressed portion. However, the droplets of the solution for forming the alignment film actually do not enter the contact hole. This results in defects in the film. The moire occurs due to the defects in the film. Thus, it is difficult to reduce the moire without reducing the defects in the alignment film. In addition, even though the contact holes of the pixels are arranged irregularly as disclosed in Patent Document 1, each contact hole cannot be arranged beyond an area of the pixel that includes the contact hole. Namely, a distance between the adjacent contact holes cannot be larger than a certain distance.
Accordingly, moire reducing effect is limited.
The present invention was made in view of the foregoing circumstances. An object of the present invention is to reduce or suppress moire.
A first display component according to the present invention includes a first conductive film, a second conductive film, an insulator, and an alignment film. The second conductive film is disposed above the first conductive film and at least a portion of the second conductive film overlaps the first conducive film in a plan view. The insulator is held between the first conductive film and the second conductive film. The insulator includes a contact hole for connecting the second conductive film to the first conductive film. The contact hole is at a position overlapping the first conductive film and the second conductive film in a plan view. The alignment film is disposed above the second conductive film. The alignment film includes a portion overlapping the contact hole in a plan view and a portion not overlapping the contact hole in a plan view. The contact hole includes an edge, at least a portion of which defines a bending portion of the insulator which bends toward an inner side of the contact hole such that an outer angle of the bending portion is a reflex angle in a plan view.
Thus, the second conductive film formed after the formation of the first conductive film and the insulator is connected to the first conductive film on the lower side via the contact hole of the insulator. When the solution for forming the alignment film is supplied locally to the surface of the second conductive film or the like in the formation of the alignment film above the first conductive film, the solution spreads to the outside and inside of the contact hole, thereby forming the alignment film having a portion overlapping the contact hole in a plan view and a portion not overlapping the contact hole in a plan view. Here, in the case where the solution for forming the alignment film supplied to the outside of the contact hole spreads into the contact hole, when the solution reaches the bending portion that bends toward the inner side of the contact hole such that the outer angle of the bending portion is a reflex angle in a plan view, the solution is drawn into the contact hole because of the bending portion. It is considered that the solution is drawn because the reach of the solution to the bending portion with the reflex angle in a plan view produces the force to spread the solution in a wide angle. It is easier to arrange the alignment film in the contact hole and defects are less likely to be developed in the alignment film. Accordingly, the moire is properly reduced or suppressed.
Preferable embodiments may include the following configurations.
(1) In the insulator, the contact hole may include a contact hole main portion overlapping at least a portion of the first conductive film and the second conductive film in a plan view, and an expanded hole portion formed by expanding a portion of the contact hole main portion. The bending portion may be defined by edges of the contact hole main portion and the expanded hole portion that are communicated with each other, and the expanded hole portion may have a smaller opening width than the main body of the contact hole main portion. The opening widths of the expanded hole portion and the contact hole main portion are each defined by the distance between a pair of edges opposite to each other. Here, in the case where the solution for forming the alignment film reaches both the pair of edges opposite to each other at the expanded hole portion included in the contact hole in the formation of the alignment film, the solution reaching the edges is easily connected as compared to the contact hole main portion side. When the solution is connected, the solution flows to have a smaller surface area due to the surface tension, thereby making it easier for the solution to flow into the contact hole. In addition, the edge of the expanded hole portion communicated with the edge of the contact hole main portion forms the bending portion. Therefore, in combination with the easy flow of the solution for forming the alignment film into the contact hole due to the bending portion, the solution for forming the alignment film can flow into the contact hole more easily. This allows the alignment film to be formed more easily in the portion overlapping the contact hole in a plan view and the defects are less likely to be developed in the alignment film.
(2) The second conductive film may form the pixel electrode formed of a transparent electrode material, and in the insulator, the expanded hole portion may be formed by extending a portion of the contact hole main portion that is relatively far from the center of the pixel electrode in a plan view. The portion of the alignment film that overlaps the contact hole has a depressed shape relative to the non-overlapped portion. Therefore, the aligning function cannot be exhibited sufficiently in some cases and this tends to be remarkably observed in the expanded hole portion formed by extending the contact hole main portion. In this regard, the expanded hole portion is formed by extending a portion of the contact hole main portion that is relatively far from the center of the pixel electrode in a plan view. Therefore, the defective alignment that may be caused by the expanded hole portion affects the display of the pixel electrode less easily. For this reason, the deterioration in display quality due to the expanded hole portion is suppressed.
(3) In the insulator, the expanded hole portion may be formed by extending a corner of the contact hole main portion. This allows the expanded hole portion to be disposed as far from the pixel electrode as possible in the contact hole. Thus, the defective alignment caused by the expanded hole portion affects the display of the pixel electrode less easily.
(4) The second conductive film may form the pixel electrode formed of a transparent electrode material, and in the insulator, the expanded hole portion may be disposed not overlapping the pixel electrode in a plan view. The portion of the alignment film that overlaps the contact hole in a plan view has a depressed shape relative to the non-overlapped portion. Thus, the aligning function cannot be exhibited sufficiently in some cases, and in particular, this tends to be remarkably observed in the expanded hole portion formed by extending the contact hole main portion. In this regard, the expanded hole portion is disposed not overlapping the pixel electrode in a plan view. Therefore, the defective alignment that may be caused by the expanded hole portion affects the pixel electrode less easily. Thus, the deterioration in display quality due to the expanded hole portion is suppressed. When the pixel electrode is formed of a transparent electrode material, the fluidity of the solution for forming the alignment film on the pixel electrode may be low. However, when the expanded hole portion with the bending portion for enabling the easy flow of the solution for forming the contact hole into the contact hole is formed not overlapping the pixel electrode in a plan view, the fluidity of the solution toward the expanded hole portion is maintained high. This makes the solution for forming the alignment film flow to the contact hole more easily.
(5) In the insulator, the expanded hole portion may be disposed not overlapping the first conductive film in a plan view. Thus, as compared to the contact hole main portion, the opening depth, i.e., the gap from the surface of the second conductive film and the like to which the solution for forming the alignment film is supplied is large in the expanded hole portion because the expanded hole portion does not overlap the first conductive film in a plan view. Therefore, the solution for forming the alignment film flows into the expanded hole portion more easily.
(6) The display component may further include a third conductive film disposed below the first conductive film, at least a portion of the third conductive film overlapping the first conductive film in a plan view. In the insulator, at least a portion of the contact hole main portion may be disposed overlapping the third conductive film in a plan view and the expanded hole portion may be disposed not overlapping the third conductive film in a plan view. Thus, as compared to the contact hole main portion, the opening depth, i.e., the gap from the surface of the second conductive film to which the solution for forming the alignment film is supplied is large in the expanded hole portion because the expanded hole portion does not overlap the third conductive film in a plan view. Therefore, the solution for forming the alignment film flows into the expanded hole portion more easily.
(7) In contrast to the first conductive film that may form at least the source electrode and the drain electrode, the third conductive film may form a gate electrode that overlaps at least the source electrode and the drain electrode in a plan view and an auxiliary capacitor line disposed apart from the gate electrode in a plan view. In the insulator, at least a portion of the contact hole main portion may overlap the drain electrode and the gate electrode in a plan view and the expanded hole portion may be held between the gate electrode and the auxiliary capacitor line in a plan view. Since the expanded hole portion is held between the gate electrode and the auxiliary capacitor line in a plan view, the valley is formed on the surface of the second conductive film and the like to which the solution for forming the alignment film is supplied. Therefore, the solution for forming the alignment flows more easily from the portion overlapping the gate electrode and the auxiliary capacitor line in a plan view to the expanded hole portion on the surface of the second conductive film and the like.
(8) The insulator may include at least an organic insulator formed of an organic resin material. At least the bending portion of the edge of the contact hole may have the sectional shape gradually rising, and include a first inclined portion that is disposed on the relatively lower side and has a larger inclination angle, and a second inclined portion that is disposed on the relatively upper side and has a smaller inclination angle. If the bending portion is entirely formed of the first inclined portion, the inclination is sharp so that it is difficult for the solution for forming the alignment film to move toward the first inclined portion. In contrast, when the second inclined portion that is less sharp is disposed above the first inclined portion, the solution for forming the alignment film is moved smoothly. Therefore, when the solution for forming the alignment film has reached the bending portion of the edge of the contact hole in the formation of the alignment film, the solution is induced to flow into the contact hole by the second inclined portion that is disposed on the relatively upper side and has a smaller inclination angle. As a result, the solution enters the contact hole smoothly through the first inclined portion. The above case is suitable when the contact hole is small, as compared to the case where the bending portion is entirely formed of the second inclined portion and the edge of the contact hole tends to have a larger width.
(9) The display component may further include: a third conductive film provided below the first conductive film, at least a portion of the third conductive film overlapping the first conductive film in a plan view; and a semiconductor film interposed between the third conductive film and the first conductive film. The first conductive film may form at least the source electrode and the drain electrode. The third conductive film may form the gate electrode that overlaps at least the source electrode and the drain electrode in a plan view. The semiconductor film may include an oxide semiconductor and forma channel that is connected to the source electrode and the drain electrode. Thus, upon the application of voltage to the gate electrode, current flows between the source electrode and the drain electrode through the channel formed of the oxide semiconductor film. Since this oxide semiconductor film has higher electron mobility than an amorphous silicon thin film or the like, sufficient current can be supplied between the source electrode and the drain electrode even though the channel has a smaller width. If the channel has a smaller width, the source electrode, the drain electrode, and the gate electrode have smaller size, which is preferable in achieving the higher definition of the display component. When the display component has the higher definition, the number of contact holes tends to increase. According to the configuration, defects are more likely to be developed in the alignment film. In this regard, when the bending portion that is curved to form a reflex angle on the inside in a plan view at the edge of the contact hole of the insulator is included, the solution for forming the alignment film easily enters the contact hole, which is preferable because defects are less likely to be developed in the alignment film.
A second display component according to the present invention includes a first conductive film, a second conductive film, an insulator, an alignment film, and at least two inclined portions. The second conductive film is disposed above the first conductive film and includes a portion overlapping the first conductive film in a plan view. The insulator is held between the first conductive film and the second conductive film and includes a contact hole for connecting the second conductive film to the first conductive film. The contact hole is at a position overlapping the first conductive film and the second conductive film in a plan view. The alignment film is disposed above the second conductive film and includes a portion overlapping the contact hole in a plan view and a portion not overlapping the contact hole in a plan view. The inclined portions are formed at an edge of the contact hole in the insulator and have inclined shapes in a cross-sectional view with inclination angles different from each other.
According to the configuration, the second conductive film formed after the first conductive film and the insulator are formed is connected to the first conductive film in a lower layer via the contact hole in the insulator. During the formation of the alignment film in a layer above the first conductive film, a solution for forming the alignment film is fed a portion of the surface of the second conductive film. The solution spreads outside and inside of the contact hole and the alignment film is formed. The alignment film includes the portion overlapping the contact hole in a plan view and the portion not overlapping the contact hole in a plan view. When the solution for forming the alignment film fed to the outside of the contact hole spreads toward the inside of the contact hole and reaches the edge of the contact hole, flow of the solution into the contact hole is promoted by the inclined portion having a smaller inclination angle, that is, having a gentle slope, among the inclined portions having the inclination angles different from each other at the edge of the contact hole. At a portion of the edge of the contact hole at a boundary between the inclined portions having the inclination angles different from each other, flowability of the solution for forming the alignment film is improved because of the difference in inclination angle. Therefore, the solution is more likely to flow into the contact hole. Namely, it is easier to form the alignment film inside the contact hole and defects are less likely to be developed in the alignment film. According to the configuration, the moire is properly suppressed or reduced.
Preferable embodiments of the second display component may include the following configurations.
(1) The at least two inclined portions may be formed such that a difference between the inclination angles thereof is in a range from 10° to 50°. If the difference between the inclination angles of the inclined portions is smaller than 10°, the difference is so small that the flowability of the solution for forming the alignment film at a boundary between the inclined portions having different inclination angles is not sufficient. Namely, a sufficient level of promotion of flow of the solution is not achieved. If the difference between the inclination angles of the inclined portions is larger than 50°, the slope of the inclined portion having the smaller inclination angle is so gentle that a creepage distance thereof tends to become large. Therefore, an area of a portion that is not used for display increases and display performance may decrease. As described above, the difference between the inclination angles θ1 of the inclined portions is within the range from 10° to 50°. Therefore, the flow of the solution for forming the alignment film is sufficiently promoted. Furthermore, the creepage distance of the inclined portion having the smaller inclination angle is sufficiently small. Therefore, the display component can exert the sufficient level of the display performance.
(2) The insulator may be formed such that the contact hole includes a long edge and a short edge in a plan view. One of the inclined portions having the smaller inclination angle is formed at the short edge of the contact hole. In comparison to a configuration in which the inclined portion having the smaller inclination angle is formed at the long edge of the contact hole, the solution for forming the alignment film, the flow of which into the contact hole is promoted by the inclined portion having the smaller inclination angle, is more likely to reach the boundary between the inclined portions of the edges of the contact hole having different inclination angles. Because the inclination angles at the boundary are different, the flowability of the solution for forming the alignment film increases and thus the solution is more likely to flow into the contact hole.
(3) The inclined portion having the smaller inclination angle may have a dimension along the short edge equal to 8 μm or smaller. In comparison to a configuration in which the dimension is equal to 8 μm or larger, the solution for forming the alignment film, the flow of which into the contact hole is promoted by the inclined portion having the smaller inclination angle is more likely to reach the boundary between the inclined portions having the different inclination angles, respectively, at the edge of the contact hole. Therefore, the flow of the solution into the contact hole is further promoted and thus the defects are further less likely to be developed in the alignment film.
(4) The insulator may be formed such that the contact hole has a polygonal shape in a plan view. The inclined portion having the smaller inclination angle and the inclined portion having a larger inclination angle of the inclined portions are formed at portions of at least one edge of the contact hole. According to the configuration, when the solution for forming the alignment film reaches at least one edge of the contact hole having the polygonal shape in a plan view during the formation of the alignment film, the flow of the solution into the contact hole is promoted by the inclined portion formed at a portion of at least one edge of the contact hole and having the smaller inclination angle. Furthermore, the flowability of the solution is increased at the boundary between the inclined portions formed at a portion of at least edge of the contact hole and having the larger inclination angle. According to the configuration, the flowability of the solution for forming the alignment film into the contact hole is further promoted and thus defects are further less likely to be developed in the alignment film.
(5) The insulator may be formed such that the contact hole has a rectangular shape in a plan view. The inclined portion having the smaller inclination angle and the inclined portion having the larger inclination angle of the inclined portions may be formed at portions of at least a long edge of the contact hole. According to the configuration, that is, the inclined portion having the smaller inclination angle and the inclined portion having the larger inclination angle are formed at the portions of long edge of the contact hole, flowability of a solution for forming an alignment film is increased at a boundary between the inclined portions having different inclination angles during the formation of the alignment film. This configuration is especially preferable when there is not sufficient space for forming the inclined portion having the smaller inclination angle at the short edge of the lower contact hole.
(6) The insulator may be formed such that the contact hole has around shape or an oval shape in a plan view. The contact hole having the round shape or the oval shape in a plan view does not have edges that cross each other. When a solution for forming an alignment film reaches the edge of the contact hole during the formation of the alignment film, droplets of the solution are less likely to merge and thus the solution is less likely to flow into the contact hole. By forming at least two inclined portions having different inclination angles at the edge of the contact hole, a sufficient level of flowability of the solution for forming the alignment film into the contact hole is achieved.
(7) The insulator may be formed such that the contact hole has an opening area in a range from 10 μm2 to 150 μm2. If the opening area of the contact hole is smaller than 10 μm2, a connecting area between the first conductive film and the second conductive film is so small that reliability of the connection may decrease and it may be difficult to form the contact hole. If the opening area of the contact hole is larger than 150 μm2, the solution that has reached the edge of the contact hole is less likely to merge with the solution that has reached from a different way. Therefore, the solution for forming the alignment film is less likely to flow into the lower contact hole. According to the configuration in which the opening area of the contact hole is within the range from 10 μm2 to 150 μm2, the connecting area between the first conductive film and the second conductive film has a sufficient size and thus the reliability of the connection is ensured. Furthermore, the contact hole is easily formed and the solution for forming the alignment film is more likely to flow into the lower contact hole.
A display device according to the present invention includes the display component described above, an opposite board, and liquid crystals. The opposite board is disposed opposite to the display component. The liquid crystals disposed between the display component and the opposite board. In the display device, the defects are less likely to be developed in the alignment film of the display component and the moire is properly reduced or suppressed. Therefore, the alignment of liquid crystals is properly performed and high display quality is achieved.
A method of producing the first display component according to the present invention includes a first film forming process and a second film forming process. The first film forming process is for forming the first conductive film, the insulator, and the second conductive film in this sequence on a substrate. The first film forming process includes forming the contact hole at a position overlapping the first conductive film and the second conductive film in a plan view for connecting the second conductive film to the first conductive film. The first film forming process further includes forming a bending portion at a portion of an edge of the contact hole such that the bending portion bends toward the inner side of the contact hole and has a reflex outer angle in a plan view. The second film forming process is for forming the alignment film including the portion that overlaps the contact hole and the portion that does not overlap the contact hole in a plan view.
According to the method, when the second conductive film is formed after the first conductive film and the insulator are formed on the substrate in the first film forming process, the second conductive film is connected to the first conductive film in the lower layer via the contact hole formed in the insulator. In the second film forming process performed after the first film forming process, when the solution for forming the alignment film is fed to a portion of the surface of the second conductive film for forming the alignment film in a layer above the first conductive film and the solution spreads outside and inside the contact hole, the alignment film is formed. The alignment film includes the portion overlapping the contact hole and the portion not overlapping the contact hole in a plan view. When the solution for forming the alignment film fed to the outside of the contact hole spreads toward the inside of the contact hole and reaches the bending portion that bends toward the inside with the reflex angle in a plan view at the edge of the contact hole, the solution is drawn to the inside of the contact hole by the bending portion. The reason why the solution is drawn as such is that a force may be exerted on the solution by the bending portion having the reflex angle on the inside in a plan view to spread in a wide angle when the solution reaches the bending portion. According to the configuration, the alignment film is easily formed inside the contact hole. Therefore, the defects are less likely to be developed in the alignment film and the moire is properly reduced or suppressed.
Preferable embodiments of the method of producing the first display component may include the following.
(1) In the second film forming process, an inkjet device is used and the solution for forming the alignment film is discharged out of a plurality of nozzles in the inkjet device onto the second conductive film. Thus, in the second film forming process, the solution for forming the alignment film discharged out of the nozzles of the inkjet device reaches the upper side of the second conductive film and then spreads over the surface. The arrangement of the nozzles of the inkjet device may interfere with the arrangement of the contact holes, in which case the solution for forming the alignment film discharged out of the nozzles may not spread sufficiently. This may result in the moire. According the configuration described above, the bending portion is included in the edge of the contact hole. The solution for forming the alignment film is drawn to the contact holes by the bending portions. Therefore, the alignment film is easily formed in the contact hole and the moire is properly reduced or suppressed.
(2) In the second film forming process, a stencil printing device is used. While the solution for forming the alignment film is supplied onto the mesh stencil included in the stencil printing device, the squeegee is moved on the stencil. Thus, the solution for forming the alignment film is printed onto the upper side of the second conductive film through the holes of the stencil. Thus, the solution for forming the alignment film supplied onto the mesh stencil included in the stencil printing device in the second film forming process is printed onto the second conductive film through the holes of the stencil by the squeegee moving on the stencil and spreads over the surface. The stencil of the stencil printing device has the holes and has a mesh shape. An arrangement of the holes and the arrangement of the contact holes may overlap each other. If the solution for forming the alignment film does not sufficiently spread after passed through the holes, the moire may occur. In this embodiment, the bending portions are included in the edges of the respective contact holes as described above, the solution for forming the alignment film is drawn into the contact holes by the bending portions. Therefore, the alignment film is easily formed in the contact holes and the moire is properly reduced or suppressed.
(3) In the first film forming process, at least the organic insulator formed of a photosensitive organic material is provided as the insulator and the organic insulator is exposed to light using a halftone mask including a semitransmissive film or a gray tone mask including a semitransmissive area by a slit as a photomask. Thus, at least the bending portion in the edge of the contact hole is formed to have the sectional shape gradually rising and the edge has the first inclined portion disposed on the relatively lower side and having a larger inclination angle, and the second inclined portion disposed on the relatively upper side and having a smaller inclination angle. Thus, the organic insulator formed of the photosensitive organic material provided in the first film forming process is exposed to light using the halftone mask including the semitransmissive film or the gray tone mask including the semitransmissive area by the slit. Therefore, the bending portion is formed to have the sectional shape gradually rising and the bending portion has the first inclined portion disposed on the relatively lower side and having a larger inclination angle, and the second inclined portion disposed on the relatively upper side and having a smaller inclination angle. If the bending portion is formed entirely from the first inclined portion, the solution for forming the alignment film is moved toward the first inclined portion less easily because the inclination is sharp. As compared to this, the solution for forming the alignment film is moved smoothly when the second inclined portion with a less sharp inclination is disposed above the first inclined portion. Therefore, when the solution for forming the alignment film has reached the bending portion in the edge of the contact hole in the formation of the alignment film, the solution is induced to flow into the contact hole by the second inclined portion disposed on the relatively upper side and having the smaller inclination angle. Thus, the solution enters the contact hole smoothly through the first inclined portion. The above case is suitable when the contact hole is small, as compared to the case where the bending portion is entirely formed of the second inclined portion because the edge of the contact hole tends to have a larger width.
A method of producing the second display component according to the present invention includes a first film forming process and a second film forming process. The first film forming process is for forming the first conductive film, the insulator, and the second conductive film in this sequence of a substrate. The first film forming process includes forming the contact hole at a portion overlapping the first conductive film and the second conductive film in a plan view for connecting the second conductive film to the first conductive film. The first film forming process further includes forming at least two inclined portions at an edge of the contact hole such that the inclined portions have inclined shapes in a cross-sectional view and inclination angles different from each other. The second film forming process is for forming the alignment film including a portion overlapping the contact hole and a portion not overlapping the contact hole.
According to the method, when the second conductive film is formed after the first conductive film and the insulator are formed on the substrate in the first film forming process, the second conductive film is connected to the first conductive film in the lower layer via the contact hole formed in the insulator. In the second film forming process performed after the first film forming process, when the solution for forming the alignment film is fed to a portion of the surface of the second conductive film for forming the alignment film in a layer above the first conductive film and the solution spreads outside and inside the contact hole, the alignment film is formed. The alignment film includes the portion overlapping the contact hole and the portion not overlapping the contact hole in a plan view. When the solution for forming the alignment film fed to the outside of the contact hole spreads toward the inside of the contact hole and reaches the edge of the contact hole, the flow of the solution to the inside of the contact hole is promoted by the inclined portion having the smaller inclination angle and a gentle slope among the inclined portions having the different inclination angles. Furthermore, flowability of the solution for forming the alignment film is increased at a boundary between the inclined portions having different inclination angles at the edge of the contact hole and thus the solution is more likely to flow into the contact hole. According to the configuration, the alignment film is easily formed inside the contact hole. Therefore, the defects are less likely to be developed in the alignment film and the moire is properly reduced or suppressed.
Preferable embodiments of the method of producing the second display component may include the following.
(1) The first film forming process may include forming at least an organic insulator from photosensitive organic resin material as the insulator. The first film forming process may include exposing the organic insulator using a halftone mask including a semitransmissive film or a gray-tone mask including a semitransmissive area with a slit as a photomask. The first film forming process may include forming one of the inclined portions having the smaller inclination angle at the edge of the contact hole with light transmitted through the semitransmissive film of the halftone mask or the semitransmissive area of the gray-tone mask.
(2) The first film forming process may include forming at least an organic insulator from photosensitive organic resin material as the insulator. The first film forming process may include exposing the organic insulator using a halftone mask including a light blocking film and a semitransmissive film including holes, respectively, as a photomask. The halftone mask may include a semitransmissive area in which the hole in the light blocking film overlaps the semitransmissive film in a plan view. The semitransmissive area has a width in a range from 0.5 μm to 5 μm. The first film forming process may include forming one of the inclined portions having the smaller inclination angle at the edge of the contact hole with light transmitted through the semitransmissive area. According to the method, the contact hole is formed in the organic insulator made of photosensitive organic resin material formed in the first film forming process by exposing the organic insulator using the halftone mask. At the edge of the contact hole, the inclined portion having the smaller inclination angle of the inclined portions is formed with the light transmitted through the semitransmissive area that is an area in which the hole in the light blocking film overlaps the semitransmissive film in a plan view. If the width of the semitransmissive area is smaller than 0.5 μm, the amount of light transmitted through the semitransmissive area may be so small that underexposure may occur. As a result, the inclined portion having the smaller inclination angle may not be formed in the organic insulator. If the width of the semitransmissive area is larger than 5 μm, holes different from the contact hole may be formed in the organic insulator. As a result, the inclined portion having the smaller inclination angle may not be formed in the organic insulator. By setting the width of the semitransmissive area of the halftone mask in the range from 0.5 μm to 5 μm as described earlier, the organic insulator is properly exposed and the inclined portion having the smaller inclination angle is properly formed at the edge of the contact hole.
(3) The halftone mask used in the first film forming process may be configured according to photosensitivity of the photosensitive organic resin material of the organic insulator. When the photosensitive organic resin material of the organic insulator is a positive type, the organic insulator is exposed to light using the halftone mask including a transmissive area in which the hole in the light blocking film and the hole in the semitransmissive film overlap each other in a plan view and a distance between the transmissive area and the semitransmissive area is in a range from 0.5 μm to 5 μm. When the photosensitive organic resin material of the organic insulator is a negative type, the organic insulator is exposed to light using the halftone mask including a light blocking area that overlaps the light blocking film in a plan view and a distance between the light blocking area and the semitransmissive area is in a range from 0.5 μm to 5 μm. If the distance between the transmissive area and the semitransmissive area or the distance between the light blocking area and the semitransmissive area is smaller than 0.5 μm, the semitransmissive area is so close to the transmissive area or the light blocking area that it may be difficult to form the inclined portion having the smaller inclination angle. If the distance between the transmissive area and the semitransmissive area or the distance between the light blocking area and the semitransmissive area is larger than 5 μm, holes different from the contact hole may be formed in the organic insulator. Therefore, the inclined portions having the smaller inclination angle may not be formed in the organic insulator. By setting the distance between the transmissive area and the semitransmissive area or the distance between the light blocking area and the semitransmissive area of the halftone mask in the range from 0.5 μm to 5 μm, the organic insulator is properly exposed and the inclined portion having the smaller inclination angle is properly formed to the edge of the contact hole.
(4) The first film forming process may include forming at least an organic film from photosensitive organic resin material as the insulator. The first film forming process may include exposing the organic insulator using a gray-tone mask as a photomask. The gray-tone mask may include a light blocking film and a width of the semitransmissive area including the slit is in a range from 0.5 μm to 5 μm. The first film forming process may include forming one of the inclined portions having the smaller inclination angle at the edge of the contact hole with light transmitted through the semitransmissive area. According to the method, the contact hole is formed in the organic insulator made of photosensitive organic resin material formed in the first film forming process by exposing the organic insulator using the gray-tone mask. At the edge of the contact hole, the inclined portion having the smaller inclination angle of the at least two inclined portions is formed with the light transmitted through the semitransmissive area that is the area of the gray-tone mask including the slit in the light blocking film. If the width of the semitransmissive area is smaller than 0.5 μm, the amount of light transmitted through the semitransmissive area may be so small that underexposure may occur. As a result, the inclined portion having the smaller inclination angle may not be formed in the organic insulator. If the width of the semitransmissive area is larger than 5 μm, multiple steps may be formed at the edge of the contact hole. As a result, the inclined portion having the smaller inclination angle may not be formed in the organic insulator. By setting the width of the semitransmissive area of the gray-tone mask in the range from 0.5 μm to 5 μm as described earlier, the organic insulator is properly exposed and the inclined portion having the smaller inclination angle is properly formed at the edge of the contact hole.
According to the present invention, the moire is suppressed or reduced.
A first embodiment of the present invention will be described with reference to
As illustrated in
The backlight unit 14 will be briefly described. As illustrated in
Next, the liquid crystal panel 11 will be described. As illustrated in
Next, the components connected to the liquid crystal panel 11 will be described. As illustrated in
The flexible board (FPC board) 13 includes a base member made of synthetic resin having insulating property and flexibility (e.g., polyimide resin) as illustrated in
As illustrated in
The liquid crystal panel 11 will be described in more detail. As illustrated in
The films formed in layers on the inner surface of the array board 11b (on the liquid crystal layer 11c side, a surface opposite to the CF board 11a) by a known photolithography method will be described. As illustrated in
The first metal film 34 is a multilayer film of titanium (Ti) and copper (Cu). The gate insulator 35 is formed at least above the first metal film 34 and is made of, for example, silicon oxide (SiO2). The semiconductor film 36 is formed of an oxide thin film containing indium (In), gallium (Ga), and zinc (Zn), which are a kind of oxide semiconductors. The oxide semiconductor film that contains indium (In), gallium (Ga), and zinc (Zn), that is, the oxide semiconductor film 36 is amorphous or crystalline. The protection film 37 is made of silicon oxide (SiO2). The second metal film 38 is a multilayer film that includes titanium (Ti) and copper (Cu). The first interlayer insulator 39 is made of silicon oxide (SiO2). The organic insulator 40 is made of acrylic resin (e.g., polymethyl methacrylate (PMMA)), which is an organic material, and functions as a planarization film. The first transparent electrode film 23 and the second transparent electrode film. 24 are made of a transparent electrode material such as indium tin oxide (ITO) or zinc oxide (ZnO). The second interlayer insulator 41 is made of silicon nitride (SiNx). The first transparent electrode film 23 and the second transparent electrode film 24 among these films are formed only in the display area AA of the array board 11b, and are not formed in the non-display area NAA. The insulators made of the insulating materials, such as the gate insulator 35, the protection film 37, the first interlayer insulator 39, the organic insulator 40, and the second interlayer insulator 41, are formed in solid patterns disposed in a substantially whole area of the surface of the array board 11b (although holes are formed in some areas). The first metal film 34, the oxide semiconductor film 36, and the second metal film 38 are formed in predetermined patterns in the display area AA and the non-display area NAA of the array board 11b.
Next, configurations of components in the display area AA of the array board 11b will be described in sequence. As illustrated in
As illustrated in
As illustrated in
Each pixel electrode 18 is formed from the second transparent electrode film 24 as illustrated in
The common electrode 22 is formed from the first transparent electrode film 23 as illustrated in
Next, configurations of components in the display area AA of the CF board 11a will be described in detail. As illustrated in
Next, configurations of components in the non-display area NAA of the array board 11b will be described in detail. As illustrated in
As illustrated in
As illustrated in
As illustrated in
Each of the insulators 35, 37, 39, 40, and 41 provided for the array board 11b as above has the display area side contact hole 26 (lower contact hole 30) and the non-display area side contact hole 33. Therefore, at the portion where the contact holes 26 and 33 are formed, the alignment film 11e disposed at the uppermost layer position is formed to have a depressed shape as illustrated in
In this embodiment, at least a portion of the edge of each of the contact holes 26 and 33 of the insulators 35, 37, 39, 40, and 41 includes a bending portion 43 that toward an inner side of the contact hole 26 or 33 such that an outer angle of the bending portion 43 is a reflex angle in a plan view as illustrated in
The lower contact hole 30 included in the display area side contact hole 26 includes, as illustrated in
On the other hand, the expanded hole portion 30b is formed by extending a portion of the contact hole main portion 30a that is relatively far from the center of the pixel electrode 18 as illustrated in
Moreover, as illustrated in
As illustrated in
Next, the planar shape of the non-display area side contact hole 33 will be described. The non-display area side contact hole 33 includes, as illustrated in
This embodiment has the above configuration, and next the operation thereof will be described. The procedure of manufacturing components on the array board 11b of the liquid crystal panel 11 will be described in detail.
Components are sequentially formed on the array board 11b by a known photolithography method. Specifically, first, the first metal film 34 is formed on the surface of the array board 11b and patterned, thereby forming the gate electrode 17a, the gate line 19, the auxiliary capacitor line 25, and the like as illustrated in
After that, the second metal film 38 is formed and patterned, thereby forming the source electrode 17b, the drain electrode 17c, the source line 20, the drain line 29, the connection line 32, and the like. Of the connection line 32 formed at this time, the connection line side connector 32a is connected to the gate line side connector 19a of the gate line 19 on the lower side through the non-display area side contact hole 33 provided for the gate insulator 35 and the protection film 37 (see
Then, the first transparent electrode film 23 is formed and patterned, thereby forming the common electrode 22 with the opening 22a. After that, the second interlayer insulator 41 is formed and patterned, thereby forming the upper contact hole 31 forming the display area side contact hole 26 so as to communicate to a portion of the lower contact hole 30. Next, the second transparent electrode film 24 is formed and patterned, thereby forming the pixel electrode 18 with the slit 18a. Of the pixel electrode 18 formed at this time, the pixel electrode side connector 18b is connected to the drain electrode side connector 17c1 of the drain electrode 17c on the lower side through the display area side contact hole 26 (see
The inkjet device 42 used in the formation of the alignment film 11e includes, as illustrated in
In the process of forming the alignment film 11e (second film forming process), as illustrated in
Here, the droplets LD of the solution for forming the alignment film 11e having reached the portion of the surface of the array board 11b which corresponds to the portion not overlapping the contact holes 30 and 33 with the bending portions 43 in a plan view spread to the inside of the contact holes 30 and 33 with the bending portions 43. In this case, upon the reach of the droplets LD at the bending portions 43 in the edges of the contact holes 30 and 33, the droplets LD are drawn into the contact holes 30 and 33 by the bending portions 43 as illustrated in
In addition, the contact holes 30 and 33 with the bending portions 43 have the expanded hole portions 30b and 33b formed by extending a portion of the contact hole main portions 30a and 33a. The bending portions 43 are formed by the communicating edges 43a and 43b at the contact hole main portions 30a and 33a and the expanded hole portions 30b and 33b, and the opening width of the expanded hole portions 30b and 33b is smaller than that of the contact hole main portions 30a and 33a, whereby the operation and effect as below can be obtained. Namely, when the droplets LD of the solution for forming the alignment film 11e have reached both the pair of opposite edges at the expanded hole portions 30b and 33b of the contact holes 30 and 33 as illustrated in
In consideration of the fact that the use of the transparent electrode material as the pixel electrode 18 reduces the fluidity of the droplet LD that forms the alignment film 11e on the pixel electrode 18, the expanded hole portion 30b of the lower contact hole 30 is disposed not overlapping the pixel electrode 18 in a plan view as illustrated in
As illustrated in
In this manner, the alignment film 11e is formed to the solid trace in the plate surface of the array board 11b in and out of the contact holes 30 and 33. The expanded hole portion 30b of the lower contact hole 30 is formed by extending the portion of the contact hole main portion 30a that is relatively far from the center of the pixel electrode 18 in a plan view, specifically the corner at the farthest position from the pixel electrode 18 as illustrated in
As described above, the array board (display component) 11b according to this embodiment includes: the second metal film 38 or the first metal film 34 as the first conductive film; the second transparent electrode film 24 or the second metal film 38 as the second conductive film, which is disposed above the second metal film 38 or the first metal film 34 as the first conductive film and which has at least a part thereof overlapping in a plan view the second metal film 38 or the first metal film 34 as the first conductive film; the first interlayer insulator 39 and the organic insulator 40 or the gate insulator 35 and the protection film 37, which correspond to the insulator disposed between the first conductive film (second metal film 38 or first metal film 34) and the second conductive film (second transparent electrode film 24 or second metal film 38) and has the lower contact hole 30 or the non-display area side contact hole 33 opened at the position overlapping the first conductive film (second metal film 38 or first metal film 34) and the second conductive film (second transparent electrode film 24 or second metal film 38) in a plan view for connecting the second conductive film (second transparent electrode film 24 or second metal film 38) to the first conductive film (second metal film 38 or first metal film 34); the alignment film 11e disposed above the second conductive film (second transparent electrode film 24 or second metal film 38) and having the portion overlapping the contact hole (lower contact hole 30 or non-display area side contact hole 33) in a plan view and the portion not overlapping the contact hole (lower contact hole 30 or non-display area side contact hole 33) in a plan view; and the bending portion 43 which is curved to form a reflex angle on the inside in a plan view and which is configured by at least a portion of the edges of the contact hole (lower contact hole 30 or non-display area side contact hole 33) in the insulator (first interlayer insulator 39 and organic insulator 40, or gate insulator 35 and protection film 37).
Thus, the second conductive film (second transparent electrode film 24 or second metal film 38) formed after the first conductive film (second metal film 38 or first metal film 34) and the insulator (first interlayer insulator 39 and organic insulator 40, or gate insulator 35 and protection film 37) is connected to the first conductive film (second metal film 38 or first metal film 34) on the lower side through the contact hole (lower contact hole 30 or non-display area side contact hole 33) in the insulator (first interlayer insulator 39 and organic insulator 40, or gate insulator 35 and protection film 37). In the formation of the alignment film 11e above the first conductive film (second metal film 38 or first metal film 34), when the solution for forming the alignment film 11e is locally supplied to the surface of the second conductive film (second transparent electrode film 24 or second metal film 38) and the like, the solution spreads to the outside of the contact hole (lower contact hole 30 or non-display area side contact hole 33) and to the inside of the contact hole (lower contact hole 30 or non-display area side contact hole 33). Thus, the alignment film 11e having the portion overlapping the contact hole (lower contact hole 30 or non-display area side contact hole 33) and the portion not overlapping the contact hole (lower contact hole 30 or non-display area side contact hole 33) is formed. Here, in the case where the solution for forming the alignment film 11e supplied to the outside of the contact hole (lower contact hole 30 or non-display area side contact hole 33) spreads to the inside of the contact hole (lower contact hole 30 or non-display area side contact hole 33), when the solution reaches the bending portion 43 curved to form the reflex angle on the inside in a plan view at the edges of the contact hole (lower contact hole 30 or non-display area side contact hole 33), the solution is moved to be drawn to the inside of the contact hole (lower contact hole 30 or non-display area side contact hole 33) by the bending portion 43. It is supposed that the solution is drawn because, for example, if the solution has reached the bending portion 43, the bending portion 43 forming the reflex angle on the inside in a plan view produces a force that causes the solution to spread in a wide angle. According to the configuration, the alignment film 11e is easily arranged inside the contact hole (lower contact hole 30 or non-display area side contact hole 33). Therefore, the defects are less likely to be developed in the alignment film 11e and the moire is properly reduced or suppressed.
The insulator (first interlayer insulator 39 and organic insulator 40, or gate insulator 35 and protection film 37) is formed such that the contact hole (lower contact hole 30 or non-display area side contact hole 33) includes the contact hole main portions 30a and 33a, which overlap at least a portion of the first conductive film (second metal film 38 or first metal film 34) and the second conductive film (second transparent electrode film 24 or second metal film 38) in a plan view and the expanded hole portions 30b and 33b formed by extending a portion of the contact hole main portions 30a and 33a. The bending portions 43 are formed by the communicating edges 43a and 43b at the contact hole main portions 30a and 33a and the expanded hole portions 30b and 33b. The expanded hole portions 30b and 33b have a smaller opening width than the contact hole main portions 30a and 33a. First, the opening width of the expanded hole portions 30b and 33b and the opening width of the contact hole main portions 30a and 33a are defined by the distance between the pair of edges opposite to each other. In the formation of the alignment film 11e, when the solution for forming the alignment film 11e has reached both the pair of edges opposite to each other at the expanded hole portions 30b and 33b in the contact hole main portions 30a and 33a, the solution having reached the edges is easily connected as compared to the contact hole main portions 30a and 33a side. When the solution is connected, the solution flows to have the smaller surface area due to the surface tension, thereby enabling the solution to flow into the contact hole (lower contact hole 30 or non-display area side contact hole 33) easily. Moreover, the bending portion 43 is formed by the second edge 43b of the expanded hole portions 30b and 33b communicating to the first edge 43a of the contact hole main portions 30a and 33a. Therefore, in combination with the easy flow of the solution for forming the alignment film 11e into the contact hole (lower contact hole 30 or non-display area side contact hole 33) due to the bending portion 43, the solution for forming the alignment film 11e can flow into the contact hole (lower contact hole 30 or non-display area side contact hole 33) more easily. According to the configuration, the alignment film 11e is more easily disposed in the portion overlapping the contact hole (lower contact hole 30 or non-display area side contact hole 33) in a plan view. Therefore, the defects are less likely to be developed in the alignment film 11e.
The second transparent electrode film 24 as the second conductive film forms the pixel electrode 18 made of the transparent electrode material. In the first interlayer insulator 39 and the organic insulator 40 as the insulator, the expanded hole portion 30b is formed by extending a portion of the contact hole main portion 30a that is relatively far from the center of the pixel electrode 18 in a plan view. The portion of the alignment film 11e that overlaps the contact hole main portion 30a in a plan view is formed to have a depressed shape relative to the non-overlapping portion. Therefore, the aligning function cannot be sufficiently exhibited in some cases, and this tendency is remarkable in the expanded hole portion 30b formed by extending the contact hole main portion 30a. In this regard, the expanded hole portion 30b is formed by extending a portion of the contact hole main portion 30a that is relatively far from the center of the pixel electrode 18 in a plan view; therefore, it is difficult for the defective alignment that may be caused by the expanded hole portion 30b to affect the display of the pixel electrode 18. As a result, the deterioration in display quality caused by the expanded hole portion 30b is suppressed.
In the first interlayer insulator 39 and the organic insulator 40 as the insulator, the expanded hole portion 30b is formed by extending a corner of the contact hole main portion 30a. Thus, the expanded hole portion 30b is formed as far from the pixel electrode 18 as possible in the contact hole main portion 30a; therefore, it is difficult for the defective alignment that may be caused by the expanded hole portion 30b to affect the display of the pixel electrode 18.
The second transparent electrode film 24 as the second conductive film forms the pixel electrode 18 made of the transparent electrode material. In the first interlayer insulator 39 and the organic insulator 40 as the insulator, the expanded hole portion 30b is disposed not overlapping the pixel electrode 18 in a plan view. The portion of the alignment film 11e that overlaps the lower contact hole 30 as the contact hole in a plan view is formed to have a depressed shape relative to the non-overlapped portion. Therefore, the aligning function cannot be sufficiently exhibited in some cases, and this tendency is remarkable in the expanded hole portion 30b formed by extending the contact hole main portion 30a. In this regard, the expanded hole portion 30b is formed not overlapping the pixel electrode 18 in a plan view; therefore, it is difficult for the defective alignment that may be caused by the expanded hole portion 30b to affect the display of the pixel electrode 18. As a result, the deterioration in display quality that may be caused by the expanded hole portion 30b is suppressed. When the transparent electrode material is employed as the material of the pixel electrode 18, the fluidity of the solution for forming the alignment film 11e on the pixel electrode 18 may become lower. However, the fluidity of the solution toward the expanded hole portion 30b can be maintained high by having the expanded hole portion 30b, which has the bending portion 43 for enabling the solution for forming the alignment film 11e to flow into the lower contact hole 30 easily, not overlap the pixel electrode 18 in a plan view. This enables the solution for forming the alignment film 11e to flow into the lower contact hole 30 more easily.
In the first interlayer insulator 39 and the organic insulator 40 as the insulator, the expanded hole portion 30b is disposed not overlapping the second metal film 38 as the first conductive film in a plan view. Thus, since the expanded hole portion 30b does not overlap the second metal film 38 as the first conductive film in a plan view, the opening depth, i.e., the gap from the surface of the second transparent electrode film 24 as the second conductive film to which the solution for forming the alignment film 11e is supplied can be set larger as compared to the contact hole main portion 30a. Therefore, the solution for forming the alignment film lie flows into the expanded hole portion 30b more easily.
The first metal film 34 as the third conductive film, which is disposed below the second metal film 38 as the first conductive film and at least a portion of which overlaps the second metal film 38 as the first conductive film is provided. In the first interlayer insulator 39 and the organic insulator 40 as the insulator, at least a portion of the contact hole main portion 30a overlaps the first metal film 34 as the third conductive film in a plan view and the expanded hole portion 30b is provided not overlapping the first metal film 34 as the third conductive film in a plan view. Thus, since the expanded hole portion 30b does not overlap the first metal film 34 as the third conductive film in a plan view, the opening depth, i.e., the gap from the surface of the second transparent electrode film 24 as the second conductive film to which the solution for forming the alignment film 11e is supplied can be set larger as compared to the contact hole main portion 30a. Therefore, the solution for forming the alignment film 11e flows into the expanded hole portion 30b more easily.
The second metal film 38 as the first conductive film forms at least the source electrode 17b and the drain electrode 17c. On the other hand, the first metal film 34 as the third conductive film forms at least the gate electrode 17a, which overlaps the source electrode 17b and the drain electrode 17c in a plan view, and the auxiliary capacitor line 25, which is disposed apart from the gate electrode 17a in a plan view. In the first interlayer insulator 39 and the organic insulator 40 as the insulator, at least a portion of the contact hole main portion 30a is disposed overlapping the drain electrode 17c and the gate electrode 17a in a plan view and the expanded hole portion 30b is held between the gate electrode 17a and the auxiliary capacitor line 25 in a plan view. Thus, the expanded hole portion 30b is held between the gate electrode 17a and the auxiliary capacitor line 25 in a plan view, so that the valley is formed on the surface of the second transparent electrode film 24 as the second conductive film and the like to which the solution for forming the alignment film 11e is supplied. Therefore, on the surface of the second transparent electrode film 24 as the second conductive film and the like, the solution for forming the alignment film 11e flows more easily into the expanded hole portion 30b from the portion overlapping the gate electrode 17a and the auxiliary capacitor line 25 in a plan view.
Moreover provided are the first metal film 34 as the third conductive film, which is disposed below the second metal film 38 as the first conductive film and at least a portion of which overlaps the second metal film 38 as the first conductive film in a plan view, and the semiconductor film 36 held between the first metal film 34 as the third conductive film and the second metal film 38 as the first conductive film. The second metal film 38 as the first conductive film forms at least the source electrode 17b and the drain electrode 17c. The first metal film 34 as the third conductive film forms at least the gate electrode 17a that overlaps the source electrode 17b and the drain electrode 17c in a plan view. The semiconductor film 36 is made of the oxide semiconductor and forms the channel 17d to be connected to the source electrode 17b and the drain electrode 17c. Upon the application of the voltage to the gate electrode 17a, current flows between the source electrode 17b and the drain electrode 17c through the channel 17d formed from the oxide semiconductor film. The oxide semiconductor film has higher electron mobility than the amorphous silicon thin film or the like, and therefore sufficient current can be supplied between the source electrode 17b and the drain electrode 17c even though the channel 17d has a smaller width. Because the width of the channel 17d is reduced, sizes of the source electrode 17b, the drain electrode 17c, and the gate electrode 17a can be reduced. The reduction in sizes of the electrodes 17a, 17b, and 17c is preferable for configuring the array board 11b to improve the definition. The array board 11b configured to improve the definition may have the higher number of the contact holes (the lower contact holes 30 and the non-display area side contact holes 33). Therefore, defects are more likely to be developed in the alignment film 11e. Each of the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) in the insulators (the first interlayer insulator 39, the organic insulator 40, the gate insulator 35, and the protection film 37) includes the bending portion 43 that bends toward the inner side of the contact hole and has the reflex outer angle in a plan view at the edge of the contact hole. According to the configuration, the solution for forming the alignment film 11e more easily enters the contact holes (the lower contact holes 30 and the non-display area side contact holes 33). Therefore, the defects are less likely to be developed in the alignment film 11e.
The liquid crystal panel (display device) 11 according to this embodiment includes the aforementioned array board 11b, the CF board (opposite substrate) 11a disposed opposite to the array board 11b, and the liquid crystal layer (liquid crystal) 11c disposed between the array board 11b and the CF board 11a. In the liquid crystal panel 11, the defects are less likely to be developed in the alignment film 11e of the array board 11b and the moire is properly reduced or suppressed. As a result, the alignment of the liquid crystal layer 11c is properly performed and high display quality is achieved.
A method for manufacturing the array board 11b according to this embodiment includes a first film forming process and a second film forming process. The first film forming process is for forming the first conductive film (second metal film 38 or first metal film 34), the insulator (first interlayer insulator 39 and organic insulator 40 or gate insulator 35 and protection film 37), and the second conductive film (second transparent electrode film 24 or second metal film 38) in this sequence on the glass substrate (substrate) GS. Furthermore, the first film forming process is for forming the contact holes (lower contact holes 30 and non-display area side contact holes 33) in the insulators (the first interlayer insulator 39, the organic insulator 40, the gate insulator 35, and the protection film 37) at the positions overlapping the first conductive films (the second metal film 38 and the first metal film 34) and the second conductive films (the second transparent electrode film 24 an the second metal film 38) in a plan view. The contact holes are for connecting the second conductive films (the second transparent electrode film 24 and the second metal film 38) to the first conductive films (the second metal film 38 and the first metal film 34). Furthermore, the first film forming process is for forming the bending portions 43 at the portions of the edges of the respective contact holes (the lower contact holes 30 and the non-display area side contact holes 33) so as to bend toward the inner side of the respective contact holes and have the reflex outer angles. The second film-formation process is for forming the alignment film lie having the portions overlapping the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) and the portions not overlapping the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) in a plan view above the second conductive films (the second transparent electrode film 24 and the second metal film 38).
In the first film-formation process, the first conductive films (the second metal film 38 and the first metal film 34) and the insulators (the first interlayer insulator 39, the organic insulator 40, the gate insulator 35, and the protection film 37) are formed on the glass substrate GS, and then, the second conductive films (the second transparent electrode film 24 and the second metal film 38) are formed on the glass substrate GS. The second conductive films (the second transparent electrode film 24 and the second metal film 38) are connected to the first conductive films (the second metal film 38 and the first metal film 34) on the lower side via the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) formed in the insulators (the first interlayer insulator 39, the organic insulator 40, the gate insulator 35, and the protection film 37). In the second film-formation process performed after the first film-formation process, the solution for forming the alignment film 11e is locally supplied to the surfaces of the second conductive films (the second transparent electrode film 24 and the second metal film 38) for forming the alignment film 11e above the first conductive films (the second metal film 38 and the first metal film 34). The solution spreads to the areas outside and inside the contact holes (the lower contact holes 30 and the non-display area side contact holes 33). As a result, the alignment film 11e is formed. The alignment film 11e includes the portions overlapping the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) and the portions not overlapping the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) in a plan view. When the solution for forming the alignment film 11e supplied to the areas outside of the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) spreads to the areas inside the contact holes (the lower contact holes 30 and the non-display area side contact holes 33), the solution may reach the bending portions 43 each of which bends toward the inner side of the corresponding contact hole and has the reflex outer angle in a plan view the edges of the respective contact holes (the lower contact hole 30 and the non-display area side contact holes 33). When reaches any of the pending portions 43, the solution is drawn to the inner side of each contact hole (the lower contact hole 30 or the non-display area side contact hole 33) by the bending portion 43. that the reason why the solution is drawn as described above may be that a force to spread the solution in a wide angle is exerted on the solution by the bending portions 43 each of which bends toward the inner side of the corresponding contact hole and has the reflex outer angle. According to the configuration, the alignment film 11e is easily arranged inside the contact holes (the lower contact holes 30 and the non-display area side contact holes 33). Therefore, defects are less likely to be developed in the alignment film 11e and the moire is properly reduced or suppressed.
In the second film-formation process, the inkjet device 42 is used. The solution for forming the alignment film 11e is discharged from the nozzles 42d of the inkjet device 42 onto the second conductive films (the second transparent electrode film 24 and the second metal film 38). The solution discharged from the nozzles 42d of the inkjet device 42 and landed on the second conductive films (the second transparent electrode film 24 and the second metal film 38) in the second film-formation process spreads over the surfaces. The arrangement of the nozzles 42d of the inkjet device 42 and the arrangement of the contact holes (the lower contact holes 30 or the non-display area side contact holes 33) may overlap each other. If the solution for forming the alignment film 11e, which has been discharged from the plurality of nozzles 42d, does not sufficiently spread, the moire may occur. In this embodiment, the edges of the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) include the bending portions 43, respectively. According to the configuration, the solution for forming the alignment film 11e is drawn into the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) by the bending portions 43. Therefore, the alignment film 11e is easily formed in the contact holes (the lower contact holes 30 and the non-display area side contact holes 33) and the moire is properly reduced or suppressed.
A second embodiment of the present invention will be described with reference to
The edge of the lower contact hole 130 in the organic insulator 140 has the cross-sectional shape gradually rising as illustrated in
For forming the organic insulator 140 with such a sectional shape, a gray tone mask 46 is used as a photomask in patterning the organic insulator 140 in this embodiment. The gray tone mask 46 includes a transparent glass base member 46a and a light blocking film 46b that is formed on a plate surface of the glass base member 46a to block the exposing light from a light source as illustrated in
After the first inclined portion 44 and the second inclined portion 45 are formed at the edges of the lower contact hole 130 in the organic insulator 140, a common electrode 123, a second interlayer insulator 141, a pixel electrode 118, and an alignment film 111e are formed sequentially as illustrated in
As described above, in the array board according to this embodiment, the insulator includes at least the organic insulator 140 formed of the organic resin material, and at least the bending portion 143 of the edge of the lower contact hole 130 has a sectional shape gradually rising. The edge includes the first inclined portion 44 which is disposed on the relatively lower side and whose inclination angle is relatively large, and the second inclined portion 45 which is disposed on the relatively upper side and whose inclination angle is relatively small. If the bending portion is entirely formed of the first inclined portion, it is difficult for the solution for forming the alignment film 111e to move toward the first inclined portion side because the inclination is sharp. As compared to this case, when the second inclined portion 45 with the gentle slope is disposed above the first inclined portion 44, the solution for forming the alignment film 111e can be moved smoothly. Therefore, in the formation of the alignment film 111e, when the solution for forming the alignment film 111e has reached the bending portion 143 of the edge of the lower contact hole 130, the solution is induced to flow into the lower contact hole 130 by the second inclined portion 45 disposed relatively higher and having the smaller inclination angle. As a result, the solution enters the lower contact hole 130 smoothly through the first inclined portion 44. On the other hand, this is suitable when the lower contact hole 130 is small as compared to the case in which the bending portion is entirely formed of the second inclined portion because the edge of the lower contact hole 130 tends to have a larger width.
In the method for manufacturing the array board according to this embodiment, in the first film-formation process, at least the organic insulator 140 including a photosensitive organic resin material is formed as the insulator and the organic insulator 140 is exposed to light using the gray tone mask 46 including the semitransmissive area HTA by the slit 46b1 as the photomask. Thus, at least the bending portion 143 of the edge of the lower contact hole 130 is formed to have a sectional shape gradually rising and the edge includes at least the first inclined portion 44 which is disposed on the relatively lower side and whose inclination angle is relatively large, and the second inclined portion 45 which is disposed on the relatively upper side and whose inclination angle is relatively small. Thus, the organic insulator 140 formed of the photosensitive organic resin material in the first film-formation process is exposed to light using the gray tone mask 46 including the semitransmissive area HTA by the slit 46b1, so that the bending portion 143 is formed to have a sectional shape gradually rising and moreover to have at least the first inclined portion 44 which is disposed on the relatively lower side and whose inclination angle is relatively large and the second inclined portion 45 which is disposed on the relatively upper side and whose inclination angle is relatively small. If the bending portion is entirely formed of the first inclined portion, it is difficult for the solution for forming the alignment film 111e to move toward the first inclined portion side because the inclination is sharp. As compared to this case, when the second inclined portion 45 with the gentle slope is disposed above the first inclined portion 44, the solution for forming the alignment film 111e can be moved smoothly. Therefore, in the formation of the alignment film 111e, when the solution for forming the alignment film 111e has reached the bending portion 143 of the edge of the lower contact hole 130, the solution is induced to flow into the lower contact hole 130 by the second inclined portion 45 disposed relatively higher and having the smaller inclination angle, so that the solution enters the lower contact hole 30 smoothly through the first inclined portion 44. On the other hand, this is suitable when the lower contact hole 130 is small, as compared to the case in which the bending portion is entirely formed of the second inclined portion because the edge of the lower contact hole 130 tends to have a larger width.
A third embodiment of the present invention will be described with reference to
The screen printing device (stencil printing device) 47 according to this embodiment includes, as illustrated in
In the second film-formation process in the method for manufacturing the array board 211b according to this embodiment, as described above, the screen printing device (stencil printing device) 47 is used. While the solution L that forms the alignment film is supplied onto the mesh screen (stencil) 47a of the screen printing device 47, the squeegees 47c and 47d are moved on the screen 47a, so that the solution L that forms the alignment film is printed onto the second conductive film (second transparent electrode film or second metal film) through the holes 47a1 of the screen 47a. Thus, the solution L that forms the alignment film, which has been supplied onto the mesh screen 47a in the screen printing device 47 in the second film-formation process, is printed onto the second conductive film (second transparent electrode film or second metal film) through the holes 47a1 of the screen 47a by the squeegees 47c and 47d moving on the screen 47a, and then spreads over the surface. Since the screen 47a of the screen printing device 47 has the holes 47a1 and has the mesh shape, the arrangement of the holes 47a may interfere with the arrangement of the contact holes (lower contact holes or non-display area side contact hole). In this case, if the solution L that forms the alignment film through the holes 47a1 does not spread sufficiently, the moire may be caused. In this regard, since the bending portion is included in the edge of the contact hole (lower contact hole or non-display area side contact hole), the solution L that forms the alignment film is drawn into the contact hole (lower contact hole or non-display area side contact hole) by the bending portion. Therefore, the alignment film is easily formed in the contact hole (lower contact hole or non-display area side contact hole) and this can suppress or prevent the occurrence of moire.
A fourth embodiment of the present invention will be described with reference to
The lower contact hole 330 according to this embodiment is disposed such that expanded hole portions 330b entirely overlap a pixel electrode 318, a gate line 319 (gate electrode 317a), and a drain electrode 317c in a plan view as illustrated in
A fifth embodiment of the present invention will be described with reference to
The lower contact hole 430 according to this embodiment is disposed such that a portion of expanded hole portions 430b overlaps a pixel electrode 418, agate line 419 (gate electrode 417a), and a drain electrode 417c in a plan view as illustrated in
A sixth embodiment of the present invention will be described with reference to
The lower contact hole 530 according to this embodiment is configured in a manner that a pair of expanded hole portions 530b is formed by extending upper corners of a contact hole main portion 530a as illustrated in
A seventh embodiment of the present invention will be described with reference to
The lower contact hole 630 according to this embodiment is disposed in the posture with the length direction and the width direction thereof coinciding with the X-axis direction and the Y-axis direction, respectively as illustrated in
An eighth embodiment of the present invention will be described with reference to
Of the lower contact hole 730 according to this embodiment, a pair of expanded hole portions 730b is formed by extending a center portion (non-corner portion) of a contact hole main portion 730a in the length direction of the contact hole main portion 730a as illustrated in
A ninth embodiment of the present invention will be described with reference to
Of edges of a pair of expanded hole portions 830b of the lower contact hole 830 according to this embodiment, second edges 843b of bending portions 843 are formed to be inclined in a plan view as illustrated in
A tenth embodiment of the present invention will be described with reference to
Of edges of a pair of expanded hole portions 930b of the lower contact hole 930 according to this embodiment, second edges 943b of bending portions 943 are formed to be inclined in a plan view as illustrated in
An eleventh embodiment of the present invention will be described with reference to
In the lower contact hole 1030 according to this embodiment, a pair of expanded hole portions 1030b is formed by extending diagonal corners of a contact hole main portion 1030a as illustrated in
A twelfth embodiment of the present invention will be described with reference to
In the lower contact hole 1130 according to this embodiment, four expanded hole portions 1130b are formed by extending four corners of a contact hole main portion 1130a as illustrated in
A thirteenth embodiment of the present invention will be described with reference to
In the lower contact hole 1230 according to this embodiment, one expanded hole portion 1230b is formed by extending one corner of a contact hole main portion 1230a as illustrated in
A fourteenth embodiment of the present invention will be described with reference to
In an organic insulator 1340 according to this embodiment, the edge of the lower contact hole 1330 has a vertically-long rectangular shape in a plan view as illustrated in
As illustrated in
For forming the organic insulator 1340 with such a sectional shape, in this embodiment, a gray tone mask 1346 is used as a photomask in patterning the organic insulator 1340 in this embodiment. This gray tone mask 1346 has a fundamental structure similar to that described in the second embodiment. As illustrated in
After the first inclined portion 48 and the second inclined portion 49, which are adjacent to each other in a plan view, are formed at the edge of the lower contact hole 1330 in the organic insulator 1340, a common electrode 1323, a second interlayer insulator 1341, a pixel electrode 1318, and an alignment film 1311e are formed sequentially as illustrated in
As described above, the array board 1311b according to this embodiment includes: a second metal film 1338 as a first conductive film; a second transparent electrode film 1324 as a second conductive film disposed above the second metal film 1338 as the first conductive film and having at least a part thereof overlapping the second metal film 1338 as the first conductive film in a plan view; a first interlayer insulator 1339 and the organic insulator 1340, which are interposed between the second metal film 1338 as the first conductive film and the second transparent electrode film 1324 as the second conductive film and have the lower contact hole 1330 opened at the position overlapping the second metal film 1338 as the first conductive film and the second transparent electrode film 1324 as the second conductive film in a plan view for connecting the second metal film 1338 as the first conductive film to the second transparent electrode film 1324 as the second conductive film; the alignment film 1311e disposed above the second transparent electrode film 1324 as the second conductive film and having a portion overlapping the lower contact hole 1330 in a plan view and a portion not overlapping the lower contact hole 1330 in a plan view; and the two inclined portions 48 and 49 formed at the edge of the lower contact hole 1330 in the first interlayer insulator 1339 as the insulator and having the sectional shape inclined with the different inclination angles.
Thus, the second transparent electrode film 1324 as the second conductive film formed after the formation of the second metal film 1338 as the first conductive film and the first interlayer insulator 1339 and the organic insulator 1340 as the insulator is connected to the first conductive film on the lower side through the lower contact hole 1330 of the first interlayer insulator 1339 and the organic insulator 1340 as the insulator. In the film-formation of the alignment film 1311e above the second metal film 1338 as the first conductive film, when the solution for forming the alignment film 1311e is locally supplied to the surface of the second transparent electrode film 1324 as the second conductive film, the solution spreads to the outside of the lower contact hole 1330 and to the inside of the lower contact hole 1330. Thus, the alignment film 1311e having the portion overlapping the lower contact hole 1330 in a plan view and the portion not overlapping the lower contact hole 1330 in a plan view is formed. In the case where the solution for forming the alignment film 1311e supplied on the outside of the lower contact hole 1330 spreads to the inside the lower contact hole 1330, when the solution has reached the edge of the lower contact hole 1330, the solution is induced to flow into the lower contact hole 1330 by the second inclined portion 49 with the less sharp slope and with the smaller inclination angle out of the two inclined portions 48 and 49 whose sectional shapes are inclined at the edge and whose inclination angles are different from each other. In addition, at the boundary between the inclined portions 48 and 49 with the different inclination angle in the edge of the lower contact hole 1330, the fluidity of the solution for forming the alignment film 1311e is increased because the inclination angle is different. As a result, the solution can flow into the lower contact hole 1330 more easily. According to the configuration, the alignment film 1311e is easily arranged in the lower contact hole 1330. Therefore, the defects are less likely to be developed in the alignment film 1311e and the moire is properly reduced or suppressed.
A method for manufacturing the array board 1311b according to this embodiment includes a first film-formation process and a second film-formation process. In the first film-formation process, the second metal film 1338 as the first conductive film, the first interlayer insulator 1339 and the organic insulator 1340 as the insulator, and the second transparent electrode film 1324 as the second conductive film are formed in this order on the glass substrate GS, the lower contact hole 1330 is opened at the position of the first interlayer insulator 1339 and the organic insulator 1340 as the insulator overlapping the second metal film 1338 as the first conductive film and the second transparent electrode film 1324 as the second conductive film in a plan view for connecting the second transparent electrode film 1324 as the second conductive film to the second metal film 1338 as the first conductive film, and the two inclined portions 48 and 49 whose sectional shapes are inclined and whose inclination angles are different are formed at the edge of the lower contact hole 1330. In the second film-formation process, the alignment film 1311e having the portion overlapping the lower contact hole 1330 and the portion not overlapping the lower contact hole 1330 in a plan view is formed above the second transparent electrode film 1324 as the second conductive film.
Thus, when the second transparent electrode film 1324 as the second conductive film is formed after the formation of the second metal film 1338 as the first conductive film and the first interlayer insulator 1339 and the organic insulator 1340 as the insulator on the glass substrate GS in the first film-formation process, the second transparent electrode film 1324 as the second conductive film is connected to the second metal film 1338 as the first conductive film on the lower side through the lower contact hole 1330 formed in the first interlayer insulator 1339 and the organic insulator 1340 as the insulator. In the subsequent second film-formation process, when the solution for forming the alignment film 1311e is locally supplied to the surface of the second transparent electrode film 1324 as the second conductive film or the like for forming the alignment film 1311e above the second metal film 1338 as the first conductive film, the solution spreads to the outside of the lower contact hole 1330 and to the inside of the lower contact hole 1330. Thus, the alignment film 1311e is formed which has the portion overlapping the lower contact hole 1330 and the portion not overlapping the lower contact hole 1330 in a plan view. Here, in the case where the solution for forming the alignment film 1311e supplied on the outside of the lower contact hole 1330 spreads to the inside the lower contact hole 1330, when the solution has reached the edge of the lower contact hole 1330, the solution is induced to flow into the lower contact hole 1330 by the second inclined portion 49 with the less sharp slope and with the smaller inclination angle out of the two inclined portions 48 and 49 whose sectional shapes are inclined at the edge and whose inclination angles are different from each other. In addition, at the boundary between the inclined portions 48 and 49 with the different inclination angle in the edge of the lower contact hole 1330, the fluidity of the solution for forming the alignment film 1311e is increased because the inclination angle is different. As a result, the solution can flow into the lower contact hole 1330 more easily. According to the configuration, the alignment film 1311e is easily arranged in the lower contact hole 1330. Therefore, defects are less likely to be developed in the alignment film 1311e and the moire is properly reduced or suppressed.
In the first film-formation process of the method for manufacturing the array board 1311b, at least the organic insulator 1340 including a photosensitive organic resin material is formed as the insulator and the organic insulator 1340 is exposed to light using the gray tone mask 1346 including the semitransmissive area HTA by the slit 1346b1 as the photomask. Thus, with the light transmitted through the semitransmissive area MIA of the gray tone mask 1346, at least the second inclined portion 49 with the relatively smaller inclination angle among the two inclined portions 48 and 49 is formed at the edge of the lower contact hole 1330. Thus, the organic insulator 1340 formed of the photosensitive organic resin material in the first film-formation process is exposed to light using the gray tone mask 1346 including the semitransmissive area HTA by the slit 1346b1, so that the lower contact hole 1330 is formed. At the edge of the lower contact hole 1330, at least the second inclined portion 49 with the relatively smaller inclination angle among the two inclined portions 48 and 49 is formed due to the light transmitted through the semitransmissive area HTA of the gray tone mask 1346.
A fifteenth embodiment of the present invention will be described with reference to
As illustrated in
As illustrated in
Next, results of comparative experiments will be described with reference to
The results of the comparative experiments will be described. According to the chart in
As described earlier, at least two inclined portions 1448 and 1449 are formed in the array board 1411b such that the difference between the inclination angles θ1 and θ2 is in the range from 10° to 50°. If the difference between the inclination angles of the inclined portions is smaller than 10°, the difference is so small that the flowability of the solution for forming the alignment film at a boundary between the inclined portions having different inclination angles is not sufficient. Namely, a sufficient level of promotion of flow of the solution is not achieved. If the difference between the inclination angles of the inclined portions is larger than 50°, the slope of the inclined portion having the smaller inclination angle is so gentle that a creepage distance thereof tends to become large. Therefore, an area of a portion that is not used for display increases and display performance may decrease. As described above, the difference between the inclination angle θ1 of the first inclined portion 1448 and the inclination angle θ2 of the second inclined portion 1449 is within the range from 10° to 50°. Therefore, the flow of the solution for forming the alignment film 1411e is sufficiently promoted. Furthermore, the creepage distance of the second inclined portion 1449 having the smaller inclination angle is sufficiently small. Therefore, the array board 1411b can exert the sufficient level of the display performance.
A first interlayer insulator 1439 and an organic insulator 1440 include the lower contact holes 1430. Each of the lower contact holes 1430 has the long edges and the short edges in a plan view. The second inclined portion 1449 having the smaller inclination angle among the inclined portions 1448 and 1449 is located at the short edge of the lower contact hole 1430. In comparison to a configuration in which the inclined portion having the smaller inclination angle is formed at the long edge of the lower contact hole 1430, the solution for forming the alignment film 1411e, the flow of which into the lower contact hole 1430 is promoted by the second inclined portion 1449 having the smaller inclination angle, is more likely to reach the boundary between the inclined portions 1448 and 1449 of the edges of the lower contact hole 1430 having different inclination angles. Because the inclination angles θ1 and θ2 at the boundary are different, the flowability of the solution for forming the alignment film 1411e increases and thus the solution is more likely to flow into the lower contact hole 1430.
Each second inclined portion 1449 having the smaller inclination angle is formed such that the dimension along the short edge of the contact hole is equal to 8 μm or smaller. In comparison to a configuration in which the dimension is equal to 8 μm or larger, the solution for forming the alignment film 1411e, the flow of which into the lower contact hole 1430 is promoted by the second inclined portion 1449 having the smaller inclination angle is more likely to reach the boundary between the inclined portions 1448 and 1449 at the edges of the lower contact hole 1430 having the different inclination angles θ1 and θ2, respectively. Therefore, the flow of the solution into the lower contact hole 1430 is further promoted and thus the defects are further less likely to be developed in the alignment film 1411e.
Each of the lower contact holes 1430 in the first interlayer insulator 1439 and the organic insulator 1440 has an opening area in a range from 10 μm2 to 150 μm2. If the opening area of the lower contact hole is smaller than 10 μm2, a connecting area between the second metal film and the second transparent electrode film is so small that reliability of the connection may decrease and it may be difficult to form the lower contact hole. If the opening area of the lower contact hole is larger than 150 μm2, the solution that has reached the edge of the lower contact hole is less likely to merge with the solution that has reached from a different way. Therefore, the solution is less likely to flow into the lower contact hole. According to the configuration in which the opening area of the lower contact hole 1430 is within the range from 10 μm2 to 150 μm2, the connecting area between the second metal film 1438 and the second transparent electrode film 1424 has a sufficient size and thus the reliability of the connection is ensured. Furthermore, the lower contact hole 1430 is easily formed and the solution for forming the alignment film 1411e is more likely to flow into the lower contact hole 1430.
A sixteenth embodiment of the present invention will be described with reference to
The organic insulator 1540 according to this embodiment is made of photosensitive organic resin material having positive photosensitivity. For patterning of the organic insulator 1540, a halftone mask 50 having the following configuration is used as a photomask. As illustrated in
As illustrated in
Within the plate surface of the halftone mask 50, the second holes 50b2 (the semitransmissive areas HTA) in the light blocking film 50b are arranged separated from the first hole 50b1 (the transmissive area TA) in the Y-axis direction as illustrated in
When the organic insulator 1540 is exposed to the exposing light from the light source via the halftone mask 50 having the above configuration and developed, the lower contact holes 1530 and first inclined portions 1548 are formed at positions that overlap the transmissive areas TA in the organic insulator 1540 in a plan view, respectively. Each first inclined portion 1548 defines the edge of the corresponding lower contact hole 1530 and has an inclination angle that is larger. Furthermore, second inclined portions 1549 are formed at positions that overlap the semitransmissive areas HTA in a plan view. Each second inclined portion 1549 has an inclination angle that is smaller. As illustrated in
Each lower contact hole 1530 of an array board 1511b according to this embodiment formed in the organic insulator 1540 has a polygonal shape in a plan view. The second inclined portion 1549 having the smaller inclination angle and the first inclined portion 1548 having the larger inclination angle of at least two inclined portions 1548 and 1549 are formed at portions of the at least one edge of the lower contact hole 1530, respectively. According to the configuration, when the solution for forming the alignment film reaches at least one edge of the lower contact hole 1530 during the formation of the alignment film, the flow of the solution into the lower contact hole 1530 is promoted by the second inclined portion 1549 formed at a portion of at least one edge of the lower contact hole 1530 and having the smaller inclination angle. Furthermore, the flowability of the solution is increased at the boundary between the second inclined portion 1549 and the first inclined portion 1548 formed at a portion of at least edge of the lower contact hole 1530 and having the larger inclination angle. According to the configuration, the flowability of the solution for forming the alignment film into the lower contact hole 1530 is further promoted and thus defects are further less likely to be developed in the alignment film.
In a first film formation process in a method of producing the array board 1511b according this embodiment, at least the organic insulator 1540 made of photosensitive organic resin material is formed as an insulator. In the process, the halftone mask 50 is used as a photomask. The halftone mask 50 includes the light blocking film 50b and the semitransmissive film 50c. The light blocking film 50b and the semitransmissive film 50c include the holes 50b1, 50b2, and 50c1. The width of the semitransmissive area HTA that is an area in which the second hole 50b2 in the light blocking film 50b and the semitransmissive film 50c overlap each other in a plan view is in the range from 0.5 μm to 5 μm. Using the halftone mask 50, the organic insulator 1540 is exposed to light and the second inclined portion 1549 having the smaller inclination angle among at least two inclined portions 1548 and 1549 is formed at the edge of the lower contact hole 1530 with the light transmitted through the semitransmissive area HTA. According to the method, the lower contact hole 1530 is formed in the organic insulator 1540 formed in the first film formation process with photosensitive organic resin material. The lower contact hole 1530 is formed through the exposure of the organic insulator 1540 using the halftone mask 50. At the edge of the lower contact hole 1530, the second inclined portion 1549 having the smaller inclination angle of at least two inclined portions 1548 and 1549 is formed with the light transmitted through the semitransmissive area HTA that is the area in which the second hole 50b2 in the light blocking film 50b overlaps the semitransmissive film 50c. If the width of the semitransmissive area is smaller than 0.5 μm, the amount of light transmitted through the semitransmissive area may be so small that underexposure may occur. As a result, the second inclined portion having the smaller inclination angle may not be formed in the organic insulator 1540. If the width of the semitransmissive area is larger than 5 μm, holes different from the lower contact hole 1530 may be formed in the organic insulator 1540. As a result, the second inclined portion having the smaller inclination angle may not be formed in the organic insulator 1540. By setting the width of the semitransmissive area HTA of the halftone mask 50 in the range from 0.5 μm to 5 μm as described earlier, the organic insulator 1540 is properly exposed and the second inclined portion 1549 having the smaller inclination angle is properly formed at the edge of the lower contact hole 1530.
In the first film formation process in the method of producing the array board 1511b, the organic insulator 1540 made of positive photosensitive organic resin material is exposed using the halftone mask 50. The halftone mask 50 includes the transmissive area TA that is an area in which the first hole 50b1 in the light blocking film 50b and the hole 50c1 in the semitransmissive film 50c overlap each other in a plan view and the distance between the transmissive area TA and the semitransmissive area HTA is in the range from 0.5 μm to 5 μm. If the distance between the transmissive area TA and the semitransmissive area HTA is smaller than 0.5 μm, the semitransmissive area is so close to the transmissive area that it may be difficult to form the second inclined portion having the smaller inclination angle. If the distance between the transmissive area TA and the semitransmissive area HTA is larger than 5 μm, holes different from the lower contact hole 1530 may be formed in the organic insulator 1540. Therefore, the second inclined portions having the smaller inclination angle may not be formed in the organic insulator 1540. By setting the distance between the transmissive area TA and the semitransmissive area HTA of the halftone mask 50 in the range from 0.5 μm to 5 μm, the organic insulator 1540 is properly exposed and the second inclined portions 1549 having the smaller inclination angle are properly formed to the edges of the lower contact hole 1530.
A seventeenth embodiment will be described with reference to
The organic insulator 1640 according to this embodiment is made of photosensitive organic resin material having negative photosensitivity. For patterning of the organic insulator 1640, a halftone mask 1650 having a basic configuration similar to the sixteenth embodiment (a configuration including a glass substrate 1650a, a light blocking film 1650b, and a semitransmissive film 1650c) is used as a photomask. As illustrated in
As illustrated in
After the organic insulator 1640 is exposed with the exposing light from the light source via the halftone mask 1650 having the above configuration, the organic insulator 1640 is developed. As a result, the lower contact holes 1630 and the first inclined portions 1648 are formed in the portions overlapping the light blocking area SA of the organic insulator 1640 in a plan view. The first inclined portions 1648 are at edges of the lower contact holes 1630 and each first inclined portion 1648 has the larger inclination angle. Furthermore, the second inclined portions 1649 are formed in the portions overlapping the semitransmissive areas HTA in a plan view. The second inclined portions 1649 are at edges of the lower contact holes 1630 and each second inclined portion 1649 has the smaller inclination angle. The areas in which the second inclined portions 1649 are formed are similar to those of the sixteenth embodiment (see
As described earlier, the method of producing the array board 1611b according to this embodiment includes the first film forming process. In the first film forming process, the photosensitive organic resin material of the organic insulator 1640 is used as a negative and the organic insulator 1640 is exposed with the halftone mask 1650. The halftone mask 1650 includes the light blocking areas SA in the portions overlapping the light blocking film 1640b in a plan view and the distance between each light blocking area SA and the corresponding semitransmissive area HTA is in the range from 0.5 μm to 5 μm. If the distance between the light blocking area and the semitransmissive area of the halftone mask is 0.5 μm or smaller, that is, the semitransmissive portion is so close to the light blocking area that it may be difficult to form the second inclined portion having the smaller inclination angle. If the distance between the light blocking area and the semitransmissive area of the halftone mask is 5 μm or larger, the holes different from the lower contact hole 1630 may be formed in the organic insulator 1640. As a result, the second inclined portion having the smaller inclination angle may not be formed in the organic insulator 1640. By setting the distance between the light blocking area SA and the semitransmissive area HTA of the halftone mask 1650 in the range from 0.5 μm to 5 μm as described earlier, the organic insulator 1640 is properly exposed and the second inclined portions 1649 having the smaller inclination angle are properly formed at the edge of the lower contact holes 1630.
An eighteenth embodiment of the present invention will be described with reference to
The organic insulator 1740 according to this embodiment is made of photosensitive organic resin material having negative photosensitivity. For patterning of the organic insulator 1740, a gray tone mask 1746 is used as a photomask. The gray tone mask 1746 has a basic configuration similar to the one used in the fourteenth embodiment (a configuration including a glass substrate 1746a and a light blocking film 1746b). As illustrated in
After the organic insulator 1740 is subjected to exposing light from a light source via the gray tone mask 1746 having the above configuration, the organic insulator 1740 is developed. As a result, lower contact holes 1730, first inclined portions, and second inclined portions 1749 are formed. The lower contact holes are formed in portions of the organic insulator 1740 overlapping the transmissive areas TA. The first inclined portions are formed at edges of the lower contact holes 1730. Each first inclined portion has a larger inclination angle. The second inclined portions 1749 are formed in portions of the organic insulator 1740 overlapping the semitransmissive areas HTA in a plan view. The second inclined portions 1749 are formed at edges of lower contact holes 1730. Each second inclined portion has a smaller inclination angle. The portions in which the second inclined portions 1749 are formed are similar to those of the sixteenth embodiment described earlier (see
As described earlier, the method of producing the array board 1711b according to this embodiment includes the first film forming process. In the first film forming process, at least the organic insulator is formed from photosensitive organic resin material as an insulator. The organic insulator 1740 is exposed using the gray tone mask 1746 as a photomask. The gray tone mask 1746 includes the light blocking film 1746b including the slits 1746b1 and the semitransmissive areas THA in which the slits 1746b1 are formed and the width of which is in the range from 0.5 μm to 5 μm. With rays of light transmitted through the semitransmissive areas HTA, at least second inclined portion 1749 having the smaller inclination angle among the inclined portions is formed at the edge of the corresponding lower contact hole 1730. By exposing the organic insulator 1740, which is made of photosensitive organic resin material in the first film forming process, using the gray tone mask 1746, the lower contact holes 1730 are formed in the organic insulator 1740. The second inclined portions 1749 are formed at the edges of the lower contact holes 1730 with the rays of light transmitted through the semitransmissive areas HTA of the light blocking film 1746b in which the slits 1746b1 are formed. The second inclined portions 1749 are the inclined portions having the smaller inclination angle among the inclined portions. If the width of the semitransmissive area is smaller than 0.5 μm, an amount of light transmitted through the semitransmissive areas may be so small that underexposure may occur. As a result, the second inclined portions having the smaller inclination angle may not be formed in the organic insulator 1740. If the width of the semitransmissive area is larger than 5 μm, multiple steps may be formed at the edges of the lower contact holes 1730. As a result, the second inclined portions having the smaller inclination angle may not be formed in the organic insulator 1740. By setting the width of each semitransmissive area HTA of the in the range from 0.5 μm to 5 μm, the organic insulator 1740 are properly exposed and the second inclined portions 1749 are properly formed at the edges of the lower contact holes 1730.
A nineteenth embodiment of the present invention will be described with reference to
As illustrated in
As described above, the organic insulator 1840 in the array board according to this embodiment includes the lower contact holes 1830 each having the rectangular shape in a plan view. The second inclined portion 1849 having the smaller inclination angle and the first inclined portions 1848 having the larger inclination angle are formed at the portions of long edge of each lower contact hole. According to the configuration, that is, the second inclined portion 1849 having the smaller inclination angle and the first inclined portions 1848 having the larger inclination angle are formed at the portions of long edge of each lower contact hole, flowability of a solution for forming an alignment film is increased at a boundary between the inclined portions 1848 and 1849 having different inclination angles during the formation of the alignment film. This configuration is especially preferable when there is not sufficient space for forming the second inclined portions 1849 having the smaller inclination angle at the short edges of the lower contact holes 1830.
A twentieth embodiment of the present invention will be described with reference to
As illustrated in
A twenty-first embodiment of the present invention will be described with reference to
As illustrated in
As described above, the organic insulator 2040 in the array board according to this embodiment includes the lower contact holes 2030 each having the oval shape in a plan view. Each lower contact hole 2030 having the oval shape in a plan view does not have edges that cross each other. When a solution for forming an alignment film reaches the edge of the lower contact hole 2030 during the formation of the alignment film, droplets of the solution are less likely to merge and thus the solution is less likely to flow into the lower contact hole 2030. By forming at least two inclined portions having different inclination angles at the edge of the lower contact hole 2030, a sufficient level of flowability of the solution for forming the alignment film into the lower contact hole 2030 is achieved.
A twenty-second embodiment of the present invention will be described with reference to
As illustrated in
As described above, each lower contact hole 2130 is formed in the round shape in a plan view in the organic insulator 2140 in an array board according to this embodiment. The lower contact hole 2130 having the round shape in a plan view does not have edges that cross each other. When a solution for forming an alignment film reaches the edge of the lower contact hole 2130 during the formation of the alignment film, droplets are less likely to merge and thus the solution is less likely to flow into the lower contact hole 2130. By forming at least two inclined portions having different inclination angles at the edge of the lower contact hole 2130, a sufficient level of flowability of the solution for forming the alignment film into the lower contact hole 2130 is achieved.
A twenty-third embodiment of the present invention will be described with reference to
As illustrated in
A twenty-fourth embodiment of the present invention will be described with reference to
As illustrated in
A twenty-fifth embodiment of the present invention will be described with reference to
As illustrated in
A twenty-sixth embodiment of the present invention will be described with reference to
As illustrated in
A twenty-seventh embodiment of the present invention will be described with reference to
As illustrated in
A twenty-eighth embodiment of the present invention will be described with reference to
As illustrated in
A twenty-ninth embodiment of the present invention will be described with reference to
As illustrated in
A thirtieth embodiment of the present invention will be described with reference to
As illustrated in
A thirty-first embodiment of the present invention will be described with reference to
As illustrated in
A thirty-second embodiment of the present invention will be described with reference to
As illustrated in
The present invention is not limited to the above embodiments described with reference to the drawings. The following embodiments may be included in the technical scope of the present invention.
(1) The angle between the first edge and the second edge inside the contact hole in the bending portion may be defined as appropriate other than the angles defined in the above embodiments illustrated in the drawings.
(2) Each of the first edge and the second edge of each bending portion in each of the above embodiments is a straight edge in a plan view. However, each of the first edge and the second edge of the bending portion may a curved edge.
(3) The shapes of each contact hole main portion and each expanded hole portion in a plan view may be defined as appropriate other than those in the above embodiments. For example, the shapes of the contact hole main portion and the expanded hole portion in a plan view may be square shapes, triangular shapes, polygonal shapes with five or more sides, diamond-like shapes, parallelogram shapes, round shapes, or elliptical shapes.
(4) The arrangement of each expanded hole portion relative to the corresponding contact hole main portion may be defined as appropriate other than the arrangements in the above embodiments. The number and the size of the expanded hole portions in a plan view may also be altered as appropriate.
(5) The arrangement of the expanded hole portion of the upper contact hole relative to the pixel components (gate electrode, drain electrode, channel, hole of the insulator, gate line, pixel electrode, common electrode, drain line, or upper contact hole) may be defined as appropriate other than the arrangements in the above embodiments.
(6) The arrangement and the shape of each upper contact hole in a plan view and the area in which the upper contact hole is formed may be defined as appropriate other than those of the above embodiments. For example, the arrangement may be altered such that the upper contact hole overlaps the expanded hole portion of the lower contact hole in a plan view, or the upper contact hole overlaps the lower contact hole in a plan view. In this configuration, the shape of the upper contact hole in a plan view may be the same as that of the lower contact hole. According to the configuration, the upper contact hole can be used as a mask for patterning the lower contact holes.
(7) In the second and fourteenth embodiments, the patterning is performed on the organic insulator using the gray tone mask. However, the patterning may be performed on the organic insulator using a halftone mask including a semitransmissive film.
(8) The alignment film is applied to the array board using the inkjet device or the screen printing device in the above embodiments, the alignment film may be applied to the array board using an offset printing device, a relief printing device, an intaglio printing device, or a lithographic printing device. It is preferable to use the same device for applying the alignment film to the CF board as that used for the array board.
(9) The alignment film is made of polyimide in the above embodiments. However, liquid crystal alignment materials other than polyimide may be used for the alignment film.
(10) The alignment film is the light alignment film made of light alignment material to exert the alignment function when subjected to the ultraviolet light. However, an alignment film configured to exert alignment function through rubbing may be included in the scope of the present invention.
(11) The display area side contact hole overlaps the drain electrode of the TFT in a plan view and the pixel electrode is directly connected to the drain electrode in the above embodiments. However, the display area side contact hole may not overlap the drain electrode in a plan view but overlap the drain line (including capacitance formation portion) in a plan view and the pixel electrode may be connected to the drain line.
(12) In each of the above embodiments, the TFTs are disposed over the respective gate lines. However, a configuration in which the TFTs that do not overlap the gate lines in a plan view may be included in the scope of the present invention. In the configuration, the gate electrodes may be formed branched off the gate lines.
(13) In each of the above embodiments, a portion of each TFT is disposed over the corresponding source line. However, a configuration in which each TFT does not overlap the source line in a plan view may be included in the scope of the present invention. In the configuration, the source electrodes may be formed branched off the source lines.
(14) In each of the above embodiments, each gate line and each auxiliary capacitor line are disposed such that the middle portion of the pixel electrode is sandwiched therebetween in a plan view, or the auxiliary capacitor line may be disposed so as to cross the middle portion of the pixel electrode in the length direction.
(15) In the above embodiments, each bending portion (at least two inclined portions) is formed at the edge of the corresponding non-display area side contact hole for connecting the corresponding gate line to the row control circuit. However, in a configuration in which the non-display area side contact holes are formed at a portion where the column control circuit and the source line are connected, the bending portion (at least two inclined portions) may be formed at an edge of the non-display area side contact hole. Furthermore, in a configuration that includes the non-display area side contact holes for connecting the lines formed from the first metal film to the lines formed from the second metal film in the non-display area, the bending portion (at least two inclined portions) may be formed at an edge of the non-display area side contact hole.
(16) The arrangement and the number of row control circuits on the array board may be defined as appropriate other than those of the above embodiments. For example, a configuration in which the row control circuit is disposed on the right side of the display area on the array board in
(17) The materials of the gate insulator, the protection film, the first interlayer insulator, the organic insulator, and the second interlayer insulator may be defined as appropriate other than those of the above embodiments.
(18) In the above embodiments, the oxide semiconductor film is the oxide thin film containing indium (In), gallium (Ga), and zinc (Zn). However, another kind of oxide semiconductor material may be used. Specifically, an oxide containing indium (In), silicon (Si), and zinc (Zn), an oxide containing indium (In), aluminum (Al), and zinc (Zn), an oxide containing tin (Sn), silicon (Si), and zinc (Zn), an oxide containing tin (Sn), aluminum (Al), and zinc (Zn), an oxide containing tin (Sn), gallium (Ga), and zinc (Zn), an oxide containing gallium (Ga), silicon (Si), and zinc (Zn), an oxide containing gallium (Ga), aluminum (Al), and zinc (Zn), an oxide containing indium (In), copper (Cu), and zinc (Zn), an oxide containing tin (Sn), copper (Cu), and zinc (Zn) may be used.
(19) The first metal film and the second metal film are formed from a multilayer film of titanium (Ti) and copper (Cu) in the above embodiments. However, titanium may be replaced by molybdenum (Mo), molybdenum nitride (MoN), titanium nitride (TiN), tungsten (W), niobium (Nb), molybdenum-titanium alloy (MoTi), or molybdenum-tungsten alloy (MoW). Alternatively, a single-layer metal film of titanium, copper, or aluminum may be used.
(20) In each of the above embodiments, the liquid crystal panel includes the FFS mode as an operation mode. However, a liquid crystal panel including the IPS (In-Plane Switching) mode or the VA (Vertical Alignment) mode as an operation mode may be included in the scope of the present invention.
(21) In each of the above embodiments, the display area on the liquid crystal panel is in the middle of the short dimension and off to one end of the long dimension. However, a liquid crystal panel including a display area in the middle of the long dimension and off to one end of the short dimension may be included in the scope of the present invention. Furthermore, a liquid crystal panel including a display area off to one end of the long dimension and to one end of the short dimension may be included in the scope of the present invention. Furthermore, a liquid crystal panel including a display area in the middle of the long dimension and in the middle of the short dimension may be included in the scope of the present invention.
(22) The driver is mounted directly on the array board by the COG method in the above embodiments. However, the driver mounted on the flexible board connected to the array board through ACF may be included in the scope of the present invention.
(23) The row control circuit and column control circuit are disposed in the non-display area of the array board in the above embodiments. However, a configuration that does not include one of or both the row control circuit and the column control circuit and includes a driver configure to perform the functions of those circuit may be included in the scope of the present invention. The configuration that does not include the row control circuit does not include the non-display area side contact holes.
(24) Each of the embodiments includes the liquid crystal panel having a vertically-long rectangular shape. However, a liquid crystal panel having a horizontally-long rectangular shape or a square shape may be included in the scope of the present invention.
(25) A configuration including the liquid crystal panel in each of the above embodiments and a functional panel such as a touch panel or a parallax barrier panel (switch liquid crystal panel) attached to the liquid crystal panel may be included in the scope of the present invention. Furthermore, a configuration including a touch panel pattern directly formed on a liquid crystal panel may be included in the scope of the present invention.
(26) The backlight device in the liquid crystal display device is the edge-light type in the above embodiments. However, a liquid crystal display device including a direct backlight device may be included in the scope of the present invention.
(27) Each of the above embodiments includes the transmissive type liquid crystal display device including the backlight device as an external light source. However, a reflective liquid crystal display device configured to display images using external light may be included in the scope of the present invention. Such a display device does not require a backlight device.
(28) Each of the above embodiments includes the TFTs as switching components of the liquid crystal display device. However, switching components other than the TFTs (such as thin film diodes (TFDs)) may be included in the scope of the present invention. Furthermore, a liquid crystal display device configured to display black and white images other than o the liquid crystal display device configured to display color images.
(29) Each of the above embodiments includes the liquid crystal panel including the liquid crystals held between the substrates and the alignment film for controlling the alignment of the liquid crystals. However, a display panel including an alignment film for controlling alignment of functional organic molecules other than the liquid crystals may be included in the scope of the present invention.
(30) The above embodiments include the liquid crystal panels that are classified as small sized or small to middle sized panels. Such liquid crystal panels are used in electronic devices including PDAs, mobile phones, laptop computers, digital photo frames, portable video games, and electronic ink papers. However, liquid crystal panels that are classified as middle sized or large sized (or supersized) panels having screen sizes from 20 inches to 90 inches are also included in the scope of the present invention. Such display panels may be used in electronic devices including television devices, electronic signboards (digital signage), and electronic blackboard.
(31) The bending portions, or the first inclined portions and the second inclined portions are formed at the edges of the lower contact holes of the display area side contact holes in the second and sixth to fourteenth embodiments. However, the bending portions, or the first inclined portions and the second inclined portions similar to those of the second and sixth to fourteenth embodiments may be formed at the edges of the non-display area side contact holes.
(32) In the fourteenth embodiment, the number of the first inclined portions and the number of the second inclined portions are the same (in pairs). However, the first inclined portions and the second inclined portions may be formed in the different numbers. Specifically, the first inclined portion(s) or the second inclined portion(s) may be formed at three edges out of four edges of each lower contact hole (non-display area side contact hole), and the second inclined portion or the first inclined portion may be formed at the rest of the edges. Even if the shape of each lower contact hole in a plan view is altered to a shape other than the rectangular shape, the first inclined portions and the second inclined portions may be formed in the different numbers similarly to the above. The arrangement of the first inclined portions and the second inclined portions at the edges of the lower contact hole in a plan view may be altered as appropriate.
(33) In the fourteenth embodiment, two inclined portions (first inclined portion and second inclined portion) with the different inclination angles are formed at the edge of the lower contact hole. However, three or more inclined portions with different inclination angles (specifically, at least the first inclined portion, the second inclined portion, and a third inclined portion with an inclination angle different from both the first inclined portion and the second inclined portion) may be formed at the edge of the lower contact hole (non-display area side contact hole).
(34) The configuration according to the fourteenth embodiment may be combined with the configuration according to any of the first to thirteenth embodiments. In this case, the bending portion, and the first inclined portion and the second inclined portion are provided for the edge of the lower contact hole (non-display area side contact hole).
(35) In the fifteenth embodiment, the difference between the inclination angles of the inclined portions are altered by adjusting the inclination angle of the second inclined portion while the inclination angle of the first inclined portion is maintained constant in the comparative experiment. The difference between the inclination angles of the inclined portions may be altered by adjusting the inclination angle of the first inclined portion while the inclination angle of the second inclined portion is maintained constant. Furthermore, the difference between the inclination angles of the inclined portions may be altered by adjusting the inclination angle of the second inclined portion and the inclination angle of the first inclined portion, respectively.
(36) In each of the fifteenth to the thirty-second embodiment (except for the eighteenth embodiment), the organic insulator is exposed to light using the halftone mask. However, the organic insulator in each of those embodiments may be exposed to light using a gray-tone mask.
(37) In each of the fifteenth to the thirty-second embodiment (except for the eighteenth embodiment), the positive photosensitive organic resin material is used for the organic insulator exposed to light using the halftone mask. However, a negative photosensitive organic resin material may be used for the organic insulator exposed to light using the halftone mask in each of those embodiments.
(38) In the eighteenth embodiment, the positive photosensitive organic resin material is used for the organic insulator exposed to light using the gray-tone mask. However, a negative photosensitive organic resin material may be used for the organic insulator exposed to light using the gray-tone mask.
(39) The width of the semitransmissive area, the distance between the transmissive area and the semitransmissive area, and a distance between the light blocking area and the semitransmissive area of the halftone mask may be altered from those in the sixteenth embodiment or the seventeenth embodiment as appropriate. It is preferable to define those in a range from 0.5 μm to 5 μm.
(40) The width of the semitransmissive area of the halftone mask may be altered from that in the eighteenth embodiment as appropriate. It is preferable to define the width in a range from 0.5 μm to 5 μm.
(41) The difference between the inclination angles of the first inclined portion and the second inclined portion may be altered from that in the fifteenth embodiment as appropriate. It is preferable to define the difference in angle in a range from 10° to 50°. The inclination angle of the first inclined portion and the inclination angle of the second inclined portion may be altered as appropriate.
(42) The length of the second inclined portion formed at the short edge of the lower contact hole may be altered from that in the fifteenth embodiment as appropriate. It is preferable to define the length equal to 8 μm or smaller.
(43) The area of each lower contact hole may be altered from that in the fifteenth embodiment as appropriate. It is preferable to define the area in a range from 10 μm2 to 150 μm2.
(44) In the twentieth embodiment, the second inclined portion is formed at the short edge of the lower contact hole for the entire length of the short edge. However, the second inclined portion may be formed at the long edge of the lower contact hole for the entire length of the long edge.
(45) A modification of the twenty-first embodiment or the thirtieth embodiment may include a second inclined portion formed at an end of a long dimension of a contact hole having an oval shape in a plan view. Alternatively, a second inclined portion may be formed off the long axis or the short axis of the contact hole. Furthermore, the number and the arrangement of the second inclined portions and the area in which the second inclined portion is formed may be altered as appropriate.
(46) The number and the arrangement of the second inclined portions and the area in which the second inclined portion is formed at the edge of the lower contact hole having the round shape in a plan view may be altered as appropriate from those in the twenty-second, the thirty-first, or the thirty-second embodiment. For example, four or more second inclined portions may be formed or the second inclined portions may be arranged at irregular intervals along a circumferential direction of the lower contact hole.
(47) The number and the arrangement of the second inclined portions and the areas in which the second inclined portions are formed at the edges of the lower contact hole having a rectangular shape in a plan view may be altered from those in the fifteenth embodiment to the thirty-second embodiment. For example, three second inclined portions or five or more second inclined portions may be formed. Alternatively, two second inclined portions may be formed at the long edge of the lower contact hole and two second inclined portions may be formed at the short edge of the lower contact hole. Furthermore, the configuration of any of the fifteenth embodiment to the thirty-two embodiment and the configuration of any of the first embodiment to the fourteenth embodiment may be combined.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-285308 | Dec 2012 | JP | national |
| 2013-023564 | Feb 2013 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2013/084230 | 12/20/2013 | WO | 00 |
