Patent Application
20060068677
1. Field of the Invention
The present invention relates to display panel assembly apparatus and an assembly method for assembling display panels by bonding a glass panel and driver substrate via a connector.
2. Background Art
Display panels, including plasma display panels and liquid crystal display panels employed in displays of electronic apparatuses, are assembled by bonding a driver substrate onto the edge of a glass panel, which becomes the display screen, via a connector such as TCP (tape carrier package). In this assembly type, the glass panel, connector, and terminals formed on the edge of the driver substrate are bonded using a bonding material such as an anisotropic conductive tape. This technology is disclosed in the Japanese Patent No. 3531586. Conventional thermo-compression bonding apparatus bonds a connector, bonded in advance on the driver substrate, onto the edge of glass panel by thermo-compression to assemble a display panel.
In line with the recent diversification of display panels, manufacturing processes are also becoming more diverse depending on panel size and type. For example, a glass panel with connector bonded in advance is needed for using a glass panel with narrow-pitch terminals to permit higher-density mounting. To use this type of glass panel, an anisotropic conductive tape needs to be attached to the driver substrate. This makes conventional thermo-compression bonding apparatus not applicable on its own, since it requires an additional unit for attaching the anisotropic conductive tape. However, attachment of this additional unit increases the area occupied by the assembly apparatus, and in some cases results in loss of operational efficiency.
The present invention aims to offer display panel assembly apparatus and an assembly method that reduce the apparatus installation area while achieving high productivity.
The display panel assembly apparatus of the present invention assembles a display panel by bonding the substrate onto a glass panel via a connector and bonding material. The assembly apparatus includes a bonder for bonding the connector attached to the glass panel in advance and the substrate using the bonding material; a panel-positioning unit disposed on one side (a first side) of the bonder for holding the glass panel in which the connector is bonded to its edge and positioning the glass panel with respect to the bonder; a panel transport unit for loading the glass panel onto the panel-positioning unit and unloading an assembled display panel from the panel-positioning unit; a substrate transport unit disposed on the other side (a second side) of the bonder for circulating a substrate holder holding the substrate by a circulatory transport mechanism so as to transport the substrate supplied to the substrate holder by a substrate feeder at a substrate-feeding position to the bonder; and a bonding material feeder disposed on the circulating route of the circulatory transport mechanism for supplying the bonding material to the substrate held by the substrate holder.
The display panel assembly method of the present invention assembles the display panel by bonding the glass panel onto the substrate with the bonding material by the bonder. The assembly method of the present invention includes a panel-loading step for loading the glass panel of which the connector is bonded to its edge onto the panel-positioning unit; a panel-positioning step for holding the glass panel on the panel-positioning unit and positioning the glass panel from one side (a first side) of the bonder; a substrate transport step for transferring the substrate supplied to the substrate holder at the substrate-feeding position from the other side (a second side) of the bonder by circulating the substrate holder onto which the substrate is placed using a circulatory transport mechanism; a bonding material feeding step for supplying the bonding material to the substrate held with the substrate holder by the bonding material feeder disposed on the circulating route of the circulatory transport mechanism in the middle of the substrate transport step; a bonding step for bonding the connector bonded to the glass panel in advance and the substrate using the bonding material by the bonder; and a panel-unloading step for unloading the assembled display panel from the panel-positioning unit.
A preferred embodiment of the present invention is described below with reference to drawings.
The display panel assembly apparatus has the function of assembling a display panel by bonding a driver substrate (first workpiece) onto a glass panel via a connector and an adhesive tape made of anisotropic conductive agent (bonding material). The connector is already connected to the glass panel in the previous step, and this glass panel, when connected to the connector, configures the second workpiece. The display panel assembly apparatus of the present invention is thus the workpiece assembly apparatus for bonding and assembling the first and second workpieces.
In
Panel-positioning table 7 is configured by piling X-axis table 7X, Y-axis table 7Y, and Zθ-axis table 7Zθ, and holds glass panel 4 loaded from loading conveyor 3A. Bonder 8, described later, is disposed at the back of loading conveyor 3A and unloading conveyor 3B on base 1. Panel-positioning table 7 positions glass panel 4 against bonder 8.
In this position, substrate 6 transferred by circulatory transport mechanism 10, described later, and glass panel 4 are bonded to assemble a display panel. The assembled display panel, which is glass panel 4 to which substrate 6 is bonded through the connector, is unloaded to downstream apparatus by unloading conveyor 3B. Loading conveyor 3A and unloading conveyor 3B comprise a panel transport unit that loads glass panel 4 to panel-positioning table 7 and unloads glass panel 4 from panel-positioning table 7.
As shown in
As shown in
The display panel assembly apparatus as configured above has a layout providing a mechanism for transferring and positioning glass panel 4 including loading conveyor 3A, unloading conveyor 3B, and panel-positioning table 7 on one side of bonder 8; and a substrate transport system for transferring substrate 6 supplied from substrate feeder 2 and held by substrate holder 20 to bonder 8 by circulatory transport mechanism 10 on the other side of bonder 8.
Substrate-feeding mechanism 13 is equipped with substrate holding head 13a for holding substrate 6 by suction. Head transfer table 13b transfers substrate holding head 13a holding substrate 6 to substrate-feeding position [A] (workpiece feeding position) set on the circulating route of circulatory transport mechanism 10. Substrate 6 is then placed on and held by substrate holder 20 in this position. Since substrate 6 is difficult to handle and transfer because it is a flexible resin substrate which is thin and easily warped, substrate holder 20 supports and clamps the rear face of substrate 6 for transfer and positioning. Substrate-feeding mechanism 13 is a substrate-feeding unit (first workpiece feeder) that supplies substrate 6 to substrate holder 20 at substrate-feeding position [A].
The circulating route of circulatory transport mechanism 10 is configured with five guide rails: movable rails 16 and 17, fixed rail 18, and movable rails 11b and 12b disposed respectively along direction X. Of these guide rails, fixed rail 18 is fixed onto base 1, and the other four guide rails are movable by their respective rail transfer mechanisms.
More specifically, movable rails 11b and 12b respectively move in direction Y by means of rail transfer table 11a and rail transfer table 12a of first rail transfer unit 11 and second rail transfer unit 12. Movable rail 16 moves in directions X, Y, Z, and θ by means of X-axis table 14X, Y-axis table 14Y, and Zθ-axis table 14Zθ of first holder transfer table 14. Still more, movable rail 17 moves in directions X, Y, Z, and θ by means of X-axis table 15X, Y-axis table 15Y, and Zθ-axis table 15Zθ of second holder transfer table 15.
Substrate holder 20 is a flat plate that includes substrate placement area 20a which contacts and retains the bottom face of substrate 6, and damper 20b which holds down and secures substrate 6. Substrate holder 20 is fixed to slider 22 through attachment table 21. Accordingly, substrate holder 20 can slide along movable rail 16, for example. In substrate holder 20, damper 20b is not essential. A method of securing substrate 6 by suction is also applicable.
Attachment table 21 is attached to slider 22 with a bolt on attachment hole 21a and screw hole 22a. Substrate holder 20 can be transferred between guide rails when two guide rails are aligned lengthwise and the end faces of these guide rails in the length direction are brought closer to a predetermined distance.
An example shown in
Substrate holder 20 transferred to movable rail 16 on the circulating route by circulatory transport mechanism 10 moves together with movable rail 16 by driving first holder transfer table 14. Accordingly, substrate 6 held by substrate holder 20 relatively moves with respect to bonding tape applicator 90. Through this relative movement, bonding tape applicator 90 applies bonding tape 41 onto substrate 6.
As shown in
Substrate holder 20 holding substrate 6 after bonding tape 41 is applied is transferred to movable rail 17. Here, substrate holder 20 holding substrate 6 is positioned with respect to bonder 8 by driving second holder transfer table 15. As shown in
In
First transport route 10a and second transport route 10b are parallel to panel loading conveyor 3A and panel unloading conveyor 3B, and are disposed across bonder 8. First transport route 10a is nearer to bonder 8 than second transport route 10b. In other words, second transport route 10b is disposed parallel to first transport route 10a at a position slightly more distant from bonder 8 than first transport route 10a on the face at the same side of bonder 8.
This circulating route is configured in a way that movable rails 11b and 12b are movable between both ends of first transport route 10a and between both ends of second transport route 10b. This configuration enables multiple substrate holders 20 to move in circulating fashion along the circulating route including first transport route 10a and second transport route 10b. More specifically, substrate holder 20 transfers between guide rails and moves linearly along first transport route 10a and second transport route 10b. Substrate holder 20 transfers between first transport route 10a and second transport route 10b parallel to each other by driving rail transfer tables 11a and 12a to slide movable rails 11b and 12b in direction Y when substrate holder 20 is transferred to movable rails 11b and 12b. This configuration of the circulating route for circulating substrate holder 20 achieves a compact and simple circulatory transport mechanism.
The position where substrate holder 20 transfers from movable rail 11b to fixed rail 18 in second transport route 10b is indicated as substrate-feeding position [A] as described previously. Substrate-feeding mechanism 13 supplies substrate 6 to substrate holder 20 when substrate holder 20 reaches this substrate-feeding position [A]. Substrate holder 20 holding substrate 6 then moves toward the downstream of second transport route 10b, and is transferred to movable rail 12b. The position where this substrate holder 20 reaches the right end of first transport route 10a by second rail transfer unit 12 is loading standby position [B] where substrate holder 20 stands by until the timing where substrate holder 20 can be loaded to the operation standby position described below.
The substrate-feeding position is not limited to that illustrated in the drawing. The substrate-feeding position can be at any position where substrate 6 is not present on substrate holder 20. For example, unloading position [G], described later, can also be used as the substrate-feeding position. It is apparent that the substrate-feeding position can be set to any other point as long as it is on the circulating route of circulatory transport mechanism 10.
In
Also in
Loading standby position [B], first operation standby position [C], second operation standby position [E], and unloading position [G] are set on first transport route 10a at predetermined pitch p. This enables synchronized transport at an equivalent pitch by first holder transport mechanism 30 described later. A position on movable rail 11b where substrate holder 20 is transferred from movable rail 16 is unloading position [G] where substrate holder 20 is unloaded from first transport route 10a.
While three transport hooks 34 are individually positioned at an end face of substrate holder 20 in direction X at loading standby position [B], first operation standby position [C], and second operation standby position [E]; transport hooks 34 are lowered to the pushing level (arrow a); and then belt 32 is moved to the direction of arrow b by driving motor 31 so that each substrate holder 2 can be simultaneously moved along first transport route 10a.
Here, if the movement of transport hooks 34 by belt 32 is set to aforementioned pitch p, substrate holders 20 respectively at loading standby position [B], first operation standby position [C], and second operation standby position [E] are moved on first transport route 10a to first operation standby position [C], second operation standby position [E], and unloading position [G]. Then, in this state, transport hooks 34 are elevated to the backward level (arrow c), and then belt 32 is moved to the direction indicated by arrow d such that each of the transport hooks 34 returns to its origin in readiness for the next holder movement.
Second holder transport mechanism 35 is configured with one transport hook 38 coupled to belt 37 which horizontally reciprocates in direction X, driven by motor 36. Transport hook 38 is positioned to substrate holder 20 on second transport route 10b. Transport hook 38 is then lowered to the pushing level, and belt 37 is moved to the direction indicated by arrow d so that substrate holder 20 moves along second transport route 10b.
Accordingly, substrate holder 20 on movable rail 11b coupled to second transport route 10b is moved to substrate-feeding position [A] on fixed rail 18, after which substrate holder 20 is further moved along fixed rail 18 so as to be transferred to movable rail 12b. This substrate holder 20 then moves to loading standby position [B] together with movable rail 12b by second rail transfer unit 12. This completes one cycle of circulatory movement of substrate holder 20 by circulatory transport mechanism 10.
The circulating route of circulatory transport mechanism 10 described above includes first linear loading route 10a and second linear loading route 10b parallel to each other on the same side of bonder 8. Loading standby position [B], first operation standby position [C], second operation standby position [E], and unloading position [G] are set on first transport route 10a, disposed nearer to bonder 8 than second transport route 10b, at an equivalent distance of predetermined pitch p. Substrate-feeding position [A] is set on second transport route 10b disposed further from bonder 8 than first transport route 10a. First transport route 10a and first holder transport mechanism 30 configure a transport mechanism for moving a plurality of substrate holders 20 holding substrate 6 one way from loading standby position [B] to unloading position [G] along the linear transport route.
This transport mechanism transfers substrate holders 20 to loading standby position [B], first operation standby position [C], second operation standby position [E], unloading position [G], substrate-feeding position [A], and then returns the substrate holders 20 to loading standby position [B]. Transport by this transport mechanism makes holder transport mechanism 30 act as a synchronous transport unit for transferring substrate holders 20 respectively set at loading standby position [B], first operation standby position [C], and second operation standby position [E] to first operation standby position [C], second operation standby position [E], and unloading position [G] simultaneously at an uniform pitch.
The above substrate transport system is a workpiece transport device for transferring substrate 6 to first operation position [D] (operation position) by moving substrate holder 20 (workpiece holder) holding substrate 6 (workpiece) along the circulating route. In this workpiece transport device, movable rails 11b, 12b, 16, and 17, and fixed rail 18 are a plurality of linear guide members that guide movement of substrate holder 20, and coupled rails allow transfer of substrate holder 20 from one rail to another. In addition, rail transfer tables 11a and 12a, first holder transfer table 14, and second holder transfer table 15 act as a guide member transfer unit forming a circulating route by moving a specific linear guide member out of multiple linear guide members and coupling it to another specific linear guide member.
First holder transport mechanism 30 and second holder transport mechanism 35 are a substrate holder transport unit for moving substrate holder 20 along linear guide members forming the circulating route. Substrate-feeding position [A], loading standby position [B], first operation standby position [C] (workpiece standby position), second operation standby position [E], and unloading position [G] are stops set on this circulating route where substrate holder 20 stops. Substrate 6 transferred from second operation standby position [E] to second operation position [F] is ejected to unloading conveyor 3B together with glass panel 4. Accordingly, from the view of the circulatory transport function of circulatory transport mechanism 10, second operation standby position [E] is an ejection position where substrate 6 is taken outside from the circulating route of circulatory transport mechanism 10.
More specifically, these stops in the workpiece transport device are configured to include substrate-feeding position [A] where substrate 6 is fed to substrate holder 20, first operation standby position [C] where substrate holder 20 stands by before substrate 6 is supplied and moved to first operation position [D] at substrate-feeding position [A], and ejection position [E] where substrate 6 after operation is finished at first operation position [D] is taken outside of the circulating route. Furthermore, first holder transfer table 14 acts as a first transfer unit for transferring substrate holder 20 to first operation standby position [C] and first operation position [D] set at bonding tape applicator 90.
In other words, the circulating route in the workpiece transfer device is configured to include linear first transport route 10a including first operation standby position [C] and second operation standby position [E] as the ejection position, and second transport route 10b parallel to this first transport route 10a. Rail transfer tables 11a and 12a which configure the guide member transfer unit couple first transport route 10a and second transport route 10b by moving movable rails 11b and 12b which are linear guide members between both ends of first transport route 10a and between both ends of second transport route 10b.
Substrate holder 20 on which substrate 6 is placed by circulatory transport mechanism 10 stops at positions at least substrate-feeding position [A], first operation standby position [C] before being transferred to first operation position [D], and ejection position [E] where substrate 6 after operation is finished at first operation position [D] is taken outside of the circulating route.
Next, a position stopper for substrate holder 20 provided at each position in the aforementioned substrate transport system is described. This position stopper retains substrate holder 20 sliding on each guide rail by slider 22 shown in
As shown in
Substrate holder 20 transferred along the circulating route of circulatory transport mechanism 10 holds substrate 6 to which bonding tape 41 is applied by bonding tape applicator 90, and stops at second operation standby position [E]. Then, Y-axis table 15Y transfers substrate holder 20 to second operation position [F]. Second holder transfer table 15 is the second transfer unit which transfers substrate holder 20 holding substrate 6 to second operation standby position [E] and second operation position [F] set at bonder 8.
For bonding, substrate 6 is positioned to a predetermined pressing position on back support 8b by driving each table mechanism of second holder transfer table 15. Then, panel positioning table 7 positions glass panel 4 with respect to substrate 6. This enables relative positioning of connecting terminals of connectors 5 prebonded on edge 4a of glass panel 4 and connecting terminals of substrate 6.
As shown in
In the above configuration, bonder 8 is a bonding unit which bonds connectors 5 attached to glass panel 4 in advance and substrate 6 via bonding tape 41. In other words, bonder 8 is the bonding unit which bonds substrate 6 (first workpiece) positioned at second operation position [F] and glass panel 4 with connectors 5 (second workpiece) via bonding tape 41 (bonding material).
Panel positioning table 7 disposed in front (one side) of bonder 8 acts as a workpiece positioning unit for positioning glass panel 4 with respect to substrate 6 on substrate holder 20 positioned at second operation position [F], and holding glass panel 4 in which connectors 5 are bonded to its edge 4a.
Circulatory transport mechanism 10 and second holder transfer table 15 disposed at back side (the other side) of bonder 8 act as a substrate transfer unit for transferring substrate 6 supplied to substrate holder 20 by substrate-feeding mechanism 13 at substrate-feeding position [A] set in the circulating route to bonder 8 by circulating substrate holder 20 holding substrate 6 along the circulating route.
Bonding tape applicator 90 is disposed on the circulating route and acts as a bonding material feeder which feeds bonding tape 41 to substrate 6 held by substrate holder 20 at first operation position [D]. Still more, first holder transfer table 14 acts as the first transfer unit for transferring substrate holder 20 holding substrate 6 to first operation standby position [C] and first operation position [D]. This first transfer unit transfers substrate holder 20 for applying the bonding tape by bonding tape applicator 90.
Next, as shown in
As described later in
In parallel with this substrate feeding operation, substrate holder 20B is transferred from second operation standby position [E] to second operation position [F]. Then, bonder 8 bonds substrate 6 and glass panel 4. In addition, substrate holder 20C is transferred from first operation standby position [C] to first operation position [D]. After this transfer, bonding tape applicator 90 applies bonding tape 41 to substrate 6.
Then, as shown in
The same operations repeat on and after.
In other words, the operation of the display panel assembly described above includes the substrate transport step for transferring substrate 6 fed to substrate holder 20 by substrate-feeding mechanism 13 at substrate-feeding position [A] to bonder 8 from the other side by circulating substrate holder 20 on which substrate 6 is placed by means of circulatory transport mechanism 10; the bonding material feeding step for applying bonding tape 41 to substrate 6 held by substrate holder 20 by bonding tape applicator 90 disposed on the circulating route of circulatory transport mechanism 10 in the middle of the substrate-feeding step; the bonding step for bonding connectors 5 prebonded to glass panel 4 and substrate 6 using bonding tape 41 by bonder 8; and the panel-unloading step for unloading assembled glass panel 4 from panel-positioning table 7.
The method of bonding and assembling substrate 6 as the first workpiece and glass panel 4 to which connectors 5 are bonded as the second workpiece includes the step of feeding (workpiece feeding step) by placing substrate 6 on substrate holder 20 at substrate-feeding position [A], the first standby step of making substrate holder 20 to which substrate 6 is fed in the feeding step to stand by at first operation standby position [C], the first transfer step of transferring substrate 6 at first operation standby position [C] to first operation position [D]; the bonding material feeding step of feeding bonding tape 41 to substrate 6 on substrate holder 20 at first operation position [D]; second operation standby step of making substrate 6 to which bonding tape 41 is applied to stand by at second operation standby position [E]; the second transfer step of transferring substrate 6 on substrate holder 20 at second operation standby position [E] to second operation position [E]; the workpiece positioning step of positioning glass panel 4 against substrate 6 on substrate holder 20 at second operation position [E]; the bonding step of bonding substrate 6 on substrate holder 20 at second operation position [E] and connectors 5 coupled to glass panel 4 via bonding tape 41; and the unloading standby step of transferring empty substrate holder 20 after substrate 6 is taken out in the bonding step and making substrate holder 20 stand by at unloading position [G].
Circulation of substrate holder 20 by circulatory transport mechanism 10 allows substrate 6 to be transferred to first operation standby position [C] after the feeding step, substrate 6 to be transferred to second operation standby position [E] after the bonding material feeding step, and empty substrate holder 20 to be transferred to substrate-feeding position [A] after the bonding step. Moreover, the substrate holders at, respectively, loading standby position [B], first operation standby position [C], and second operation standby position [E] are simultaneously transferred to first operation standby position [C], second operation standby position [E], and unloading position [G]. Furthermore, during continuous operation, substrate holder 20 reciprocates the circulatory movement to loading standby position [B], first operation standby position [C], second operation standby position [E], unloading position [G], substrate-feeding position [A] and then returns to the loading standby position [B].
Adoption of this substrate transport system establishes the circulating route for circulating substrate holder 20 to take up the smallest feasible space and thus reduces the apparatus's footprint in the system for transporting thin and easy-to-warp substrate 6 by holding it with substrate holder 20. Still more, in the steps of circulating a small number of substrate holders 20, movement of substrate holders 20 becomes more efficient during continuous operation by adopting a structure for synchronously transferring a plurality of substrate holders 20. This improves operation efficiency and productivity.
Rail transfer mechanisms 111a and 112a are designed to respectively move movable rails 111b and 112b to positions parallel to movable rails 17 and 16 on second transport route 10b, i.e., where fixed rail 18 is disposed in
In
As shown in
In the above configuration, rail transfer mechanisms 111a and 112a form a guide member transfer unit that forms the circulating route by moving and coupling movable rails 111b and 112b, which are linear guide members, to other specific linear guide members. Adoption of this configuration reduces the length of the apparatus in the transport direction, making an even smaller circulatory transport mechanism feasible.
The display panel assembly apparatus and display panel assembly method of the present invention both reduce the footprint of the apparatus and achieve highly productive assembly of display panels. Accordingly, the present invention is effective in the display panel assembly field, which involves assembly of display panels by bonding a glass panel and driver substrate via connectors.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2004-279080 | Sep 2004 | JP | national |
