Double-effect thermoelectric cooling apparatus

Abstract

A double-effect thermoelectric cooling apparatus is described. The double-effect thermoelectric cooling apparatus includes a heat-dissipating barrel, a wind guide, cooling fins, and a fan. The heat-dissipating barrel further includes a thermoelectric chip-cooling module and heat-dissipating fins disposed therein. The fan drives a part of air passing through the heat-dissipating fins to remove a heat exchanged by the thermoelectric chip-cooling module. One end of the wind guide is coupled to a heat source of an electronic device, for example, a CPU or a graphic card of a computer. Another end of the wind guide is coupled to the fan to guide another part of the air through the cooling fins reducing the temperature thereof to the heat source of the electronic device to reduce the operating temperature of the heat source.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1 illustrates a schematic view of one embodiment of a double-effect thermoelectric cooling apparatus according to the present invention.

Claims

1. A double-effect thermoelectric cooling apparatus, comprising: a heat-dissipating barrel with a thermoelectric chip-cooling module and heat-dissipating fins disposed therein, to remove a heat exchanged by the thermoelectric chip-cooling module;a wind guide coupled to a heat source of an electronic device;cooling fins disposed between the wind guide and the thermoelectric chip-cooling module; anda fan installed on one end of the wind guide to drive an airflow through the cooling fins and the heat-dissipating fins, wherein a part of the airflow passes through the heat-dissipating fins to remove the heat exchanged by the thermoelectric chip-cooling module out of the electronic device, another part of the airflow passes through the cooling fins so as to reduce the temperature of the another part of the airflow, and the another part of the airflow is blown to the heat source of the electronic device through the wind guide to reduce the operating temperature of the heat source.

2. The double-effect thermoelectric cooling apparatus of claim 1, wherein the electronic device is a computer.

3. The double-effect thermoelectric cooling apparatus of claim 2, wherein the heat source comprises a central processing unit.

4. The double-effect thermoelectric cooling apparatus of claim 2, wherein the heat source comprises a graphic chip.

5. The double-effect thermoelectric cooling apparatus of claim 1, further comprising heat source dissipating fins coupled to the heat source, the fan blows the airflow to the heat source dissipating fins to reduce the operating temperature of the heat source.

6. The double-effect thermoelectric cooling apparatus of claim 5, wherein the airflow passes through the heat source dissipating fins and then is guided into the interior of the electronic device.

7. The double-effect thermoelectric cooling apparatus of claim 5, wherein the airflow passes through the heat source dissipating fins and then is emitted out of the electronic device.

8. The double-effect thermoelectric cooling apparatus of claim 5, further comprising a heat source fan installed between the wind guide and the heat source dissipating fins, wherein the wind guide covers the heat source fan to fully guide the another part of the airflow to the heat source fan.

9. The double-effect thermoelectric cooling apparatus of claim 1, wherein the airflow is directly sucked from the exterior of the electronic device.

10. The double-effect thermoelectric cooling apparatus of claim 1, wherein the wind guide is made of a heat insulation material.

11. The double-effect thermoelectric cooling apparatus of claim 1, wherein the wind guide is made of a plastic material.

12. The double-effect thermoelectric cooling apparatus of claim 1, further comprises a separating plate with an opening, wherein the thermoelectric chip-cooling module is fitted in the opening to isolate a hot side of the thermoelectric chip-cooling module from a cold side of the thermoelectric chip-cooling module.

13. The double-effect thermoelectric cooling apparatus of claim 1, wherein the separating plate is made of a heat insulation material.

14. A double-effect thermoelectric cooling apparatus, comprising: a heat-dissipating barrel with a thermoelectric chip-cooling module and heat-dissipating fins disposed therein, to remove a heat exchanged by the thermoelectric chip-cooling module;a wind guide coupling to an integrated circuit of a computer;cooling fins disposed between the wind guide and the thermoelectric chip-cooling module; anda fan installed on one end of the wind guide and the heat-dissipating barrel to drive an airflow through the cooling fins and the heat-dissipating fins, wherein a part of the airflow passes through the heat-dissipating fins to remove the heat exchanged by the thermoelectric chip-cooling module out of the computer, another part of the airflow passes through the cooling fins so as to reduce the temperature of the another part of the airflow, and the another part of airflow is blown to the integrated circuit of the computer through the wind guide to reduce the operating temperature of the integrated circuit.

15. The double-effect thermoelectric cooling apparatus of claim 14, wherein the heat source comprises a central processing unit.

16. The double-effect thermoelectric cooling apparatus of claim 14, wherein the heat source comprises a graphic chip.

17. The double-effect thermoelectric cooling apparatus of claim 14, further comprising integrated circuit heat-dissipating fins coupling to the integrated circuit and an integrated circuit fan installed between the wind guide and the integrated circuit heat-dissipating fins to drive the another part of the airflow to the integrated circuit heat-dissipating fins so as to reduce the operating temperature of the integrated circuit, wherein the wind guide covers the integrated circuit fan to fully guide the another part of the airflow to the integrated circuit fan.

18. The double-effect thermoelectric cooling apparatus of claim 17, wherein the airflow passes through the heat source dissipating fins and then is guided into the interior of the computer.

19. The double-effect thermoelectric cooling apparatus of claim 17, wherein the airflow passes through the heat source dissipating fins and then is emitted out of the computer.

20. The double-effect thermoelectric cooling apparatus of claim 14, further comprises a separating plate with an opening, wherein the thermoelectric chip-cooling module is fitted in the opening to isolate a hot side of the thermoelectric chip-cooling module from a cold side of the thermoelectric chip-cooling module.