Cooling arrangements using the Peltier effect

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/38Cooling arrangements using the Peltier effect

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Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric cooling pedestal for substrate processing systems
- Patent number 12,266,588
- Issue date Apr 1, 2025
- Lam Research Corporation
- Mrinal Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature adaptive information handling system
- Patent number 12,225,682
- Issue date Feb 11, 2025
- Dell Products L.P.
- Zhuo Ya Shi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical non-volatile memory device including thermoelectric device...
- Patent number 12,207,463
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jaebeom Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management device and system
- Patent number 12,188,692
- Issue date Jan 7, 2025
- BLUEXTHERMAL, INC.
- Reza Monazami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
On-chip peltier cooling device and manufacturing method thereof
- Patent number 12,183,657
- Issue date Dec 31, 2024
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling and heating system for non-idling vehicle
- Patent number 12,172,491
- Issue date Dec 24, 2024
- PACCAR Inc.
- David Mielke
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Nanoscale thermoelectric refrigerator
- Patent number 12,154,841
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power regeneration in a memory device
- Patent number 12,156,472
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera having a reduced dark current photodetector
- Patent number 12,148,855
- Issue date Nov 19, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermoelectric cooling packages
- Patent number 12,125,766
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with actively cooled sensor array
- Patent number 12,119,285
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Minseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for dissipating thermal loads in wearable devices
- Patent number 12,090,086
- Issue date Sep 17, 2024
- EMBR Labs IP LLC
- Matthew J. Smith
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Graphene-based nanosensor for identifying target analytes
- Patent number 12,059,251
- Issue date Aug 13, 2024
- The Trustees of Columbia University In the City of New York
- Qiao Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Accelerated cooling in storage devices
- Patent number 12,050,788
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Cono J Sammarco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state imaging device
- Patent number 12,034,016
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Masaki Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
- Patent number 12,029,123
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling device based on Peltier effect and manufacturing...
- Patent number 12,027,443
- Issue date Jul 2, 2024
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Jet impingement cooling for high power semiconductor devices
- Patent number 12,002,736
- Issue date Jun 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett Galloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dark current photodetector
- Patent number 11,961,936
- Issue date Apr 16, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Header for semiconductor package and semiconductor package
- Patent number 11,955,403
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subsea variable speed drive apparatus
- Patent number 11,950,389
- Issue date Apr 2, 2024
- Ana Maria Guimarães Guerreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating or cooling apparatus-integrated heat sink for a computing d...
- Patent number 11,925,003
- Issue date Mar 5, 2024
- Dell Products L.P.
- Eric Michael Tunks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure comprising a semiconductor die with a thermoelect...
- Patent number 11,915,994
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superlattice structures for thermoelectric devices
- Patent number 11,908,769
- Issue date Feb 20, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acclimated regulating system for electronics packages
- Patent number 11,901,259
- Issue date Feb 13, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT
- Publication number 20250183220
- Publication date Jun 5, 2025
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE
- Publication number 20250174518
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Rui JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoelectric System for Cooling Processors and RAM Memories
- Publication number 20250112117
- Publication date Apr 3, 2025
- Emil Stefanov Milanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
- Publication number 20250087554
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Chetan Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR DISSIPATING THERMAL LOADS IN WEARABLE DEVICES
- Publication number 20250057688
- Publication date Feb 20, 2025
- EMBR Labs IP LLC
- Matthew J. Smith
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250054834
- Publication date Feb 13, 2025
- Sony Semiconductor Solutions Corporation
- Takahiro WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER REGENERATION IN A MEMORY DEVICE
- Publication number 20250040439
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250038068
- Publication date Jan 30, 2025
- QingDing Precision Electronics (Huai’an) Co., Ltd.
- Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20250029885
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Donggyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY
- Publication number 20250022771
- Publication date Jan 16, 2025
- Microsoft Technology Licensing, LLC
- Minseok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR
- Publication number 20250022979
- Publication date Jan 16, 2025
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF
- Publication number 20250017110
- Publication date Jan 9, 2025
- Realtek Semiconductor Corp.
- Chih-Yen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT
- Publication number 20240363484
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PACKAGE EMBEDDED COOLING DEVICE
- Publication number 20240332127
- Publication date Oct 3, 2024
- Intel Corporation
- Eng Kwong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER
- Publication number 20240321677
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jingjing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM
- Publication number 20240323556
- Publication date Sep 26, 2024
- Sony Semiconductor Solutions Corporation
- JUMPEI KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation module
- Publication number 20240322106
- Publication date Sep 26, 2024
- CORETRONIC CORPORATION
- SHAO-PENG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES
- Publication number 20240312867
- Publication date Sep 19, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES
- Publication number 20240312866
- Publication date Sep 19, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240312873
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett GALLOWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PELTIER MODULE, ASSEMBLY, AND APPARATUS FOR MASK INSPECTION
- Publication number 20240298082
- Publication date Sep 5, 2024
- Carl Zeiss SMT GMBH
- Lutz Brekerbohm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multistage Thermoelectric Cooler with Phononic Structure
- Publication number 20240276882
- Publication date Aug 15, 2024
- William N. Carr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ADJUSTMENT DEVICE
- Publication number 20240274492
- Publication date Aug 15, 2024
- KELK LTD.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP
- Publication number 20240264374
- Publication date Aug 8, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING ADDITION
- Publication number 20240249995
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES
- Publication number 20240243545
- Publication date Jul 18, 2024
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Susant K. PATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE THERMAL MANAGEMENT
- Publication number 20240234238
- Publication date Jul 11, 2024
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Chandra S. Namuduri
- H01 - BASIC ELECTRIC ELEMENTS

Cooling arrangements using the Peltier effect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermoelectric cooling pedestal for substrate processing systems

Embedded cooling systems with coolant channel for device packaging

Thermal management in integrated circuit packages

Temperature adaptive information handling system

Vertical non-volatile memory device including thermoelectric device...

Thermal management device and system

On-chip peltier cooling device and manufacturing method thereof

Thermoelectric cooling and heating system for non-idling vehicle

Nanoscale thermoelectric refrigerator

Power regeneration in a memory device

Camera having a reduced dark current photodetector

Thermoelectric cooling packages

Image sensor with actively cooled sensor array

Heat removal from silicon photonics chip using a recessed side-by-s...

Methods and systems for dissipating thermal loads in wearable devices

Graphene-based nanosensor for identifying target analytes

Accelerated cooling in storage devices

Solid-state imaging device

Semiconductor structure and method of manufacturing a semiconductor...

Integrated cooling device based on Peltier effect and manufacturing...

Thermal management in integrated circuit packages

Jet impingement cooling for high power semiconductor devices

Reduced dark current photodetector

Header for semiconductor package and semiconductor package

Subsea variable speed drive apparatus

Heating or cooling apparatus-integrated heat sink for a computing d...

Package structure comprising a semiconductor die with a thermoelect...

Superlattice structures for thermoelectric devices

Acclimated regulating system for electronics packages

Thermoelectric semiconductor device and method of making same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT

THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

Nanoelectric System for Cooling Processors and RAM Memories

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION

METHODS AND SYSTEMS FOR DISSIPATING THERMAL LOADS IN WEARABLE DEVICES

SEMICONDUCTOR APPARATUS

POWER REGENERATION IN A MEMORY DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY

CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR

THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF

THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT

ON-PACKAGE EMBEDDED COOLING DEVICE

SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER

SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM

Heat dissipation module

SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES

SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES

JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

PELTIER MODULE, ASSEMBLY, AND APPARATUS FOR MASK INSPECTION

Multistage Thermoelectric Cooler with Phononic Structure

TEMPERATURE ADJUSTMENT DEVICE

PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP

THERMOELECTRIC COOLING ADDITION

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES

POWER MODULE THERMAL MANAGEMENT